Umkhiqizi Othembekile we-HDI Flex PCB | I-Highleap Electronic

Ngaphezulu kweminyaka eyishumi, i-Highleap Electronics ibe ngumholi esizukulwaneni esilandelayo µVia technologies. Njengoba i-laser yendabuko nge-plating isondela emikhawulweni yayo, ama-PCB ethu aguquguqukayo e-HDI ashayela ikusasa lokusebenza nokuthembeka kukagesi. Ngokusebenzisa i-µVia encane njengo-50 μm kanye nekhopha izacile njengo-8 μm, siphusha imingcele yokuminyana kumaphakheji kagesi ahlangene.

Ngaphambili kobuchwepheshe be -FPC (Flexible Printed Circuit), i-Highleap Electronics ivumela ukwenziwa kube lula kwamadivayisi e-3D ane-radii egobile ephansi kakhulu kanye namakhono e-Ultra-HDI. Lokhu kuphumelela kuvumela ukudalwa kwezinto ezincane, ezigqokwayo ezihlanganisiwe kakhulu kanye nezinhlelo zokusebenza zesignali ezinabantu abaningi.

Ngerekhodi elifakazelwe kumasekhethi aguquguqukayo, sinikeza imikhiqizo enezibalo zesendlalelo kusukela kokungu-1 ukuya kokungu-16, esebenza ngamafoil e-polyimide azacile kakhulu (azacile njengo-12.5 µm) nezinsimbi zokunamathisela ezinembayo ezinembayo. Ama-vias ethu abholwe nge-laser amancane njengo-35 µm ububanzi angagcwaliswa ngethusi ukuze kwakhe izakhiwo ezithuthukisiwe ngephedi, okuqinisekisa ukwethembeka okuphezulu nokuphindaphinda kuwo wonke umkhiqizo.

Izinzuzo ze-HDI Flex PCBs

Amasekhethi e-High-Density Interconnect (HDI) avumelana nezimo anikeza uhla lwezinzuzo ngaphezu kwamasekethe avumelana nezimo, okuhlanganisa:

1. Izindleko Eziphansi Nosayizi Omncane: Ukwanda kobuningi besekethe kungasusa izendlalelo ezengeziwe, konge kufika ku-40% uma kuqhathaniswa nemiklamo engeyona i-HDI.

2. Ukupakishwa Kwezingxenye Ezithuthukisiwe: I-HDI ivumela amakhono esici se-high-I/O kanye ne-fine-pitch.

3. Izinketho Ezengeziwe Zokuklama Nokuguquguquka: Ama-microvia angaboni futhi afihliwe avumela ukuqondisa umqhubi ezingqimbeni zangaphakathi ngaphansi kwama-via, okudala isikhala sokuklama esisebenziseka kakhulu ngengqimba ngayinye.

4. Ukusebenza Okuthuthukisiwe Kukagesi kanye Nobuqotho Besignali: Ama-Microvia kumasekethe anesivinini esikhulu athuthukisa ukusebenza kukagesi ngokuvumela izindlela zesekethe ezimfushane, ukunciphisa ama-stub, kanye nokukhuluma okuphansi nomsindo.

5. Ukusebenza Okuthuthukisiwe Kokushisa Nokuthembeka: Ama-Microvia anciphisa ukucindezeleka kokushisa kwe-z-axis phakathi kwezingqimba eziseduze.

6. Ukusebenza Kahle Kwezindleko Okuthuthukisiwe: Usayizi wephaneli ye-Highleap Electronic ongu-18” x 24” (45.7 cm x 61 cm) ukhulisa ubuningi bephaneli, okwandisa ukusebenza kahle kwenqubo yokuhlanganisa.

Uhlolojikelele lwekhono le-HDI Flex PCB

Kwa-Highleap Electronics, ubuchwepheshe bethu be-HDI Flex PCB yakhelwe ukuminyana okuphezulu, imiklamo ehlangene esebenza ngendlela eyisimanga. Sinikeza ama-PCB aguquguqukayo asukela kwezingu-3 kuye kweziyi-16, aklanyelwe ukuhlangabezana nezidingo zezinto zikagesi zesimanje.

Ama-HDI Flex PCB ethu afaka osayizi be-microvia abancane njengo-50 μm abaqediwe, abanomugqa ocolekile nesikhala esingu-50 μm. Ubuchwepheshe bokwakha obulandelanayo obuthuthukisiwe buvumela i-vias enokwethenjelwa eyimpumputhe nengcwatshwe, kuyilapho ithusi ngokugcwaliswa iqinisekisa ukuqina kwesikhathi eside. Bheka ithebula elingezansi ukuze uthole ukubuka konke okunemininingwane yamakhono ethu we-HDI Flex PCB, elungiselelwe izinhlelo zokusebenza ezisebenza kahle kakhulu.

Izinto ezisetshenziswa kuma-HDI Flex PCBs

Izinto ezisetshenziswa kuma-HDI Flex PCBs zikhethwe ngokucophelela ukuze kuqinisekiswe ukusebenza okuphezulu nokuthembeka ezinhlelweni ezahlukahlukene. Ngezansi ukubuka konke kwezinto ezibalulekile ezisetshenziswa enqubweni yokukhiqiza:

• Ikhava/I-Substrate
• Ifilimu ye-Polyimide: Itholakala ngogqinsi obungu-½ mil (12μm), 1 mil (25μm), 2 mil (50μm), 3 mil (75μm), kanye 5 mil (125μm)
• I-Liquid Photoimageable Coverlay (LPI): Isetshenziselwa ukuvikela indawo eqondile futhi eqinile.
• Conductor
• Copper: Inikezwa ngobukhulu obuhlukahlukene: 1/8 oz. (5μm), 1/4 oz. (9μm), 1/3 oz. (12μm), 1/2 oz. (18μm), 1 oz. (35μm), 2 oz. (71μm), 3 oz. (107μm)
• I-Stiffener
• I-Epoxy-Glass (FR-4), Polyimide-Glass, Polyimide, Copper, Aluminium: Isetshenziselwa ukuthuthukisa ubuqotho besakhiwo kanye nokuvumelana nezimo.

Amaphuzu Avelele Ezobuchwepheshe we-HDI Flex PCBs

• Izixazululo ze-Turnkey flex eziqondise ukwenziwa kwe-3D miniaturization
• Okuthembeke kakhulu, okuqinile kwe-multilayer flex/microvia substrates
• Izinto eziyisisekelo ezincanyana kakhulu
• Kugcwaliswe nge-stack ngenqubo etholakalayo
• Izici eziyinkimbinkimbi zosizo lwemishini/yokuhlanganiswa, okuhlanganisa amaphrofayli akhethekile, imigqa egoqiwe, ukusikwa, kanye nezindawo/imigodi yokugoba ezacile.
• Amabhodi okugoqa
• I-Chip-on-flex (COF), i-chip-scale packaging (CSP) substrates, nama-BGA
• Izinhlobonhlobo zokuqedwa kwendawo, kufaka phakathi i-OSP, i-ENIG, i-ENEPIG, i-E-AU, ne-DIG
• Ukuhamba ngendiza
• Ukuhlolwa kokugoba kwamasekhethi aguquguqukayo
• Izintambo eziguquguqukayo zomugqa ocwebe kakhulu

Kungani Usebenzisa I-Blind Via Flex PCBs

Emiklamo yesimanje ye-PCB eguquguqukayo, izakhi eziminyana kakhulu—ezifana nalezo ezitholakala kuma-PCB aqinile—zivame ukudingeka. Ukuze kuhlangatshezwane nalezi zingxenye, ama-pass angaboni kahle kanye/noma agqitshiwe abalulekile ukuze imigqa yesignali yomzila iphumelele ngaphakathi komklamo. Omunye wabashayeli abavame kakhulu lesi sidingo iphakethe le-BGA elingu-0.4mm.

I-Vis eyimpumputhe ivumela amasiginali ukuthi adluliselwe ukusuka kuphedi ye-BGA SMT kuya kwesendlalelo esilandelayo bese kuya ngaphandle. Kumadivayisi wokubala amaphini amaningi, ama-vias angeziwe angaboni futhi agqitshwe ngokuvamile ayadingeka ukuze kuqinisekiswe umzila wesignali ofanele nokusebenza okuthembekile.

Kodwa-ke, ukusebenzisa lezi zindlela kumiklamo ye-PCB eguquguqukayo kuveza izinselelo eziyingqayizivele uma kuqhathaniswa nama-PCB aqinile, ngenxa yomehluko wezinto zokwakha nezinqubo zokukhiqiza. Ukuvumelana nezimo kwe-substrate, kanye nezindlela ezinembayo zokumba nezindlela zokucwenga ezidingekayo, kwenza ukuklama okungaboni ngama-PCB aguquguqukayo kube inqubo ekhethekile kakhulu.

Iqhaza le-Via-in-Pad ku-High-Layer Count Flex PCB Designs

Kumadizayini e-PCB aguquguqukayo anezibalo eziphezulu zezingqimba ezisebenzisa izendlalelo zangaphandle ezinobuningi obukhulu, indawo eyengeziwe esetshenziselwa ama-pad ahlukene kanye nezingxenye ze-SMT inciphisa isikhala esitholakalayo sokuphuma kwe-trace fan. Ukuklama i-via-in-pad kuma-PCB aguquguqukayo naqinile kungandisa kakhulu ubuningi ngokusebenzisa ama-via njengama-pad okufaka. Ama-via ayisicaba agcwele ithusi noma isiliva avumela izingxenye zokunamathisela ngqo ezimbotsheni.

Nakuba ubuchwepheshe be-via-in-pad bungakhulula indawo eyengeziwe yokulandelela umzila, kukhona amaphuzu ambalwa okufanele uwaqaphele uma usebenzisa lolu hlobo lokwakha nge-flex. Abakhiqizi bavamise ukugcwalisa i-PCB eqinile yamaphedi e-SMT nge-epoxy conductive, ipuleti le-copper, bese bewabeka phansi. Nokho, le ndlela ayivamile ukusetshenziswa kuma-flex microvias noma i-laser vias ngenxa yobunzima bokukhipha izinsalela ezingafuneki kuphaneli ye-flexible PCB.

Inqubo entsha nethuthukisiwe ye-flat via-in-pad kuma-PCB aguquguqukayo amaningi ihlanganisa ukugcwalisa i-vias ngohlobo olukhethekile lwe-copper plating. Le chemistry yokucwenga igcwalisa i-laser ukusuka phansi ukuya phezulu, idale ingaphezulu eliyisicaba ngendlela efanele. Nakuba i-dimpling encane ingabonakala ngokuvamile, ayivezi inkinga kubahlanganisi. Lobu buchwepheshe bokucwenga busetshenziswa ezinhlobonhlobo zama-PCB aguquguqukayo futhi aqinile.

Ukuze uthole isibuyekezo esiphelele sokukhiqiza, sebenzisa lesi sihloko kanye nokusekelwa kokukhiqiza izinto zikagesi kanye nokukhiqizwa kwe-PCB okuguquguqukayo uma uhlola izidingo ze-stackup, ukuhlanganiswa, noma ukuhlolwa.

Isiphetho

Sekukonke, ama-PCB e -Highleap Electronic e-HDI flex kanye nobuchwepheshe obusha obusebenzisa i-blind via kushintsha isimo se-flexible circuitry, okunikeza ukuguquguquka okukhulu komklamo, ukuthembeka, kanye nokusebenza kwe-electronics yesizukulwane esilandelayo. Ngokugxila ekuthuthukisweni kobuchwepheshe kanye nokwaneliseka kwamakhasimende, i-Highleap Electronic iyaqhubeka nokuhola imboni ekuhlinzekeni ngezixazululo ezisezingeni eliphezulu zezidingo zebhodi lesifunda le-flexible flexible, rigid-flex, kanye ne-rigid ultra-HDI/microvia kuzo zonke izimboni.