Amabhodi E-Copper Clad (i-Copper-Clad Laminate): Ayini, Izinhlobo, kanye Nendlela Ama-PCB Enziwa Ngawo

Ibhodi elimbozwe ngethusi, noma i-laminate embozwe ngethusi (CCL), iyizinto zokusetshenziswa eziqala kuzo zonke i-PCB eqinile: ishidi le-substrate yokuvikela ene-foil yethusi eboshelwe ohlangothini olulodwa noma zombili. Susa ithusi elingafuneki bese okusele kuyisekethe yakho. Ukuqonda i-CCL — amamaki ayo, izinsimbi zethusi, nokuthi iba kanjani ibhodi eliqediwe — ukuqonda ukuthi i-PCB iyini ngempela. Lo mhlahlandlela uchaza i-laminate embozwe ngethusi, izinhlobo zayo, ukuthi isisindo sethusi sichazwa kanjani, nokuthi i-Highleap Electronics iguqula kanjani i-CCL ibe amabhodi aqediwe.

1. Liyini ibhodi elimbozwe ngethusi (CCL)?

Ibhodi elimbozwe ngethusi liyisisekelo se-PCB: i-substrate evikela ukushisa — ngokuvamile i-epoxy eqiniswe ngengilazi — enesendlalelo esincane se-foil yethusi ebekwe endaweni eyodwa noma zombili. Yindawo engenalutho yokuqala lapho kwenziwa khona isekethe; ithusi lingumqhubi kanti i-substrate iyi-insulator ebamba yonke into endaweni yayo. Ngaphambi kokuba kube khona noma yimiphi iminonjana, ibhodi limane liyishidi elimbozwe ngethusi ngokuphelele.

I-laminate yakhiwa ngokucindezela i-foil yethusi ku-substrate eqinisiwe (noma eqinisiwe) ye-resin-and-reinforcement ngaphansi kokushisa nokucindezela, ibophezele ephepheni eliqinile. Ubukhulu bethusi, uhlobo lwe-substrate, kanye nobukhulu be-substrate konke kukhethwa ngokwezidingo zebhodi. Lokhu kuyizinto eziyisisekelo ze-PCB laminate , futhi indlela eyakhiwe ngayo — i-foil, i-resin, ukuqinisa — ichazwe ngokuningiliziwe kulokhu kubukwa kokwakhiwa kwe-PCB laminate.

2. Izinhlobo ze-laminate embozwe ngethusi: FR-4, CEM, metal-core, nokuningi

Ama-laminate ambozwe ngethusi afika ngezinhlobo eziningana ezichazwe yi-substrate yawo: i-FR-4 (i-epoxy eqiniswe ngengilazi, okujwayelekile), ama-CEM grades (i-epoxy ehlanganisiwe), ama-laminate avame kakhulu (i-PTFE kanye ne-ceramic-filled), kanye ne-metal-core (i-foil yethusi phezu kwesisekelo se-aluminium noma sethusi). I-substrate inquma ukuziphatha kwebhodi kagesi, ukushisa, kanye nokwemishini, ngakho-ke uhlobo lwe-CCL lulandela kusukela ekusetshenzisweni:

I-FR-4 ihlanganisa iningi lomsebenzi, kanti eminye ikhethwa lapho izinzuzo zayo ezithile — izinga lokushisa eliphakeme, ukulahlekelwa okuphansi kwe-RF, noma ukuqhutshwa kokushisa okunamandla — kudingeka. I-CCL yensimbi, isibonelo, isekela amabhodi e-LED kanye nawamandla ngama -PCB e-aluminium substrate , kuyilapho imiklamo ye-RF isebenzisa amazinga aphezulu. Ukukhetha phakathi kwazo yisinqumo sezinto zebhodi lesifunda esibumba ibhodi lonke.

3. Isisindo sethusi ku-CCL: 1 oz, 2 oz, nokuthi kusho ukuthini

Isisindo sethusi sichaza ubukhulu be-foil yethusi ku-laminate, ecashunwe ngama-ounces nge-square foot — ithusi elingu-1 oz lingama-micron angu-35 ubukhulu, ama-ounces angu-2 cishe ama-micron angu-70. Kuyindlela endala, kodwa umqondo oyinhloko ulula: isisindo sethusi esiningi sisho ithusi elijiyile, elithwala amandla amaningi futhi lisuse ukushisa okwengeziwe, ngezindleko zokusika okuqinile kwesici esihle. Izisindo ezivamile:

• I-0.5 oz (~17.5 µm) — isetshenziswa ezingqimbeni zangaphakathi kanye nasemsebenzini womugqa omncane.
• I-1 oz (~35 µm) — indinganiso yezendlalelo zangaphandle ezijwayelekile.
• I-2 oz (~70 µm) — yamabhodi wamandla aphezulu kanye nawamandla.
• 3 oz nangaphezulu (~105 µm+) — ithusi elisindayo lemiklamo yamandla aphezulu kanye nokushisa.

Ukukhetha kuyindlela yokushintshana: ithusi elisindayo lithwala ugesi omningi ngobubanzi obunikeziwe kodwa kunzima ukulifaka emigqeni emincane kakhulu, ngakho-ke amabhodi anamandla aphezulu kanye nesignali avame ukusebenzisa izisindo ezahlukene. Lokhu kuyindlela efanayo yokulinganisa isisindo sethusi eqhuba amandla okuthwala ugesi kanye nemiklamo yethusi elisindayo, futhi ichazwe kanye nohlobo lwe-laminate. Kumabhodi asunduza ugesi ophezulu, i-laminate embozwe ugesi osindayo iyisisekelo sokwakha okwazi ukushisa.

4. Indlela i-PCB eyenziwe ngayo nge-laminate embozwe ngethusi

I-PCB yenziwa nge-laminate embozwe ngethusi ngokuthwebula iphethini yesekethe phezu kwethusi, iqophe ithusi elingafuneki ukuze lishiye izinsalela, bese kungezwa ukubhoboza, ukucwebezela, imaski yokubopha, kanye nokuqeda. I-CCL iyi-canvas, kanti ukwenziwa kuyinqubo yokususa eyembula isekethe. Uchungechunge oluyinhloko:

• Faka isithombe ngephethini. Kusetshenziswa ukumelana futhi kufakwe iphethini (ngokuvamile ngezithombe-mfanekiso) ukuvikela ithusi elizoba yizicucu.
• I-Etch. Ithusi eliveziwe nelingavikelekile lisuswa ngamakhemikhali, kushiye imikhondo yesekethe ku-substrate.
• Ukubhoboza nepuleti. Imigodi iyabholwa bese ifakwa ipulasitiki ukuze kuxhunywe izendlalelo, kwakhiwe uxhumano.
• Qedela. Imaski yokusongelwa, isikrini sesilika, kanye nokuphela kwendawo kuyangezwa ukuze kuvikelwe ithusi futhi kulungiselelwe ukuhlanganiswa.

Kumabhodi anezingqimba eziningi, ama-core amaningana aqoshwe ngethusi kanye nezendlalelo ezilungiselelwe kusengaphambili zihlanganiswa ndawonye, ​​​​ziphinda lesi simiso ezingqimbeni eziningi. Isisindo sethusi se-laminate yokuqala kanye ne-substrate kusetha lokho okungafinyeleleka ekuqopheni nasekusebenzeni, yingakho ukukhetha kwe-CCL kuza kuqala - konke ekukhiqizweni kwe -PCB kwakha phezu kwaleyo nto eyisisekelo.

5. Indlela yokukhetha i-laminate egqoke ithusi efanele

Khetha i-laminate embozwe ngethusi ngokufanisa i-substrate nezidingo zakho zikagesi, ukushisa, kanye nokuthembeka kanye nesisindo sethusi nezidingo zakho zamanje kanye nokushisa — i-FR-4 enethusi elingu-1 oz imboza amabhodi amaningi, kanye nama-laminate akhethekile akhethwe kuphela lapho izinzuzo zawo zidingeka khona. Ukukhetha okungaphezu kwalokho okudingwa umklamo kwengeza izindleko; ukukhetha izingozi ezincane zokusebenza noma ukuthembeka. Izici zesinqumo:

• Izidingo zikagesi. Izimpawu ezivame kakhulu noma ezisheshayo zikhomba ama-laminate alahlekelwa kancane; umsebenzi ojwayelekile wedijithali kanye nowe-analog ulungile ku-FR-4.
• Izidingo zokushisa. Ukushisa okuphezulu noma amandla aphezulu kuthanda i-laminate ene-Tg ephezulu noma i-metal-core ukulawula izinga lokushisa.
• Isisindo sethusi. Qondanisa nogesi wamanje kanye nokushisa — okunzima ngamandla, okujwayelekile kwezimpawu — kulinganisela ngokumelene nokuqoshwa kwesici esihle.
• Izindleko nokutholakala. Izisindo ze-FR-4 ezijwayelekile kanye nezethusi ezivamile yizona ezingabizi kakhulu futhi ezitholakala kalula, njengoba kuchazwe ku- ukukhetha i-laminate egqoke ithusi engcono kakhulu.

Ngenxa yokuthi i-laminate isekela konke, lokhu kukhetha kuqinisekiswa kangcono ngumkhiqizi wakho, okungcono kakhulu ekubuyekezweni kokukhiqiza, ngakho-ke izinto zokwakha, isisindo sethusi, kanye ne-stackup kuhambisana kokubili umklamo kanye nenqubo yokukhiqiza ngaphambi kokuba kwakhiwe noma yiliphi ibhodi.

6. Indlela i-Highleap ekhetha futhi icubungula ngayo i-CCL yamabhodi akho

I-Highleap ikhetha i-laminate embozwe ngethusi kanye nesisindo sethusi ukuze ivumelane nezidingo zikagesi, ukushisa, kanye nokuthembeka kwebhodi lakho, bese iyicubungula ngokuthwebula izithombe, ukuqopha, ukubhoboza, ukuplasta, kanye nokuqedela ibe ibhodi eliphelele. Izinto ziphathwa njengokukhetha kobunjiniyela: i-FR-4 ejwayelekile lapho ifanela khona, kanye nama-laminate ane-Tg ephezulu, ama-frequency aphezulu, noma i-metal-core lapho umklamo uwadinga ngempela, usebenzisa uhla olubanzi lwezinto ze -laminate.

Ngenxa yokuthi i-base laminate ibeka lokho ibhodi eliqediwe elingakwenza, isibuyekezo sokukhiqiza siqinisekisa ukuthi izinto zokwakha, isisindo sethusi, kanye ne-stackup kungaphambi kokwenziwa, okugwema ukungalingani okutholakala ngemva kokuba ibhodi lenziwe. I-Highleap ihlanganisa lokhu ekukhiqizweni kwe-PCB futhi isekela ibhodi elinabantu ngokuhlanganiswa kwe-turnkey . Uma ucela ikhotheshini, chaza uhlobo lwe-laminate (noma izidingo zakho zikagesi, ze-thermal, kanye ne-Tg), isisindo sethusi, kanye nenani lezingqimba ukuze kusetshenziswe izinto zokwakha ezifanele.

7. Imibuzo Evame Ukubuzwa Ngebhodi Elimbozwe Ngethusi

Uyini umehluko phakathi kwebhodi elimbozwe ngethusi kanye ne-PCB?

Ibhodi elimbozwe ngethusi liyi-laminate eluhlaza, embozwe ngethusi ngokuphelele ngaphambi kokuba kube khona noma yimuphi umjikelezo; i-PCB yilokho okutholayo ngemva kokuba ithusi elingafuneki seliqotshiwe futhi kufakwe ukubhoboza, ukucwebezela, imaski, kanye nokuqeda. I-CCL iyinto yokuqala ye-PCB.

Iyini i-laminate embozwe ngethusi ye-FR-4?

I-FR-4 CCL iyisisekelo se-PCB esijwayelekile: i-substrate ye-epoxy eqiniswe ngengilazi ene-foil yethusi eboshelwe ohlangothini olulodwa noma zombili. Ihlanganisa iningi lamabhodi aqinile ngenxa yokulinganisela kwayo kwezindleko, amandla, kanye nezakhiwo zikagesi.

Kusho ukuthini ukuthi ithusi elingu-1 oz ebhodini elimboziwe?

Ichaza ubukhulu be-foil yethusi — cishe ama-micron angu-35 (0.035 mm) — ecashunwe njengesisindo ngefidi lesikwele. I-2 oz ingama-micron angaba ngu-70. Ithusi elisindayo lithwala ugesi omningi kodwa kunzima ukulifaka emigqeni emincane.

Ungakwazi yini ukwenza i-PCB ekhaya ngebhodi elimbozwe ngethusi?

Amabhodi alula anohlangothi olulodwa noma oluphindwe kabili angenziwa nge-laminate embozwe ngethusi ngokufaka iphethini yokumelana nokuchoma, kodwa amabhodi anezingqimba eziningi, izici ezinhle, imigodi embozwe ngeplatifomu, kanye nokuqedwa okuthembekile kudinga ukwenziwa kobungcweti. Ukuchoma ekhaya kufaneleka kuphela kuma-prototypes ayisisekelo.

Iyini ibhodi elimbozwe ngethusi elinohlangothi olulodwa noma elinohlangothi oluphindwe kabili?

I-CCL enohlangothi olulodwa inethusi ebusweni obubodwa kanti enohlangothi oluphindwe kabili inethusi kuzo zombili. Uhlangothi oluphindwe kabili luvumela ukujikeleza kanye nezimbobo ezifakwe amapulangwe kuzo zombili izindawo, okusekela umzila oyinkimbinkimbi kakhulu kunezinto ezinohlangothi olulodwa.

Ingabe i-laminate embozwe ngethusi ithinta ukusebenza kwesignali?

Yebo — izakhiwo ze-dielectric ze-substrate zithinta i-impedance kanye nokulahlekelwa, yingakho amabhodi anemvamisa ephezulu esebenzisa ama-laminate akhethekile anokulahlekelwa okuncane kune-FR-4 ejwayelekile. Izinto eziyisisekelo ziyisici esibalulekile ekuziphatheni kukagesi kwebhodi.