Ukwakhiwa kwe-VIPPO PCB kwe-BGA kanye ne-Thermal Pad Designs

I-Highleap Electronics inikeza ukwenziwa kwe-VIPPO PCB kwemiklamo edinga izakhiwo ezisebenzisa i-in-pad ezine-fill echaziwe kanye nendawo ebekwe phezu kwayo. I-VIPPO ivame ukucaciswa ngaphansi kwamaphakheji e-BGA noma e-LGA acwebezelayo, ama-thermal pad avelelayo kanye nezakhiwo ezixineneyo lapho ama-via avamile avulekile noma afakwe amatende engafaneleki. Uma umhlinzeki wakho we-PCB wamanje engakwazi ukuhlangabezana nezidingo ze-via fill, cap noma finished-pad, sithumelele amafayela okwenziwa ukuze siwabukeze.

Isilinganiso sokukhiqiza se-VIPPO PCB esithembekile kumele sichaze ukwakhiwa kwe-via kunokuthembela emushweni othi “via in pad” kuphela. Ububanzi be-Via, i-geometry ye-pad, uhlobo lokugcwalisa, isivalo sethusi, ukwakheka okuhlelekile, ukuqeda ubuso kanye nemigomo yokuhlola konke kuthinta izindleko, isikhathi sokuhola kanye nemiphumela yokuhlanganiswa. I-Highleap ibuyekeza le mininingwane icabanga ngohlelo lokusebenza oluhlosiwe ukuze ukwakhiwa okucashuniwe kufane nesakhiwo esidingekayo.

Kuyini Ukwenziwa kwe-VIPPO PCB?

I-VIPPO imele i-Via-In-Pad Plated Over. I-via itholakala ngaphakathi kwephedi yesakhi, igcwaliswe kusetshenziswa inqubo ecacisiwe, ihlelwe ngendlela ehlelekile njengoba kudingeka, bese ibekwa ngethusi ukuze kudalwe indawo yephedi eqhubekayo. Igama elithi “Vula” aliyona ingxenye yesifinyezo; lichaza isimo sokuvuleka noma sokuchayeka futhi kufanele lichazwe ngokwehlukana lapho kufanele khona.

• Indawo etholakala ngaphakathi kwephedi: i-via ingaphakathi komhlaba wengxenye kunokuba iseduze kwayo.
• Imininingwane yokugcwalisa: amanothi okudweba noma okwenziwa akhomba izinto ezidingekayo zokugcwalisa kanye nezindinganiso zokwamukelwa; i-resin kanye nokugcwalisa okuqhubayo akukwazi ukushintshaniswa.
• Ubuso obumboziwe: Ithusi libekwa phezu kwe-via egcwele ukuze kwakheke indawo eqhubekayo, eshibilikayo. Ukuqina, ubuqotho besivalo kanye nokuphela kwendawo kufanele kuchazwe lapho kusetshenziswa.

Isizathu somehluko obalulekile ukuthi eziningana zalezi zinyathelo zingakhethwa ebhodini elijwayelekile futhi ngayinye engeziwe ishintsha lokho umenzi okufanele akulawule. I-A via ebholiwe futhi efakwe amatende empeleni imahhala. Isakhiwo se-VIPPO sidinga ukugcwaliswa okulawulwayo, ukuhleleka njengoba kudingeka, isivalo sethusi kanye nochungechunge lokuqeda ubuso. Ukuvulwa kwemaski yesolder ezungeze iphedi eliqediwe kuchazwe ngokwehlukile; akufanele kudidaniswe ne-a evulekile noma engagcwalisiwe. Umhlinzeki wezinto ezibonakalayo angakutshela ukuthi “senza ngephedi” futhi asho inguqulo egcwele futhi evalwe, inguqulo evalwe amatende, noma inguqulo exhunywe nge-resin, ngakho-ke amagama kufanele afakwe kumanothi obuciko.

I-VIPPO vs i-Open Via kanye ne-Filled Via-in-Pad PCB Designs

Lona umehluko ovame ukubangela ukuthi isilinganiso sihambe. Umugqa ngamunye ongezansi unesakhiwo esihlukile somzimba esinomzila ohlukile wokushisa, izindleko ezihlukile, kanye nengozi ehlukile yokwehluleka.

Umugqa wesithathu kuphela ongu-VIPPO wangempela. Uma umklamo uthi “ngokusebenzisa iphedi, vula” ngaphandle kokucacisa ukugcwalisa, umenzi angaletha noma yikuphi kwalokhu okune. Umhlahlandlela wethu wokugcwalisa nge-copper plating uhlanganisa izinqubo zokugcwalisa kanye ne-cap ngokuningiliziwe, futhi umehluko phakathi kwezindlela zokugcwalisa nge-resin kanye ne-metal fill uchazwe ku- resin-plugged via construction yethu.

Kungani Kufanele Usebenzise I-Copper-Capped Via-in-Pad Kuma-PCB E-BGA?

Kuphedi yokushisa, umgomo uyindlela yokushisa ebikezelwayo esuka kuphedi iye esakhiweni sethusi sebhodi. Indlela egcwaliswe kahle futhi efakwe ipulasitiki ihlinzeka ngendawo eqhubekayo yokunamathisela futhi igwema indlela yokuxhuma i-solder enembobo evulekile ehlotshaniswa ne-via engagcwalisiwe. Ukusebenza kokushisa kusaxhomeke ezintweni zokugcwalisa, nge-array, izendlalelo zethusi ezixhunyiwe kanye ne-stackup ezungezile.

Impikiswano efanayo iyasebenza ku-RF. I-via efakwe amatende futhi ehlezi phakathi nendawo yendiza yomhlabathi iyisiqephu esincane sokungaqhubeki; i-via egcwalisiwe futhi efakwe ipulasitiki iwubhedu oluqhubekayo. Emklamo lapho i-via ibekwa ngamabomu ukuze iphule indiza noma idale i-stub eyaziwayo, kuyasebenza i-logic ephambene futhi i-via kufanele ivuleke, hhayi i-tent, ukuze isakhiwo sichazwe kunokuba sibe ngengozi.

Ngenxa yokuthi i-via ivulekile, ukuqeda kobuso kuba yimfuneko esebenzayo kunokuba kube yinto yobuhle. I-ENIG iyindlela evamile yokukhetha i-via ezohlanganiswa kuyo, ngoba ihlala ithambekile futhi ingahlanganiswa isikhathi eside. I-ENEPIG isetshenziswa lapho ukusebenza kokushisa kwesiliva lokucwilisa kufunwa khona kanye nendawo ehlanganiswayo. Isiliva lokucwilisa lizongcola emoyeni ophethe isibabule, okubalulekile uma amabhodi ehlala endaweni yokugcina ngaphambi kokuhlanganiswa. Ukukhetha kwethu ukuqeda kobuso kwamabhodi e-RF nama-microwave kuhlanganisa lokhu kushintshana, futhi izinketho ezijwayelekile ziqhathaniswa enkambisweni yethu yokuqeda kobuso be-ENIG.

Inqubo Yokukhiqiza ye-VIPPO PCB: Ngokugcwalisa kanye ne-Copper Capping

Uchungechunge olungezansi luchaza ukuthi kungani ibhodi le-VIPPO lingelona nje ibhodi elijwayelekile elinenothi elinamathiselwe. Isinyathelo ngasinye siwumjikelezo ohlukile onezilawuli zaso, futhi i-oda alilungiseki kalula.

Imininingwane emibili kulelo thebula inquma ukuthi inqubo iyasebenza yini. Eyokuqala ukulawula ukugcwalisa nokulungiselela ubuso ngaphambi kokuvala, okuthinta ukunamathela kwe-cap kanye nokulingana. Eyesibili incazelo ye-solder-mask ezungeze iphedi eliqediwe: ukuvulwa kwe-mask kumele kufane nephethini yomhlaba wephakheji, futhi akufanele kushiye insalela ye-mask engafuneki ebusweni obungashintshwa. Ubudlelwano phakathi kokugcwalisa, i-cap kanye ne-mask buhlanganiswe ngokuningiliziwe ekukhiqizweni kwethu kwe-HDI PCB.

I-Vias ye-VIPPO Egcwele Ithusi vs Egcwele I-Resin

Uma umklamo udinga i-via egcwele, efakwe i-plated-over, izinto zokugcwalisa ziyisinqumo esinemiphumela yangempela. Izinketho ezimbili ezivamile insimbi ne-resin, futhi azikwazi ukushintshaniswa.

• Ukugcwaliswa kwe-Copper paste ikhiqiza ikholomu yensimbi eqinile. Iqhuba ukushisa kanye nomsinga, futhi ingafakwa phezu kwayo ngqo. Iyancipha ngesikhathi sokusila, ngakho-ke imbobo kumele ibe ncane kancane kunethagethi, futhi idinga iphrofayili yokusila engeke ilimaze i-laminate. Lena ukukhetha okufanele lapho i-via kufanele ithwale ukushisa noma umsinga uye engqimbeni engaphakathi.
• Ukugcwaliswa kwe-resin ivala i-via futhi ingahlinzeka ngobuso bokuhlela nokuvala okulandelayo. I-resin ngokuvamile ayihambisani nokushisa kakhulu kunethusi, ngakho-ke indlela yokushisa kumele ihlolwe ngokumelene nomklamo ohlosiwe kunokuba kucatshangwe ukuthi ukugcwalisa i-resin kanye nokugcwalisa ithusi kusebenza ngendlela efanayo.

Kukhona ezinye izinhlobo ezimbili. I-Via fill by lamination isebenzisa ifilimu yokugcwalisa ku-prepreg ukuze ukugcwalisa kusetshenziswe kumjikelezo ofanayo wokucindezela njenge-lamination, okuyindlela ejwayelekile yezakhiwo ze-microvia ekwakhiweni okulandelanayo. Ukugcwalisa okukhethiwe kugcwalisa kuphela ama-via aqokiwe kuphaneli equkethe kokubili okugcwalisiwe nokungagcwalisiwe ngezakhiwo, okuyindlela ibhodi ene-vias ezishisayo endaweni eyodwa kanye nama-vias avaliwe nge-resin kwenye indawo enziwa ngayo. Ukushintshana kwendlela ye-resin kuchazwe ekhasini lethu le-resin plug hole, futhi uhlobo lwenqubo oluncike okulandelaneni luchazwe ku -lamination yethu elandelanayo yama-HDI PCB.

Izidingo Zokuhlanganisa Nokushisela ze-VIPPO PCB ze-BGA

Ukugoqa i-solder kuyinkinga enkulu lapho i-solder ingangena endaweni evulekile noma engavaliwe ngokuphelele. Iphedi ye-VIPPO egcwaliswe kahle futhi efakwe i-plated yenzelwe ukuhlinzeka ngendawo eqhubekayo egoqekayo. Ingozi yokuhlanganisa ingase ivele ngenxa yokukhubazeka kwe-cap, ukugoqa ngokweqile, ukulingana okubi, i-geometry yephedi engafanele noma ivolumu engalungile ye-solder-paste, ngakho-ke umenzi kanye nomhlanganisi kufanele bavumelane ngemigomo yokwamukela ngaphambi kokwakhiwa kokuqala.

Kunezindlela ezintathu lokhu okulawulwa ngazo, futhi zisetshenziswa ngokuhlanganiswa:

• Iphedi echaziwe futhi ngokusebenzisa i-geometry. Cacisa ububanzi, usayizi wephedi, iphimbo kanye nesivalo sethusi esidingekayo ukuze iphedi eliqediwe lisekele umdwebo wengxenye kanye nomklamo wemaski we-solder.
• Ukunciphisa ukuvuleka kwe-stencil ephepheni. I-stencil yokunamathisela yephedi eveziwe incishisiwe endaweni ukuze ivolumu yokuqala yokusongelwa ihambisane nalokho okudingwa yijoyinti, kunokuba kube yivolumu indawo yephedi engaphakamisa. Lokhu kuyindlela yokulawula ohlangothini lokuhlanganisa, futhi kufanele kuvunyelwane ngayo nomhlanganisi, hhayi nje nomenzi.
• Ukuqinisekiswa kokugcwalisa, isivalo kanye nobungako. Izinto zokugcwalisa ezichaziwe, ubuqotho besivalo kanye nokulingana kwendawo eqediwe kufanele kuhlolwe ngokuhambisana nomdwebo. Ukukhetha okuhle kokugcwalisa kuncike ezidingweni zikagesi, zokushisa, zemishini kanye nezokuthembeka.

Imithetho yokuklama eyenza lokhu kusebenze ibekwe ku -RF PCB yethu ngokuklama , futhi inqubo yokuhlangana ichazwe enqubweni yethu yokuhlanganisa i-PCB . Uma umklamo une-VIPPO kanye nendawo yokushisa edingayo, kufanelekile ukuvumelana ngokunciphisa i-stencil kanye nephethini ye-via kokubili nomenzi kanye nommenzi ngaphambi kwendatshana yokuqala, ngoba izinhlangothi ezimbili kufanele zihambisane.

Amaphutha E-VIPPO PCB Avamile kanye Nezingozi Zokuthembeka

Lezi yiziphambeko lapho isakhiwo se-VIPPO singaphumelela ekuhlolweni okubonakalayo kodwa siqhubeke sihluleka ukusebenza.

• Gcwalisa izikhala. Ikholomu enesikhala phakathi iqhuba okungaphansi kwalokho okushiwo umdwebo futhi ayibonakali ebusweni. Lapho ukusebenza kokushisa kuyisishayeli somklamo, lesi yisici esibaluleke kakhulu, futhi yingakho ukulawula inqubo yokugcwalisa kunokuba ukugcwalisa kubonakale kuyinto okufanele ixoxwe ngayo.
• Ukususwa kwe-cap. Isibopho sesivalo siyahlukana nokugcwalisa, sishiya isikhala endaweni ecindezeleke kakhulu esakhiweni. Lokhu kubonakala njengesekethe evulekile ngemva kokujikeleza kokushisa.
• Amaphutha esivikelo noma ebusweni. Ukufaka izitsha, ukungcola, ukuhlukaniswa kwe-cap noma ukungcola kwe-solder-mask ku-pad eqediwe kungonakalisa ukunamathelana kwe-solder kanye nokulingana. Izindlela zokwamukela kufanele zihlukanise iphutha lokugcwalisa enkingeni yokuphela kwendawo noma inqubo yokuhlanganisa.
• Ukushiswa okunganele endaweni yokuhlangana. Lokhu kungase kubangelwe ukwakheka kwe-stencil, ivolumu yokunamathisela, i-geometry yephedi noma izilungiselelo zokuhlanganisa. Ukuze uthole iphedi ye-VIPPO evalwe kahle, ungacabangi ukuthi ukugoqa i-solder kuyimbangela ngaphandle kokuhlola i-via kanye ne-solder joint eqediwe.
• Ukuchayeka kwethusi elingenalutho kanye nokugqwala. Iphedi evulekile iyithusi elingenalutho elingenalo isivikelo semaski. Uma umklamo unendlela evulekile futhi kungekho ukuphela kwendawo okucacisiwe, noma ukuphela okungashintshwa, iphedi iyindawo yokugqwala.

Ukuqinisekisa ubuqotho bembobo ehlanganisiwe kuhlanganiswe ekuhlolweni kwethu kokucindezeleka kokuxhumana (i-IST) , futhi izinto ezijwayelekile zokucatshangelwa zokuthembeka kwembobo ehlanganisiwe zisekhasini lethu lokuthembeka le-PCB.

Iziqondiso Zokuklama ze-VIPPO PCB ze-Fine-Pitch BGA

Lena imithetho enquma ukuthi ibhodi lingakhiqizwa yini, futhi kufanele ilungiswe ngaphambi kokuba umsebenzi wobuciko ukhishwe kunokuba utholakale ngesikhathi sokubuyekezwa.

Lapho i-via idlula eduze noma idlula esakhiweni esifihliwe noma esingaboni, ukusebenzisana phakathi kwezinqubo ezimbili kufanele kuhlolwe kunokuba kucatshangelwe, futhi lokho kuhlanganiswe ekhasini lethu elingabonakali nelifihliwe. Ukubuyekezwa okujwayelekile kobuciko obuhambisana nemithetho ejwayelekile kuyatholakala ngokubuyekezwa kwe -PCB design for manufacturability (DFM).

Umkhiqizi we-VIPPO PCB wama-Vias Agcwalisiwe Nama-Plated-Over

Kumaphrojekthi afuna umenzi we-VIPPO PCB , i-Highleap ingabuyekeza okugcwalisiwe nokuvalwe ngesakhiwo, ukwakheka kwephedi elizungezile kanye nezidingo zokuhlola. Ikhotheshini kufanele icacise ukuthi ukwakhiwa okuceliwe kusebenzisa ukugcwalisa i-resin, ukugcwalisa okuqhubayo noma omunye umzila ovunyiwe, nokuthi yiziphi izindlela zokuqeda ezisebenza. Lokhu kubaluleke kakhulu ekwakhiweni kwe-VIPPO PCB ye-BGA , lapho ukulingana kwephedi kanye nokulawulwa kwevolumu ye-solder kungathinta isivuno sokuhlanganiswa.

Ukuze uthole isilinganiso se-PCB esigcwalisiwe nesifakwe i-cap nge-pad , nikeza ifayela lokubhoboza, ngobubanzi, i-pitch, ubukhulu be-pad, uxhumano lwesendlalelo, i-stackup yebhodi, ukuqeda kwendawo, imininingwane yokugcwalisa kanye nanoma iyiphi indinganiso yokwamukelwa kwamakhasimende. Uma ibhodi lizohlanganiswa, faka i-BOM, ifayela lokukhetha nokubeka kanye nomdwebo wokuhlanganisa ukuze izidingo zokwenziwa kanye nokuhlanganisa zibuyekezwe ndawonye.

Ulwazi lwenqubo yokugcwalisa nokufaka i-Highleap lubalulekile engxoxweni yokugcwalisa nokuvala, kuyilapho ukukhiqizwa kwe-HDI PCB kubalulekile lapho i-VIPPO iyingxenye yesakhiwo esiqinile noma esakhiweni esakhiwe kabusha. Ukuze uthole ukwakheka kwe-turnkey, xoxani ngebhodi kanye nobubanzi bokuhlanganisa ngethimba lethu lezinsizakalo zokuhlanganisa ze-PCB.

• Iphakheji yesilinganiso: Idatha ye-Gerber/ODB++, ifayela lokubhoboza, i-stackup, i-geometry ye-via/pad, imininingwane yokugcwalisa kanye ne-cap, ukuqeda kwendawo, ubuningi kanye nenqubo yokuhlola.

Imibuzo Evame Ukubuzwa Yokwenziwa Kwe-VIPPO PCB

Ingabe i-VIPPO ifana ne-via in pad?

Cha. I-“Via-in-pad” ichaza indawo ye-via. I-VIPPO isho i-Via-In-Pad Plated Over futhi ichaza i-via egcwele enobuso obumboziwe. Izinto zokugcwalisa, izidingo zesivalo, ukuvulwa kwemaski yesolder kanye nokuphela kobuso kufanele kuchazwe ngokwehlukana kumdwebo wokwenziwa.

Ingabe i-VIPPO ingahlanganiswa nama-via angaboni kanye nama-vried?

Yebo, kodwa lezi zinqubo ezimbili ziyaphazamisana futhi ukulandelana kubalulekile. I-via egcwaliswe nge-lamination kufanele igcwaliswe ngomjikelezo wokunyathelisa, kanti i-blind via egqitshwe ku-laminate efanayo kungadingeka ivezwe futhi ibekwe nge-plated emjikelezweni olandelayo. Amabhodi ahlanganisa womabili akhona, kodwa adinga indlela yenqubo ehleliwe kunokuba kube yinqwaba yamanothi azimele.

Ingabe i-VIPPO iyawuthinta umthelela wamanethi athintekile?

Ingakwazi, futhi ezimweni eziningi iwusizo kumanethi kagesi kanye nomhlabathi, ngoba i-via egcwele futhi efakwe ipulasitiki isebenza njengekholomu yethusi eqinile kunokuba ibe yishubhu efakwe ipulasitiki ene-dielectric core. Kunethi yesignali ye-impedance elawulwayo, i-via egcwele iveza i-impedance ehlukile kunengagcwalisiwe, ngakho-ke imodeli ye-via ekulingiseni kufanele ibonise ukwakhiwa okuqediwe.

Ingabe amabhodi angahlanganiswa ngemva kokwenziwa kwe-VIPPO?

Yebo. Ama-VIPPO pads enziwe kahle ahloselwe ukusekela ukusonta kwezingxenye ngqo ebusweni obumboziwe. I-assembler kufanele isabukeze i-pad geometry, i-stencil aperture, ivolumu ye-solder-paste kanye nezincomo ze-thermal-pad package, ikakhulukazi kuma-pads amakhulu avele noma amaphakheji e-BGA acwebezelayo.

I-VIPPO iqinisekiswa kanjani?

Ngokuhlukanisa ama-vias agcwele kumayunithi esampula ukuhlola ukugcwaliswa kanye nesivalo, ngokuqhubeka nokulinganisa ukumelana nokushisa lapho umklamo uncike khona, nangokuhlola iphedi eveziwe ukuze kutholakale insalela yemaski. Uhlelo lwesampula kanye nendlela yokulinganisa kufanele kuvunyelwane ngayo kusilinganiso kunokuba kucatshangelwe.