Izinhlobo Zesakhiwo Sohlamvu Lwethusi: Imiklamo ye-Press-Fit, Eshumekiwe, kanye Ne-Inlay

Isingeniso: Ukuqonda Izakhiwo Ze-PCB Ye-Copper Coin

Ekusetshenzisweni kwe-semiconductor yamandla kanye nobuningi obukhulu bokushisa, ubuchwepheshe besakhiwo sezinhlamvu zethusi bube yinto ebalulekile ekuphatheni izinselele zokushabalalisa ukushisa. Njengoba izingxenye zikhiqiza ubuningi bamandla aphezulu, izindlela zokuphatha ukushisa ze-PCB zendabuko zifinyelela imikhawulo yazo. Ukuhlanganiswa kwezinhlamvu zethusi kulungisa lokhu ngokudala izindlela eziqondile zokushisa eziqhuba ukushisa ngqo kusuka kumadivayisi kagesi kuya ezitsheni zokushisa noma ezisekelweni zensimbi.

Izinhlobo ezintathu eziyinhloko zesakhiwo sohlamvu lwemali yethusi zibusa ukukhiqizwa kwamanje: i-press-fit, eshumekiwe, nemiklamo ye-PCB yekhopha ehlanganisiwe. Isakhiwo ngasinye sihluka ngokuyisisekelo endleleni ithusi elihlanganiswe ngayo nezinto ze-dielectric, izendlalelo zethusi, nama-substrates. Lesi sihloko sinikeza onjiniyela bokuklama imibandela esebenzayo yokukhetha uhlaka olufanele lwemali yethusi ukuze kulinganiswe ukusebenza okushisayo, ukwethembeka kwesikhathi eside, nezindleko zokukhiqiza.

Uhlolojikelele lwe-Copper Coin Structure Integration kuma-PCB

Isimiso sokulawula ukushisa kohlamvu lwesiliva lwethusi sigxile ekusunguleni izindlela zokuqhuba ukushisa okume mpo. Ukushisa kugeleza kusuka engxenyeni ngohlamvu lwemali yethusi kuya ngqo esisekelweni sensimbi, kudlule izingqimba ze-dielectric eziphakeme zokumelana nokushisa. Le ndlela eqondile inciphisa kakhulu ukumelana nokushisa kwe-junction-to-case uma kuqhathaniswa nokwakhiwa kwe-PCB evamile.

Umehluko obalulekile phakathi kwezinhlobonhlobo zesakhiwo sohlamvu lwemali yethusi usezindleleni zokuhlanganisa esibonakalayo. Izakhiwo ezilinganisa ukucindezela zithembele ekucindezelweni kokuthintana kwemishini, izinhlobo ezishumekiwe zithola ukuhlangana kwe-metallurgical ngokusebenzisa i-lamination, futhi imiklamo ye-inlay isebenzisa imishini enembile yama-thermal cores afakwe emanzini. Lo mehluko wesixhumi esibonakalayo uthinta ngqo i-impedance eshisayo, ukusatshalaliswa kwengcindezi komshini, kanye nobunzima bokukhiqiza.

Cindezela-Fit Copper Coin Isakhiwo

Ukukhiqiza Process

Izakhiwo zekhopha ezilingana ngokucindezela zisebenzisa ukufakwa ngomshini ukubeka amasilinda ethusi emigodini egayiwe ngaphambili ngaphakathi kwe-PCB. Imali yethusi yenza ukuthintana okuqondile ngokomzimba nezingqimba ze-foil zethusi ezizungezile, isungula iziteshi ezishisayo ngaphandle kwezinto zokubopha ezengeziwe. Ubukhulu bohlamvu lwemali obujwayelekile busukela ku-1.0mm ukuya ku-3.0mm, obunobubanzi obufaniswe nengxenye yezinyathelo.

Izinzuzo Key

Le ndlela yesakhiwo semali yethusi iletha izinzuzo eziningi zokukhiqiza:

• Izindleko zokukhiqiza eziphansi - Izidingo ezincane zamathuluzi kusetshenziswa imishini yokugaya ejwayelekile ye-CNC yehlisa ukutshalwa kwezimali okukhulu.
• Izikhathi zokuhola ezimfushane - Ayikho imijikelezo ekhethekile yokukhiqiza ecindezela kakhulu amashejuli okukhiqiza.
• Ukusebenza okulula - Ukuhlanganiswa kwemishini kuvumela ukushintshwa kwendawo ngaphandle kokukhipha wonke amabhodi.

Ukulinganiselwa Kokusebenza

Isixhumanisi esibonakalayo sokumelana nokushisa kudlula lokho kwezinye izindlela eziboshwe nge-metallurgically. Ijoyinti likamishini lethula ukuvinjelwa okuvela ezikhaleni zomoya ezincane kanye nokuqina kwendawo. Ukuhamba ngebhayisikili okushisayo kudala ingcindezi yokwandiswa okuhlukile endaweni yokusebenzelana yemali-to-cavity, okungenzeka okonakalise ikhwalithi yokuxhumana ngokusebenza okunwetshiwe.

Izicelo ezijwayelekile

Izakhiwo zohlamvu lwemali yethusi elilingana ngokucindezela zithola ukusetshenziswa kumabhodi wamandla ezokuxhumana, amamojula okulawula izimoto, namasekhethi okushayela ezimbonini lapho kwenzeka ukushabalaliswa kwamandla okumaphakathi. Ukusebenza kahle kwezindleko kwenza lesi sakhiwo sikhange ezinhlelweni zokusebenza ezidinga isithuthukisi sendawo esishisayo esingaphansi kuka-50 W/cm².

Uhlobo Lwesakhiwo Semali Yethusi Eshumekiwe

Ukukhiqiza Process

Izakhiwo zohlobo lwemali yethusi ezifakiwe zihlanganisa izinqwaba zethusi ngaphakathi kwe- PCB substrate ngokusebenzisa ukubopha kokucindezela kokushisa ngesikhathi sokulamina. Izinhlamvu zemali zibekwe kahle emihumeni efakwe ngomshini, bese zilaminatelwa ngezingqimba ze-prepreg neze-copper foil ngaphansi kokushisa okulawulwayo kanye nengcindezi. Le nqubo idala izibopho zensimbi phakathi kohlamvu lwemali kanye nezingqimba zethusi zangaphakathi.

Izinzuzo Key

Isibopho esiqondile sensimbi-kuya-metal kulesi sakhiwo sohlamvu lwemali yethusi iletha ukusebenza okuphezulu:

• I-conductivity enhle kakhulu ye-thermal - Ukuhlanganiswa kwe-Metallurgical kuqeda izikhala zomoya, kunciphisa ukumelana nesixhumi esibonakalayo.
• Ukusabalalisa kwengcindezi efanayo - Ukushisa kusakazeka ngokulinganayo kuzo zonke izindawo eziboshiwe, kunciphisa ukwakheka kwendawo eshisayo.
• Ukubekezela kokuhamba ngebhayisikili okushisayo - Igcina ubuqotho ngemijikelezo engaphezu kuka-3000 yonkana -40°C kuya ku-150°C ububanzi.

Izidingo Zokukhiqiza

Inkimbinkimbi yokukhiqiza ikhuphuka kakhulu uma iqhathaniswa nezindlela zokulinganisa umshini. Ukunemba kokuma kwe-CNC kuba okubalulekile ukuze kuvinjwe ukungahambi kahle kwesendlalelo ngesikhathi sokucwala. Inqubo ekhethekile idinga ingcindezi elawulwayo kanye namaphrofayili okushisa, ukwelula isikhathi sokukhiqiza nokwandisa izindleko zeyunithi ngamaphesenti angamashumi amathathu kuya kwamashumi amahlanu ngaphezu kokunye okufanelana nokucindezela.

Izicelo ezijwayelekile

Izakhiwo zohlobo lwemali yethusi ezishumekiwe zisebenzela i-silicon carbide kanye namamojula wamandla we-gallium nitride, amamojula okulawula i-voltage yeseva, kanye nezikhulisamandla ze-RF zesisekelo se-5G. Ukusebenza okushisayo kufakazela izindleko eziphakeme lapho ukwethembeka kwengxenye kanye nezinga lokushisa lokusebenza kuthinta ngokuqondile ukusebenza kwesistimu.

I-Inlay Copper Coin PCB Design

Ukukhiqiza Process

Imiklamo ye-PCB ye-inlay yethusi isebenzisa ukunemba kwe-slot machining ukuze idale izindawo zokuhlala ezamukela amabhlogo ethusi ukusuka phezulu noma phansi. I-copper inlay ihlala igcwele izendlalelo ezizungezile, ihlanganiswe nezindiza zethusi eziwugqinsi ukuze zakhe izakhiwo ezixubile ezishisayo. Ukubekezelelwa komshini kufanele kugcine okungcono kunokunemba kokuma okungu-0.05mm.

Izinzuzo Key

Izakhiwo ze-inlay zinikeza amandla okuphatha okushisayo alungile:

• Indlela eshisayo emfishane – Ukugeleza kokushisa okuqondile kusuka ezingxenyeni ezithile kuya esisekelweni sensimbi kunciphisa izinga lokushisa lokuhlangana.
• Ukushisa okuphezulu okusakazeka - Idizayini efakwe ku-Flush inika amandla ukulungiselelwa kokususa ukushisa okuhlangothi olulodwa noma olukabili.
• Isilinganiso esiphezulu se-thermal conductivity - Isondela ekusebenzeni okuqinile kwe-copper substrate enokumelana okuncane kokubonakalayo.

Izinselele Zokukhiqiza

Lesi sakhiwo sohlamvu lwemali yethusi sidinga ukunemba okwedlulele komshini kanye nokulawulwa ngokucophelela kokucindezeleka okushisayo ngesikhathi somhlangano. Ukulawulwa kobukhulu kubaluleka ukuvimbela i-warpage noma i-delamination ngaphansi kwamabhayisikili ashisayo. Inqubo yokwenziwa okukhethekile ikhawulela ukukhiqizwa ezikhungweni ezinamakhono athuthukile e-CNC.

Izicelo ezijwayelekile

Amamojula wamandla e-IGBT, iziguquli ze-DC-DC kuma-inverter okudonsa kwezimoto, kanye namadrayivu ezimoto amanje aphezulu aphakamisa izakhiwo ze-PCB zekhopha efakiwe. Izinhlelo zokusebenza ezidinga ukuncishiswa kokushisa okungaphezu kuka-100 W/cm² kuyilapho zigcina amazinga okushisa okuhlangana ngaphansi kwemikhawulo ebalulekile zithethelela utshalomali lokukhiqiza.

Ukuhlaziya Ngokuqhathanisa: Ukusebenza Kwesakhiwo Sohlamvu Lwemali Yethusi

Ukuqhathanisa Ukusebenza Okushisayo

Ukusebenza kahle kwendlela yokushisa kukhuphuka kancane kancane kuzo zonke izinhlobo zesakhiwo sezinhlamvu zemali yethusi. Amadizayini alingana nokucindezela anikezela ngezithuthukisi ezongayo zokushisa kwezinhlelo zokusebenza zamandla amaphakathi. Izakhiwo ezishumekiwe zibhalansisa ukusebenza kanye nezindleko zamasemiconductors amandla ajwayelekile. Ukucushwa kwe-inlay kufinyelela ukuhanjiswa kwe-thermal okuphezulu kokuminyana kwamandla okudlulele.

Ukuthembeka kanye Nezindleko

Ukwethenjwa kuhlobana kakhulu nekhwalithi yokuhlanganisa esibonakalayo ezakhiweni zezinhlamvu zemali yethusi. Imiklamo eshumekiwe nefakwe ngaphakathi ikhombisa ukukhuthazela okuphakeme kokuhamba ngebhayisikili, ukumelana nemijikelezo engaphezu kuka-3000 kuwo wonke amabanga okushisa ezimbonini. Izakhiwo ezilingana nokucindezela zibonisa ukusebenza okwamukelekayo emijikelezweni yemisebenzi enzima kakhulu kodwa kungase kudinge ukuncishiswa ezindaweni ezidlulele.

Ukucatshangelwa Kwedizayini Yokukhethwa Kwesakhiwo Semali Yethusi

Izidingo Zokushisa

Izidingo ze-thermal conductivity kufanele zilingane nokuqina nobubanzi bemali yethusi. Izinhlamvu zemali eziwugqinsi zinciphisa ukumelana nokushisa kodwa zandisa inkimbinkimbi yokukhiqiza. Onjiniyela kufanele babale ukuthintana okushisayo okudingekayo ngokusekelwe ekushabalaleni kwamandla kwengxenye kanye nokukhuphuka kwezinga lokushisa okuvumelekile kwe-junction.

Idizayini kagesi kanye neMechanical

Ukuhlukaniswa kukagesi kudinga imvume eyanele phakathi kohlamvu lwemali yethusi nokulandelelwa kwesignali ukuze kuvinjwe ukuhlangana kwe-capacitive noma ukuwohloka kwe-voltage. Izinhlelo ze-high-voltage zingadinga isikhala esengeziwe se-dielectric eduze kwamapherimitha emali. Ukucatshangelwa kwamandla omshini kufaka ukugcinwa kohlamvu lwemali ngaphansi kokudlidliza kanye nokungezwani kokwanda kokushisa.

Ukuhambisana Kwephakheji

Amamojula we-MOSFET kanye namamojula e-IGBT anamaphedi aphansi asobala azuza kakhulu kumadizayini e-PCB ekhopha egxilile noma efakwayo akhulisa ukuhlangana okuqondile okushisayo. Amadivayisi we-silicon carbide asebenza emazingeni okushisa aphakeme ahlanganayo ngokuvamile adinga ukusebenza okushisayo okuphakeme kwezinhlobo zezinhlamvu zemali yethusi ezishumekiwe ukuze kugcinwe amamajini athembekile.

Amandla Okukhiqiza

Ukukhethwa kwesakhiwo kufanele kucabangele ukuqinisekiswa kwamandla omphakeli, ikakhulukazi ezakhiweni ezishumekiwe ezidinga ukuma okunembayo kwe-CNC kanye nezinqubo ezilawulwayo zokubeka impahla. Izidingo zesikhathi sokuhola kanye nevolumu zithonya ukuthi imiklamo yesakhiwo semali yethusi ethuthukisiwe ihlala ibiza izindleko zezinhlelo ezithile zokusebenza.

Isiphetho: Ukukhetha Isakhiwo Semali Yethusi Esifanele

Ukukhethwa kwesakhiwo sohlamvu lwemali yethusi kumelele ukuhwebelana kobunjiniyela okuyisisekelo phakathi kokusebenza okushisayo, ukwethembeka, nezindleko zokukhiqiza. Amadizayini alingana nokucindezela ahlinzeka ngokuthuthukisa ukonga kokushisa kwezinhlelo zokusebenza zamandla amaphakathi. Izakhiwo zohlobo lwemali yethusi elishumekiwe ziletha ukusebenza okulinganiselayo kwamamojula avamile we-semiconductor yamandla. Ukulungiselelwa kwe-PCB yohlamvu lwe-inlay yethusi kufinyelela ukuqhutshwa kokushisa okuphezulu kokuminyana kwamandla okwedlulele lapho ukuphathwa okushisayo kunika amandla ukusebenza komkhiqizo ngokuqondile.

I-Highleap Electronics iletha ukwakhiwa kohlamvu lwemali olunembe:

• Ukwenziwa okushunyekiwe okuthuthukile - Izinqubo ezilawulwayo zokubeka i-lamination ngokuma okuqondile kwe-CNC ukuze kuhlanganiswe ngokugcwele okushisayo.
• Ubuchwepheshe besakhiwo se-inlay - Amakhono omshini wokubekezelela okuphezulu asekela ama-thermal cores afakwe emanzini ukuze alahle ukushisa okukhulu.
• Izixazululo ezishisayo zangokwezifiso - Idizayini yesakhiwo sohlamvu lwekhopha oluqondene nohlelo lokusebenza oluhambisana nezidingo zakho zamandla kagesi.

Xhumana ne-Highleap Electronics ukuze uxoxe ngezixazululo ze-PCB zemali yethusi yezinhlelo zakho zokusebenza ze-semiconductor ezinamandla aphezulu. Ithimba lethu lobunjiniyela linikeza ukwesekwa komodeli wokushisa kanye nesiqondiso sokukhiqiza ukuze kuthuthukiswe ukuthembeka nokusebenza.