Inqubo Yokukhiqiza Ye-PCB Yohlamvu Lwethusi: Ukusuka Ekubhobolweni Kuya Ekushumekeni Kwezinhlamvu zemali

Isingeniso: Kungani Ukwenziwa Kwe-Copper Coin PCB Kudinga Ukunemba

Amamojula e-semiconductor anamandla aphezulu adinga izindlela ezisebenzayo zokuhlakazeka kokushisa ukuze kulondolozwe ukuzinza kokusebenza nokuvimbela ukwehluleka kwedivayisi. Ukukhiqizwa kwe-PCB yezinhlamvu zethusi kufeza le mfuneko ngokuhlanganisa ukufakwa kwethusi okujiyile ngqo ku-substrate, kudala imigwaqo yokushisa yendawo esebenza kahle kakhulu kune-vias yendabuko yokushisa. Lobu buchwepheshe bufinyelela ukuthuthukiswa kokuqhuba kokushisa okungaphezu kuka-390 W/mK uma kuqhathaniswa nezinto ezijwayelekile ze-PCB, ngamanani ajwayelekile okumelana nokushisa angaphansi kuka-0.5°C/W kwezicelo ze-semiconductor yamandla.

Inqubo yokukhiqiza idinga ukunemba okukhethekile kuzo zonke izigaba, kusukela ekwakhekeni komgodi wokuqala kuya ekushumekeni kokugcina. Isinyathelo ngasinye sithinta ngokuqondile ukusebenza okushisayo nokuthembeka kwesikhathi eside. Le ndatshana ihlola izigaba zokukhiqiza ezibucayi eziguqula ama-substrates ajwayelekile abe yizixazululo zokuphatha ezishisayo ezisebenza kahle kakhulu.

Uhlolojikelele Lwenqubo: I-Copper Coin PCB Manufacturing Workflow

Ukugeleza komsebenzi wokukhiqiza uhlamvu lwethusi lwe-PCB kulandela izigaba eziyisithupha ezihlanganisiwe ezinquma ukusebenza kokugcina okushisayo:

1. Ukwakhiwa kwe-cavity kanye nokubhoboza - Ukwenza ngokunemba kwemishini kusungula isisekelo sejiyomethri enokubekezelelana kobukhulu phakathi kuka-±20 μm ukuze kufakwe uhlamvu lwemali olufanele.
2. Ukwenza uhlamvu lwemali yethusi nokulungiswa kwendawo - Ukulungiswa kwezinto kuqinisekisa ukuthintana okushisayo okuhle kanye nezici zokunamathela kwemishini ezindaweni ezibucayi.
3. Ukushumeka nokuqondanisa - Ukuma okuqondile kugcina ubuqotho bendlela eshisayo futhi kuvimbela ukufuduka kwe-lateral ngesikhathi sokucubungula okulandelayo.
4. Ukugcwaliswa kwe-resin kanye ne-lamination - Isibopho esilawulwayo silawula ukungezwani kokwanda okushisayo ngenkathi kususwa ama-voids abeka engcupheni ukuqhutshwa kokushisa.
5. Ukwenziwa isicaba kanye ne-planarization - I-topology efanayo inika amandla ukwakheka kongqimba lwesekethe olungaguquki kuzo zonke izifunda ezishumekiwe zemali.
6. Ukuthembeka kokushisa nokuhlola - Ukuhlola okuphelele kuqinisekisa imingcele yokusebenza nobuqotho besakhiwo ngaphambi kokuthunyelwa.

Ukulawulwa kwenqubo kuzo zonke lezi zigaba kunquma ukuthi umkhiqizo oqediwe uyahlangabezana yini nezicaciso ezidingekayo ezishisayo nezemishini zezinhlelo zokusebenza zama-electronics wamandla.

I-Cavity Drilling in Copper Coin PCB Manufacturing

Precision Machining Izindlela

Ukwakhiwa kwe-Cavity kusungula isisekelo sejiyomethri sokusebenza okushisayo ekukhiqizeni i-PCB yemali yethusi. Umzila we-CNC kanye nomshini we-laser kufinyelela ukubekezelelana phakathi kuka-±20 μm, kuqinisekisa ukulingana okunembile phakathi komgodi nokufakwa kwethusi. Ukuchezuka kwe-Dimensional ngale kwalo mngcele kudala izikhala ezibeka engcupheni ukuthintana okushisayo futhi kwethule ama-resin voids ngesikhathi sokucwenga.

Ukukhishwa kwe-laser kunikeza incazelo ephakeme kakhulu yama-geometries ayinkimbinkimbi kodwa kudinga ukulungiselelwa ngokucophelela kwepharamitha ukuvimbela ukushaja kwe-substrate. Umzila wemishini uhlinzeka ngokuphuma okusheshayo komumo we-cavity olula kuyilapho kugcinwa ukunemba okwanele kwezinhlelo zokusebenza eziningi ze-semiconductor yamandla.

Ukulawulwa Kwekhwalithi Yobuso

Ukuqina kodonga lwe-Cavity kuthinta ngokuqondile ukuqhutshwa kokushisa kanye nokunamathela komshini kusixhumi esibonakalayo se-copper-substrate. Amanani okuhlosiwe okuhlosiwe asukela ku-1.6 kuya ku-3.2 μm Ra ukulinganisa ukuthintana okushisayo nokunamathela kwe-resin. Ukushelela ngokweqile kunciphisa ukuhlangana kwemishini phakathi kwezindonga ze-resin ne-cavity, okwandisa ingozi ye-delamination ngesikhathi sokuhamba ngebhayisikili elishisayo.

Ukungaguquguquki okulawulwayo kukhuthaza ukumanzisa kwe-resin ngenkathi kugcinwa izindlela zokushisa eziqhubekayo . Ukuhlanza ngemva komshini kususa izinhlayiya ezingadala izikhala ngesikhathi senqubo elandelayo yokushumeka uhlamvu lwemali yethusi.

Inqubo Yokushumeka Kohlamvu Lwemali Yethusi: Isiteji Somhlangano Esibalulekile

Ukufaniswa kwe-Dimensional kanye nokulawulwa kwe-Fit

Inqubo yokushumeka uhlamvu lwemali yethusi idinga ukufanisa okunembayo kobukhulu phakathi kobubanzi bohlamvu lwemali nokuvuleka komgodi. Iziphazamiso zilingana ukusuka ku-10 kuye ku-30 ​​μm zinikeza ukugcinwa okuphephile komshini kuyilapho kugwema ukuqhekeka kwe-substrate ngesikhathi sokufakwa. Izindlela zokulinganisa i-press-fit zisebenzisa amandla okulawula ukubeka izinhlamvu zemali ezigubha phansi ngaphandle kokucindezela i-substrate.

Izinhlelo zokubona ezizenzakalelayo ziqinisekisa ukuqondanisa phakathi kuka-±25 μm ngaphambi kokuhlwanyela, ukuvimbela ukugudluzwa kwezinhlangothi ngesikhathi sokugeleza kwe-resin. Ukungaqondani kahle kudala izindlela ezishisayo ezilinganayo ezehlisa ukumelana nokushisa okuphelele futhi zikhiqize izindawo ezishisayo zendawo ekuhlanganiseni kokugcina.

Amapharamitha we-Lamination ku-Copper Coin PCB Manufacturing

Ukukhiqiza okuphumelelayo kwe-PCB yohlamvu lwemali yethusi kuncike ezimeni ezilawulwayo zokubopha ezihlanganisa umhlangano ngaphandle kokungqubuzana:

• Ukulawula iphrofayela yezinga lokushisa - Amazinga erempu angu-2-3°C ngomzuzu afanisa ama-coefficients okwanda okushisayo phakathi kwethusi, inhlaka, nezinto ezingaphansi komhlaba ezinamazinga okushisa aphezulu ukusuka ku-170°C kuya ku-200°C.
• Ukuthuthukisa ingcindezi esetshenzisiwe – Ukuphoqelela phakathi kwebha engu-15 no-25 kuqinisekisa ukugeleza kwe-resin okuphelele kumapherimitha ohlamvu lwemali kuyilapho kuvimbela ukuvela kohlamvu lwemali ngaphezu kwendawo engaphansi.
• Ukucubungula okusizwa ngevacuum - Isusa umoya ovaleleke obungadala imigoqo yokumelana nokushisa ezindaweni ezibalulekile ze-copper-substrate.

I-Surface Planarization in Copper Coin PCB Manufacturing

Ukugcwaliswa kwe-Resin kanye nokuphathwa kokugeleza

Ukugcwalisa ukukhethwa kwempahla kulinganisa ukuqhutshwa kwe-thermal nezici zokucubungula ngesikhathi senqubo yokushumeka uhlamvu lwemali yethusi. Ama-epoxies ahambisa ukushisa aqukethe izithasiselo ze-ceramic afinyelela ku-3-5 W/mK kuyilapho egcina ukugeleza okwanele ngesikhathi sokucwala. Izinto ezisetshenziswa ngaphambi kokukhulelwa zihlinzeka ngokuqiniswa kwesakhiwo kodwa zidinga ukulawulwa kokuqukethwe kwe-resin ngokucophelela ukuze kuvinjelwe indlala emaphethelweni emali.

Ukusatshalaliswa kwe-resin efanayo kuqeda i-voids ebeka engcupheni kokubili ukusebenza kwe-thermal kanye ne-dielectric. Ukucindezela kwe-lamination okulawulwayo kuqinisekisa ukujiya kwe-resin okungaguquki phakathi kwendawo yemali yethusi kanye nezendlalelo ze-substrate eziseduze ukuze kudluliselwe ukushisa okufanelekile.

Izindlela Zokufeza I-Planarity

Ukugaya ngemva kokulanyiswa kususa ithusi eliningi kanye nenhlaka ukuze kuzuzwe ukucaba kwendawo ngaphakathi kuka-±15 μm kulo lonke iphaneli. Amasondo edayimane abrasive kancane kancane anciphisa impahla ngenkathi eqapha ukushuba nge-laser profilometry. Ukuncishiswa kwegrit okuqhubekayo kusuka ku-400 kuya ku-1200 mesh kudala i-topology efanayo yendawo efanele i-photolithography.

Ukupholisha ngamakhemikhali kunikeza ukulungiswa kokugcina kwendawo, kususa umonakalo ongaphansi komhlaba ekugayweni kwemishini. Ukuqinisekiswa kwe-Planerity ngaphambi kokuthwebula kwesifunda kuvimbela amaphutha okubhalisa futhi kuqinisekisa ukwakheka komkhondo okungaguquki kuzo zonke izifunda eziqukethe izinhlamvu zemali zethusi ezishunyekiwe.

Ukuhlolwa Kokwethenjelwa Ekwenziweni Kwe-Copper Coin PCB

Ukuqinisekiswa Kokusebenza Okushisayo

Ukuhlola okuphelele kuqinisekisa ikhwalithi yokukhiqiza ye-PCB yemali yethusi ngokuhlolwa okushisayo okuningi:

• Ukuhlolwa kokuhamba ngebhayisikili okushisayo - Ukuhlola okuphakathi kuka -40°C no-150°C emijikelezweni engu-1000 kuveza ukuthambekela kokudelela kanye nokuwohloka kwesixhumi esibonakalayo ngaphansi kwengcindezi yokusebenza.
• Isilinganiso sokumelana nokushisa - Ukulinganisa okuqondile kuqhathanisa ukusebenza kwangempela ngokuqhathaniswa nokuhlosiwe kwedizayini, iqinisekisa impumelelo yamanani ashiwo we-thermal conductivity.
• Ukuhlaziywa kwe-infrared thermography - Ihlonza izindawo ezishisayo zendawo ezibonisa ukuthintana okushisayo okungaphelele endaweni ye-coin-substrate interface edinga ukulungiswa kwenqubo.
• Ukuhlola ukushaqeka kokushisa - Izinga lokushisa eliphakeme kakhulu liqinisekisa ukuzinza kwesakhiwo ngaphansi kwezimo ezishisayo ezisheshayo okuhlangatshezwana nazo ezinhlelweni zokusebenzisa amabhayisikili.

Ukuhlaziya Ubuqotho Besakhiwo

I-microscope yezingxenye ezihlukene ihlola ukwakheka okuyize, ukusatshalaliswa kweresin, kanye nekhwalithi yokusebenzelana kuzo zonke izifunda zenqubo yokushumeka uhlamvu lwemali yethusi. Ukuhlolwa kwe-Shear kusebenzisa amandla aseceleni ukuze kulinganise amandla ebhondi eyimishini, okuqondiswe amanani angaphezu kuka-10 MPa ukuze kunqandwe ukukhishwa kohlamvu lwemali phakathi nengcindezi yokushisa. I-Microsectioning yembula ukungena kwe-resin phakathi kodonga oluqinile futhi iqinisekisa ukugcwaliswa okuphelele okuzungeze amapherimitha wemali.

I-Highleap Electronics yenza ukuhlola okunokwethenjelwa okuphelele ukuze kuqinisekiswe ukusebenza okuzinzile kokushisa nokusetshenziswa kwemishini kuma-PCB ohlamvu lwekhopha kukho konke ukuphila okulindelwe okusebenza.

Isiphetho: Ukukhiqiza Okunembayo Kokwethenjwa Okuphezulu Okushisayo

Ukukhiqiza okuphumelelayo kwe-PCB yohlamvu lwekhopha lwekhopha kuncike ekulawuleni inqubo eqinile ukusuka ekucushweni komgodi kuya ekuhlolweni kokugcina kokuthembeka. Ukunemba okuphezulu kobukhulu ngesikhathi sokumba kwakha isisekelo sokubekwa okunembile kohlamvu lwemali yethusi kanye nokudluliswa kokushisa okuphumelelayo. Izinyathelo ezilawulwayo zokushumeka nezokucwenga ziqinisekisa ukuhlangana okufanele, i-warpage encishisiwe, nokuhleleka okungaguquguquki kwendawo yokwakheka kwesekethe okuthembekile. Ukuqinisekisa okuqinile—ngokugibela ibhayisikili elishisayo, ukuhlolwa kwezigaba ezihlukene, nokuhlolwa kwe-shear—kuqinisekisa kokubili ubuqotho bemishini kanye nokusebenza kokushisa kwesikhathi eside ngaphansi kwezimo zokusebenza ezinzima.

Kwa- Highleap Electronics , ithimba lethu lobunjiniyela lisebenzisa ulwazi olubanzi lokukhiqiza ekukhiqizweni kwe-PCB yezinhlamvu zethusi kanye nokwenza ngcono inqubo yokushumeka. Sihlanganisa imishini yokulungisa i-CNC ngokunemba, ukulawulwa kwe-lamination okuthuthukisiwe, kanye nokuhlolwa kokuthembeka kwangaphakathi ukuqinisekisa ukuthi ibhodi ngalinye lihlangabezana nezidingo zokushisa nezakhiwo zezinhlelo zokusebenza zesimanje ze-power semiconductor. Le ndlela eqhutshwa yinqubo ibonisa ukuzibophezela kwethu okuqhubekayo ekugqameni kobuchwepheshe, ukuthembeka kokukhiqiza, kanye nokuqinisekiswa kwekhwalithi okusobala kumakhasimende ethu omhlaba wonke.