I-KB-6164 Laminate kanye ne-KB-6064 Preg for Controlled Multilayer Stackups

I-KB-6164 laminate kanye ne-KB-6064 prepreg yama-PCB stackups anezingqimba eziningi

I-KB-6164 iyi-laminate embozwe ngethusi elungisiwe, kuyilapho i-KB-6064 iyi-prepreg efanayo engakalungiswa esetshenziselwa ukubopha ukwakhiwa kwe-PCB enezingqimba eziningi. I-Highleap Electronics ivame ukuthola lezi zinto njengengxenye ye-oda le-PCB noma le-PCBA eliqediwe bese iziguqula zibe yi-stackup ekhishwe enobukhulu be-dielectric obulawulwayo, ithusi kanye nokuhlolwa.

Impendulo eqondile: I-PCB ye-KB-6164 enezingqimba eziningi ayenziwanga ngeshidi elilodwa elingu-1.6 mm. Isebenzisa ama-core amaningi e-KB-6164 kanye nezendlalelo ze-KB-6064 prepreg ezicindezelwe nxazonke zethusi elinephethini ukuze kufezwe i-stackup yokugcina.

Izindima ze-PCB ze-Laminate, Preg kanye ne-Finished

Into Isimo ngaphambi kokucindezela Indima ku-PCB
Ingqikithi ye-KB-6164 I-laminate evuthwe ngokuphelele, ngokuvamile embozwe ngethusi Ihlinzeka ngesendlalelo se-dielectric esizinzile esithwala ithusi elingaphakathi noma elingaphandle
I-KB-6064 prepreg I-resin ehlungiwe kancane endwangu yengilazi Kugeleza futhi kuphulukise ngesikhathi sokulayina kuya kuma-cores okubopha kanye ne-topography yethusi egcwalisiwe
I-PCB eqediwe enezingqimba eziningi Ukwakhiwa okucindezelwe, okubholiwe, okufakwe amapulangwe kanye nokuqediwe Ihlanganisa izinto zokwakha, ithusi, izimbobo, ukuqeda kanye nokubekezelelana kumkhiqizo othengiwe

A buyer who only specifies the laminate name leaves major decisions unresolved: glass style, okuqukethwe kwe-resin, pressed thickness, copper treatment, core distribution and final thickness. Highleap resolves these through a released stackup, not through purchasing substitution on the shop floor.

Indlela Yokuchaza Izakhiwo Ezisemthethweni

I-Kingboard ibala i-KB-6164 njenge-standard-Tg, ehambisana ne-FR-4 engenalo i-lead-free-process ene-Tg ejwayelekile engu-140°C, i-Td 330°C, ukwanda okuphelele kwe-Z-axis okungu-3.5% kanye ne-CTI 175 V. Lawa manani akhomba isigaba sezinto ezibonakalayo futhi awusizo ekuqhathaniseni. Aziqinisekisiwe ukuthi zicacisiwe yini izincazelo zebhodi eliqediwe.

Izindlela zokuhlola azikwazi ukushiywa

I-Tg iyahlukahluka nge-DSC, i-TMA noma i-DMA. I-Dk ne-Df ziyahlukahluka ngokuvama kokuhlolwa, okuqukethwe kwe-resin kanye nendlela. Amadokhumenti okuthenga kufanele alondoloze indlela lapho inani libalulekile, ngaphandle kwalokho amashidi amabili edatha abonakala ephikisana angasebenzisa izilinganiso ezihlukile.

Amanani ezinto ezibonakalayo, amanani okuklama kanye nemiphumela elinganisiwe ahlukile

  • Inani lezinto ezibonakalayo: idatha ejwayelekile eshicilelwe yiKingboard.
  • Inani lomklamo: inombolo ethile yokwakha esetshenziswa ngumenzi wokwenza amamodeli e-stackup.
  • Umphumela olinganisiwe: idatha evela kukhuphoni noma ukuhlolwa kwebhodi eliqediwe.

Ukudideka kwala mazinga obufakazi kuyimbangela evamile yezingxabano ze-impedance.

Ubukhulu, Ukulungiselela Ngaphambi Kokukhulelwa, Ithusi Nokujiya Okucindezelwe

Ubukhulu be-core abukaqediwe

Ubukhulu obuqediwe bulingana nama-core ahlanganisiwe, ama-prepreg acindezelwe, ithusi kanye nokubekezelelana kwenqubo. Ubuningi bethusi bushintsha ukugeleza kwe-resin, ngakho-ke i-prepreg efanayo ingacindezela ngendlela ehlukile phakathi kwesendlalelo sendiza kanye nesendlalelo sesignali esingavamile.

Isitayela sengilazi kanye nokuqukethwe kwe-resin kuthinta indlela yokugcwalisa kanye nokuziphatha kukagesi

Ingilazi encane ingasekela ama-dielectric amancane, kuyilapho ingilazi esindayo inganikeza ukujiya okwengeziwe kanye nokuqina komshini. Okuqukethwe kwe-resin kunquma ukuthi kungakanani ukugeleza okutholakalayo ukugcwalisa ithusi eliqoshwe. Inhlanganisela ekhethiwe kumele ihlangabezane nokujiya, ukugcwaliswa kwe-resin, ukubhaliswa, ukubhobozwa kanye nokungangeni.

I-foil yethusi kumele ibhalwe kahle

I-foil yokuqala, ithusi eliqediwe kanye nethusi elifakwe ipulasitiki kuyincazelo ehlukile. Nge-impedance elawulwayo noma imigqa emincane, ukwelashwa kwethusi kanye nephrofayili kungabaluleka. I-stackup kufanele ibone ithusi eliqediwe ngeleveli kanye nanoma yimuphi umkhawulo wephrofayili yethusi ovunyiwe.

Ukuze uthole umongo womklamo wezingqimba eziningi, sebenzisa umhlahlandlela we-PCB stackup we-Highleap . Uchaza ukuthi kungani ukutholakala kwezinto kanye nekhono lokukhiqiza kumele kucatshangelwe ngaphambi kokuba ukwakheka kuqandwe.

Udinga i-Highleap ukuguqula ubukhulu bethagethi bube ukwakhiwa kwangempela?

Thumela izendlalelo, ubukhulu obuphelele, ithusi ngesendlalelo, impedance, izimbobo ezincane kakhulu kanye nobuningi. Isiphakamiso sokuqala sokuqongelela singalungiswa ngaphambi kokuba ukwakheka okuphelele kuqedwe.

Cela i-KB-6164 stackup

I-KB-6164 PCB laminate yokulawula ama-stackup amaningi

Isitoreji, Ukulawulwa Kwezindawo kanye Nokulandelela

I-Prepreg ibucayi kakhulu ekugcinweni nasekugcinweni kwayo kune-laminate elungisiwe. Izinga lokushisa, umswakama, ukupakisha kanye nesikhathi sokuvezwa kungathinta ukugeleza kanye nokwelashwa kwayo. I-Highleap ilawula ukwamukelwa kwezinto, ukuhlonza indawo kanye nokukhululwa kwayo ngokwesiqondiso samanje somhlinzeki kanye nezidingo zenqubo yangaphakathi.

Ungaxubi ama-prepreg amaningi ngokunganaki

Izinqwaba ezahlukene zingaba nokwehluka okuvamile kokuqukethwe kwe-resin kanye nokugeleza kwayo. Ukuze kube nobukhulu obudingekayo noma ukwakheka kwe-impedance, izinqwaba kanye nokwakhiwa kufanele kulawulwe. I-prepreg ephelelwe yisikhathi noma egcinwe ngendlela engafanele akufanele isetshenziswe ngaphandle kokuhlolwa okuvunyiwe.

Ukulandeleka kufanele kuhambisane nengozi yomkhiqizo

Ibhodi lezentengiselwano elivamile lingadinga ubunikazi bezinto ezibonakalayo kanye namarekhodi ezindawo. Uhlelo olulawulwayo noma oluthembekile kakhulu lungadinga izitifiketi, amarekhodi okugcina, ukulawulwa kokubuyekezwa kwe-stackup kanye namakhuphoni agciniwe. I-RFQ kufanele isho amadokhumenti adingekayo esikhundleni sokucabanga ukuthi yonke i-oda ifaka iphakheji efanayo.

Impedance kanye neFinished-Board Qualifired

I-Catalog Dk akufanele ikopishwe ngqo ku-impedance solver. I-core/prepreg ekhethiwe, okuqukethwe kwe-resin, iphrofayili yethusi kanye nomphumela wokucindezela kunquma inani lomklamo. I-Highleap ingaxazulula ububanzi be-trace kanye nesikhala ngemva kokukhethwa kokwakhiwa.

Lapho kudingeka khona ukulawula okulinganisiwe, umdwebo wokwenziwa kufanele ubonise ukuvimba okuqondiwe, ukubekezelelana, i-geometry yekhuphoni kanye nokulindela ukubika. Umhlahlandlela wezimfuneko zokuvimbela okulawulwayo unikeza ifomethi yokucacisa ewusizo.

Ukufaneleka kufanele kugxile ebhodini eliqediwe

Isitifiketi sezinto ezibonakalayo sifakazela ubuwena, hhayi ikhwalithi yomgodi oqediwe noma i-impedance. Kuye ngomkhiqizo, ubufakazi obuwusizo bungafaka phakathi ukujiya okucindezelwe, i-microsection, ukuhlolwa kukagesi, ikhuphoni ye-impedance, ukushintshwa kwe-soldering kanye nemiphumela yokuhlanganiswa kwesihloko sokuqala.

Isibonelo sokwakheka kwebhodi elinezingqimba eziyisithupha

Ibhodi elinezingqimba eziyisithupha lingasebenzisa ama-core amabili e-KB-6164 anephethini ahlukaniswe yi-KB-6064 prepreg, kanye nethusi langaphandle elibekwe eduze kwe-subassembly. Ukukhetha kokugcina kuncike ekujikeni okuqondiwe, ukuvinjelwa, ibhalansi yethusi kanye ne-geometry yokubhoboza. Uma umklamo udinga isikhala sesignali esingu-0.10 mm ukusuka eplanini, umenzi kumele aqinisekise ukuthi isitayela sengilazi esikhethiwe kanye nokuqukethwe kwe-resin kungacindezela kulelo nani kulo lonke iphethini langempela lethusi. Ubukhulu bekhathalogi obujwayelekile abuyona isiqinisekiso sokuthenga.

Imibuzo okufanele iphendulwe ngaphambi kokugunyaza i-stackup

  • Ingabe izitayela ezibalwe ngenhla kanye nezitayela zokulungiselela ziyatholakala manje emthonjeni ovunyelwe?
  • Ingabe ukujiya okucindezelwe kusekelwe kumaphesenti ethusi langempela noma etafuleni elijwayelekile?
  • Yiliphi inani le-Dk elisetshenziswe ku-geometry ngayinye ye-controlled-impedance?
  • Ingabe i-prepreg inikeza i-resin eyanele ukugcwalisa i-topography yethusi?
  • Ingabe amanani ethusi angaphakathi nangaphandle ashiwo njengethusi eliqediwe?
  • Ingabe ukwakhiwa okufanayo kuzosetshenziswa kuma-oda aphindaphindwayo, noma ingabe kudingeka umthetho ofanayo?

Indlela yokuntuleka kwezinto ezibonakalayo okufanele iphathwe ngayo

Uma ubukhulu be-core obuceliwe bungatholakali, impendulo efanele akuyona into engabhalwanga. I-Highleap kufanele iphakamise ukwakhiwa okunye okulondoloza ubukhulu obuphelele, i-impedance, ithusi, i-drill geometry kanye nesigaba sokushisa, bese ithola imvume ngaphambi kokukhululwa. Kwezinye izimo ububanzi bomkhondo buyashintsha; kwezinye, inhlanganisela ehlukile yama-prepregs ishintsha okuqukethwe kwe-resin kanye nokuziphatha kokucindezela. Ikhotheshini yezentengiselwano kufanele ibone ukuthi intengo ithatha ukwakhiwa okuthile noma ivumela okulingana okuvunyelwe.

Okungalethwa nge-oda lobunjiniyela elisekelwe ezintweni ezibonakalayo

Kuye ngobukhulu bephrojekthi, umthengi angathola i-stackup yokuqala, ukwakhiwa kokugcina okukhishwe, itafula le-impedance, irekhodi lezinto ezibonakalayo, i-microsection, ukuqinisekiswa kokuhlolwa kukagesi kanye nekhophi yesitifiketi. Lezi yizinto ezilethwayo ebhodini eliqediwe. Izitifiketi ze-laminate eluhlaza zodwa azibonisi ukuthi ibhodi licindezelwe, labholwa futhi labekwa ngendlela efanele.

Izinto Ezingavuthiwe Uma Ziqhathaniswa Nokuqedwa Kwe-PCB Sourcing

Insizakalo evamile ye-Highleap ukuhlinzeka nge-PCB noma i-PCBA eseqediwe, hhayi ukuthengisa kabusha amashidi e-laminate ahlukanisiwe. Lokhu kuvumela indlela eyodwa yokukhiqiza ukulawula ukutholakala kwezinto, ukuqoqa, ukubopha, ukubhoboza, ukuhlanganisa, ukuqeda kanye nokuhlola.

Uma ukutholakala kwe-raw-sheet kudala ingozi

Umthengi angathola inombolo yengxenye efanele kodwa akhethe ubukhulu obungalungile be-core, ifomu lethusi noma i-prepreg. Umenzi wezinto angase angabi nayo iresiphi yokushicilela ekhishwe. Ukuthengwa kwebhodi eliqediwe kubeka umthwalo wemfanelo wokwenzeka kokwakhiwa kumkhiqizi we-PCB.

Okulinganayo okuvunyiwe

Okulinganayo kumele kufane nesigaba sezinto ezibonakalayo, ukuziphatha kokushisa, i-CTI, ukutholakala kokwakhiwa, izitifiketi kanye nezidingo zamakhasimende. Ibinzana elithi “noma okulinganayo i-FR-4” libanzi kakhulu kumkhiqizo ophindaphindwayo olawulwayo. Uma ukushintsha kuvunyelwe, chaza inqubo yokugunyazwa.

Indlela yokuhlola i-stackup ehlongozwayo ngumenzi

Isiphakamiso kufanele sihambisane ngaphakathi: ama-cores abhalwe ohlwini kanye nama-prepreg kumele engeze ekujikeni okuqondiwe, amanani ethusi kumele ahlukanise isisekelo nethusi eliqediwe, imikhondo ye-impedance kumele ivumelane nemithetho yokuklama, futhi okuqukethwe kwe-resin kumele kube okufanelekile kuphethini yethusi. I-stackup ekopisha nje ubukhulu bekhathalogi ngaphandle kokusho amanani acindezelwe ayilungele ukukhiqizwa.

Ukuthengwa kufanele futhi kuhlole ukuthi igama lezinto ezibonakalayo liyavela yini kumanothi okwenziwa nokuthi umdwebo uchaza inqubomgomo efanayo yini. Uma izinto ezibonakalayo zibalulekile, ukwakhiwa okukhishwe kufanele kube yingxenye yephakheji ye-oda, hhayi okunamathiselwe kwe-imeyili okungakahleleki okungalahleka ngesikhathi sokukhiqiza okuphindaphindiwe.

Imibuzo Evame Ukubuzwa Yezinto Ze-KB-6164

Uyini umehluko phakathi kwe-KB-6164 ne-KB-6064?

I-KB-6164 iyi-laminate/core elungisiwe. I-KB-6064 iyi-prepreg efanayo esetshenziselwa ukubopha ibhodi elinezingqimba eziningi.

Ingabe ubukhulu be-catalog core bungasetshenziswa njenge-dielectric eqediwe?

Ubukhulu be-core bungase busondele enanini layo elijwayelekile, kodwa isikhala se-dielectric esiqediwe kumele sibheke ukubekezelelana kwethusi kanye nenqubo. Ubukhulu obucindezelwe yi-Prepreg buxhomeke kakhulu ekwakhiweni.

Yimuphi uDkt okufanele asetshenziswe kwi-impedance?

Sebenzisa inani lomklamo eliqondene nokwakhiwa elivunyelwene ngalo nomkhiqizi we-PCB, bese uqinisekisa ngekhuphoni uma kudingeka ukulinganisa.

Ingabe i-KB-6064 ingaxutshwa nolunye uhlelo lwe-laminate?

Kuphela ngesitifiketi esivunyiwe se-hybrid. Izinhlelo ze-resin akufanele zixutshwe njengendlela yokuthenga engabhalisiwe.

Inkomba yezinto eziyinhloko: Ulwazi lobuchwepheshe lwe-Kingboard KB-6164/KB-6064. Izibalo zomkhiqizi ziyizindinganiso ezijwayelekile zokubhekisela; sebenzisa ishidi ledatha lamanje kanye nokwakhiwa okuvunyiwe ukuze uthole imininingwane yokukhiqiza.

Thenga ukwakhiwa kwe-PCB elawulwayo, hhayi i-laminate callout engaqondakali.

I-Highleap ingayithola i-KB-6164/KB-6064, ikhulule i-stackup futhi ilethe amabhodi angenalutho ahlolwe noma ama-PCBA aphelele.

Xoxa nge-PCB esekelwe ezintweni ezibonakalayo

Izixazululo ze-Highleap PCB kanye ne-PCBA - cela ikhotheshini

Posts Kunconywe

Ungasithola kanjani isilinganiso sama-PCB

Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:

    • Gerber, ODB++, noma .pcb, spec.
    • Uhlu lwe-BOM uma udinga ukuhlangana
    • Ubuningi
    • Isikhathi sokushintsha
Ngokungeziwe ekwenziweni kwe-PCB, sinikeza uhla olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA, nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho.

Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.

    Sitshele Ngephrojekthi Yakho Ye-PCB

    Awekho amafayela okuklama okwamanje? Akunankinga. Yabelana ngalokho okwaziyo, futhi sizolandela uma kudingeka imininingwane eyengeziwe.



    Faka amafayela (ngokuzikhethela)

    Amafayela e-PCB, i-BOM, i-PDF/STEP, i-TXT, izithombe, i-ZIP/RAR/7Z · Isamba esiphezulu esingu-50 MB