I-PCB Eguquguqukayo Yamafoni Agoqekayo | Ubunjiniyela Ikusasa Lobuchwepheshe Bamaselula

Ukuvela kwamafoni agoqekayo kumelela okunye kokusungula izinto ezintsha okubaluleke kakhulu kwezobuchwepheshe beselula kusukela ekuguqukeni kwama-smartphone. Okuyisisekelo salawa madivayisi kukhona ubuchwepheshe be-PCB obuguquguqukayo , obuvumela izindlela zokugoqa ezingenamthungo eziguqula indlela esisebenzisana ngayo namadivayisi ethu. Lawa mabhodi wesekethe akhethekile kumele abekezelele imijikelezo yokugoqa engaphezu kuka-200,000 ngenkathi egcina ubuqotho bukagesi kanye nezindinganiso zokusebenza zidlula ama-PCB aqinile endabuko.

Ukuqonda I-Flexible PCB Architecture kumafoni Agoqekayo

Ama-PCB aguquguqukayo asebenza njengohlelo olubalulekile lokuxhuma kumafoni asongekayo, ahlanganisa izingxenye ezimbili zedivayisi ngomshini wehinge. Ngokungafani namabhodi aqinile avamile, lezi zixazululo ze-PCB eziguquguqukayo zivumela ukugoba okuguquguqukayo okunerediya okuqinile njengo-1.5mm kuyilapho kusekela ukudluliswa kwedatha ngesivinini esiphezulu ku-50-ohm impedance. Isakhiwo ngokuvamile sisebenzisa imiklamo ye-multilayer flex elungiselelwe izinhlelo zokusebenza zefoni ezigoqekayo.

Ukubekwa kwama-PCB aguquguqukayo ngaphakathi kwamafoni asongekayo kudinga ubunjiniyela obunembayo ukuze kulawuleke ukusatshalaliswa kwengcindezi. Onjiniyela bamisa la masekethi eduze kwe-eksisi engathathi hlangothi ukuze kuncishiswe amandla aqinile nacindezelayo ngesikhathi sokusebenza kokugoqa. Lokhu kubekwa kwamasu kwandisa isikhathi sokuphila sokusebenza ngokuphawulekayo, okuvumela amadivayisi ukufeza izidingo ezisezingeni lomkhakha.

Imiklamo yesimanje yamafoni asongekayo e-PCB ahlanganisa umzila okhethekile ezindaweni ezihinjisiwe lapho kugxila khona ukucindezeleka kwemishini. I-PCB eguquguqukayo kufanele igcine ubuqotho besignali ngenkathi igoba izinkulungwane zezikhathi nsuku zonke. Amathuluzi okulingisa athuthukile asiza onjiniyela babikezele amaphuzu okucindezelwa futhi bathuthukise ukulandelela izakhiwo ngaphambi kokukhiqizwa kwe-prototype.

Ukukhetha Okubalulekile Kwe-PCB Eguquguqukayo Kumafoni Agoqekayo

I-Substrate Materials kanye nezakhiwo

Ama-PCB aguquguqukayo athembekile kumafoni asongekayo athembele kuma- substrate e-polyimide asebenza kahle kakhulu aziwa ngamandla awo, ukumelana nokushisa, kanye nokuguquguquka. Izinto ezibalulekile okufanele uzicabangele zifaka:

• Uhlobo lwezinto - Amafilimu e-Polyimide (PI), ngokuvamile 12.5-25 μm obukhulu, hlinzeka ngebhalansi enhle kakhulu yokuguquguquka nokuzinza kwe-dimensional yokubhaliswa kwesekethe okunembayo.
• Ukusebenza okushisayo – Imelana namazinga okushisa aze afike 400 ° C, okuqinisekisa ukuzinza ngesikhathi sokusoda nokusebenza kwedivayisi.
• Izinhlobonhlobo ze-Adhesiveless - Amamaki e-polyimide athuthukile asusa izendlalelo zokunamathisela, ehlisa ukujiya okuphelele cishe 25% kanye nokwenza ngcono ukuthembeka kokugoba.
• Ukuqina kwemvelo - Ufanelekile nge 1,000+ imijikelezo yokushisa kusuka ku -40°C kuya ku-+125°C, igcina izakhiwo ezingaguquguquki zemishini nezikagesi.
• Ukuhambisana kwe-CTE - I-coefficient of thermal expansion (CTE) efaniswe eduze nethusi inciphisa ingcindezi ngesikhathi sokushintshashintsha kwezinga lokushisa.

Ukukhetha Komqhubi Nokuthuthukisa

Amakhondaktha e-Copper adlala indima ewujuqu ekukhuthazeleni kwemishini kanye nokuthembeka kwesignali yama-PCB efoni egoqekayo. Ukucatshangelwa kobunjiniyela kufaka:

• Uhlobo lwethusi
  • I-Rolled Annealed (RA) Ithusi - Ikhethwa ngokwakhiwa kwayo okusanhlamvu okude, umnikelo ~ 40% ukumelana nokukhathala okuphezulu kune-electrodeposited (ED) yethusi.
  • Electrodeposited (ED) Copper - Izonga kakhulu kodwa izifanele kancane izifunda eziguqukayo.
• Ukujiya kwethusi - Ngokujwayelekile 12-35 μm, Nge I-18 μm njengebhalansi ekahle phakathi kokuguquguquka nekhono lokuthwala lamanje.
• Ubuso buqeda
  • OSP (I-Organic Solderability Preservative) - Ihlinzeka ngokuvuleka okuhle kakhulu kokuhlanganiswa kwephimbo elihle ngenkathi igcina ukuguquguquka okuphezulu.
  • ENEPIG (I-Electroless Nickel Electroless Palladium Immersion Gold) - Inikeza ukuqina okuphakeme nokumelana nokugqwala kwemiklamo enokwethenjelwa okuphezulu.

Lelisu lempahla ehlelekile liqinisekisa ukuthi ama-PCB efoni asongekayo afinyelela kokubili ukuguquguquka kwemishini kanye nokuzinza kukagesi phezu kwemijikelezo ebanzi yokugoqa.

Inqubo Yokukhiqiza Ethuthukisiwe Yamafoni Agoqekayo PCB

Ukukhiqiza ama-PCB avumelana nezimo wamafoni asongekayo kudinga ukunemba okukhethekile kuzo zonke izigaba. Inqubo ihluke kakhulu ekukhiqizeni i-PCB eqinile ngenxa yezidingo zokuphatha izinto ezihlukile kanye nokucatshangelwa kokuvumelana nezimo. Nakhu ukuhlukaniswa okuningiliziwe kwezigaba zokukhiqiza ezibalulekile:

1. Ukulungiselela Impahla Nokusingatha

Inqubo iqala ngokukhethwa ngokucophelela nokulungiswa kwamafilimu e-polyimide namafoyili ethusi okukhiqizwa kwe-PCB okuguquguqukayo. Izinto ezisetshenziswayo zifakwe ku-conditioning ku-23°C kanye no-50% womswakama ohlobene amahora angu-24 ngaphambi kokucubungula. Amakamelo ahlanzekile akhethekile anamazinga e-Class 10,000 avimbela ukungcoliswa okungase kubangele amaphutha kuzinhlelo zokusebenza ze-PCB ezigoqekayo zamafoni.

2. Ukwakhiwa Kwesekethe Nge-Photolithography

Amasistimu wokuthwebula izithombe nge-laser adala amaphethini wesekethe ngokunemba okungu-25-micrometer kuma-substrates e-PCB aguquguqukayo. Uhlelo lokusebenza lwe-photoresist ludinga ukumbozwa okukhethekile kwesifutho ukuze kuqinisekiswe ukujiya okufanayo kuzo zonke izinto eziguquguqukayo. Amapharamitha wokuhlanganisa amakhemikhali alungiselelwe ithusi eligoqiwe, eligcina ukubekezelela okungu-±10% kubukhulu obubalulekile.

3. Inqubo ye-Multilayer Lamination

Izendlalelo eziningi zezinto eziguquguqukayo ze-PCB zithola i-lamination enembile ku-185°C kanye nengcindezi engu-250 PSI. I-vacuum lamination eyisipesheli ivimbela ukungena komoya phakathi kwezingqimba, iqinisekisa ukwakhiwa okungena-ze. Ukunemba kokubhalisa kugcina ama-micrometer angu-±25 phakathi kwezendlalelo, okubalulekile kumadizayini amafoni asongekayo asondelene kakhulu e-PCB.

4. Nge-Formation and Metallization

I-UV laser drilling kudala ama-microvias abe mancane njengama-micrometer angu-50 ububanzi kuma-substrates e-PCB aguquguqukayo. I-electroless copper deposition elandelwa yi-electrolytic plating yakheka ngemiphongolo ukuya ku-20 micrometers ukujiya. Ikhemikhali yokucwenga ivumela ukunwebeka okushisayo kwe-polyimide, ukuvimbela ukuqhekeka kwemiphongolo ngesikhathi sokuhamba ngebhayisikili elishisayo.

5. I-Surface Qeda Isicelo

Izembozo ezivikelayo zivikela amasekhethi e-PCB aguquguqukayo ekulimaleni kwemvelo ngenkathi kugcinwa ukugoba. Izembozo ezibonakalayo ezinesithombe zinikeza ukunemba kokubhaliswa kwama-micrometer angu-10 uma kuqhathaniswa nama-micrometer angu-75 wekhava yefilimu evamile. Okubalulekile kwesembozo kufana nokuguquguquka kwesisekelo se-substrate ukuvimbela ukubola ngesikhathi sokugoqwa.

6. Ukuhlolwa Kwekhwalithi Nokuqinisekisa

Yonke i-PCB eguquguqukayo yamafoni asongekayo ihlolwa ngogesi nangokomshini ngaphambi kokuthunyelwa. Ukuhlola okuzenzakalelayo kokubona kuhlonza okungalungile kuze kufike kuma-micrometer angu-25, kuyilapho ukuhlolwa kophenyo olundizayo kuqinisekisa ukuqhubeka kukagesi. Ukuhlolwa kokugoba okunamandla kuqinisekisa ukusebenza ngemijikelezo yokuqala eyi-1000 njengokuhlolwa kokukhiqiza.

Ubunjiniyela Bokwethenjwa be-PCB Eguquguqukayo Kumafoni Agoqekayo

Amaphrothokholi Wokuhlola Ukugoba Anamandla

Ukuhlola okuphelele kuqinisekisa ukuqina kwe-PCB okuguquguqukayo ngaphansi kwezimo zokusetshenziswa kwefoni ezigoqekayo zomhlaba wangempela. Okokusebenza kokuhlola kusebenza ukugoba okulawulwayo emijikelezweni engama-60 ngomzuzu, kulingisa iminyaka yokusetshenziswa phakathi nezinsuku. Amapharamitha ahlanganisa irediyasi yokugoba (1.5-5mm), i-engeli yokugoba (amadigri angu-0-180), kanye nemvamisa yomjikelezo ilinganiselwe kumaphethini wangempela womsebenzisi.

Ukuqapha ngogesi kulandelela izinguquko zokumelana kumasekhethi abalulekile ngesikhathi sokugoba, ngemibandela yokwamukela edinga ushintsho olungaphansi kuka-5% ngemva kwemijikelezo engu-200,000. Izivumelwano ezithuthukisiwe zihlanganisa izinga lokushisa lokuhamba ngebhayisikili ukusuka ku -20°C ukuya +60°C kanyekanye nokugoba. Lokhu kuhlolwa kwengcindezi okuhlanganisiwe kuveza izindlela zokuhluleka ezingabonakali ngaphansi kwezimo zokucindezeleka okukodwa.

Ukuqinisekiswa Kwengcindezi Yemvelo

Ama-PCB aguquguqukayo ezingcingo ezigoqekayo ahlolwa kabanzi ngemvelo ngale kokuqinisekiswa kwemishini. Izinga lokushisa lokuhamba ngebhayisikili lifinyelela ku-40°C kuya ku-+85°C emijikelezweni engu-1000, liqinisekisa ubuqotho obuhlangene be-solder nokuzinza kwezinto. Ukuhlolwa komswakamo ku-85°C/85% RH amahora angu-1000 kulingisa iminyaka emihlanu yokusetshenziswa okujwayelekile.

Ukuchayeka kwesifutho sikasawoti amahora angama-96 kuqinisekisa ukumelana nokugqwala kwamakhondaktha aveziwe kuzingcingo ezigoqekayo zePCB. Ukuhlolwa kokushaqeka okushisayo nokuguquka okusheshayo phakathi kwezinga lokushisa elidlulele kuqinisekisa ukumelana ne-delamination. Lezi zivivinyo ezibanzi ziqinisekisa ukusebenza okuthembekile ezindaweni ezihlukahlukene zomhlaba.

Dizayina Amasu Okuthuthukisa Amafoni Agoqekayo PCB

Ukunciphisa Ukucindezeleka Ngokusebenzisa Umzila Ohlakaniphile

Ukuthuthukisa umzila wokulandelela ezindaweni ezigobile kuba nomthelela omkhulu ekuthembekeni okuguquguqukayo kwe-PCB kumafoni asongekayo. Imikhondo ewela i-perpendicular ku-axis egoqiwe isakaza ingcindezi ngokulinganayo kunomzila ohambisanayo. Ukusebenzisa izinguquko zobubanzi bokulandelela kancane kancane kususa amaphuzu okugxilisa ingqondo aqala ukwehluleka.

Amaphethini okulandelela inyoka ezindaweni ezinengcindezi ephezulu andisa impilo yokusebenza ngo-40% uma kuqhathaniswa nomzila oqondile. Lezi zici zengeza izindleko ezincane ngenkathi zihlinzeka ngokuthuthukiswa kokuthembeka okukhulu kwemiklamo ye-PCB yamafoni asongekayo. Ukulinganisa ithusi kwamasu kuzo zombili izinhlangothi ze-PCB eguquguqukayo kuvimbela ukugoqa futhi kunciphisa izinselele zokuhlangana.

Ukulawulwa Kokuphazamiseka Kwezinhlelo Ezinamandla

Ukugcina ubuqotho besignali ngezindawo ezigobekayo kudinga ukumodelwa kwe-impedance ngokucophelela kwemiklamo ye-PCB eguquguqukayo . Indawo ye-dielectric iyashintsha njengoba i-PCB igoba, okungenzeka ibangele ukushintshashintsha kwe-impedance okungaphezu kuka-10%. Ukulingisa okuthuthukisiwe kubikezela lokhu kushintsha, okuvumela ukulungiswa komklamo ngaphambi kokukhiqizwa kweprototype.

Ukwehluka kwemizila ehambisana nokuhlangana okuqinile kunciphisa ukuhluka kwe-impedance ngesikhathi sokugoba kuzinhlelo zokusebenza ze-PCB ezigoqekayo. Ukusikwa kwendiza ephansi ngaphansi kwezindawo ezigobile kunciphisa ukuqina ngenkathi kugcinwa ukuvikela okwanele. Lawa masu aqinisekisa ukuthi amasignali anesivinini esiphezulu agcina ubuqotho ngokusebenzisa izigidi zemijikelezo egoqiwe.

Okusungulwe Kwekusasa ku-PCB Eguquguqukayo Yamafoni Agoqekayo

Izisetshenziswa ze-Substrate Yesizukulwane Esilandelayo

Ama-substrates e-Liquid crystal polymer (LCP) avela njengezinto ezibalulekile kumafoni asongekayo wesikhathi esizayo. Ziletha ukusebenza okuphezulu kwemvamisa ephezulu kulungele i-5G kanye nobuchwepheshe obuzayo be-6G, obuhlanganisa: - I-Dielectric constant: cishe ku-2.9 - Ukulahleka kwe-tangent: ngaphansi kuka-0.002 Lezi zakhiwo zinika amandla ukudluliswa kwegagasi kwe-millimeter okuphumelelayo nokulahlekelwa kwesignali okuncane.

Ugesi Onwebekayo Nophrintiwe

Ucwaningo lwe-PCB olushintshashintshayo lwesigaba esilandelayo luhlola ubuchwepheshe be-elekthronikhi obunwebekayo nobuphrintiwe: – Ama-PCB anwebekayo angase avumele amaphethini okugoqa anezikhombisi-ndlela eziningi noma ayinkimbinkimbi, asekele izici zamafomu edivayisi entsha. – Imishini kagesi ephrintiwe kusetshenziswa i-inki ekwazi ukwehlisa izindleko zokukhiqiza ngenkathi ithuthukisa ukuguquguquka kwedizayini. Ngokubambisana, lezi zinguquko zingacindezela ubude besikhathi befoni obugoqekayo ngaphezu kwemijikelezo engu-500,000.

Ukuhlanganisa kanye Nokupakishwa Okuthuthukile

Ukuhlanganisa ama-PCB aguquguqukayo ngokuqondile nezibonisi eziguquguqukayo kuqeda izixhumi, ukuthuthukisa ukwethembeka komshini kanye nokunciphisa ukujiya kwedivayisi kukonke. Ukwengeza, okunamathiselwe kwe-chip okuqondile kuma-flex substrates ngobuchwepheshe bokupakisha obuthuthukile kwenza kube lula ukuhlanganisa futhi kuthuthukisa ukusebenza kukagesi.

Lezi zinto ezintsha zihlangene zivula indlela yamafoni amancane, athembeke kakhudlwana asongekayo anokusebenza okuthuthukisiwe nempilo ende yesevisi.

Isiphetho

Ubuchwepheshe be-PCB obuguquguqukayo buyisisekelo sedizayini yefoni yesimanjemanje egoqekayo, evumela izici zefomu elihlangene, ukudluliswa kwedatha ngesivinini esikhulu, nokuqina kwemishini yesikhathi eside. Ukuthuthukiswa kwayo kudinga indlela ehlukahlukene—ukuhlanganisa isayensi yezinto zokwakha, ukuguquguquka kwemishini, kanye nokukhiqizwa okunembayo. Njengoba amadivaysi asongekayo eqhubeka nokuguqukela ekulungiseni okuncane, okulula, nokunamandla kakhulu, ukusebenza kwe-PCB okuguquguqukayo nokuthembeka kuzohlala kungukhiye wokuqamba izinto ezintsha.

Kwa-Highleap Electronics, sinikeza izixazululo zokukhiqiza ze-PCB eziguquguqukayo eziphelele zamadivayisi asongekayo esizukulwane esilandelayo. Amakhono ethu afaka:

• I-Polyimide kanye nokucutshungulwa kwe-substrate okuthuthukisiwe kwamasekhethi aguquguqukayo amancane kakhulu, athembeke kakhulu

• I-Precision multilayer flex kanye nokwakhiwa kwe-PCB eguquguqukayo eqinile enokulawula okuqinile okuqinile

• I-laser drilling kanye ne-cone-line etching yemiklamo ehlangene, enokuminyana okuphezulu

• Ukuhlola ukwethembeka okuphelele ukuze kuqinisekiswe impilo yomjikelezo omude ngaphansi kokugoqa okuphindaphindiwe

• Ukusebenzisana kwezobunjiniyela kusuka ku-DFM kuya ekukhiqizweni ngobuningi ukuze kube nesivuno esithuthukisiwe nokusebenza

Uzakwethu ne-Highleap Electronics ukuze ulethe izinto ezintsha zefoni yakho ezigoqekayo ukuze zimakethe ngokushesha. Xhumana nethimba lethu namuhla ukuze uxoxe ngezidingo zephrojekthi yakho futhi uhlole izixazululo ezivumelana nezimo ze-PCB.