I-Laser imaging eqondile (LDI) ekwenziweni kwe-PCB

Emkhakheni ohlale uvela wokukhiqiza i-PCB, isidingo sokunemba okuphezulu, izici ezincane, nokuminyana kwesekethe kuphushe abakhiqizi ukuthi basebenzise ubuchwepheshe obuthuthuke kakhulu. Enye yezinto ezintsha ezinomthelela omkhulu kule ndawo i-Laser Direct Imaging (LDI), inqubo eseyibalulekile ekuhlangabezaneni nobunkimbinkimbi obandayo bemishini kagesi.

Kwa-Highleap Electronic, samukela ubuchwepheshe be-LDI ukuze sinikeze izisombululo zokukhiqiza ze-PCB ezinembayo, ezingabizi kakhulu, nezingalawuleki. Lesi sihloko sihlola ukuthi i-LDI isebenza kanjani, izinzuzo ezilethayo ekukhiqizeni i-PCB, nokuthi kungani iyithuluzi elibalulekile lokuklama nokukhiqiza izinto zikagesi zesizukulwane esilandelayo.

Yini i-Laser Direct Imaging (LDI)?

I-Laser Direct Imaging (LDI) ubuchwepheshe obusezingeni eliphezulu obusetshenziswa ekwenziweni kwe-PCB ukudlulisa amaphethini wesekethe ngokuqondile endaweni ye-PCB kusetshenziswa i-laser egxilile. Ngokungafani ne-photolithography yendabuko, esebenzisa ama-photomasks ukudlulisa imiklamo yesekethe, i-LDI iqeda isidingo samamaski angokwenyama, inikeza izinzuzo ezimbalwa ezifana nezikhathi zokukhiqiza ezisheshayo, ukunemba okuthuthukisiwe, nokuguquguquka okukhulu komklamo.

Isebenza kanjani i-LDI

Inqubo ye-LDI iqala ngamafayela edijithali (njengedatha ye-Gerber) echaza isakhiwo sesekhethi. Ilaser elawulwa ngekhompuyutha bese ilandelela lo mklamo endaweni ye-PCB ngokusebenzisa ukukhanya ukuze kuchazwe izici, njengokulandela umkhondo nama-vias. Isistimu ye-laser iskena ingaphezulu lebhodi, idale amaphethini anokulungiswa okuphezulu ahlangabezana nokucaciswa okuqondile kwemiklamo yesimanjemanje, enokuminyana okuphezulu kwe-PCB.

Isidingo se-LDI ku-PCB Manufacturing

Njengoba isidingo samadivayisi amancane, asheshayo, futhi ayinkimbinkimbi kakhulu siqhubeka sikhula, izindlela zokukhiqiza ze-PCB zendabuko ziya ngokuya zilinganiselwe ekhonweni lazo lokufeza lezi zidingo. Noma ngabe ikuzimpahla ezigqokwayo, kumadivayisi ezokwelapha, noma kubuchwepheshe obuvela ngokushesha be-5G, lezi zimboni zidinga ama-PCB anembe kakhulu anezingxenye ezincane, ukulandelelwa kahle, namadizayini aminyana kakhulu. Ubuchwepheshe be-Laser Direct Imaging (LDI) manje sebeyisixazululo sokunqoba imikhawulo yezindlela ezijwayelekile zokuthwebula izithombe. Nakhu ukuthi kungani i-LDI ingukhiye wokuthuthukisa ukwenziwa kwe-PCB:

1️⃣ Ukwenza kancane kwamadivayisi

Ukuthambekela okuqhubekayo ekusetshenzisweni okuncane kwezinto zikagesi kusho ukuthi amadivayisi kufanele abe mancane, abe lula, futhi asebenzise amandla kakhudlwana. Ukuphendula, ama-PCB adinga ukusekela izingxenye ezincane kanye nemiklamo eyinkimbinkimbi. Ubuchwepheshe be-LDI bubalulekile kulolu shintsho, okuvumela abakhiqizi ukuthi bakhe imikhondo emihle kakhulu, kuze kufike kuma-micrometer ambalwa. Lokhu kunemba kubalulekile ekuthuthukiseni amadivayisi ahlangene njengamawashi ahlakaniphile, izinto zezokwelapha ezifakelwayo, nezinzwa ze-IoT, lapho yonke indawo eyimilimitha yesikwele kufanele ithuthukiswe ukuze isebenze.

2️⃣ Isidingo Esikhulisiwe Ama-PCB we-HDI

Njengoba izinto zikagesi ziba ziminyene futhi nezimfuno zokusebenza zikhula, isidingo sama-PCB we-High-Density Interconnect (HDI) PCBs siye sakhula. Amabhodi e-HDI abalulekile kumadivayisi adinga ukuminyana kwesekethe okuphakeme nezindlela ezincane zikagesi ukuze kuncishiswe ukulahleka kwesignali nokuthuthukisa ukusebenza kukonke. Ubuchwepheshe be-LDI buphelele kule miklamo ethuthukisiwe, enikeza ukunemba okungenakuqhathaniswa ukuze udale ama-microvias nama-vias amancane abalulekile kumabhodi aminyana kakhulu. Lokhu kubaluleke kakhulu kubuchwepheshe obusezingeni eliphezulu njenge-5G, IoT, nezinto zikagesi zezokwelapha, lapho kudingeka khona amasekhethi ahlangene, asebenza kahle kakhulu ukuze kuqinisekiswe ubuqotho besignali obuthembekile kanye nokudluliswa kwedatha okusheshayo.

3️⃣ Ukuthayipha Okusheshayo kanye nesikhathi esisheshayo sokuya emakethe

Ezimbonini ezifana nezinto ezigqokwayo, i-telemedicine, kanye ne-electronics yabathengi, i-prototyping esheshayo ibalulekile ekuletheni imibono emisha ukuze imakethwe ngokushesha. Ubuchwepheshe be-LDI bunikeza inzuzo enkulu ngokususa isidingo samamaski ezithombe zendabuko. Lokhu kuvumela ukuphindaphinda okusheshayo, izikhathi zokuhola ezincishisiwe, nemijikelezo yokukhiqiza esheshayo, okwenza kube nokwenzeka ukuhlola nokuguqula imiklamo ngesivinini nangempumelelo. Ukuvumelana nezimo okuhlinzekwe yi-LDI kwenza izinkampani zikwazi ukunciphisa isikhathi sokuya emakethe, ziqinisekise ukuthi amadivaysi amasha angethulwa ngokushesha, okunikeza amabhizinisi umkhawulo wokuncintisana emakethe esheshayo.

Kwa-Highleap Electronic, sisebenzisa i-Laser Direct Imaging ukuze sikhiqize ama-PCB ekhwalithi ephezulu, anembe kakhulu ezimbonini ezihlukahlukene, siqinisekisa ukuthi imiklamo yakho ihlala iphambili ekusunguleni izinto ezintsha. Noma ngabe udinga ama-HDI PCB, amasekhethi aguqukayo, noma i-prototyping esheshayo, i-LDI ingukhiye wokuvula amandla edivayisi yakusasa.

Izinqubo Ezithuthukiswe I-LDI Technology Ekukhiqizeni Kwe-PCB

Ubuchwepheshe be-Laser Direct Imaging (LDI) budlala indima ebalulekile ekuthuthukiseni ukwenziwa kwe-PCB, bunikeze ukunemba okungenakuqhathaniswa, ukwethembeka okuthuthukisiwe, nokusebenza kahle okukhulu kuzo zonke izinqubo eziningi. Ngokususa isidingo samamaski ezithombe zendabuko, i-LDI inika amandla ukukhiqizwa kwemiklamo emincane, eyinkimbinkimbi kakhulu ebaluleke kakhulu ekusetshenzisweni okuncane nokusebenza kwezidingo zama-electronics wesimanje.

1️⃣ Ukufanekisa Kwesendlalelo Sangaphakathi

Kuma-PCB anezingqimba eziningi, isithombe sesendlalelo sangaphakathi sibalulekile ekudalweni okunembile kwamaphethini wesekethe ayinkimbinkimbi. Ubuchwepheshe be-LDI buvumela ukunemba okuphezulu kwephethini, okubalulekile kuma-PCB e-high-density interconnect (HDI). Ivumela ukudalwa kwemigqa emihle, ama-microvias, nezici ezincane ezibalulekile ekuqinisekiseni ubuqotho bokusebenza kwezendlalelo zangaphakathi, ikakhulukazi njengoba amadizayini aminyene kakhulu futhi aminyene kakhulu.

2️⃣ Ukufanekisa Kwesendlalelo Sangaphandle

Izendlalelo zangaphandle ze-PCB zidinga ukulandelelwa okuhle kakhulu kanye nama-vias amancane ukuze kufakwe imiklamo ehlangene kanye nezinhlelo zokusebenza zamafrikhwensi aphezulu. I-LDI iqinisekisa ukunemba okuphezulu kwephethini, okudingekayo ukuze kuzuzwe ububanzi bemigqa emincane nezikhala eziqinile ezibalulekile ezinhlelweni ze-RF namadivayisi amancane. Leli khono liyisihluthulelo sokuhlangabezana nesidingo esandayo sama-electronics asebenza kahle njengobuchwepheshe obugqokekayo, amadivaysi e-5G, nemishini yezokwelapha.

3️⃣ Isicelo Semaski Solder

Ukusetshenziswa okunembile kwemaski ye-solder kubalulekile ekuvikeleni i-PCB nokuqinisekisa ikhwalithi yenqubo ye-solder. I-LDI ithuthukisa ukunemba kwezicelo zemaski ye-solder, inika amandla incazelo eqondile yokuvuleka kwemaski ye-solder. Lokhu kubangela ukusebenza okuthuthukisiwe, ukuncishiswa kwamasekhethi amafushane, kanye nokwethenjelwa okwandisiwe kumkhiqizo wokugcina, okubaluleke kakhulu kuma-PCB anomthamo omkhulu, ama-high-frequency asetshenziswa ezinhlelweni ezibucayi zemishini.

4️⃣ Ukuphrinta Kwesendlalelo seSilkscreen

Nakuba isendlalelo sesikrini sikasilika (esisetshenziselwa ukulebula nokuhlonza) singaphazamisi ngokuqondile ukusebenza kwe-PCB, ubuchwepheshe be-LDI buthuthukisa kakhulu ukulungiswa nokucaca kwamalebula aphrintiwe nokumaka. Lokhu kuthuthukiswa kuphumela emakhakheni acacile futhi ahlala isikhathi eside, abalulekile ekuhlonzweni okufanele nokulandelelwa kwe-PCB, kanye nokuthuthukisa ubuhle nokulawulwa kwekhwalithi enqubweni yokukhiqiza.

5️⃣ I-Prototyping esheshayo

Ku-prototyping esheshayo, isivinini kanye nokuguquguquka kubalulekile ekuhloleni ngokushesha nasekulungiseni imiklamo ye-PCB. Ubuchwepheshe be-LDI bunikeza ukuguquguquka okukhulu kwedizayini ngokususa isidingo samamaski aphathekayo, okuvumela ukuphindaphinda okusheshayo kanye nezikhathi zokuhola ezincishisiwe. Nge-LDI, izinguquko zedizayini zingenziwa ngokushesha, okuvumela izinguquko ezisheshayo ukusuka kumqondo ukuya ekuhlolweni kwesibonelo, ngaleyo ndlela kusheshiswe imijikelezo yokuthuthukiswa komkhiqizo.

6️⃣ I-High-Density Interconnect (HDI) Amabhodi

Njengoba izinto zikagesi ziba minyene futhi zibe namandla, isidingo samabhodi e-HDI siyaqhubeka sikhula. I-LDI ilungele ama-HDI PCB, njengoba ivumela ukudalwa kwama-microvias, imikhondo emihle, nama-vias amancane anembayo. Lawa makhono athuthukile enza ubuchwepheshe be-LDI bubaluleke kumasekhethi anesivinini esikhulu kumadivayisi eselula, izinto ezigqokwayo, nengqalasizinda ye-5G, lapho ukunciphisa ukulahlekelwa kwesignali nokuthuthukisa ukuminyana kwesekethe kubalulekile.

7️⃣ Ama-PCB aguqukayo futhi Aqinile-Flex

Ama-PCB aguquguqukayo futhi aqinile aletha izinselele eziyingqayizivele ngenxa yenhlanganisela yawo yokuguquguquka nokuqinile. Ubuchwepheshe be-LDI buhlinzeka ngokunemba okuphezulu okudingekayo ukuze kusingathwe inkimbinkimbi yale miklamo, iqinisekisa ukuthi ubuqotho bukagesi bugcinwa ngaphandle kokuphazamisa ukuguquguquka. Lokhu kwenza i-LDI ibe ilungele ukukhiqiza amasekhethi aguquguqukayo asetshenziswa kumadivayisi agqokekayo, izimila zezokwelapha, nezinye izinhlelo zokusebenza ezisebenza kahle lapho ukuguquguquka nokuqina kubaluleke kakhulu.

Izinzuzo ze-Laser Direct Imaging (LDI) ku-PCB Manufacturing

I-Laser Direct Imaging (LDI) inikezela ngezinzuzo ezibalulekile kunezindlela zokukhiqiza ze-PCB ezivamile, ikakhulukazi uma ikhiqiza imiklamo ye-PCB enokuminyana okuphezulu, eyenziwe nge-miniaturized, neyinkimbinkimbi. Ikhono lokudala izici ezinhle nokugcina ukunemba okuphezulu kwenza i-LDI ibe ithuluzi elibalulekile lokuhlangabezana nezidingo eziguqukayo zezimboni ezifana nezokuxhumana ngocingo, izisetshenziswa zezokwelapha, i-IoT, nezinto zikagesi zabathengi. Ngezansi izinzuzo ezibalulekile ezilethwa i-LDI ekukhiqizeni i-PCB:

✅ Ukulungiswa Okuphezulu Nokunemba

Amasistimu e-LDI anika amandla ukulungiswa kwezinga le-micrometer, okubalulekile ekudaleni imikhondo emihle kakhulu, ama-vias amancane, namaphethini wesekethe ayinkimbinkimbi. Lokhu kunemba okuphezulu kwenza i-LDI ifaneleke kuma-HDI PCB, adinga imininingwane emihle kanye noxhumano oluphezulu lokuminyana (HDI) kuzinhlelo zokusebenza ezithuthukile ze-elekthronikhi. Ngekhono lokudala imikhondo emincane nemizila eminyene, i-LDI isekela ukuthuthukiswa kwamadivayisi afana nama-smartphone, izinto ezigqokwayo, nobuchwepheshe be-5G obudinga amabhodi esekethe ahlangene nasebenza kahle.

✅ Amaphutha Ancishisiwe Okuqondanisa

Enye yezinto ezibaluleke kakhulu ekwenziweni kwe-PCB ye-multilayer ukuqondanisa ungqimba olunembile. Izinqubo zendabuko ze-photolithography zingaholela ezinkingeni zokuqondanisa, okuholela ekuphumeni okungalungile noma ukulandelelwa phakathi kwezendlalelo. Ngobuchwepheshe be-LDI, lawa maphutha okuqondanisa ancishiswa kakhulu, okuqinisekisa ukuthi zonke izendlalelo zibhaliswe ngokunembile. Lokhu kubaluleke kakhulu kumabhodi we-multilayer HDI, lapho ukubekwa okuqondile kwezingxenye kuyadingeka ukuze kuqinisekiswe ukusebenza nokuthembeka kwamasekethe anesivinini esikhulu.

✅ Design Ukuvumelana nezimo kanye nezinguquko ezisheshayo

Nge-LDI, ukuguqulwa kwedizayini kungenziwa ngokushesha ngaphandle kokudinga ukwakha imaski emisha, okusheshisa kakhulu inqubo yokuphindaphinda kokuklama. Lesi sici sizuzisa kakhulu phakathi nesigaba se-prototyping, lapho ngokuvamile kudingeke izinguquko eziningi zedizayini. Ukuvumelana nezimo kwe-LDI kwenza abakhiqizi bakwazi ukwenza izinguquko ngokushesha ekwakhiweni ngaphandle kokufaka izindleko ezengeziwe noma ukubambezeleka okuhlobene nokukhiqizwa kwemaski. Lokhu kusheshisa ukuthuthukiswa komkhiqizo futhi kusiza imijikelezo emisha esheshayo.

✅ Izikhathi Zokukhiqiza Ezisheshayo

Ukudala imaski yendabuko kungadla isikhathi futhi kusebenze kanzima. Ngokususa isidingo samamaski angokwenyama, i-LDI ivumela izikhathi zokukhiqiza ezisheshayo, ikakhulukazi ezizuzisayo ekugijimeni kokukhiqiza okuncane kuya kokuphakathi noma ukwenza i-prototyping ngokushesha. Inqubo eyenziwe lula yenza abakhiqizi bakwazi ukuletha imikhiqizo emakethe ngokushesha, ukunciphisa isikhathi sokuya emakethe futhi banikeze inzuzo yokuncintisana. Lokhu kubaluleke kakhulu ezimbonini lapho isivinini nokushesha kubalulekile ukuze uphumelele.

✅ Ukukhiqiza Okuthuthukisiwe Nokungaguquguquki

Ngezinqubo zendabuko ezisekelwe ku-photomask, kuhlale kunengozi yokukhubazeka okubangelwa ukungahambi kahle kwemaski noma ukuguga nokuklebhuka ngokuhamba kwesikhathi. Ubuchwepheshe be-LDI buqeda lezi zinkinga, okuholela kumazinga esivuno aphezulu kanye nekhwalithi engaguquki kuwo wonke amaqoqo okukhiqiza. Ukunemba okuphezulu okunikezwa yi-LDI kuqinisekisa ukuthi yonke i-PCB ihlangabezana nezindinganiso eziqinile zokusebenza, ukuthuthukisa ukuthembeka kukonke komkhiqizo wokugcina kanye nokunciphisa amathuba okuba nenkinga nokwehluleka ngesikhathi sokusetshenziswa.

✅ Ukusebenza Kwezindleko Kwamaqoqo Amancane

Ngokukhiqizwa kwe-prototype noma ukugijima kweqoqo elincane, i-LDI ifakazela ukuthi ibiza kakhulu kunezindlela zendabuko. Ukukhiqizwa kwe-PCB yomdabu kuvame ukudinga ama-photomasks abizayo abizayo ukuwakha nokuyinakekela. Nge-LDI, asikho isidingo salezi zimaski ezibonakalayo, ukunciphisa izindleko zangaphambili futhi kuqedwe isidingo sokugcinwa kwemaski. Lokhu kwenza i-LDI ibe inketho ekahle ezinkampanini ezidinga ama-prototypes asheshayo noma ukukhiqizwa okuncane okuqhutshwa lapho izindleko zokudala imaski yendabuko zingaba zimbi.

✅ Ukusimama Kwemvelo

Ukusetshenziswa kobuchwepheshe be-LDI akuthuthukisi ukusebenza kahle kuphela kodwa futhi kwenza inqubo yokukhiqiza ye-PCB igcineke ngokwendalo. Ukukhiqizwa kwe-PCB yendabuko kudala imfucuza ekukhiqizweni kwemaski kanye nokulahlwa kwemaski, okungaba nomthelela ekumoshweni kwezinto ezibonakalayo. Nge-LDI, ukuqedwa kwemaski aphathekayo kunciphisa ukusetshenziswa kwezinto ezibonakalayo kanye nokuphehla udoti, kuyenze ibe inketho evumelana nemvelo. Ngokwamukela i-LDI, izinkampani zingafaka isandla ezenzweni zokukhiqiza ezizinzile kuyilapho zigcina amazinga aphezulu okunemba nokusebenza.

Kungani i-LDI iyi-Game-Changer ku-PCB Manufacturing

Ukwethulwa kwe-Laser Direct Imaging (LDI) kushintshe indlela ama-PCB akhiqizwa ngayo. Njengoba inikeza ukunemba okungenakuqhathaniswa, ukuguquguquka, kanye nokusebenza kahle kwezindleko, i-LDI isibe yitshe lesisekelo lokukhiqizwa kwe-PCB yesimanje , ikakhulukazi ezimbonini ezidinga imiklamo eyinkimbinkimbi nexineneyo. Njengoba izinto zobuchwepheshe ziqhubeka nokuncipha kanye nokulindelwa kokusebenza kukhuphuka, ubuchwepheshe be-LDI buqinisekisa ukuthi abakhiqizi bangahlangabezana nalezi zidingo ngenkathi bethuthukisa isivuno, ukusebenza kahle, kanye nokusimama.

Kwa-Highleap Electronic, sisebenzisa ubuchwepheshe be-LDI ukuhlinzeka ngezixazululo ze-PCB ezinembayo ezinhlotsheni eziningi zezimboni, kusukela kumishini yezokwelapha kuye kwezokuxhumana. Ngokuhlanganisa i-LDI ohlelweni lwethu lokukhiqiza, siqinisekisa ukuthi amakhasimende ethu athola ikhwalithi engcono kakhulu, ukwethembeka, kanye nokusebenza kahle kwezindleko kumadizayini awo e-PCB.

Xhumana nathi Namuhla ukuze ufunde kabanzi mayelana ne-LDI ku-PCB Manufacturing

📩 Xhumana nathi ukuze uthole ukubonisana kwamahhala kanye nekhwothi ukuze uthole ukuthi i-Laser Direct Imaging ingathuthukisa kanjani ukukhiqizwa kwakho kwe-PCB futhi isize ukwenza imiklamo yakho emisha iphile!

I-FAQ: I-Laser Direct Imaging (LDI) ku-PCB Manufacturing

1. Ingabe i-LDI ibhekana kanjani nezinselele zesignali yobuqotho kuma-PCB anemvamisa ephezulu (isb, i-5G/mmWave)?
Ukunemba kwezinga le-micron ye-LDI kuqinisekisa ububanzi bokulandela umkhondo nesikhala, kunciphisa ukuhluka kokuphazamiseka okubangela ukubonakaliswa kwesignali. Emiklamweni engu-28+ GHz, ifinyelela u-<5 μm wokulungiswa komkhondo, okubalulekile ekugcineni ukuhambisana kwesigaba kumasekhethi e-RF. I-Highleap ibhangqa i-LDI nokuhlolwa kwe-TDR ukuze kuqinisekiswe ukuthintana (±2% ukubekezelelana) nokulahlekelwa kokufaka (<0.2 dB/cm) kuma-antenna angu-5G.

2. Yikuphi ukuncishiswa kwemfucuza yemvelo i-LDI ekunikezayo uma kuqhathaniswa ne-photolithography yendabuko?
Ngokuqeda ama-photomasks, i-LDI yehlisa udoti wamakhemikhali ekuhlanzeni imaski kanye nemfucuza engokomzimba kumamaski aphelelwe yisikhathi. Ngenqwaba yamabhodi angu-1,000, lokhu kunciphisa ukusetshenziswa kwe-solvent ngo-30-40% futhi kugwema u-15-20 kg wemfucumfucu yemaski ye-acrylic/polyester. I-Highleap iphinde ithuthukise ukusimama ngokusetshenziswa kabusha kwefilimu eyomile.

3. Ingabe i-LDI ingakwazi ukuphatha izakhiwo ze-HDI ezithuthukisiwe njengama-microvias amile noma ukweqa?
Yebo. Usayizi wendawo ye-laser engu-5 μm we-LDI uvumela ukumba okunembayo kwama-microvias angama-50 μm kanye ne-skip-vias kumabhodi angu-20-layer HDI. Lokhu kusekela ama-BGA angu-0.2 mm kuma-accelerator e-AI, ngo-99.9% ngokunemba kokubhalisa ngokuhlolwa kwangemuva kwe-AOI.

4. I-LDI ikuthuthukisa kanjani ukwethembeka kwama-PCB aguquguqukayo kumadivayisi agqokekayo?
Inqubo engenamaski ye-LDI igwema ukucindezelwa komshini kusuka ekuqondaneni kwemaski kuma-substrates aguquguqukayo njenge-polyimide. Ifinyelela iminonjana engu-25 μm kumiklamo eguquguqukayo ngenkathi igcina > isivuno esingu-90%, esibalulekile kuma-elekthronikhi asongekayo kanye nezinto ezigqokwayo zezokwelapha ezivezwe emijikelezweni egobayo.

5. Yiziphi izindinganiso zefayela lokuklama ezidingekayo ukuze kuhambisane ne-LDI?
I-LDI isekela amafomethi ajwayelekile e-Gerber X2 noma i-ODB++, kodwa i-Highleap incoma ukuthi kufakwe amaphrofayili e-impedance kanye nemithetho ye-DRC eqondene nongqimba kumafayela. Ezicini ezinhle kakhulu (isb, ukulandelelwa okungu-3/3 mil), amafomethi asuselwa ku-vector aqinisekisa ukucaciswa konqenqema okushelelayo kunedatha ehluziwe.

6. Ingabe i-LDI ikhawulela ukukhetha kwezinto ezibonakalayo ku-high-Tg noma ama-substrates akhethekile?
Cha. Izinhlelo ze-LDI ze-Highleap ziyahambisana ne-high-Tg FR-4 (Tg=180°C), i-laminate ekhethekile ephansi yokulahlekelwa, kanye ne-polyimide. Ubude be-laser (355 nm) bulungiselelwe izinto ze-low-Df, okuqinisekisa ukuthi i-<1% CD iyahlukahluka ngisho nasezindaweni ze-aerospace ze-low-CTE.