Inqubo Yokuhlanganisa i-PCB ye-Chip-on-Board kanye Nokuthembeka

Ukuqonda I-Chip On Board Technology

Iyini I-Chip Ebhodini

I-chip ebhodini imele indlela yokupakisha lapho ukufa kwe-semiconductor engenalutho kufakwe ngokuqondile kumabhodi esekethe aphrintiwe kunokuba kufakwe kumaphakheji endabuko. Idayi linamathela ku-substrate ye-PCB nge-adhesive noma nge-solder, ngoxhumo lukagesi olusungulwe nge-wire bonding noma amasu we-flip-chip. Le ndlela yokuhlanganiswa eqondile iqeda isinyathelo sokupakisha esiphakathi, idale umhlangano ohlangene futhi osebenza kahle.

I-Evolution evela ku-Traditional Packaging

Ukushintsha kusuka ezindleleni zokupakisha ezivamile njenge- QFP ne -BGA kuya kubuchwepheshe be-chip onboard kwavela ezidingweni zezinyathelo ezincane zedivayisi kanye nokusebenza okuthuthukisiwe kokushisa. Amaphakheji endabuko anezela ukuphakama, isisindo, kanye nokumelana nokushisa phakathi kwedayi ne-PCB. Ubuchwepheshe be-COB bubhekana nalezi mikhawulo ngokususa umlamuleli wephakheji, okuvumela izindlela ezimfushane zokuxhumanisa kanye nokusatshalaliswa kokushisa okuqondile nge-substrate yebhodi.

Iqhaza le-COB Ekwenziweni Kwe-PCB

Ngaphakathi kokusebenza kokuhlanganiswa kwe-PCB, ukuhlanganiswa kwe-chip ebhodini kudinga amakhono akhethekile adlula ubuchwepheshe obujwayelekile bokukhweza phezulu. Inqubo idinga imishini yokubeka eqondile, imishini yokubopha izintambo, kanye nezinhlelo ze-encapsulation. Abakhiqizi be-PCB kumele baxhumanise ukulungiswa kwe-substrate, ukuqedwa kwendawo, kanye nokwakheka kwebhodi ukuze kuhambisane nokunamathiselwe kokufa okungenalutho futhi kuqinisekiswe ukwethembeka kukho konke ukuhamba komsebenzi womhlangano.

Inqubo Yomhlangano We-Chip On Board

Ukulungiselela I-substrate

I-PCB substrate ithola ukwelashwa okucophelelayo okungaphezulu ngaphambi kokunamathiselwe kokufa. Ukuhlanza kususa ukungcola okungafaka engcupheni ukunamathela, kuyilapho ukukhetha kokuqedwa kwendawo—imvamisa ukucwecwa kwegolide okugqinsile noma i-ENIG—kuqinisekisa ukubopha kwezintambo okuthembekile. Ukufakwa kwe-Adhesive noma ukufakwa kwe-solder kwenzeka ezindaweni ezikhethiwe, ngokunemba kokubekwa okubalulekile emisebenzini elandelayo yokubopha.

Izindlela Zokunamathisela I-Die

I-Bare dies igibela ebhodini ngokusebenzisa izinto zokunamathisela eziqhutshwayo noma ezingaqhubeki, kuye ngezidingo ezishisayo nezikagesi. Ama-epoxies e-conductive ahlinzeka ngezindlela zokumisa kagesi, kuyilapho izinamathelisi ezishisayo zithuthukisa ukudluliswa kokushisa. Isikhundla sezinhlelo zokubeka siyafa ngokunemba kwezinga le-micron, kulandelwa imijikelezo yokwelapha esungula izibopho zomshini phakathi kwe-silicon ne-substrate.

Amasu Okuxhumana

I-wire bonding isalokhu kuyi-chip ehamba phambili endleleni yokuxhumana yebhodi, kusetshenziswa izintambo zegolide elicolisekileyo noma ze-aluminium ukuxhuma amaphedi okufa ukuze kulandele umkhondo we-PCB. I-Ultrasonic noma i-thermosonic bonding idala amalunga e-metallurgical kuzo zombili iziphetho zocingo ngalunye. I-Flip-chip isondela ekuguquleni idayizi, ixhume ngamaqhubu e-solder noma izinsika zethusi ukuze kusetshenziswe izinhlelo zokusebenza eziminyana ezidinga ubude obufushane bokuxhuma.

I-Ecapsulation kanye Nokuvikelwa

Ngemuva kokuxhumana, i-glob-top epoxy noma izinhlanganisela zokubumba zimboza amabhondi okufa nawocingo. Lolu ngqimba oluyisivikelo luvikela umswakama, ukucindezeleka komshini, nokungcola kwemvelo. Ukukhethwa kwezinto kulinganisa ama-coefficients okunweba okushisayo phakathi kwe-silicon, i-adhesive, ne-PCB substrate ukuze kuncishiswe ingcindezi ngesikhathi sokuhamba ngebhayisikili.

Ukuhlola Nokuqinisekisa

Ukuhlolwa kukagesi kuqinisekisa ukusebenza ngaphambi kokuhlanganisa okokugcina lapho kungenzeka, nakuba amanye ama-chip on board ahlola kuphela ngemva kokuhlanganisa okuphelele. Ukuqinisekiswa kokwethenjelwa kubandakanya ukuhamba ngebhayisikili kwezinga lokushisa, ukuchayeka komswakamo, nokuhlolwa kokucindezeleka komshini ukuze kuqinisekiswe ukuthi umhlangano uhlangabezana nezimfuneko ezithile zokuphila kuwo wonke amabanga okushisa okusebenza.

Izinzuzo Zokuhlanganiswa Kwe-Chip On Board

Ukunciphisa Usayizi Nezindleko

Ubuchwepheshe be-Chip on board buqeda izindleko zephakeji futhi kunciphisa ukunyatheliswa komhlangano wonke. Ngaphandle kwezakhiwo zamaphakheji ezidla indawo yebhodi, abaklami bathola ukuminyana okuphezulu kwengxenye. Lokhu kusebenza kahle kwesikhala kufakazela ukuthi kubaluleke kakhulu emikhiqizweni eyenziwe nge-miniaturized lapho i-millimeter yesikwele ibalulekile.

Ukusebenza Kagesi Okuthuthukisiwe

Izindlela ezimfushane zokuxhumanisa kuma-chip kuma-assemblies ebhodi zinciphisa inductance ye-parasitic kanye namandla. Ubuqotho besignali buyathuthuka ngobude obuncishisiwe bokulandelela phakathi kwama-die pads namasekhethi e-PCB. Le nzuzo yokusebenza izuzisa izinhlelo zokusebenza zemvamisa ephezulu lapho inductance yomthofu wephakheji ingakhawulela izivinini zokusebenza.

Ukuphathwa Kwezifudumezi Okuthuthukisiwe

Okunamathiselwe kwe-die okuqondile kuma-substrates e-PCB kudala izindlela ezishisayo zokukhipha ukushisa. Ukumelana nokushisa kuyehla uma kuqhathaniswa namadivayisi apakishiwe lapho umzimba wephakheji uvimbela ukugeleza kokushisa. Lesi sici senza i-chip ebhodini ifaneleke kugesi wamandla kanye namaphrosesa asebenza kahle kakhulu. Ama-Aluminium substrates athuthukisa futhi ukuqhutshwa kokushisa lapho kudingeka.

Izinzuzo Eziyinhloko ze-COB

Indlela ye-chip on board iletha izinzuzo ezihlukile kuzo zonke izici eziningi zokusebenza:

• Izinyathelo ezincishisiwe - Ukuqedwa kwezindikimba zamaphakeji kuvumela ukonga isikhala esingu-40-60% uma kuqhathaniswa nezingxenye ezihlanganisiwe ezihlanganisiwe
• Ukumelana nokushisa okuphansi - Ukuthintana okuqondile kwe-die-to-board kunikeza izindlela ezishisayo zokuhlangana ukuya ku-ambient eziphansi njengo-1-3°C/W
• Ukusebenza kahle kwezindleko - Ukwehliswa kwezindleko zezinto ezibonakalayo ngo-20-30% okuzuzwe ngokuqedwa kwephakheji ekukhiqizweni kwevolumu ephezulu
• Ubuqotho besignali - Ubude be-Interconnect ngaphansi kuka-3mm bunciphisa imiphumela ye-parasitic ezinhlelweni ze-high-frequency

Ndawonye, ​​lezi zinzuzo zenza ubuchwepheshe be-chip-on-board bube yisixazululo esikhangayo konjiniyela abafuna ama-compact electronic, asebenza kahle ngokushisa, futhi angabizi kakhulu.

Imikhawulo kanye Nezinselele Ekwenziweni Kwe-Chip On Board

Inqubo Eyinkimbinkimbi

Ukuhlanganiswa kwe-chip ebhodini kudinga izindawo ezilawulwayo zegumbi elihlanzekile kanye nemishini ekhethekile. Ukuphatha ukufa kudinga ukunemba ukuze kugwenywe ukulimala noma ukungcoliswa. Ukuvumelana kwe-wire bonding kuthinta isivuno, ngebhondi ngayinye edinga amapharamitha alungile. Lezi zidingo zenqubo zandisa inkimbinkimbi yokukhiqiza uma kuqhathaniswa nomhlangano ojwayelekile wokukhweza phezulu.

Amandla Okusebenza Kabusha Alinganiselwe

Uma isihlanganisiwe, i-chip ebhodini yemihlangano iba yaphakade. Ukufa okuhlulekile akukwazi ukususwa futhi kufakwe esikhundleni ngaphandle kokucekela phansi indawo ye-PCB. Abakhiqizi kufanele bathole isivuno esiphezulu se-first pass, njengoba izindleko ze-scrap zihlanganisa kokubili ukufa okungenalutho kanye ne-PCB substrate.

Izithiyo Zokuklama Nokuthembeka

Amadivayisi wokubala okuphezulu kwe-I/O angase ahlangabezane nemikhawulo yokubopha izintambo ngenxa yephedi yephedi nobunkimbinkimbi bomzila wezintambo. Amabhondi ezintambo ezinde angenisa inductance engathinta ubuqotho besignali kumafrikhwensi aphezulu. I-coefficient yokungezwani kokwanda okushisayo phakathi kwe-silicon, i-adhesive, i-encapsulant, ne-PCB kudala ukucindezelwa komshini ngesikhathi sokuhamba ngebhayisikili.

I-PCB Design Guidelines for Chip On Board

Izidingo Zokuqeda Ubuso

Ukuthembeka kwe-wire bonding kuncike kwikhwalithi yokuqedwa kwendawo kanye nokuqina. Electroless nickel immersion gold (ENIG) inikeza indawo eyisicaba, ebophekayo enempilo enhle kakhulu yeshelufu. Ukufakwa kwegolide okuqinile kunikeza amandla okubopha aphakeme kodwa kwenyusa izindleko. Isiphetho kufanele singabi nokungcoliswa kanye ne-oxidation ngesikhathi sokuhlanganisa.

Leli khasi limayelana nezindlela zokuhlanganisa ama-chip-on-board, hhayi ama-electronics e-drone ajwayelekile. Ukuze uthole ukukhethwa kwezingxenye ze-drone kanye nomongo wohlelo lokusebenza, bheka umhlahlandlela wohlelo lokusebenza lwe-drone chip ; ukuze uthole ukwesekwa kokukhiqiza, i-Highleap ihlola umsebenzi we-COB ngokusebenzisa ikhono layo lokuhlanganisa i-PCB.

Ngesu Lokuphatha

Thola ukudlula ngaphandle komngcele we-die footprint kanye nomngcele we-encapsulant ukuze uvimbele i-epoxy wicking ngokusebenzisa izimbobo. Uma i-vias kufanele ibe khona phakathi kwalezi zifunda, cacisa ukuxhuma okuphelele nge-copper noma ukugcwaliswa okungaconductive, okulandelwa yi-planarization. I-Vis engavaliwe idala amaphuzu abuthakathaka lapho ukunamathela kwe-encapsulant kwehluleka futhi umswakama ungangena.

I-Fiducial kanye ne-Bond Pad Layout

Automated die placement and wire bonding equipment require precise position references. Place crosshair-style amamaki eqiniso rather than circular patterns for optimal machine vision recognition. Design bond pad layouts to minimize and equalize wire lengths across the die periphery to prevent current imbalances and mechanical stress variations.

I-Critical Design Parameters

Ukuphumelela kwe-chip ekusetshenzisweni kwebhodi kuncike ekubambeleleni kumibandela ethile yokuklama:

• Ukujiya kwegolide - Ubuncane begolide elikhanyayo elingu-0.05μm noma igolide eliqinile elingu-0.75-1.25μm ukuze kuhlanganiswe izintambo ezinokwethenjelwa
• Isikhala sephedi yebhondi - Gcina iphimbo elincane elingu-150-200μm ukuze uvimbele ukunqanyulwa kwentambo ngesikhathi sokusebenza kokubopha
• Ubude belophu yentambo - Nikeza imvume engu-200-400μm ngaphezu kwendawo yokufa ukuze uhlanganise i-encapsulant
• I-Thermal ngokusebenzisa ukuminyana - Misa i-thermal vias ngaphakathi kwe-1mm yomjikelezo wokufa ukuze usakaze ukushisa okufanelekile

I-Thermal Design Integration

Ukubekwa kwe-Bare die kuthinta ngokuqondile ukusebenza okushisayo. Isikhundla samandla aphezulu siyafa eduze kwe-thermal vias noma izindawo ezinogqinsi lwethusi oluthuthukisiwe. Cabangela amaphethini okusabalalisa ukushisa ezendlalelo ze-PCB. Ngemithwalo eshisayo eshisayo, ama-aluminium substrates noma izinhlamvu zemali zethusi ezishunyekiwe zinikeza izindlela ezingcono zokulahla ukushisa ukusuka ku-die junction kuya kumasinki okushisa angaphandle.

Ukucatshangelwa Kokukhiqiza kwe-Chip On Board PCB

Ukukhethwa Kwezinto Zebhodi

Amaphrojekthi e-chip ebhodini adinga ama-substrate e-PCB anezakhiwo ezifanele zokushisa kanye nokuqedwa kwendawo. I-FR-4 isebenza ngokusetshenziswa okuvamile, kuyilapho amabhodi asekelwe nge-aluminium efanelana nezidingo zamandla aphezulu. Ama-PCB ensimbi ahlinzeka ngokusabalala kokushisa okuthuthukisiwe kwezinhlelo zokusebenza ezisebenzisa ukushisa kakhulu.

Izidingo Zengqalasizinda Yokukhiqiza

Izinsiza zokuphatha i-chip ebhodini zidinga ama-die bonder, amasistimu wokubopha izintambo, okokusebenza kokunamathelayo nama-encapsulants, namahhavini okwelapha. Ukulinganiswa kwezisetshenziswa nokugcinwa kunomthelela ngqo emvuzweni. Izindawo zokukhiqiza ezihlanzekile zivimbela ukungcoliswa kwezinhlayiya ngesikhathi sokunamathiselwa kwefa kanye nokubopha.

Iphrothokholi Yokuxhumana Kwamakhasimende

Ukusebenzisana kwangaphambi kwesikhathi phakathi kwabakhiqizi be-PCB namakhasimende kufakazela ukuthi kubalulekile empumelelweni ye-chip. Ukucaciswa kwefa, imidwebo yokubopha, izinhlobo ze-encapsulant, nezidingo ezishisayo kufanele zichazwe ngokucacile. Abahlinzeki kufanele banikeze imibhalo enemininingwane yenqubo futhi, lapho kufanele, amavidiyo enqubo yokukhiqiza abonisa amandla.

Izicelo Zemboni Ye-Chip On Board Technology

Ama-LED Lighting Systems

Amamojula e-LED ane-chip ebhodini alawula izinhlelo zokukhanyisa ezikhanya kakhulu. Ama-LED amaningi afakwa kuma-substrate e-aluminium, okwenza imithombo yokukhanya efanayo ngokuphathwa okuhle kakhulu kokushisa. Lokhu kulungiselelwa kukhulisa ukusebenza kahle okukhanyayo ngenkathi kunciphisa izindleko zamaphakheji ezibanini zezimoto, izibani zezentengiselwano, kanye nokukhanya okukhethekile.

Amadivayisi agqokekayo kanye ne-IoT

I-Miaturization idinga idrayivu yokwamukelwa ebhodini kuma-electronics agqokekayo kanye nezinzwa ze-IoT. Amawashi ahlakaniphile, izilandeleli zokufaneleka, nezinsiza-kuzwa kusebenzisa ubuchwepheshe be-COB ukuze kuzuzwe izici zefomu elincane. Ukususwa kobude bephakheji kunika amandla imiklamo emincane yomkhiqizo njengoba amadivayisi axhunyiwe aqhubeka anda.

Amathuba Emakethe Asafufusa

Ukuthuthukiswa kwengqalasizinda ye-5G kanye nezinhlelo zokusebenza ze-millimeter-wave kudala amathuba e-chip ebhodini kumamojula e-RF lapho ama-parasitic okuxhumana okuncane kubaluleke khona. Ama-elekthronikhi kagesi aya ngokuya asebenzisa i-COB yamadrayivu ezimoto kanye nokuguqulwa kwamandla, kuyilapho ama-electronics ezimoto amukela ubuchwepheshe bamamojula okulawula akhawulelwe esikhaleni.

Izinzuzo zohlelo lokusebenza ngomkhakha

Izimboni ezihlukene zisebenzisa i-chip kubuchwepheshe bebhodi ngezidingo ezithile zokusebenza:

• ukukhanyisa LED - Ukuthuthukiswa kokusebenza kahle kokushisa okungama-25-35% ngokufakwa okuqondile kwe-aluminium substrate
• wearables - Ukunciphisa ukujiya kwedivayisi okuvumela izici zefomu ngaphansi kobude besamba obungu-5mm
• Amamojula we-RF - Ukunciphisa ukulahlekelwa kwesignali ngama-parasites okuxhumana kwehliswe ngo-50-70% uma kuqhathaniswa nezinye izindlela ezipakishiwe
• Amandla kagesi - Ukunciphisa izinga lokushisa kwe-Junction ye-15-20 ° C ngokusebenzisa ukuhlanganisa okushisayo okuthuthukisiwe
• Izithuthi - Umhlangano wokuthuthukisa ukuthembeka kwezidingo ze-AEC-Q100 zeBanga loku-1 -40°C kuya ku-150°C ukusebenza

Lezi zinzuzo eziqondene nomkhakha zigqamisa ukuthi ubuchwepheshe be-chip-on-board buvumela kanjani ukusebenza okuphezulu, ukwethembeka okukhulu, kanye nemiklamo ehlangene kakhulu kuzo zonke izinhlelo zokusebenza ze-elekthronikhi ezihlukahlukene.

Isiphetho

Ubuchwepheshe be-Chip on board bunikeza izinzuzo ezicindezelayo zezinhlelo zokusebenza ezifuna usayizi ohlangene, ukusebenza kahle kwezindleko, nokusebenza okuthuthukisiwe. Indlela eqondile ye-die-to-board iqeda ukupakisha okujwayelekile ngenkathi ithuthukisa izici ezishisayo nezikagesi. Kodwa-ke, ukuqaliswa ngempumelelo kudinga amakhono akhethekile okukhiqiza, ukucatshangelwa kwedizayini ngokucophelela, nokulawulwa kwekhwalithi okuqinile.

Ezinhlanganweni ezihlola izixazululo ze-chip ebhodini, ukukhetha ozakwethu bokukhiqiza abanolwazi kufakazela ukuthi kubalulekile. Hlola amakhono abahlinzeki ngokucwaningwa kwamabhuku, inqubo yokubuyekezwa kwamadokhumenti, nokuhlolwa kwesampula. Cela amavidiyo enqubo yokukhiqiza abonisa ukunemba kokubekwa kwefa, ukungaguquguquki kwebhondi, kanye nekhwalithi ye-encapsulation.

Kwa-Highleap Electronics, amakhono ethu okukhiqiza nokuhlanganisa ama-PCB ahlanganisa ubuchwepheshe be-chip onboard nge-ISO 9001, ISO 13485, kanye nezitifiketi ze-IATF 16949. Sisekela amakhasimende avela ekubonisaneni ngokuklama ngokusebenzisa ukukhiqizwa kwevolumu, sihlinzeka ngobuchwepheshe kanye nengqalasizinda yokukhiqiza ebalulekile ekuhlanganisweni kwe-COB okuphumelelayo. Xhumana nethimba lethu lobunjiniyela ukuze uxoxe ngezidingo zakho ze-chip onboard.