I-Heavy Copper PCB Stack-up: Ukulinganisa Ukusebenza Nokwenziwa

Isingeniso

Ukwakheka kwe-PCB yethusi esindayo kumelela inselele ebalulekile yobunjiniyela ezisetshenziswayo zamandla kagesi zanamuhla. Njengoba ichazwa yisisindo sethusi esingu-3 oz/ft² noma ngaphezulu, ama-PCB ethusi esindayo adinga ukucushwa okukhethekile kwe-stack-up okuhlukile kakhulu kumabhodi wesekethe ajwayelekile. Ukwakheka kwe-stack-up kuthinta ngqo ubuqotho besignali, izindlela zokushabalalisa ukushisa, ukuqina kwemishini, futhi ekugcineni, ukukhiqizwa.

Lesi sihloko sihlola indlela yokufinyelela idizayini yesitaki ye-PCB yethusi esindayo ngokuhlanganisa izimfuneko zokusebenza nezingqinamba zokwenziwa ezingokoqobo.

Ukuqonda Iqhaza Le-Heavy Copper PCB Stack-up

Imisebenzi kagesi kanye neThermal ye-Stack-up Design

Ukucushwa kwe-stack-up kuma-PCB ethusi elisindayo kulawula izici ezintathu eziyisisekelo: umthamo wokuthwala ugesi , ukusebenza kahle kokushabalalisa ukushisa, kanye nobuqotho besakhiwo ngaphansi kokucindezeleka kokushisa. Ngokungafani nama-PCB ajwayelekile lapho ukujiya kwethusi kungavamile ukudlula ama-ounces angu-2, amabhodi ethusi elisindayo aqukethe ukusatshalaliswa kwethusi okungalingani okudala izinselele ezihlukile ngesikhathi se-lamination. Izendlalelo zethusi ezijiyile zinciphisa ukugeleza kwe-resin ngesikhathi sokucindezela, okungase kubangele izikhala noma i-delamination uma ukujiya kwe-dielectric kungachazwanga kahle.

Amazinga Nokuqina Kwethusi

Amazinga e-IPC-2221 kanye ne-IPC-6012 ahlinzeka ngezidingo eziyisisekelo zogqinsi lwethusi nokwakhiwa kongqimba, nokho izinhlelo zethusi ezisindayo ngokuvamile zidlulela ngale kwalokhu kucaciswa. Umehluko oyinhloko ekwakhiweni kwe-PCB ye-multilayer usekuthi isisindo sethusi sikuthinta kanjani ukungezwani kwe-coefficient yokunwetshwa okushisayo phakathi kwezendlalelo. Isendlalelo sangaphakathi esingu-6 oz sinwebeka ngokuhlukile kunesendlalelo sangaphandle esingu-3 oz ngesikhathi sokuhamba ngebhayisikili, sidala izingcindezi zangaphakathi ezidinga ukucatshangelwa okucacile kusukela kusigaba sokuqala sesakhiwo.

Okucatshangelwayo Okubalulekile Kwedizayini Yezitaki Ze-PCB Enzima Enzima

I-Copper Distribution kanye ne-Symmetry

Ugqinsi lwethusi olulinganiselayo kuzo zonke izitaki kunciphisa i-warpage kanye nengcindezi yangaphakathi phakathi ne-lamination kanye nokuhamba ngebhayisikili okushisayo. Uma izendlalelo ezingenhla neziphansi zihluke kakhulu ngesisindo sethusi, ukungezwani kokukhulisa kungabangela umnsalo noma ukusonteka, kunciphise isivuno somhlangano. Abaklami kufanele bafanekisele ukusatshalaliswa kwethusi endaweni emaphakathi yebhodi futhi balungise amaphethini endiza ukuze kugcinwe ibhalansi kagesi nokuzinza kwesakhiwo.

Ubukhulu be-Dielectric kanye nokulawulwa kokugeleza kwe-resin

Ugqinsi olufanele lwe-dielectric luqinisekisa ukugeleza kwe-resin okwanele ukugcwalisa indawo elukhuni yamafoyili ethusi aminyene. Isikhala esinganele siholela ku-voids noma i-delamination eyenza buthaka ukuthembeka kokufakwa. Njengoba i-copper etch-back yehlisa ukujiya kwe-dielectric okusebenzayo, abaklami kufanele bengeze amayintshi angu-0.002–0.003 kumanani avamile we-prepreg lapho ithusi lidlula u-4 oz ukuze kugcinwe ikhwalithi yokufaka engaguquki.

Ngezakhiwo kanye Nezinselele zokuPlating

Ubuqotho be-Via buxhomeke ekufinyeleleni ukufakwa kwethusi okufanayo, okuba nzima ngezingqimba zangaphandle ezisindayo. Ama-vias angaboni futhi agqitshwe asiza ukunciphisa ubude bendlela yamanje, athuthukise ukuqhutshwa kokushisa, futhi athuthukise ukufana kwe-plating uma kuqhathaniswa nezimbobo ezigcwele. Nakuba zidinga i-lamination elandelanayo, lezi zakhiwo zinikeza ukusebenza okuphezulu emiklamo yamandla aphezulu.

I-Thermal and Mechanical Balancing

Izendlalelo zethusi eziwugqinsi eduze kwemithombo yokushisa zisebenza njengezisakazi zokushisa zangaphakathi, ezithuthukisa ukushabalala kokushisa kanye nokuqina kwemishini. Ukugcina i-symmetry yethusi kuvimbela ukwandiswa okuhlukile nokuguquguquka ngesikhathi sokusebenza. Ukulingisa okushisayo esigabeni sokuklama kusiza ukuhlonza izindawo zokucindezeleka nokuthuthukisa ukwethembeka kwe-stack-up ngaphansi komthwalo.

Imikhawulo Yezokukhiqiza Nemihlahlandlela Esebenzayo

Izithiyo Zenqubo Ye-Lamination

Izisindo zethusi ezinongqimba olulodwa ezedlula u-10 oz zishintsha ngokuyisisekelo imingcele yokubeka i-lamination, edinga imijikelezo yokucindezela enwetshiwe kumazinga okushisa ashintshiwe. Isisindo esishisayo sethusi esindayo kakhulu sibambezela ukudluliswa kokushisa ngesikhathi sokucwala, okudinga izikhathi ezihlala isikhathi eside lapho ingozi ye-resin yokwelapha ngokweqile izendlalelo ezincane eziseduze. Abakhiqizi abaningi balinganisela ubuningi bekhopha yesendlalelo esisodwa ku-8-10 oz ukuze uthole izitaki eziningi ze-PCB zethusi ezisindayo.

Ukubekezelelana kwe-Dielectric kanye nokubhaliswa

Ubukhulu obuncane be-dielectric obufinyelelekayo buhlobana ngokuqondile nesisindo sethusi, njengoba ithusi elishubile lidala ukukhululeka okwengeziwe okudinga inhlaka eyengeziwe:

• 4-6 oz ithusi - Ubuncane be-0.006-0.008 intshi ubukhulu be-dielectric phakathi kwezendlalelo.
• 8-10 oz ithusi - Ubuncane be-intshi engu-0.010 noma ngaphezulu ukujiya kwe-dielectric kuyadingeka.
• Ukubhaliswa kwemaski ye-solder - Ukunemba kwehlisa ithusi elisindayo ngenxa yesimo sendawo, esidinga ukubekezelelana okunwetshiwe.

Indlela Yokuqinisekisa Ukuklama

Amaqembu onjiniyela kufanele ahlanganyele ozakwethu bokukhiqiza ngesikhathi sokuklama isitaki sokuqala ukuze kutholwe imingcele yepharamitha engokoqobo. Ukulingisa okushisayo nokwemishini kuqinisekisa ukutholakala kwe-lamination, ukuhlonza izinkinga ezingase zibe khona zokugeleza kwe-resin noma ukugxila kwengcindezi ngaphambi kokuzibophezela ekwenzeni. Le ndlela yokusebenza ivimbela imijikelezo yokuklama kabusha ebizayo lapho ukwakhiwa kokuqala kwehluleka ukuhlolwa kokufaneleka.

Kwenzelwe I-Heavy Copper PCB Stack-up ye-Power Electronics

Isitaki se-PCB esisebenzayo esendlalelo esiyisi-6 sezinhlelo zokusebenza zesiguquli se-DC-DC sibonisa izimiso zokuklama ezisebenzayo. Ukucushwa kubeka ithusi elingu-6 oz kuzendlalelo zangaphakathi 3 kanye no-4 njengamandla ayinhloko nezindiza ezingaphansi, ezinethusi elingu-3 oz kwizendlalelo zangaphandle 1 no-6 zomzila wesignali. Izendlalelo 2 no-5 zisebenzisa ithusi elingu-2 oz kumasiginali okulawula, kwakheka isakhiwo esinokulinganisela.

Lokhu kulungiselelwa kwesitaki se-multilayer kunikeza cishe ubukhulu be-dielectric eyiyintshi engu-0.008 phakathi kwezendlalelo zangaphakathi ezisindayo, ezanele ukufakwa okuthembekile ngenkathi kulawula ukugeleza kwe-resin. Ukusatshalaliswa kwethusi elilinganayo kuvimbela i-warpage, futhi isisindo sethusi esithweswe iziqu kusuka kungqimba yangaphandle kuya kwangaphakathi sidala isakhiwo esizinzile esimelana nengcindezi yokushisa. Ugqinsi lwebhodi luhlala liku-0.093 amayintshi, luhambisana nezinqubo zokuhlanganisa ezijwayelekile.

Imiklamo ye-Power electronics iyazuza kulokhu kunqwabelaniswa kwe-PCB yethusi yethusi ngokusebenzisa:

• Kwehlisiwe ukumelana ne-DC - Izindiza zangaphakathi ezingu-6 oz zisekela ukuminyana kwamanje okungaphezu kuka-10 A/mm² ngokwehla okuncane kwamandla kagesi.
• Ukusabalalisa okushisayo okuthuthukisiwe - Izendlalelo zethusi eziwugqinsi zihambisa kahle ukushisa kude nama-semiconductors amandla.
• Ubuqotho bendiza yaphansi ethuthukisiwe - Indiza yaphansi enesisindo inikeza ukucindezelwa komsindo okuphezulu kumasekhethi okulawula.

Isiphetho

Idizayini yesitaki se-PCB esindayo esebenzayo idinga ukunakwa okuhlelekile ekusabalaliseni isisindo sethusi, ukucaciswa kwe-dielectric, ngezakhiwo, kanye nebhalansi ye-thermal-mechanical. Impumelelo incike ekuqondeni izingqinamba zokukhiqiza ezilawula ukugeleza kwe-resin, ingcindezi yokucwiliswa kwe-lamination, kanye nokufana kwe-plating kumabhodi anesisindo sethusi kusuka ku-3 kuya ku-10 oz. Onjiniyela abahlanganisa lokhu kucatshangelwa phakathi nesakhiwo sokuqala bathola ukwethembeka okuphakeme nokwenziwayo.

Amakhono e-Highleap Electronics Heavy Copper PCB:

• Ubunjiniyela bokupakisha obuthuthukile - Ukuthuthukiswa kokuklama ngokubambisana ukuze kuthuthukiswe ukusatshalaliswa kwethusi, ukukhetha kwe-dielectric, kanye ukuphathwa okushisayo ngezicelo ezifunayo.
• Ubungcweti bokukhiqiza obufakazelwe - Umuzwa wokukhiqiza ngezisindo zethusi ezifika ku-10 oz ekucushweni kwezendlalelo ezi-4 kuye kwezingu-12, okuqinisekisa ikhwalithi engaguquki kanye nesivuno.
• Usekelo lokuqinisekisa inqubo - Izinsizakalo zokulingisa ezishisayo nezemishini zokuqinisekisa ukuthi kungenzeka yini ukunqwabelanisa ngaphambi kokuzibophezela kokukhiqiza.

Bambisana ne-Highleap Electronics ukuze kwenziwe i-PCB yethusi esindayo enezingqimba eziningi elinganisela ukusebenza kukagesi, ukushisa, kanye nokwemishini ezinhlelweni zamandla. Ithimba lethu lobunjiniyela liqinisekisa ukuthi imiklamo yakho ihlangabezana nezidingo zokucaciswa kanye namaqiniso okukhiqiza. Xhumana nathi ukuze uxoxe ngezidingo zakho zokuhlanganisa i-PCB yethusi esindayo.