Ukukhiqiza Nokuhlanganisa i-DAS Storage Enclosure PCB

I-Highleap Electronics ikhiqiza ama-PCB nama-PCBA e-DAS storage enclosure akhishwe amakhasimende emikhiqizo ye-HDD/SSD ene-single-drive, i-dual-bay kanye ne-multi-bay. Sisekela ukwenziwa kwe-PCB, ukuthola izingxenye, ukuhlanganiswa kwe-SMT/THT, ukulawula i-backplane kanye nesixhumi, ukuhlela/ukucushwa kanye nokuhlolwa kokusebenza kwesitoreji okuchazwe amakhasimende, nge-interface eqondile ye-host, ukwakheka kwe-drive, ukuziphatha kwamandla kanye nemisebenzi ye-RAID/JBOD echazwe ukukhishwa kwe-OEM.

Imindeni Yomkhiqizo we-DAS kanye Nezakhiwo Zesitoreji

I- PCB yokugcina isitoreji se-DAS kufanele ikhishwe iye ekukhiqizeni njengeplatifomu yokugcina echaziwe, hhayi nje "njengebhokisi le-USB drive." Isitoreji esinamathiselwe ngqo singasukela ebhodini lebhuloho elinomshini owodwa kuya ku-chassis yedeskithophu enama-bay amaningi ene-backplane, ukusatshalaliswa kwamandla, ukulawula ukupholisa kanye nemisebenzi ye-RAID/JBOD yokuzikhethela. Ku-Highleap, umsebenzi wokukhiqiza uqala ngokukhomba isikhombimsebenzisi somsingathi, imidiya yokushayela, inani le-bay, i-topology yokulawula, umthombo wamandla, okulindelwe kwe-hot-swap, imishini yokuvala kanye nomngcele wokuhlola amakhasimende we-SKU ngayinye.

Izinhlobo Ezivamile Zokuvalelwa Kwe-DAS kanye Nezinguquko Ku-PCB

I-HDD DAS ene-bay eyodwaNgokuvamile igxile ebhulohweni elilodwa lokugcina izinto, isixhumi se-SATA esisodwa, ukuguqulwa kwamandla kanye ne-enclosure I/O. Umklamo ulula ngokwemishini kodwa indawo yesixhumi kanye nokulingana kwedrayivu kuhlala kubalulekile ekukhiqizeni.

I-DAS enama-bay amabiliIngeza isiteshi sesibili sokushayela futhi ingasekela amadiski azimele, ama-JBOD noma amamodi e-RAID achazwe yisilawuli. Ukuqalisa amandla, isibonakaliso sesimo kanye nokuhlolwa kokusebenza kwamadrayivu amabili kuba okubaluleke kakhulu.

I-DAS enama-bay amane kuya kwayisishiyagalombiliNgokuvamile kwethula ibhodi yokulawula ezinikele noma enkulu, izixhumi zokushayela eziphindaphindwayo, ukulawula abalandeli, ukusatshalaliswa kwamandla okuyinkimbinkimbi kanye nesidingo esinamandla sokulungiswa kwesixhumi esisekelwe ku-fixture.

I-USB-C DASIsebenzisa isixhumi se-host yohlobo C, kodwa ikhono ledatha ye-USB elisetshenzisiwe kanye nanoma yikuphi ukuziphatha kwendima yamandla kuncike kumlawuli kanye nomklamo. Uhlobo C lodwa akumele lusetshenziswe njengesimangalo sokusebenza.

Isitoreji se-USB4 noma i-ThunderboltIsigaba sesivinini esiphezulu kuphela uma ukwakheka kwesilawuli esikhishwe kusebenzisa ngempela lobo buchwepheshe. Imingcele ye-stack-up, ukulahleka kwesiteshi, ama-retimer kanye nokuhambisana nomthetho ingase ihluke kakhulu kwisitoreji se-USB esivamile.

I-SATA SSD DASIhlanganyela ingxenye enkulu yokwakheka kwebhuloho le-SATA nemikhiqizo ye-HDD kodwa isusa ukuziphatha kokuqala kwe-spindle futhi ivame ukuvumela izindawo ezincane ezivalekile, ishintshela ukunaka ekubekweni okuqinile kanye nokushisa kwesilawuli sebhuloho.

I-NVMe DASIsebenzisa ukwakheka okuhlanganisa isikhombimsebenzisi se-host kwisitoreji se-PCIe/NVMe uma kucacisiwe. I-M.2 mechanics, i-PCIe routing kanye nokuziphatha okuqhubekayo kokushisa kuhlukile kwisitoreji se-SATA.

I-Hot-swap / i-removable-bay DASKudinga ukuqina kwesixhumi sedrayivu, ukulungiswa kokufakwa, ukuziphatha okuchaziwe kokulawula amandla kanye nohlelo lokuhlola olubonisa ukwakheka kwe-hot-plug ye-OEM kunokucabanga ukuthi yonke imikhiqizo yokugcina iziphatha ngendlela efanayo.

Isiteshi sokufaka isitorejiUmkhiqizo ovulekile noma ovulekile kancane owenzelwe ukufakwa njalo kwedrayivu. Ukusekelwa kwesixhumi, amandla okufakwa komsebenzisi kanye nezindlela ze-ESD eziveziwe kubalulekile njengesekethe yebhuloho uqobo.

I-DAS enokukhethwa kwe-RAID/JBODIngeza izilawuli zemodi, ukucushwa kwe-firmware kanye nokuziphatha kwe-drive-state okumele kukhiywe ku-matrix ehlukile. Amamodi e-RAID asekelwayo akufanele anqunywe kusukela ku-bay count.

Ikilasi le-DAS	Ukwakhiwa kwebhodi okujwayelekile	Ukugcizelelwa kokukhiqiza
Indawo ebiyelwe ngedrayivu eyodwa	Ibhodi lebhuloho + isixhumi sedrayivu eyodwa	Umzila omncane, indawo yokuxhuma, i-FCT eyisisekelo
Indawo ebiyelwe ngama-dual bay	Ibhuloho/isilawuli + amadrayivu amabili	Ukulandelana kwamandla, i-logic yesimo, ukuhlolwa kwama-drive amabili
Indawo ebiyelwe ngama-multi-bay	Ibhodi lokulawula + i-PCB yesitoreji sangemuva	Izixhumi eziphindaphindwayo, amandla, ifeni/ukushisa, ukulungiswa kwemishini
I-NVMe ebiyelwe	Ibhuloho lokusingatha + indlela ye-PCIe/NVMe	Umzila wesivinini esikhulu, imishini ye-M.2, ukuqinisekiswa kokushisa

Uma uthenga, lo mbono womndeni womkhiqizo uvimbela amaphutha amabili avamile okucaphuna: ukuphatha yonke indawo ebiyelwe njenge-PCBA efanayo ngoba isixhumi sangaphandle sibukeka sifana, nokuqhathanisa abahlinzeki ngentengo engenalutho ngaphandle kokubala izinto ezifakiwe ngemuva, imidiya yokuhlola idrayivu, uhlelo lwe-firmware, ihadiwe yokushisa noma ukulingana kokugcina kwendawo ebiyelwe.

Indlela Inani Ledrayivu Elishintsha Ngayo Isethi Yebhodi

Inani ledrayivu lishintsha kakhulu kunobuningi besixhumi. I-single-bay enclosure ivame ukubeka ibhuloho, ukuguqulwa kwamandla kanye nesixhumi sedrayivu ebhodini elilodwa. Umkhiqizo we-four-or-eight-bay ungahlukanisa leyo misebenzi phakathi kwebhodi le-host/controller, i- backplane yokugcina kanye nebhodi lamandla noma le-front-panel. Lokho kuhlukaniswa kuthinta inani lekhebula, i-board-to-board interfaces, ama-mechanical datums kanye nohlelo lapho ama-subassemblies angahlolwa khona. I-RFQ kufanele ibone isethi ephelele yebhodi ukuze i-PCB eyodwa ingacashunwa ngaphandle kwezixhumi ezinquma ukuthi i-enclosure iyasebenza yini.

Ukucushwa kwe-DAS	Ukugcizelelwa okungenzeka kokukhiqiza	Ubufakazi be-NPI okufanele bucelwe
I-HDD/SSD ebiyelwe ene-bay eyodwa	Ibhuloho le-IC, isixhumi sedrayivu eyodwa, indlela yamandla encane	Ukuqashelwa komsingathi, idrayivu eyodwa yokubhekisela, ukulingana kwe-enclosure
I-DAS / JBOD enama-bay amabili	Iziteshi ezimbili zokushayela, imodi/i-logic yokulungiselela, umthwalo wokuqalisa ophezulu	Womabili ama-bay agcwele, ukuziphatha kwemodi, ukulandelana kwamandla
Ideskithophu engu-4–8 bay DAS	I-Backplane, ukusatshalaliswa kwamandla aphezulu, ama-fan/LED harnesses	Inani labantu abasebenzisa yonke indawo, ukugijima kokushisa, ukuqondanisa izixhumi
Indawo yokushintshana eshisayo	Izindlela zokufaka eziphindaphindwayo, izindlela zokuba khona/zokuthola ukushayela	Inqubo yokufaka/yokususa kanye nokuziphatha kokuthola okuchazwe amakhasimende
I-DAS egxile ku-NVMe	Ukwakhiwa kwebhuloho le-PCIe/NVMe, ubuningi obukhulu bendawo obushisayo	Uhlu lwe-SSD oluvunyiwe, indlela yokudlulisa okuqhubekayo kanye nokuqinisekiswa kokushisa

Lezi zinhlobo ziphinde zihlangane ne -hard-drive PCB kanye nehadiwe yesitoreji-seva, kodwa akufanele zihlukaniswe zibe ikhasi elilodwa elijwayelekile. I-DAS enclosure ichazwa ukwakheka kwe-host/storage okukhishwe kanye nomkhiqizo wemishini, kuyilapho ama-drive electronics ngokwawo eyizihlanganisi ezihlukene.

I-Backplane, Izixhumi Zedrayivu kanye Nemishini Yama-Multi-Bay

Ku-DAS enama-bay amaningi, insimu yesixhumi sedrayivu ephindaphindwayo ivame ukuba yisici sokukhiqiza esivelele. I-backplane ingase ithwale izixhumi ze-SATA, oxhumana nabo bamandla, ama-LED, izifunda zokubona ubukhona, ama-fan headers kanye nezixhumanisi zebhodi nebhodi eziya ekhadini lokulawula. Umdwebo we-PCB, ishidi ledatha lesixhumi kanye nemodeli ye-chassis mechanical kufanele kuvunyelwane nge-bay pitch, ukujula kokuhlangana kanye nendawo yedatha. Ukuhlanganiswa okulungile ngogesi kusengabangela ukwehluleka ukuhlanganiswa kwesistimu uma isixhumi esisodwa sitshekile noma sishintshiwe ngokwanele ukudala amandla okufaka amaningi.

Izilawuli Zemishini Zokuqandisa Ngaphambi Kokwakhiwa Kwe-Pilot

I-Bay pitch kanye ne-connector coplanarity: Sebenzisa i-fixture noma i-chassis datum ukuqinisekisa izixhumi eziphindaphindwayo kunokuzihlola ngamehlo ngayinye ngayinye.
Indlela yokufaka umthwalo ngamandla: Ukufakwa kwedrayivu kufanele kuphendulwe yizisekelo zemishini eziklanyiwe; amajoyinti e-solder akufanele abe yinto eyinhloko yokwakha.
Izixhumanisi zebhodi nebhodi kanye nekhebula: Uma i-backplane ixhumeka ebhodini lokulawula, khipha ukuphakama kokuhlangana, i-pinout, i-keying kanye nobude bekhebula njengedatha elawulwayo yemishini/kagesi.
Ukulungiswa kwe-LED kanye nepayipi lokukhanya: Ama-LED e-drive-status avame ukusondelana nezixhumi futhi angaphazamiseka ngisho nalapho umsebenzi kagesi udlula.
Ihadiwe yokushintshana okushisayo: Amaswishi kagesi, imisebenzi yokushaja ngaphambi kokushaja noma yokuqalisa ngezigaba kumele ilandele umklamo we-OEM. Ukukhiqiza kufanele kuphinde kukhiqize ukuziphatha okukhishwe esikhundleni sokwengeza izici ezijwayelekile "zokushintshana okushisa".

I-Highleap ingahlanganisa ukwenziwa kwe-backplane nokuhlanganiswa kwe-PCB kanye nokuhlolwa kwemishini lapho ikhasimende linikeza i-geometry yokwamukelwa. Lokhu kuwusizo kakhulu kunokuhlolwa kwesixhumi esijwayelekile ngoba kuqinisekisa ibhodi ngokumelene nemingcele efanayo yomzimba ebekwe yi-enclosure yokugcina.

I-Host Interface, iBhuloho kanye nokulawula uhlangothi lwesitoreji

Isixhumi esibheke kumphathi kanye nemidiya eseceleni kwesitoreji azichazi isilawuli sangaphakathi ngokwazo. I-USB-to-SATA DAS ingasebenzisa ibhuloho lokugcina elizinikele; umkhiqizo we-multi-bay ungangeza i-port multiplier, isilawuli se-RAID noma i-MCU; kanti umkhiqizo we-NVMe usebenzisa indlela ehlukile yebhuloho eya kwisitoreji se-PCIe/NVMe. Ngakho-ke iphakheji ye-BOM kanye ne-firmware kudingeka ithole isilawuli esiqondile, i-crystal/oscillator, i-configuration EEPROM noma i-flash, ama-power rails kanye nanoma yimaphi amadivayisi okungafanele ashintshwe ngaphandle kwemvume yobunjiniyela.

Izilawuli Zesivinini Esiphezulu Nokucushwa

Umzila we-USB: Gcina i-geometry yokwehluka ekhishwe, izindiza zokubhekisela, ukuqhekeka kwesixhumi kanye nokuqhubeka kokubuya kwamandla kagesi. Uma kudingeka i-impedance elawulwayo, amanothi okukhiqiza kufanele asho okuqondiwe kunokuthembela ekuqoqweni okujwayelekile kwefektri.
Umzila we-SATA: Gcina iziteshi zokuhlukanisa eziseceleni kwesitoreji ziboshwe ekubekweni kwe-stack okukhishwe kanye nokubekwa kwesixhumi. Amadokhumenti obunjiniyela kufanele asebenzise isikhombimsebenzisi se-SATA esisekelwayo sangempela kunokuba asebenzise amagama abasebenzisi angacacile.
Ukusekelwa kwe-UASP: Iphrothokholi ye-SCSI enamathiselwe ku-USB iyiphrothokholi yesitoreji se-USB echaziwe, kodwa ukwesekwa kuncike ku-firmware yebhuloho/isilawuli kanye nendawo yomsingathi. Ifanele ukuhlolwa kokukhiqiza kuphela uma ukukhishwa kwe-OEM kudinga lokho.
Inkumbulo yokucushwa: Okuqukethwe kwe-EEPROM/flash, ama-ID edivayisi, izinqubomgomo zamandla kanye nezilungiselelo zemodi kufanele kulawulwe inguqulo kanye nokubuyekezwa kwehadiwe.
Ukuthola ingxenye: Kubalawuli bebhuloho, amakristalu nezixhumi zokugcina, sebenzisa ukutholakala kwezingxenye ezilawulwayo ngezinketho ezivunyiwe esikhundleni sokushintshaniswa okubangelwa yizindleko ngemva kokuvunyelwa kweprototype.

Umngcele wokukhiqiza

Ukukhiqizwa kufanele kuphinde kukhiqize indlela yesignali ekhishwe, inani lesilawuli kanye nokucushwa. Ukuhambisana kwe-Host, ukuziphatha kwe-RAID kanye nokusebenza kwesitoreji kuhlala kuyimisebenzi ye-silicon evunyelwe, i-firmware, isethi yedrayivu, uhlelo lwe-host kanye ne-enclosure kunokuba kube yizibikezelo ezisekelwe esigabeni se-PCB.

Ukusatshalaliswa Kwamandla, Umthwalo Wokuqalisa kanye Nokulawula Ukushisa

Umklamo wamandla ushintsha kakhulu emndenini we-DAS. Umkhiqizo wedrayivu encane engu-2.5 intshi ungase uklanywe uzungeze amandla ebhasi le-host, kuyilapho amadrayivu edeskithophu angu-3.5 intshi kanye nezinhlelo ze-multi-bay ngokuvamile zidinga ukunikezwa kwangaphandle kanye nokusatshalaliswa kwamandla aphezulu. Izinhlelo zamadrayivu amaningi kumele futhi zibheke isu lokuqalisa elikhishwe, ukulahlekelwa kokuguqulwa, amandla okuxhuma, amandla efeni kanye nokuphathwa kwamaphutha. Umhlinzeki we-PCB kufanele aqinisekise ithusi, ngezakhiwo, izilinganiso zokuxhuma kanye nehadiwe yokushisa ngokumelene nephakheji yokuklama esikhundleni sokusebenzisa umthetho owodwa "we-PCB yokugcina" kuwo wonke umkhiqizo.

Izingozi Zokukhiqiza Eziphathelene Nogesi Nokushisa

Ukuqala kwedrayivu: Qinisekisa izimo zokuqala/zokulayisha ezichazwe ngamakhasimende ngamamodeli edrayivu acacisiwe noma imithwalo emele; ungafaneleki ibhodi kusukela ku-idle current kuphela.
Izixhumi zamandla eziphindaphindwayo: Hlola ukugcwaliswa kwe-solder, ukwesekwa kwemishini kanye nokuhambisana kwendlela yamanje kuyo yonke indawo, ikakhulukazi uma kusetshenziswa izingxenye zesitayela se-THT noma zesitayela se-press-fit.
Ukushisa kwebhuloho/isilawuli: Izivalo ezincane zingabamba ukushisa eduze kwesilawuli ngisho noma indawo yokugcina izinto ipholile. Ama-thermal pad, ithusi elisakazekayo kanye nezindawo zokuthintana nezivalo kumele zihambisane nomdwebo womshini.
Imisebenzi ye-fan kanye ne-temperature-sensor: Lapho kukhona, ama-fan header, amasignali okubamba kanye nokuzwa izinga lokushisa kufanele kufakwe esivivinyweni sokusebenza esikhundleni sokuphathwa njengezinto zesistimu ezingahlobene.
Inethiwekhi yokusabalalisa amandla: Uma umklamo uzwela kakhulu kumanje, buyekeza Ukusatshalaliswa kwamandla e-PCB amanothi, izindawo zethusi kanye nezindlela zokubuya njengengxenye ye-DFM.

Umhlangano we-DAS PCBA, i-NPI kanye nokuhlolwa kokusebenza

Uhlelo oluwusizo lwe-DAS NPI luhlola ukuhlanganiswa njengomkhiqizo wokugcina, hhayi nje njengebhodi eligcwele abantu. Ukwakhiwa kokuhlola kufanele kusebenzise indawo ebiyelwe noma i-mechanical fixture ehlosiwe, ama-drive amele, ihadiwe yokusingatha evunyiwe, i-firmware ekhishwe kanye nezintambo ezichaziwe. Inhloso ukuguqula i-prototype eyamukelekile ibe isisekelo sokukhiqiza esiphindaphindwayo esingahlukanisa amaphutha okugoqa, izinkinga zokuxhuma, izinkinga ze-firmware kanye nokuziphatha okuqondene nedrayivu.

Ukugeleza Kokuhlolwa Kokukhiqizwa Kwe-DAS Okunconyiwe

Ukuhlolwa kokucushwa: Qinisekisa ukubuyekezwa kwe-PCB, i-bay-count variant, i-firmware/imemori yokucushwa, inani lezixhumi kanye nesethi yelebula.
Amandla kanye nokuhlolwa okufushane: Qinisekisa imigqa ebalulekile ngaphambi kokufaka amadrayivu amakhasimende bese uqopha noma yimiphi imikhawulo echaziwe yokuqalisa noma yamanje.
Ukutholwa kwe-Per-bay: Qinisekisa ukuthi yonke indawo enabantu ithola idrayivu yokubhekisela echaziwe kanye nezinkomba zesimo zisebenza njengoba zikhishwe.
Ukuhlolwa kokushayela ngasikhathi sinye: Ngemikhiqizo enama-multi-bay, sebenzisa zonke iziteshi ezidingekayo ndawonye kunokwamukela isixhumi ngasinye sodwa.
Umsebenzi wokugcina isitoreji: Sebenzisa inqubo yokufunda/ukubhala noma yethrafikhi echazwe yikhasimende, okuhlanganisa i-UASP noma ezinye izindlela kuphela uma zichaziwe.
Ukulingana kwemishini: Faka i-PCBA ku-chassis noma ku-representative fixture ukuqinisekisa ukulungiswa kwe-bay, ama-LED, izinkinobho, izixhumi zefeni kanye ne-I/O yangaphandle.

I-Highleap ingenza ukuhlolwa kokusebenza okuchazwe ngamakhasimende uma isethi yedrayivu, ipulatifomu yokusingatha, i-firmware, izinto ezifakiwe kanye nezindlela zokwamukelwa zinikezwa. Ukuhambisana okubanzi kohlelo lokusebenza, iziqu zokugcina isikhathi eside kanye neziqu zomthengisi wedrayivu kuhlala kugxile kakhulu emisebenzini yamakhasimende/yohlelo ngaphandle kokuthi kunenkontileka ehlukile.

Ukuhlanganiswa Kwezinga Lesistimu Kuba Okubalulekile Emikhiqizweni Yama-Multi-Bay

Njengoba indawo ebiyelwe ithola abalandeli, amathreyi okushayela, amabhodi e-LED, ama-adapter kagesi kanye nama-PCBA amaningana, isivuno sokugcina sincike kakhulu ekuhlanganisweni kwesistimu. Ukucindezeleka kwesixhumanisi, ukuqondisa ikhebula, ukuhlanganiswa kwezikulufo, ukuvaleka komoya kanye namakheji okushayela angaqondani kahle kungadala ukwehluleka okungabonakali ngesikhathi sokuhlolwa kukagesi kwebhodi elingenalutho. Uma i-Highleap icelwa ukuthi yakhe ngale kwe-PCBA, ukuhlanganiswa kwebhokisi kufanele kucashunwe kuphakheji yemishini ekhishwe kanye nokuhlolwa kohlelo lokugcina oluchaziwe kunokwengezwa ngokungahleliwe ngemva kokuhlanganiswa kwe-PCB.

Idatha yekheji lokushayela: qinisekisa ukuthi izixhumi ze-SATA/SAS/NVMe, kuye ngomkhiqizo okhishwe, ziyahlangana ngaphandle kokuphoqa i-backplane.
Indlela yefeni kanye nokuhamba komoya: qinisekisa ukuqondiswa kwefeni, i-polarity yesixhumi kanye nezindawo zokungenisa umoya ezingavimbelwe ngaphambi kokuhlolwa komshayeli we-thermal.
Ibhodi lephaneli engaphambili: Ama-LED, izinkinobho kanye nezinombolo ze-bay kufanele kufane ne-firmware ye-host kanye nelebula le-enclosure.
Okokufaka kwamandla kwangaphandle: uhlobo lwesixhumi, indlela yamanje kanye nokugcinwa kwemishini kufanele kuhlolwe ngokumelene ne-adaptha yangempela noma isikhombimsebenzisi se-PSU.
Ukuhlanganisa kabusha: Amabhodi okulawula, i-backplane kanye ne-UI/amandla kumele agcinwe ezibuyekezweni ezivunyiwe ezihambisanayo ngesikhathi sokukhiqiza okuphindaphindiwe.

Kusukela ku-DAS Prototype kuya ku-Repeat Production

I-RFQ enamandla yomkhiqizi we -DAS enclosure PCB kufanele ifake iphakheji ephelele yokwenziwa kanye nokuhlanganiswa, hhayi ama-Gerber kuphela. Emikhiqizweni ye-multi-bay, faka imodeli ye-enclosure, ulwazi lwedatha ye-backplane, imidwebo yesixhumi sedrayivu, izibikezelo zokunikezwa kwamandla, ihadiwe yefeni/yokushisa, amafayela e-firmware/okucushwa, imidiya yokuhlola kanye ne-SKU matrix. Lokhu kuvumela i-DFM ukuthi ibone imibuzo yokukhiqiza ngaphambi kokuba kubekwe abalawuli besitoreji ababizayo, izixhumi kanye nezingxenye zemishini.

Izinhlelo Ezihlobene Zokugcina Isitoreji se-PCB/PCBA

I-RAID enclosure PCBIngeza izindlela ze-array eziqondene nesilawuli, i-firmware/ukulawula ukucushwa kanye ne-matrix ebanzi yokuhlola ama-drive amaningi.

I-PCB yangaphandle ye-HDD ebiyelweUmkhiqizo webhuloho eliqhutshwa kanye noma elilula elinamandla e-SATA kanye nokucatshangelwa kwe-mechanical-drive.

I-PCB ye-SSD yangaphandleIngasebenzisa isitoreji se-SATA SSD noma se-PCIe/NVMe futhi ivame ukucindezela kakhulu ekwakhiweni kokushisa okuqinile.

I-PCB ye-NAS enclosureKuxhunywe kunethiwekhi kunokuba kuxhunywe ngqo; ngokuvamile kufaka phakathi isilawuli/ibhodi eliyinhloko kanye ne-backplane kanye ne-interface yenethiwekhi.

I-backplane yeseva yesitorejiUkuxhumeka kwedrayivu ephindaphindwayo okunobuningi obuphezulu okugcizelela kakhulu ukulungiswa kwesixhumi, ukulungiselelwa kanye nokusatshalaliswa kwamandla.

I-PCB ye-adaptha ye-USB-to-SATAIbhodi eligxile ebhulohweni elisetshenziswa ezintanjeni, kuma-adaptha nasezikhungweni zokufaka izintambo ngaphandle kohlelo oluphelele lokuvala olunama-bay amaningi.

Isiteshi sokumisa i-Hard-driveUkufakwa njalo kwedrayivu kwandisa ukuguguleka kwesixhumi, ukuvezwa kwe-ESD kanye nezidingo zokusekelwa kwemishini.

I-PCB yesitoreji sezinto/isevaUhlelo oluseduze lwesigaba seseva lapho izixhumi zesitoreji zihlanganiswa khona ekwakhiweni okukhulu kokubala kanye nenethiwekhi.

I-Highleap ingasekela ukukhiqizwa kwe-prototype okuphindaphindiwe ngokubuyekezwa kwe-DFM , ukuhlolwa kwesihloko sokuqala kanye nemibhalo yokuhlanganiswa elawulwayo. Isisekelo sokukhiqiza kufanele sivale ukubuyekezwa kwe-PCB, ukuhlanganiswa, ama-BOM/alternates avunyiwe, i-firmware, inqubo yokuhlola, ukubuyekezwa kwe-fixture kanye nemigomo yokwamukelwa kwemishini ukuze ama-lot kamuva aqhathaniswe nokwakhiwa kwe-NPI okwamukelwe esikhundleni sencazelo yomlomo.

I-Highleap Electronics • Ukukhiqiza i-PCB kanye ne-PCBA

Isibuyekezo Sokukhiqiza se-DAS Storage Enclosure PCB

Thumela amafayela e-PCB akhishwe, i-BOM, idatha yokuhlanganisa, imikhawulo yemishini, iphakheji yokuhlela noma yokulungiselela, izidingo zokuhlola kanye nobuningi obuqondiwe ukuze kubuyekezwe ukukhiqiza.

Cela Isilinganiso se-DAS Storage Enclosure PCB → Xoxani Ngokwakhiwa Kwakho kwe-PCBA →

✓ Ukubuyekezwa kwe-DFM kanye ne-DFA ✓ Uhlobo lokuphinda ukukhiqizwa ✓ Ukwenziwa nokuhlanganiswa kwe-PCB

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Ungayithola kanjani ikhotheshini yama-PCB

Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:

- Gerber, ODB++, noma .pcb, spec.
- Uhlu lwe-BOM uma udinga ukuhlangana
- Ubuningi
- Isikhathi sokushintsha

Ngaphezu kokukhiqiza ama-PCB, sinikeza uhla oluphelele lwezinsizakalo ze-elekthronikhi, okuhlanganisa ukwakheka kwe-PCB, i-PCBA, kanye nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo nge-prototyping, ukuqinisekiswa komklamo, ukuthola izingxenye, noma ukukhiqizwa ngobuningi, sinikeza ukwesekwa kusukela ekuqaleni kuze kube sekupheleni ukuqinisekisa impumelelo yephrojekthi yakho.

Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.