Ukwakhiwa kwe-PCB yeseva ye-HPC yama-OEM ebhizinisi kanye nama-HPC

I-Highleap Electronics yenza ukwenziwa kwe-PCB yeseva ye-HPC ngokusekelwe kumadizayini anikezwe amakhasimende noma amafayela e-Gerber ama-OEM ekhompyutha asebenza kahle kakhulu, amalabhorethri kazwelonke, izikhungo ze-supercomputing zaseyunivesithi, kanye nabathengisi bohlelo lwe-Tier-1 HPC. Sakha ama-PCB ngokwezincazelo zamakhasimende, kufaka phakathi amabhodi amakhulu e-node yokubala (izithwali ze-Xeon Max ezimbili nezine-socket, i-EPYC HPC, i-A64FX, i-NVIDIA Grace/Grace Hopper carriers), amakhadi okuxhumana e-InfiniBand HDR/NDR kanye ne-Slingshot/Omni-Path, izithwali ze-cold-plate ezipholile ngoketshezi, amabhodi e-node okugcina nokungena, amabhodi wamandla nokuphatha ezingeni le-rack, kanye nezithwali zokuhlanganisa ze-HBM-host.

Okuqukethwe

1. Lokho Okudingwa yi-HPC OEM kuMkhiqizi we-PCB (uma kuqhathaniswa nokuqeqeshwa kwe-AI)
2. Ukwakhiwa Kwebhodi Elikhulu Le-Compute Node — Xeon Max, EPYC HPC, ARM HPC
3. Ukwakhiwa Kwebhodi Lokuthwala Le-HBM-Host kanye neGrace Hopper-Class
4. Ukwakhiwa kwekhadi le-InfiniBand HDR/NDR HCA kanye ne-Interconnect
5. Ukupholisa Okuqondile Koketshezi — Izithwali Zezingqwembe Ezibandayo, Amabhodi E-CDU Nama-Manifold
6. Isistimu Engaphansi Kwememori — Ukulethwa Kwamandla kwe-DDR5, CXL, kanye ne-HBM
7. I-Storage Node, i-Login Node kanye namaBhodi Okuphatha Amaqoqo
8. Ikhwalithi, Iziqu ze-AVL kanye nokusekelwa kohlelo lwempilo ende
9. Ukubandakanya i-Highleap ekwakhiweni kwakho kwe-HPC Cluster

1. Okudingwa yi-HPC OEM kuMkhiqizi we-PCB (uma kuqhathaniswa nokuqeqeshwa kwe-AI)

Izinhlelo zeseva ye-HPC kanye nezinhlelo zeseva yokuqeqesha i-AI zibukeka zifana uma zikude — zombili zakha ihadiwe yokubala eningi enokuxhumeka kwe-bandwidth ephezulu, zombili zisebenzisa ukupholisa koketshezi ngezinga, zombili zihlose inani elincane lamakhasimende anenani eliphezulu. Umehluko uvela kusikhathi sesikhathi sohlelo, ukuqina kweziqu, kanye nokulindelwe komjikelezo wokuphila. Amandla ethu okukhiqiza i-PCB yokubala esebenza kahle ahlanganisa kokubili ukwakheka kokuhlangana kwe-AI/HPC kanye namaqoqo e-HPC ajwayelekile e-CPU.

Umehluko womjikelezo wokuthengwa kwe-HPC

• Isikhathi sokuthengwa: Izinkontileka zesistimu ye-HPC zisebenza iminyaka engu-2-4 kusukela ku-RFP kuya ekwamukelweni kwesistimu; izinhlelo zehadiwe ze-AI zisebenza izinyanga ezingu-12-18.
• Ukuqina kweziqu: Amalebhu kazwelonke kanye nezikhungo ze-HPC zaseyunivesithi ngokuvamile zidinga ukuhlolwa okusemthethweni kokwamukelwa okuhlanganisa amasampula okuqinisekisa ezingeni le-PCB; izinhlelo eziningi zehadiwe ze-AI zamukela ukugeleza kwe-AVL kwesitayela se-hyperscaler ngaphandle komthetho osemthethweni.
• Ukugxila kwamakhasimende: Imakethe ye-HPC igxile kakhulu — amalebhu e-DOE, amanyuvesi amakhulu, amasayithi abhalwe ohlwini lwe-Top500 — futhi ubudlelwano namakhasimende buthatha amashumi eminyaka. Ihadiwe ye-AI isakazeke kakhulu ngabakhi be-hyperscalers, izinhlelo ze-AI ezizimele, kanye nabathengi be-AI bebhizinisi kubathengisi abaningi.
• Umjikelezo wokuphila kokuzinza: Izinhlelo ze-HPC zivame ukusebenza iminyaka engu-7-10 zisebenza; ihadiwe yokuqeqesha i-AI ivuselelwa njalo eminyakeni engu-2-3.

Izidingo zobunjiniyela be-HPC ezihlukile ekuqeqeshweni kwe-AI

• Izakhiwo ezibusa kakhulu kwi-CPU zisekhona: ngenkathi ukuhlangana kwe-AI/HPC kungokoqobo, imisebenzi eminingi ye-HPC (i-CFD, i-MD, ukumodela kwesimo sezulu) isalokhu ibusa i-CPU; ama-compute node anama-socket e-CPU angu-4-8 anenani elikhulu leziteshi ze-DDR5.
• Umthamo wememori vs ibhalansi ye-bandwidth: Imithwalo yemisebenzi ye-HPC ivame ukudinga kokubili — i-4 TB+ nge-node ngayinye ene-bandwidth ephezulu akuyona into engavamile; ukwandiswa kwe-CXL kubaluleke kakhulu.
• Ukugcizelelwa kokucubungula amavektha: I-AVX-512, i-SVE2, kanye nama-vector ISA afanayo aqhuba izidingo ezithile zomzila kanye nokulethwa kwamandla kwemithwalo yemisebenzi yevector eqhubekayo.
• Ukuhlangana kwenethiwekhi/isitoreji: I-InfiniBand ene-RDMA kokubili ukuxhumana kanye nokugcina; inethiwekhi eyodwa kunokuba kube amanethiwekhi ahlukene ekhompyutha kanye nesitoreji.
• Isitoreji esisheshayo nesisezingeni: ama-node e-burst-buffer azinikele anokusekelwa kwe-NVMe esebenza kahle kanye ne-DAOS/Lustre/GPFS; amabhodi okuthwala isitoreji akhethekile.

Izidingo zokuthengwa kwe-HPC

• Izimpendulo ezisemthethweni ze-RFP: iziphakamiso ezinemininingwane ezihambisana nezidingo zobuchwepheshe nezentengiselwano zamakhasimende.
• Ukusekelwa kokwamukelwa kwesistimu: amabhodi esampula kanye nemibhalo ephelele yokuhlolwa kokwamukelwa kwamakhasimende.
• Ukuzibophezela ekusekeleni: Ukuzibophezela kokutholakala kwezingxenye ezisele zeminyaka engu-7-10 kanye nokuphathwa kwe-EOL okubhaliwe.
• Ukuhlolwa kanye nokulandelelwa: Ezinye izinhlelo zelebhu kazwelonke kanye nezinhlelo eziseduze nezokuvikela zidinga izindlela zokuhlola ezigcwele zochungechunge lokuhlinzeka.
• Idokhumenti yezwe elivela kulo: Thenga iMelika, Thenga iYurophu, kanye nezidingo zokunikezwa kwempahla ezizimele lapho kufanele khona.

2. Ukwakhiwa Kwebhodi Elikhulu Le-Compute Node — Xeon Max, EPYC HPC, ARM HPC

Amabhodi amakhulu e-HPC compute node aqinisa yonke i-cluster. Ukwenziwa kweplatifomu yamanje yi-CPUs efakwe i-HBM kanye ne-accelerator-CPU hybrids; sakha amabhodi amakhulu ukuze kube nokwakheka kwendawo okugcwele.

Amabhodi amakhulu e-Intel Xeon Max (Sapphire Rapids HBM) kanye ne-Granite Rapids HPC

• I-Xeon Max: I-64 GB HBM2e ibekwe eceleni kweziteshi ze-DDR5 ezingafika ku-8 ngesokhethi; amandla amakhulu kanye nokuxinana kokushisa.
• Isibalo sesendlalelo: ngokuvamile izendlalelo ezingu-16-22 kumabhodi amakhulu e-Xeon Max anezisokhethi ezimbili — eyethu ukukhiqizwa kwe-PCB ye-multilayer umugqa usekela amabhodi amakhulu e-HPC kusukela ezingqimbeni eziyi-12 kuya ekulungiselelweni kwezilawuli ezimbili kwezingqimba ezingu-32+.
• Ubunzima bomzila: Iziteshi ezingu-8 ze-DDR5 ngesokhethi × amasokhethi angu-2 = iziteshi ezingu-16 zomzila we-DDR5 ngaphezu kwezixhumanisi ze-PCIe Gen5 kanye nezixhumanisi ze-UPI eziphakathi kwezisokhethi.
• Umzila wesixhumanisi se-UPI: I-UPI enezixhumanisi ezi-4 noma ezi-6 phakathi kwama-socket; izidingo zokuqina kwesignali efana ne-PCIe Gen5.
• Ukulethwa kwamandla: I-TDP engu-350-400W ngesokhethi ngayinye; ukubekwa kwe-VRM exinene ngokusatshalaliswa kwamandla okuvinjelwa okuphansi.
• Material: I-I-Tera MT40 ezingqimbeni ze-UPI kanye ne-PCIe Gen5; i-FR408HR ezingqimbeni ze-DDR5; i-370HR yezingqimba zamandla.

Amabhodi amakhulu we-AMD EPYC HPC (Genoa-X, Bergamo, Turin).

• I-EPYC Genoa-X: Ama-core angu-96 ane-cache engu-1 GB L3 (i-3D V-Cache); iziteshi ezingu-12 ze-DDR5 ngesokhethi ngayinye.
• I-EPYC Turin: isizukulwane esilandelayo; kufika kuma-cores angu-192 ngesokhethi ngayinye.
• Isibalo sesendlalelo: Izendlalelo ezingu-18-24 ezivamile kumabhodi amakhulu e-EPYC HPC anezisokhethi ezimbili ngenxa yesibalo esiphezulu seziteshi ze-DDR5.
• Izixhumanisi ze-Infinity Fabric inter-socket: umzila wesivinini esikhulu oqinile phakathi kwezisekelo; izidingo ze-PCB ezifanayo ne-UPI.
• Inani lemizila ye-PCIe Gen5: Imizila engu-128 ngesokhethi = imizila engu-256 ngesistimu enamasokhethi amabili; ukuminyana okukhulu komzila ngisho nangaphambi kokucabangela i-DDR5.

Amabhodi amakhulu e-Fujitsu A64FX kanye ne-ARM HPC

• I-A64FX: Ama-core angu-48 ane-32 GB HBM2 ephaketheni; i-ARMv8.2-A SVE; uhlelo lwe-Fugaku exascale olusebenza ngamandla.
• UMusa we-NVIDIA: I-ARM Neoverse V2 engu-72-core ene-480-960 GB LPDDR5X; ihloselwe ukuhlaziya i-HPC, i-AI, kanye nedatha.
• I-Ampere Altra Max kanye ne-AmpereOne: Ama-CPU e-ARM server asetshenziswa kakhulu ku-HPC.
• Inani lezingqimba kanye nobunzima: kufana namabhodi amakhulu e-x86 HPC; Amabhodi amakhulu e-Grace afakwe i-LPDDR5X anomzila ohlukile ngenxa yememori ehlanganisiwe kunezindawo ze-DIMM.

Amabhodi amakhulu anama-socket amane kanye nama-socket ayisishiyagalombili anama-node amafutha

• Icala lokusebenzisa: isizindalwazi esingaphakathi kwememori, ukulingisa imemori okwabelwana ngayo kakhulu, imithwalo yemisebenzi ekhethekile ye-HPC engahambelani kahle nememori esatshalaliswe.
• Isibalo sesendlalelo: Izendlalelo ezingu-22-28 ngenxa yobunzima bokuxhumanisa amasokhethi.
• Indwangu ehlanganisa amasokhethi: I-UPI noma i-Infinity Fabric ekhula kancane ngaphezu kwama-socket angu-4; eminye imiklamo ye-quad-socket isebenzisa i-ring topology, eminye isebenzisa i-switched topology.
• Umthamo wememori: 8-16 TB ngenodi ngayinye evamile; izindlu ezibalulekile ze-DIMM ebhodini.

3. Ukwakhiwa kweBhodi Yokuthwala ye-HBM-Host kanye neGrace Hopper-Class

I-CPU efakwe i-HBM ingenye yezakhiwo zeprosesa ye-HPC ezichazayo zalesi sizukulwane. Kungakhathaliseki ukuthi i-HBM ikwiphakheji (i-Xeon Max, i-A64FX) noma ixhunywe nge-chip-to-chip interconnect (i-Grace Hopper Superchip), i-PCB ephethe inezidingo ezithile zokulethwa kwamandla, ukuphathwa kokushisa, kanye nokubonisa izimpawu okuhlukile kumabhodi amakhulu angewona awe-HBM.

Ukwenziwa kwenkampani yokuthwala i-Grace Hopper Superchip

• I-Architecture: I-NVIDIA Grace ARM CPU + Hopper GPU ihlanganiswe nge-NVLink C2C (i-chip-to-chip); I-NVLink ehambisanayo engu-900 GB/s phakathi kwe-CPU ne-GPU.
• Ukwakhiwa kwebhodi lokuthwala: ngokuvamile izendlalelo ezingu-18-24.
• Umzila we-NVLink C2C: indwangu emfushane, ehambisanayo esheshayo phakathi kwama-chips amabili ku-carrier efanayo; izidingo eziqinile kakhulu zokuqina kwesignali ebhodini.
• I-HBM3 (ku-Hopper die): ayithunyelwanga ku-PCB kodwa isekelwa ukulethwa kwamandla amaningi kuphakheji ye-Hopper die.
• I-LPDDR5X (Inamathiselwe ngomusa): i-soldered ku-carrier eduze kwe-chip ye-Grace; i-LPDDR5X ihambisa ngesivinini sedatha esiphezulu.
• Material: I-Tachyon 100G noma i-Megtron 7 ye-NVLink C2C; i-I-Tera MT40 ye-PCIe Gen5 host; i-FR408HR ye-LPDDR5X.

Ukulethwa kwamandla kwama-CPU afakwe i-HBM

• Ama-currents: Ama-CPU afakwe i-HBM adonsa i-400-500W TDP ngaphansi komthwalo we-vector oqhubekayo; ama-current aqhubekayo angu-500-800A kuma-core rails.
• Ukubekwa kwe-VRM: ama-VRM anolaka oluphezulu anokubekwa kwephoyinti lomthwalo ngaphansi noma eduze kwephakheji ye-CPU.
• Ithusi lendiza: Ithusi elingu-2-3 oz ezindizeni zamandla eziyinhloko; eminye imiklamo isebenzisa ama-4 oz ezitimeleni ezithile zamandla aphezulu.
• Ukuhlukanisa ubuningi be-capacitor: amakhulu ama-capacitor ngesokhethi ngalinye asatshalaliswa kulo lonke uhlu lokulethwa kwamandla.
• Ukuphazamiseka kwendiza: umklamo wendiza ene-low-impedance oqinisekiswe ngokulingiswa kwamandla-ubuqiniso esigabeni sokuklama; ukwenziwa kwe-PCB kumele kufinyelele kahle ku-stackup emodeliwe.

Izinto okufanele uzicabangele ngokwakhiwa kwephakheji ye-HBM-host

Amaphakheji e-CPU afakwe i-HBM makhulu ngokomzimba futhi asinda ngokomshini. I-PCB engaphansi kwawo kumele isekele iphakheji ngokomshini (ngaphansi kwamandla okubopha amapuleti abandayo noma ukugcinwa kwesokhethi), ngokushisa (ukudlulisa ukushisa kusuka ngemuva kwephakheji naku-VRM), nangogesi (ukuletha amakhulu ama-ampere ngokusebenzisa ama-vias kagesi ngaphansi kwephakheji). Ukubekezelelana kwembobo yamathuluzi, izici zokuqinisa ngomshini, kanye nomklamo we-via-array ngaphansi kwephakheji konke kubalulekile ekwakhiweni kwe-PCB ye-HBM-host ngezindlela ezingezona kumabhodi amakhulu e-CPU avamile.

4. Ukwakhiwa kwekhadi le-InfiniBand HDR/NDR HCA kanye ne-Interconnect

Ukuxhumana kwe-HPC kuqhuba ukusebenza kwezinga lesistimu ngaphezu kwanoma iyiphi enye ingxenye eyodwa. I-InfiniBand ibusa imakethe ye-HPC ephezulu ngemikhiqizo ye-HDR (200 Gbps) kanye ne-NDR (400 Gbps); i-HPE Slingshot (ekuqaleni yayiyi-Cray) kanye ne-Intel Omni-Path kuyizindlela ezingasetshenziswa ezinhlelweni ezithile ze-Top500.

Ukwenziwa kwebhodi labathwali be-InfiniBand HDR HCA

• I-chip ye-adaptha: I-NVIDIA ConnectX-6 (HDR) noma i-ConnectX-7 (HDR/NDR).
• Inani lembobo: Amakhadi e-HDR anembobo eyodwa noma amabili ajwayelekile.
• Isixhumi esibonakalayo se-PCIe Gen4 host: Imizila eyi-16 ye-Gen4 yokusingatha i-CPU; amanye ama-host e-Gen5 asebenzisa ikhadi elifanayo.
• Ukuxhumana kwenethiwekhi: Isixhumi se-QSFP56 sokuxhuma izintambo ze-HDR.
• Isibalo sesendlalelo: Izendlalelo ezingu-14-18 kuma-HCA e-HDR anezimbobo ezimbili.
• Material: I-I-Tera MT40 ye-PCIe kanye nomzila wenethiwekhi; 370HR yamandla kanye nomhlabathi.

Ukwenziwa kwebhodi labathwali be-InfiniBand NDR HCA

• I-chip ye-adaptha: I-NVIDIA ConnectX-7 NDR enamandla efinyelela ku-400 Gbps.
• Isixhumi esibonakalayo se-PCIe Gen5 host: Imizila eyi-16 iGen5; ukubhola emuva okuphoqelekile kuma-via aseceleni kombungazi.
• Ukuxhumana kwenethiwekhi: Isixhumi se-OSFP sezintambo ze-NDR.
• Isibalo sesendlalelo: Izendlalelo ezingu-16-20 ngenxa yokuminyana komzila ngesivinini esiphezulu.
• Material: I-Tachyon 100G noma i-Megtron 7 kunethiwekhi ebalulekile ye-NDR kanye nezendlalelo zesignali ze-Gen5 host.
• Ukuqaliswa okukhokhelwayo: ukuqaliswa okufaniswe nokumelana okunembile kusixhumanisi somphetho we-PCIe kanye nekheji le-OSFP.

Ukwenziwa kwe-HPE Slingshot kanye ne-Omni-Path HCA

• I-Slingshot: Ixhumanisa i-200 Gbps ezinhlelweni ze-Cray/HPE EX-class (Frontier, El Capitan); Iyahambisana ne-Ethernet engqimbeni ebonakalayo enokulawula ukuminyana kwe-HPC okuqondile.
• Indlela Emikhulu: Ukuxhumana kwe-Intel okungu-100 Gbps; ifa kodwa kusakhiqizwa eziklasini ezithile zeqoqo.
• Ukwakhiwa kwekhadi le-HCA: kufana nama-InfiniBand HCA; i-PCIe Gen4 host, isikhombimsebenzisi senethiwekhi esenziwe ngokwezifiso.

Ukwenziwa kwamakhadi omugqa wokushintsha we-InfiniBand

• Iswishi ye-NVIDIA Quantum-2 NDR: Amachweba angu-64 × 400G noma amachweba angu-32 × 800G nge-switch chip ngayinye.
• Inani lesendlalelo sekhadi lomugqa wokushintsha: Izendlalelo ezingu-28-32.
• Ubuningi bomzila: amakhulu ezibhangqa ezihlukile kusukela kumakheji e-ASIC kuya ku-OSFP.
• Material: I-Tachyon 100G kuzo zonke izendlalelo zesiginali.
• Ukulethwa kwamandla: 800-1200W nge-chip ngayinye yokushintsha; umklamo we-VRM oqinile kanye nethusi elinamandla amakhulu.

5. Ukupholisa Okuqondile Koketshezi — Izithwali Zezingqwembe Ezibandayo, Amabhodi E-CDU Nama-Manifold

Izinhlelo ze-HPC zesimanje zipholiswa uketshezi ngqo kusokhethi ye-CPU. Izinhlelo ze-exascale zelabhorethri kazwelonke ziqhubekisela phambili lokhu ngokupholisa ngamanzi afudumele okuvumela ukupholisa mahhala unyaka wonke. Umklamo we-PCB we-HPC epholiswe uketshezi usuvuthiwe kodwa usadinga ubunjiniyela kanye nokukhiqizwa ngokucophelela.

Ukwenziwa kwebhodi lokuthwala ipuleti elibandayo

• Ukuqondanisa ngomshini: izimbobo zamathuluzi okunemba ukuze kulungiswe ipuleti elibandayo ngokubekezelelana kwesimo okungu-±0.10 mm.
• Ukuthamba kwebhodi: Ukulingana okungu-±0.15 mm phakathi kwe-CPU ukuqinisekisa ukuthintana kwe-cold-plate okufanayo.
• Imikhawulo yokuphakama kwengxenye: izingxenye ezingaphansi kwepuleti elibandayo azikwazi ukudlula ukujula kokunciphisa ipuleti elibandayo; ukubambisana okuqinile kwe-DFM nomthengisi wepuleti elibandayo.
• Ukuqinisa ukukhweza: Izithwali zebhodi noma iziqinisi zisekela amandla okubopha; ukwakheka kwe-PCB kuhambisana nesixhumi esibonakalayo senkampani.

Ukwenziwa kwebhodi lokulawula le-CDU (iyunithi yokusabalalisa okupholile)

• umsebenzi: phatha ukugeleza kokupholisa ezingeni le-rack, izindawo zokubeka izinga lokushisa, ukulawula iphampu, ukutholwa kokuvuza, ama-alamu.
• I-Architecture: ngokuvamile i-ARM SBC efakwe ngaphakathi ene-I/O yezimboni (izinzwa zokugeleza ezingu-4-20 mA, okokufaka kokushisa kwe-RTD, izishayeli zamavalvu).
• Isibalo sesendlalelo: Izendlalelo ezingu-6-8; i-analog/digital exubile ene-isolation efanele.
• Material: i-high-Tg FR4 (Isola 370HR) yokuthembeka kwezimboni.
• Ikilasi le-IPC: Ukwamukelwa kwesigaba sesi-3 kwezingxenye ezibucayi zemodi yokwehluleka.

Ukwenziwa kwebhodi lezinzwa ezininginingi

• Ukuzwa okusatshalalisiwe: izinga lokugeleza, izinga lokushisa, ingcindezi ezindaweni eziningi eziningi.
• Ifomethi encane: ngokuvamile i-60 × 40 mm enezixhumi zezimboni ze-M12.
• I-conformal coating: Izinga lokumboza le-AR noma le-UR lokuvikela umswakama.
• Ukugeleza kabusha okungenalo umthofu: inqubo ejwayelekile ye-SAC305 iyahambisana nazo zonke izinto ezichaziwe.

Ukutholwa kokuvuza kanye namabhodi epani lokuvuza

• Izinzwa zokuvuza ezinamandla: kusatshalaliswa ngaphansi kwamapuleti abandayo nasezindaweni ezingase zivuthe.
• I-elekthronikhi yepani lokuconsa: ukuqapha ukugeleza kwamanzi nge-alamu yokubonisa i-rack BMC.
• Ukwethembeka: izinga elibonisa ukuthi kukhona iphutha elibalulekile (ama-alamu angamanga avaliwe ukubala); izinga elibonisa ukuthi akukho iphutha elibalulekile futhi (ukuvuza okuphuthelwe yimishini yokulimala).

6. Isistimu Engaphansi Kwememori — Ukulethwa Kwamandla kwe-DDR5, CXL, kanye ne-HBM

Izidingo zememori yomsebenzi we-HPC ziqhuba ukukhetha okuthile kokwenziwa kwe-PCB kokuhambisa i-DDR5, ukunwetshwa kwememori ye-CXL, kanye nokulethwa kwamandla kwe-HBM kunethiwekhi.

Umzila we-DDR5 wamabhodi amakhulu e-HPC

• Isibalo sesiteshi: Iziteshi eziyi-8 ngesokhethi (Intel Xeon Max), iziteshi eziyi-12 ngesokhethi (AMD Genoa-X).
• Isilinganiso sedatha: I-DDR5-4800 kuya ku-DDR5-6400 kuye ngeplatifomu; ikhuphuka ngesizukulwane ngasinye.
• Impedance: 40Ω okunesiphelo esisodwa ±10% ejwayelekile; ±7% ingafinyeleleka.
• Ukufanisa ubude: ngaphakathi kwebhayithi ±2 mil; ukubekezelelana kwebhayithi kuya kubhayithi kuyahlukahluka ngesivinini.
• Ukukhetha okubalulekile: I-FR408HR yeziteshi ezimfushane; I-I-Tera MT40 yeziteshi ezinde noma amazinga aphezulu edatha; I-370HR iyamukeleka ekusebenzeni okufushane kwesivinini esiphansi.
• Ukulukwa kwengilazi: Ingilazi engu-1080 noma engu-2113 ezingqimbeni zesiginali ze-DDR5 esezingeni eliphezulu.

Ukwakhiwa kokunwetshwa kwememori ye-CXL

• Okunamathiselwe kwe-CXL 2.0: I-PCIe Gen5 PHY; Izikhulisi zememori ze-CXL zinamathiselwa ngezikhala ze-PCIe noma izixhumi ezikhethekile ze-CXL.
• Icala lokusetshenziswa kwe-HPC: ukuhlanganisa imemori ukuze kwandiswe inkumbulo ye-per-node esebenza kahle ngaphezu komthamo we-DIMM; kubaluleke kakhulu ekuhlaziyeni kwememori, ukulingisa kwegridi enkulu, kanye nomthwalo womsebenzi wokuhlangana kwe-AI/HPC.
• Imfuneko yokukhiqiza: Ukunemba kwesigaba se-Gen5 ku-impedance ye-differential pair kanye ne-back-drilling.
• Ukwakhiwa kwe-Backplane: Ukushintsha kwe-CXL kwethula uhlobo olusha lwamabhodi e-backplane nama-switch ezinhlelweni ze-HPC.

Ukulethwa kwamandla e-HBM kubathwali be-CPU abahlonyiswe yi-HBM

Ngenkathi ama-HBM stacks ehlanganiswe ngaphakathi kwephakheji kumikhiqizo ye-Xeon Max, i-A64FX, kanye ne-Hopper GPU, i-PCB yomphathi kumele inikeze ugesi omkhulu ukuze isekele kokubili i-host die kanye nama-HBM stacks. Izindiza zamandla kumele ziphathe ugesi ozodlula ukucabanga kokuklama kwebhodi eliyinhloko le-CPU, kanye nobukhulu obufanele ngamaphethini ngaphansi kwephakheji ukuze kuncishiswe ukwehla kwamandla kagesi. Ukulingisa ukuqina kwamandla ngesikhathi sokuklama akunakuxoxiswana ngakho; ukwenziwa kwe-PCB kumele kufinyelele ku-stackup elingisiwe ngokubekezelelana kobukhulu be-dielectric obungu-±5% ukuze kulondolozwe ukusebenza okumodeliwe, kanye nokulawulwa kwe-impedance kuzo zonke izinhlangothi ezibalulekile ze-Gen5 differential kuyadingeka kulo lonke ukwakhiwa.

7. I-Storage Node, i-Login Node kanye namaBhodi Okuphatha Amaqoqo

Iqoqo le-HPC liqukethe izinhlobo eziningi zamabhodi ngale kwama-compute node. Amabhodi esitoreji, ukungena ngemvume, kanye nengqalasizinda yokuphatha ayizinhlelo ezincane ngobuningi kodwa abalulekile ekuthembekeni kwesistimu.

Ukwenziwa kwe-node yokugcina izinto

• Amaseva esitoreji se-Lustre/GPFS: amabhodi amakhulu e-Xeon noma e-EPYC anezimbobo ezimbili ze-NVMe kanye ne-SAS storage backplanes.
• Amapulani esitoreji se-NVMe: Ama-backplane e-U.2/U.3 ashintshashintshayo ashisayo ane-PCIe Gen4/Gen5 eqondisa kubalawuli besitoreji.
• Ama-node okugcina e-DAOS: isitoreji esisekelwe kwimemori esiqhubekayo sezinga lesitoreji se-HPC sesizukulwane esilandelayo; i-backplane ye-NVMe ekhethekile kanye nokuhlanganiswa kwemodyuli ye-PMEM.
• Ama-node e-Burst-buffer: amaseva e-NVMe anabantu abaningi asebenza njengesigaba sokusheshisa se-I/O phakathi kwama-compute node kanye nesistimu yamafayela ehambisanayo.

Ukwakhiwa kwe-node yokungena kanye neseva yokuphatha

• Amabhodi amakhulu e-node yokungena: amabhodi amakhulu eseva asetshenziswa kabanzi (isokhethi elilodwa noma amabili) asekela igobolondo lomsebenzisi kanye nokuthunyelwa komsebenzi; hhayi okubalulekile ekusebenzeni, kodwa okubalulekile ekuthembekeni.
• Amaseva okuphatha: umsingathi we-cluster scheduler (Slurm, LSF, PBS Pro); amaseva edathabheyisi e-accounting kanye nokuqapha.
• Imikhuba ejwayelekile ye-PCB yeseva: izinto ezilahlekelwa phakathi nendawo okungenani; ama-stackup alungiselelwe kahle izindleko.

Amabhodi okushintshana aphezulu kanye nabaphathi

• Ukushintsha kokuphatha kwe-GbE okungu-1: ukuphathwa okuhlukile Inethiwekhi ye-Ethernet ehlukanisiwe nendwangu yedatha.
• Izishintshi zenethiwekhi yesevisi ye-10/25 GbE: ukufinyelela isitoreji kanye nethrafikhi yokuphatha.
• Ukuphathwa kwangaphandle kwebhendi: ama-concentrator e-serial console, amasango e-IPMI/Redfish.

Amandla nengqalasizinda esezingeni le-rack

• Amabhodi eshalofu kagesi angu-48V: ukusatshalaliswa kwamandla okuphakathi okufana nokwakhiwa kwe-rack yokuqeqesha ye-AI.
• Amabhodi amakhulu e-BMC e-rack: ukuphathwa kwezinga le-rack lokubala, isitoreji, inethiwekhi, nokupholisa.
• Amabhodi ezinzwa zemvelo: izinga lokushisa, umswakama, ukudlidliza, ukuqapha ukungena.

8. Ikhwalithi, Iziqu ze-AVL kanye nokusekelwa kohlelo lwempilo ende

Izinhlelo ze-HPC zibonakala ngezikhathi ezinde kanye nezinselelo ezinkulu. Uma uhlelo lwe-Top500 selusebenza, ukwehluleka kwebhodi kuhumusha ngqo kube yisikhathi sokungasebenzi kocwaningo - futhi ikhasimende lingadinga izingxenye ezisele eminyakeni engu-7-10 ngemuva kokuthengwa kokuqala.

Izidingo zokugeleza kwekhwalithi ye-HPC

• Ukwamukelwa kwe-IPC Class 3: indinganiso yamabhodi e-compute kanye ne-interconnect ezinhlelweni ze-HPC.
• Ukuthatha amasampula e-microsection: isihloko sokuqala 100%, ukusampula okusenquboni kuvame kakhulu (ngokuvamile 1 ngephaneli ngayinye ezakhiweni ezibalulekile).
• Ukuhlolwa kwepharamitha ye-S: ukulahlekelwa kokufakwa kwezinga lekhuphoni kanye nokulahlekelwa kokubuyisela ku-40 GHz kumabhodi anesivinini esikhulu.
• Ukuqinisekiswa kokujikeleza kwe-thermal: ukuhlolwa kokuthembeka kwezinga lekhuphoni ngezindlela ze-IPC-TM-650.
• Imibhalo ngokulethwa ngakunye: I-CoC, izitifiketi zokugaya, ukuhlolwa kukagesi, impedance, i-S-parameter, i-AOI, i-microsection, amarekhodi okuhlola okubonakalayo.

Iziqu ze-AVL zama-HPC OEM

• Ukuhlolwa kwangaphambi kokufaneleka: ukuvakashelwa kwesayithi yithimba lekhwalithi yamakhasimende; ukubuyekezwa kwemishini, inqubo, kanye nemibhalo.
• Iziqu ze-athikili yokuqala: Isampula eyakhiwe ngezingcezu ezingu-25-200 enemibhalo ephelele.
• Ukuqinisekiswa kwenqubo: Idatha ye-SPC ekhombisa ikhono lenqubo; izinhlelo zokulawula kanye nemibhalo ye-FMEA.
• Ukwamukelwa kohlangothi lwamakhasimende: ukuhlolwa kwemvelo, ukuqinisekiswa kwezinga lesistimu, ukusayinwa okusemthethweni.
• Ukugcinwa kwe-AVL: izilinganiso zokusebenza eziqhubekayo, ukuhlolwa okwenziwa njalo, ukubuyekezwa kwekhwalithi okuhlanganyelwe.

Usekelo lohlelo lwempilo ende

• Uhlu lwezingxenye ezisele: amandla okukhiqiza izingxenye ezisele ezizibophezele iminyaka engu-7-10 ngemva kokufakwa kokuqala.
• Ukuqapha umjikelezo wokuphila kwezinto: Silandelela ama-PCN e-laminate kanye nezingxenye ukuze sibone ingozi yomjikelezo wesikhathi eside kusenesikhathi.
• Ukufakwa esikhundleni okubhalwe phansi: kuzo zonke izinto ezifanelekile, kubhalwe phansi ezinye izindlela ezicishe zifane.
• Ukuphathwa kokuphela kokuphila: Ezinyangeni ezingu-18-24 ngaphambi kwe-EOL, ukuhlela okuhlanganyelwe kwamakhasimende nomhlinzeki wokuthenga okokugcina.
• Ukugcinwa kwengobo yomlando: wonke amafayela okuklama, amarekhodi enqubo, kanye nedatha yekhwalithi egcinwe isikhathi sohlelo + iminyaka engu-7.

9. Ukubandakanya i-Highleap ekwakhiweni kwakho kwe-HPC Cluster

Kuma-OEM e-HPC, abahlanganisi bezinhlelo, kanye nabalingani behadiwe belebhu kazwelonke abahlola abalingani bokukhiqiza be-PCB, imodeli yethu yokuzibandakanya ihlanganisa isikhathi eside kanye nokugeleza kweziqu okuqinile okubonisa ukuthengwa kwe-HPC:

• Ukubonisana ngobuchwepheshe ngaphambi kwe-RFP: ngesicelo samaqembu obunjiniyela bamakhasimende, sinikeza izincomo ze-stackup, isiqondiso sezinto ezibonakalayo, kanye nezitatimende zamakhono ezisekela izimpendulo ze-RFP.
• Ukusekelwa kwesiphakamiso: iziphakamiso ezisemthethweni ezinenani eliningiliziwe, isikhathi sokuhola, ukuzibophezela komthamo, kanye nemibhalo yekhwalithi ehambisana nezidingo ze-RFP yamakhasimende.
• Ukwakhiwa kwesibonelo kanye neziqu: Amasampula angu-25-200 anemibhalo ephelele esekela ukuhlolwa kokwamukelwa kwamakhasimende.
• Ukukhishwa komkhiqizo: ukubhukha umthamo okuhambisana neshejuli yokulethwa kwesistimu; ukugeleza kokulawula ushintsho okuhlelekile.
• Ukusekelwa kokusimama: ukukhiqizwa kwezingxenye ezisele kanye nokuphathwa kokuphela kokuphila ngokusebenzisa isikhathi sokusebenza kohlelo oluphelele.

I-Highleap inesitifiketi se-ISO 9001 kanye ne-IATF 16949, kanye nokugeleza kwenqubo okuhambisana ne-AS9100D okutholakalayo ezinhlelweni ze-HPC ezidinga imibhalo yekhwalithi yokuzivikela kanye neye-aerospace. Sakha ama-PCB eseva ye-HPC kusukela ezingqimbeni eziyi-8 kuya kwezingqimbeni ezingama-32+, nge-HDI sequential lamination, i-impedance elawulwayo kuya ku-±5%, ithusi elisindayo kuya ku-4 oz, kanye nokumbozwa okuphelele kokuphela kwendawo. Umugqa wethu wedijithali osheshayo usebenzisa i-laser direct imaging ku-25 µm resolution kanye nokukhiqizwa kwe-HDI PCB ye-fanout ebanzi ye-BGA edingekayo kuma-CPU ahlonyiswe yi-HBM kanye nabathwali be-Grace Hopper. Isisekelo samakhasimende ethu sihlanganisa abahlanganisi bezinhlelo ze-HPC, abalingani be-hardware yelabhorethri kazwelonke, kanye nezikhungo ze-supercomputing zaseyunivesithi kuzo zonke izizukulwane eziningi zezinhlelo ze-Top500.

Thumela amafayela e-Gerber, idatha yokuprakthiza, imininingwane ye-stackup, inani eliqondiwe, kanye nesikhathi sohlelo nge -portal yethu yesilinganiso esiku-inthanethi ukuze uthole impendulo yamahora angama-24. Ukuze uthole ukwesekwa kwe-RFP, ukuthuthukiswa kwesiphakamiso esisemthethweni, noma ukuhlela ukusekelwa kwezinhlelo ze-HPC ezikhona, ithimba lethu le-HPC lingaxhumana ngqo ukuze lixoxe ngobubanzi nesikhathi. Ukuze uthole okuqukethwe kwamakhono ahlobene, bheka amakhasi ethu ekukhiqizweni kwe-PCB yeseva kanye nekhono le-PCB eliqinile elihlanganisa ukubalwa kwezingqimba, isisindo sethusi, kanye nokumbozwa kokuphela kobuso kwezinhlelo ze-HPC mainboard.