Iziqondiso Zokuklama Ze-Copper Coin PCB: Ukuthuthukiswa Okushisayo Nokwethenjelwa

Isingeniso: Kungani I-Copper Coin i-PCB Design Ibalulekile ku-Power Electronics

Ubuchwepheshe be-PCB yezinhlamvu zethusi bube yinto ebalulekile kumasekethe anamandla aphezulu kanye namazinga aphezulu okushisa lapho izindlela zokuphatha ukushisa ezivamile zingakwazi ukuhlangabezana nezidingo zokusebenza. Njengoba ubuningi bamandla buqhubeka nokwanda kuma-elekthronikhi ezimoto, ukukhanyisa kwe-LED, kanye nezinhlelo zokuguqula amandla, izakhiwo zezinhlamvu zethusi ezifakiwe zinikeza izindlela eziqondile zokuqhuba ukushisa ezinciphisa kakhulu ukumelana nokushisa kwe-junction-to-case. Ikhwalithi yomklamo we-PCB wezinhlamvu zethusi inquma ngokuqondile kokubili ukusebenza kokushisa kanye nokuthembeka kwesikhathi eside.

Ukuqonda Izakhiwo Zezinhlamvu Zethusi Ezishumekiwe

Ukucushwa Kwesakhiwo Okubalulekile

Izakhiwo zohlamvu lwemali yethusi ezishumekiwe ngokuvamile zivela ekucushweni okuthathu: amabhulokhi ethusi agxilile emithombo yokushisa egxilile, izigxobo zethusi eziyisilinda zezindlela ezishisayo ezihamba ebhodini, kanye nemigoqo yethusi yezindawo zamandla asabalalisiwe. Ukucushwa ngakunye kubhekana nezidingo ezithile zokuphatha okushisayo ngenkathi kugcinwa ubuqotho bemishini ngaphakathi kwesakhiwo sebhodi elaminethiwe.

I-Thermal Conduction Pathways ku-Copper Coin PCB Design

Uhlamvu lwemali lwethusi olushumekiwe ludala indlela yokushisa engamelana kancane exhuma indawo yokukhweza yengxenye ngokuqondile kusinki wokushisa noma isendlalelo sesisekelo esishisayo. Ukushisa kugeleza kuqonde ngqo kusuka lapho kuhlangana khona idivayisi kudlulele ekuhlanganiseni kwe-solder, kudlulele kuphedi yethusi engaphezulu, kuhlamvu lwemali lwethusi olushunyekiwe, futhi ekugcineni lufike esixhumi esibonakalayo esishisayo. Lo mzila ome mpo wedlula ukusebenza okushisayo okubuthakathaka kwempahla ye-dielectric ye-FR-4, ngokuvamile ebonisa ukusebenza okushisayo okungu-0.3 kuya ku-0.4 W/mK kuphela uma kuqhathaniswa ne-400 W/mK yethusi.

Imibandela Yokukhetha Ecacisiwe Yohlelo

Ama-semiconductors anamandla aphezulu afana nama-MOSFET nama-IGBT azuza kakhulu kumabhulokhi ethusi aqinile abekwe ngokuqondile ngaphansi kwephedi ye-thermal yedivayisi. Amamojula wamandla we-Multi-chip ngokuvamile adinga izinhlamvu zemali eziningi zethusi ezinezikhala ezithuthukisiwe ukuze kulinganiswe ukusabalalisa okushisayo. Izindawo zamandla alayini kumasekhethi okulawula amandla kagesi angase asebenzise ukulungiselelwa kwebha yethusi ukuze asabalalise ukushisa endaweni elawulwayo ngempumelelo.

Isu Lokubekwa Kwemali Yethusi

Izimiso Zokuqondanisa Umthombo Wokushisa

Idizayini ye-PCB yohlamvu lwemali yethusi ephumelelayo idinga ukuqondanisa okunembile phakathi kwesakhiwo sethusi esishunyekiwe kanye nomthombo wokushisa wengxenye. Uhlamvu lwemali yethusi kufanele lubekwe ngokuqondile ngaphansi kwephedi ye-thermal yedivayisi ene-offset encane, ngokuvamile egcina ukuqondana phakathi kuka-0.1 mm. Noma yikuphi ukungaqondi kahle kwethula ukumelana nokushisa kwe-lateral ngokusebenzisa izendlalelo ze-foil yethusi, kwehlisa kakhulu ukusebenza kokushisa.

Ukucatshangelwa kwesakhiwo sedivayisi eminingi

Lapho amadivaysi amandla amaningi esebenza eduze, idizayini ye-PCB yohlamvu lwemali yethusi kufanele ibhekane nezinto ezimbalwa ezibalulekile:

• Ukuqondanisa okuqondile nomthombo ngamunye wokushisa kunciphisa ukumelana kwendlela yokushisa ngamaphesenti angu-30 kuya kwangu-50 uma kuqhathaniswa nokubekwa kwe-offset.
• Gcina isikhala esincane esingu-0.3 mm phakathi kwezinhlamvu zemali zethusi eziseduze ukuze uvimbele ukugxila kokucindezeleka komshini ngesikhathi sokuhamba ngebhayisikili elishisayo.
• Sebenzisa amaphethini e-symmetrical layout ukuze uthole ibhalansi yokucindezeleka ebhodini lonkana, ikakhulukazi amabhodi angaphezu kuka-100 mm kunoma ibuphi ubukhulu.
• Qondisa ukujula kohlamvu lwemali yethusi ukuze uqinisekise ibanga elingaguquki ukusuka endaweni ekhwezwayo kuzo zonke izindawo.

Ukugwema Izendlalelo Zokukhinyabezeka Ezishisayo

Indlela yokudlulisa ukushisa kufanele ihlale ingavinjwa imaski ye-solder, isikrini sikasilika, noma i-dielectric material eyeqile. Uhlamvu lwemali lwethusi kufanele ludlulele phakathi kongqimba olulodwa lwethusi lwengxenye ekhwezayo, kube ne-prepreg necwecwe lethusi elidingekayo kuphela elihlukanisa uhlamvu lwemali olushunyekiwe kuphedi ongaphezulu. Imithetho yedizayini kufanele ichaze ngokucacile izidingo zokuvula imaski ye-solder phezu kwezindawo zohlamvu lwemali yethusi ukuze kuvinjwe i-thermal impedance.

Usayizi Wezinhlamvu Zethusi Nokuthuthukiswa Kokuqina

Imihlahlandlela Eyi-Dimensional ye-Copper Coin PCB Design

I-footprint yethusi kufanele inwebe ngamaphesenti ayi-10 kuye kwangama-20 ngaphezu komjikelezo wephedi yedivayisi ukuze ivumelane nokukhiqiza futhi iqinisekise ukuthintana okuphelele okushisayo. Izinhlamvu zemali ezingaphansi kobukhulu zidala amabhodlela ashisayo, kuyilapho izinhlamvu zemali ezinkulu zimosha izinto futhi zandisa ukucindezeleka kwemishini. Ngephedi ye-thermal yedivayisi yamandla engu-10 mm × 10 mm, uhlamvu lwemali lwethusi olukala u-11 kuya ku-12 mm ohlangothini ngalunye lunikeza ukumbozwa okuphelele.

Imibandela Yokukhetha Ukuqina

Ugqinsi lwemali yethusi ngokuvamile lusukela ku-1.0 kuye ku-3.0 mm kuye ngokuhlakazeka kwamandla kanye nogqinsi lwebhodi. Izinhlamvu zemali eziwugqinsi zinikeza ukumelana nokushisa okuphansi kodwa zandisa ubunzima be-lamination kanye nengozi ye-warpage yebhodi. Uhlamvu lwemali lwethusi oluwugqinsi olungu-1.5 mm lufanele izinhlelo zokusebenza eziningi ezilahla ama-watts angu-20 ukuya kwangu-50, kuyilapho ukuminyana kwamandla okudlulele ngaphezu kuka-100 W/cm² kungase kuthethelele ukujiya okungu-2.5 ukuya ku-3.0 mm.

Ibhalansi Yokwenzeka Kwezokukhiqiza

Ugqinsi lwemali yethusi akufanele ludlule amaphesenti angu-40 ogqinsi lwebhodi eliphelele ukuze kuvinjwe izinselele zokucwasa kanye nengozi yokuncipha. Ukuxhumana nomkhiqizi we-PCB ngesikhathi sesigaba sokuklama se-PCB yekhopha kuqinisekisa ukuthi ubukhulu obukhethiwe buhambisana namakhono abo enqubo kanye nemikhawulo yemishini.

Ukucatshangelwa kwe-Thermal Design ye-Copper Coin PCB

Ukunciphisa Ukumelana Ne-Junction-to-Base Thermal Resistance

Indlela yokushisa esuka ekuhlanganeni kwe-semiconductor kuya kusinki yokushisa inquma ukusebenza kokushisa okuphelele ekwakhiweni kwe-PCB yezinhlamvu zethusi. Isici ngasinye sokumelana kulolu chungechunge kumele sincishiswe. I-solder joint phakathi kwedivayisi ne-PCB ivame ukufaka u-0.1 kuya ku-0.3 °C/W. Uhlamvu lwethusi ngokwalo lunezela ukumelana okuncane okungaba ngu-0.05 kuya ku-0.1 °C/W ngenxa yokushisa okuphezulu kwethusi.

I-Void-Free Thermal Interfaces

Izimbobo ezigcwele inhlaka noma izikhala zomoya ezizungeze uhlamvu lwemali lwekhopha zikhuphula ngokuphawulekayo ukumelana nokushisa, okungenzeka zengeze u-1 kuya ku-3 °C/W wokuvinjelwa okungafunwa. Inqubo ye-lamination kumele iqinisekise ukungena okuphelele kwe-resin nxazonke nangaphansi kohlamvu lwemali yethusi. Amanye amadizayini e-PCB ohlamvu lwekhopha ahlanganisa i-nickel plating endaweni engaphansi yemali ukuze kuvunyelwe ukunamathiselwa kwe-solder okuqondile ku-thermal base plate.

Ukuqinisekiswa Kokulingisa Okushisayo

Isici esiphelile sekulingisa esishisayo kufanele siqinisekise amazinga okushisa okuhlangana ngaphansi kwezimo eziphezulu zamandla ngaphambi kokuphothula umklamo we-PCB wohlamvu lwemali yethusi. Amamodeli okulingisa kufanele amelele ngokunembile ijometri yohlamvu lwemali yethusi, izinto zokusebenzisana ezishisayo, nezimo zomngcele. Amazinga okushisa okuhlanganisa okuqondiwe kufanele agcine okungenani u-20°C wemajini ngaphansi kwesilinganiso esiphezulu sedivayisi ukuze kuqinisekiswe ukwethembeka.

Ukucindezeleka Komshini Nokwethenjelwa Ku-Copper Coin PCB Design

I-CTE Mismatch Management

I-coefficient ye-Copper yokwandisa okushisayo (17 ppm/°C) ihluke kakhulu ku-FR-4 epoxy resin (14-17 ppm/°C endizeni, 50-70 ppm/°C ukushuba), idala ingcindezi ye-shear kusixhumi esibonakalayo se-copper-resin ngesikhathi sokuhamba ngebhayisikili. Lokhu kugxila kwengcindezi kungaqala ukuhlukaniswa kwe-delamination noma uhlamvu lwemali yethusi ngokuhamba kwesikhathi. Ubukhulu bengcindezi bukhuphuka ngosayizi wemali yethusi nokuqina.

Amasu Okusiza Ukucindezeleka

Ukufaka iwindi le-resin eliwumngcingo noma i-slot yokukhulula eduze komjikelezo wohlamvu lwemali yethusi kuvumela ukuwohloka kwenhlaka yendawo, kunciphisa ukugxila kwengcindezi. Igebe lokusiza ngokuvamile lilinganisa u-0.1 kuya ku-0.2 mm ububanzi futhi lingagcwaliswa ngezinto ezithobelayo. Imiklamo yezinhlamvu zemali yethusi ehlukaniswe izingxenye isakaza ukunwetshwa okushisayo ngokulinganayo kuso sonke isakhiwo.

Lamination Process Control

Ukulawulwa okunembile kokucindezela kwe-lamination kanye nezinga lokupholisa kunciphisa ukucindezeleka okusala ebhodini eliqediwe. Ukucindezela okweqile ngesikhathi sokucwenga kungagcizelela ngaphambili isixhumi esibonakalayo se-copper-resin, kuyilapho ukupholisa kukhiya ngokushesha ekucindezelekeni okushisayo. Izingcindezi ze-lamination ezijwayelekile zisukela ku-200 kuye ku-400 psi ngezinhlaka ze-PCB zekhopha.

Izidingo Zokuhlola Ukuqinisekisa

Ukuhamba ngebhayisikili okushisayo phakathi kokweqisa kwezinga lokushisa kuqinisekisa ubuqotho bemishini yemihlangano ye-PCB yemali yethusi:

• Izinga lokushisa lokuhamba ngebhayisikili lisuka ku -40°C liye ku-+125°C imijikelezo engu-500 kuya ku-1000 ngokwezinga ngalinye le-IPC-9701.
• Ukuhlaziywa kwe-cross-sectional kanye ne-acoustic microscopy kuthola i-voids yangaphakathi noma ukwehluleka kwe-incipient.
• Ukuhlolwa okuhlanganyelwe kwe-Solder ngesithombe se-X-ray ngemva kokuchayeka kokucindezeleka okushisayo.
• Ukuqapha ukukalwa kokumelana ukuze kutholwe ukusakazeka kokuqhekeka ngaphambi kokwehluleka okuyinhlekelele.

Ukukhiqiza kanye Nokucatshangelwa Komhlangano

Imininingwane Yokubekezelela Kokwenziwa

Ukushumeka kohlamvu lwemali yethusi kudinga ukulawulwa kwenqubo okuqinile ekwakhiweni kwe-PCB yemali yethusi. Ukubekezelela indawo yemali kufanele kucaciswe ±0.15 mm endaweni ye-XY futhi ±0.1 mm ekujuleni kwe-eksisi engu-Z. I-surface planarity kuyo yonke indawo yemali yethusi kufanele ihlale ngaphakathi kuka-0.05 mm ukuze kuqinisekiswe ukwakheka okuhlangene kwe-solder okufanele.

Izidingo zangaphambi kokucwenga

Imiklamo eminingi ye-PCB yezinhlamvu zethusi icacisa i-nickel noma i-nickel-gold plating endaweni yemali yethusi ngaphambi kokuba i-lamination. Lokhu kufakwa kwe-plating kusebenzela izinjongo eziningi ezihlanganisa ukuvimbela i-oxidation, ukuthuthukisa ukumanzisa kwe-solder, nokuthuthukiswa kokusebenzelana okushisayo. Ugqinsi lwe-plating ngokuvamile lusuka kuma-micrometer angu-3 ukuya kwangu-5 nge-nickel enokukhanya kwegolide okungama-micrometer angu-0.05 kuya ku-0.1.

Ukuhambisana Kwenqubo Yomhlangano

Uhlamvu lwemali lwethusi olushumekiwe ludala isisindo esishisayo esisendaweni esithinta amaphrofayili e-reflow soldering. Indawo engaphezulu ngqo kohlamvu lwemali yethusi idinga isikhathi esinwetshiwe sokushisa ukuze ifinyelele izinga lokushisa elifanele le-soldering lika-150-180 ° C. Amaphrofayili okugeleza kabusha kufanele aqinisekiswe ngama-thermocouples abekwe ezingxenyeni ezibekwe phezu kwezinhlamvu zemali zethusi ukuze kuvinjelwe amalunga abandayo e-solder.

Ukuqinisekiswa Kwedizayini Nokuhlola

Indlela Yokulingisa Okushisayo

Qala ukuqinisekiswa nge-computational fluid dynamics noma ukulingisa okushisayo kwesici esilinganiselwe sedizayini ye-PCB yemali yethusi. Yenza imodeli yomzila oshisayo ophelele ohlanganisa uhlamvu lwemali lwethusi olushumekiwe, izinto zokusebenzelana, kanye nesinki sokushisa sangaphandle. Qinisekisa ukuthi izinga lokushisa elibikezelwe lendawo ehlanganayo lihlangabezana nokuhlosiwe kwedizayini enamamajini okuphepha afanelekile ngaphansi kwezimo ezimbi kakhulu.

Ukuqinisekiswa Kwesilinganiso Se-infrared

Ngemuva kokwenziwa kwe-prototype, ukuthwebula kwe-infrared thermal kuqinisekisa ukusatshalaliswa kwezinga lokushisa langempela endaweni yonke yebhodi. Khipha ibhodi ekucushweni okuhlosiwe kokusebenzelana okushisayo okuhlosiwe, sebenzisa amandla alinganiselwe, futhi uvumele ukulingana kokushisa. Izilinganiso zokushisa ezingaphezulu kufanele zihambisane nezibikezelo zokulingisa phakathi kwamaphesenti angu-10 kuya kwangu-15.

Ukuhlola Ubuqotho Bemishini

Ukulinganisa kwe-warpage kusetshenziswa imishini yokulinganisa ye-optical coordinate noma izindlela ze-shadow moiré kulinganisa ukucaba kwebhodi ngaphambi nangemuva kwengcindezi yokushisa. Ikhasi le-warpage elamukelekayo ngokuvamile lihlala lingaphansi kwamaphesenti angu-0.5 wobukhulu obuyi-diagonal yebhodi. Ukuhlolwa okuhlanganyelwe kwe-solder nge-X-ray noma ukuhlukaniswa kwezigaba kuqinisekisa ukwakheka okufanele ezindaweni zemali yethusi.

Iphrothokholi Yokuhlola Ukwethembeka

Ukuhlanganiswa kwesibonelo sesihloko ukuze kusheshiswe ukuhamba ngebhayisikili elishisayo, ukuhamba ngamabhayisikili amandla, kanye nokuhlolwa okuhlanganisiwe kokushisa-nomswakama-okuchema ngakunye kwamazinga e-JEDEC. Lokhu kuhlola kuveza izindlela ezingase zehluleke ezihlanganisa uhlamvu lwemali yethusi delamination, ukukhathala kwe-solder, noma ukuwohloka kwe-dielectric. Ukusungula ukuzethemba okuthembekile kudinga ukuhlola amasampuli amaningi ngokusebenzisa imibandela yokuqedela evame ukuchazwa njengemijikelezo yokushisa engu-1000.

Isiphetho: Ukuthuthukisa Ukusebenza Okushisayo Nokwethenjelwa Ku-Copper Coin PCB Design

Ukuklama ama-PCB ohlamvu lwemali yethusi okusetshenziswa kwamandla aphezulu kudinga ukucatshangelwa ngokucophelela kokuqhutshwa kwe-thermal, ukucindezeleka komshini, nokwenza. Ukubeka kahle, ukunemba kobukhulu, nogqinsi lwemali yethusi eshumekiwe kuthonya ngokuqondile ukumelana nokushisa kwe-junction-to-board kanye nokuthembeka kwesikhathi eside. Onjiniyela kufanele bahlanganise ukulingisa okushisayo, ukuhlaziya ikhasi le-warpage, nezilawuli zenqubo ukuze kuqinisekiswe ukuthi amadizayini ahlangabezana kokubili nezimfuneko zokusebenza nokukhiqiza.

Kwa- Highleap Electronics , onjiniyela bethu bokuklama abanolwazi banikeza isiqondiso mayelana nokucushwa kwezinhlamvu zemali zethusi ezilungiselelwe izidingo ezithile zokushisa nezogesi. Sisebenzisa izinqubo zokukhiqiza eziqinisekisiwe kanye nokulawulwa kwekhwalithi okuqinile, sisiza ekuhumusheni izinhloso zokuphathwa kokushisa zibe izixazululo ze-PCB ezikhiqizwayo nezinokwethenjelwa kakhulu. Ukusebenzisana nomkhiqizi we-PCB ofanelekayo kuqinisekisa ukuthi ubuchwepheshe bezinhlamvu zemali zethusi ezifakiwe buhlinzeka ngokusebenza kokushisa okubikezelwayo kuyo yonke impilo yomkhiqizo.