Ukuhlolwa Kogesi kwe-PCB Flying Probe vs ICT vs FCT

Onjiniyela abafuna izixazululo ze-PCB zokuhlola kagesi abafuni into efanayo. Abanye bakhetha phakathi kwe-flying probe kanye ne-ICT fixture. Abanye banamaphutha okulandelela ama-shorts, ama-open, noma ama-impedance. Abanye badinga umenzi wezinto ozibophezele ekuhlolweni kukagesi okungu-100% ngemibhalo ngayinye. Abanye babhala imininingwane yokuhlola futhi badinga ukwazi kahle ukuthi yimiphi imigomo nezindlela okufanele bazicacise. Futhi abanye badinga ukuqonda indima yonjiniyela we-CAM - ngoba izinqumo ezenziwa ngaphambi kokugijima kwebhodi lokuqala zinquma ukuthi uhlelo lokuhlola lubamba amaphutha angempela noma lukhiqiza imibiko edlulayo ephuthelwa amaphutha abucayi.

Thola i-PCB ngokuhlolwa kukagesi okungu-100%

Ukuhlolwa Kukagesi kwe-PCB Engenalutho vs. Okuhlanganisiwe

Ukuhlolwa kukagesi kwe-PCB kwenzeka ngezigaba ezimbili ezihlukene, futhi kubamba izigaba ezahlukene zeziphambeko - akukho okunye okungathatha indawo yesinye.

Ukuhlolwa kukagesi kwebhodi elingenalutho kwenziwa ngaphambi kokuba kubekwe izingxenye. Inethi ngayinye ihlolwa ukuqhubeka kwayo (≤10Ω) kanye nokuhlukaniswa kwayo (≥10MΩ ku-250VDC). Ibamba amaphutha okwenziwa: ukuvuleka kokuchoboza kanye nokufushane, ukubhaliswa kabi kokubhoboza, ngokuvuleka kwemiphongolo, kanye nama-shorts angaphakathi. Ubuso bebhodi bufinyeleleka ngokugcwele, ngakho ukumbozwa kwenethi kufinyelela ku-95–99%.

Ukuhlolwa kukagesi ngemva kokuhlanganiswa kwenziwa ngemva kokushiswa nge-solder. Ukumbozwa kuyehla ngoba izingxenye zomzimba zivimba ukufinyelela kwe-probe kuma-pad ngaphansi. Emabhodini anzima e-BGA, ukumbozwa okufinyelelekayo kuvame ukwehlela ku-60-80%.

Lokho Okuqinisekiswa "Ukuhlolwa Kukagesi okungu-100%" Empeleni

Uma umenzi wezinto ezibophezela ekuhlolweni kukagesi okungu-100%, kusho ukuthi yonke ibhodi engenalutho iyahlolwa ngaphambi kokuthunyelwa — akukho sampula. Ihlanganisa ukuqhubeka kanye nokuhlukaniswa kuwo wonke amanethi. Ayiqinisekisi ngokuzenzakalelayo ukuqinisekiswa kwe-impedance noma ukuhlolwa kwesigaba esiphambene — lokho kudinga imininingwane ecacile.

Kwa-Highleap, ukuhlolwa kukagesi okungu-100% ebhodini elingenalutho nge-IPC-9252 kuyinto ejwayelekile kuwo wonke ama-oda. Imibiko yokuhlolwa kwe-per-lot ithunyelwa namabhodi. Cela ifomethi yombiko ngaphambi kokufaka i-oda uma imininingwane yakho yokuthenga idinga ubufakazi bokuhlolwa obubhaliwe.

I-Flying Probe vs. I-ICT Fixture: Izindleko, Ukumbozwa, kanye Nesikhathi Sokusebenzisa Ngayinye

Isikhathi Sokusetshenziswa Ngasinye

• Amabhodi / ama-prototype angaphansi kwe-100: Ukuhlola okundizayo njalo. Ukutshalwa kwezimali kwemishini akulungile; kulindeleke ukuthi kubuyekezwe.
• Amabhodi ayi-100–500: I-probe endizayo yebhodi elingenalutho. I-ICT kuphela uma ukwakheka kwayo kuyisekela futhi ukwakheka kwayo kuzinzile.
• Amabhodi angu-500–5,000 ngonyaka: Hlola ngokuhambisana nesidingo sokukhipha. I-fixture engu-$1,000 ngamayunithi angu-500 = $2/ibhodi — ngokuvamile iyakufanelekela uma isikhathi somjikelezo sibalulekile.
• >5,000 amabhodi ngonyaka: umshini we-ICT wokukhipha; i-flying probe yamanethi angafinyeleleki ngokwejiyometri kuphela.
• I-HDI enama-microvia: I-Flying probe iphatha kangcono ama-microvia pad. I-Hybrid isebenza kahle: I-ICT yamanethi amakhulu, i-flying probe yamanethi asebenzisa i-microvia kuphela.
• Ukuhlanganiswa okuphezulu / ukubuyekezwa okuvamile: I-flying probe igwema ukuphelelwa yisikhathi kwe-fixture — akukho ukwakhiwa kabusha okudingekayo lapho ibhodi libuyekeza.

Kungani Ukumbozwa kwe-BGA Kwehla Ngaphansi Kwama-70%

Amaphakheji e-BGA, QFN, kanye ne-LGA ahlala phezu kwamajoyinti awo e-solder — ama-probe awakwazi ukuwafinyelela evela ngaphandle. Ebhodini elinama-BGA amathathu amakhulu, ama-net angu-30–40% angase angabi nendawo yokuphenya efinyelelekayo kunoma yiliphi ibhodi. Izixazululo: engeza ama-via okuhlola ama-net abalulekile e-BGA ngesikhathi sokuhlelwa; sebenzisa ukuskena komngcele (i-JTAG) kuma-IC ahambisanayo; noma umboze izinhlelo ezingaphansi ezingafinyeleleki ngokuhlolwa okusebenzayo.

Imithetho Yokuklama Amaphuzu Okuhlola e-PCB Yokumbozwa Okugcwele

Ukumbozwa kokuhlolwa kunqunywa ngesikhathi sokuhlelwa kwe-PCB — hhayi unjiniyela wokuhlola ngemva kokwakhiwa kwamabhodi. Le mithetho kumele isetshenziswe ngaphambi kokuba umzila uqedwe.

Izidingo Zesimiso Se-ICT

• Ububanzi bephedi yokuhlola: Kukhethwa yi-1.0mm, ubuncane obuphelele obungu-0.80mm
• Ukususwa komzimba wengxenye: 2.5mm ubuncane
• Isikhala sephedi yokuhlola: Kukhethwa yi-2.54mm; okungenani yi-1.27mm. Ngaphansi kwe-1.27mm kudinga ukulungiswa ngokwezifiso ngezindleko eziphakeme kakhulu
• Ukubekwa ohlangothini olulodwa: Kunciphisa izindleko ze-fixture ngo-40–60% ngokususa ipuleti lesibili le-fixture
• Inhloso yokumbozwa: Iphuzu elilodwa lokuhlola okungenani kwenethi; i-node eyodwa ngenethi yokukwazi ukuhlukanisa amaphutha

Izidingo Zokuhlola Okundizayo

• Iphedi encane: 0.30mm — akukho mkhawulo wegridi, zombili izinhlangothi ziyafinyeleleka, amaphedi omhlaba we-microvia ayafinyeleleka
• Alukho uhlobo lwe-probe olungafinyelela amanethi ngaphandle kwephedi elifinyeleleka phezulu. Amanethi angaphansi kwamaphakheji e-BGA adinga izindlela ezengeziwe kungakhathaliseki ukuthi i-probe ikhethwe kanjani.

Ukushiya amaphuzu okuhlola ukuze kulondolozwe indawo yebhodi kuhlale kuphumela emiphumeleni efanayo: i-probe ehamba kancane enokumbozwa okungaphelele, i-ICT embozwe ngo-50-60% enikeza ukuzethemba okungamanga, noma akukho ukuhlolwa kukagesi kwe-PCB okuzenzakalelayo nhlobo. Ithusi lendawo yokuhlola alibizi lutho ekukhiqizweni.

Ukumbozwa Kokuhlolwa kwe-PCB: Indlela Yokubala Ngaphambi Kokuthi Ukuhlelwa Kube Okokugcina

Ukumbozwa Okuphelele vs. Ukumbozwa Kwe-Node

“Ukuhlolwa kukagesi okungu-100%” kusho ukuthi amanethi angu-100% anendawo yokuhlola okungenani eyodwa efinyelelekayo — hhayi ukuthi yonke i-node ihlolwa ngokuzimela. Inethi enama-node amahlanu ehlolwe kuphela ezindaweni zayo zokugcina ishiya ama-node amathathu aphakathi aqinisekiswe ngokuphetha. I-marginal cold joint e-maphakathi enokumelana okungu-7Ω emkhawulweni ongu-10Ω idlula ingatholakali.

Izilinganiso ezintathu ezibalulekile:

• Ukumbozwa kwe-Net: % wawo wonke amanethi anephuzu elilodwa okungenani elifinyelelekayo. Qonda ku-100% ebhodini elingenalutho.
• Ukumbozwa kwe-node: % wawo wonke ama-net node (ama-pad, ama-junction, ama-via) ahlolwe ngqo. >80% iqinile; <60% idinga imibhalo kanye nokunciphisa.
• Ukumbozwa kwamaphutha: % yazo zonke izinhlobo zamaphutha ezingaba khona uhlelo lokuhlola olungazithola — inombolo enenjongo kakhulu futhi okunzima kakhulu ukuyibala ngaphandle kwamathuluzi okulingisa okuhlola.

Ukubalwa Kwesembozo Ngaphambi Kokuqedela Ukuhlelwa

1. Thumela uhlu oluphelele lwe-net olunenani lama-node kusuka kuthuluzi lakho le-PCB CAD
2. Maka inethi ngayinye: ingabe inayo okungenani iphedi eyodwa efinyelelekayo (≥1.0mm yento yokufakelwa, ≥0.30mm yeprobe endizayo)?
3. Amanethi amboziwe ÷ amanethi aphelele × 100 = ukumbozwa okulinganiselwe kwenethi
4. Uma kungaphansi kuka-85%: engeza ama-via noma ama-pad okuhlola manje, ngaphambi kokuba ukwakheka kuqedwe

Izinga Lokuphunyuka Kwamaphutha Ngesu Lokuhlola

Ukuhlolwa kwe-Impedance, i-Hipot, kanye nokuhlolwa kwe-RF kwama-PCB anejubane eliphezulu

Ukuqinisekiswa kwe-TDR Impedance

Ukuhlolwa kokuqhubeka okujwayelekile kuqinisekisa ukuthi kukhona umkhondo — akuqinisekisi ukuvinjelwa kwawo. Umkhondo oqoshwe ngo-3µm omncane kunokwaklanywe ulinganisa ukumelana okulungile ku-DC kodwa ungase ube ngu-53Ω esikhundleni sika-50Ω — inkinga yobuqotho besiginali engabonakali ekuhlolweni kukagesi kwe-PCB okujwayelekile.

I-TDR (i-reflectometry yesizinda sesikhathi) ifaka umphetho we-voltage esheshayo futhi ilinganise i-waveform eboniswayo. Ukwamukelwa okujwayelekile: ±10% we-nominal; imiklamo eqinile ichaza ±5%. Ukuze lokhu kube umkhiqizo otholakalayo, chaza ikhuphoni le-TDR kuphaneli: umkhondo one-geometry efanayo egijima onqenqemeni lwephaneli, onesendlalelo, izindiza zokubhekisela, ububanzi bomkhondo, impedance eqondiwe, kanye nokubekezelelana okubhalwe kumanothi okwenziwa. Ikhuphoni elilodwa ngephaneli ngayinye ngencazelo ye-impedance. Ngaphandle kwalokhu, awunabo ubufakazi be-impedance obuqondile.

Kuma -PCB alawulwayo ane-impedance — DDR5, PCIe, USB 3.x, RF — TDR akuyona into ongayikhetha.

Ukuhlolwa kwe-Hipot

I-Hipot isebenzisa i-voltage ephezulu phakathi kwamanethi ahlukanisiwe ukuqinisekisa ukuthi ayikho indlela yokuqhekeka ekhona ku-voltage yokusebenza. Ipheya elibonisa i-10MΩ ku-250VDC lingase liqhekeke ku-500V uma kukhona imbobo yemaski noma indlela yokungcola. Kuyadingeka kumadivayisi ezokwelapha (IEC 60601: 1,500–4,000V), ama-electronics kagesi ezimoto angaphezu kuka-48V (500–1,000V), ukuhlukaniswa kwe-mains yezimboni (IEC 61010: 1,000–1,500V), kanye nokuhambisana nomthetho wokunikezwa kwamandla (IEC 62368: 1,500–3,000V). Izindleko: $0.20–$0.80/ibhodi. Kusetshenziswa ngo-100% ku-Class 3 kanye nezinhlelo zezokwelapha.

Ukuhlaziywa Kwenethiwekhi ye-RF Ngaphezu kwe-1 GHz

Ekuhlolweni kwe-RF PCB okungaphezu kwe-1 GHz, ukuhlaziywa kwenethiwekhi ye-vector (i-VNA) kulinganisa amapharamitha e-S — ukulahlekelwa kokufakwa, ukulahlekelwa kokubuya, kanye nokuhlukaniswa kwembobo — kuyo yonke imvamisa. Kusetshenziselwa ukuqinisekiswa kwesihloko sokuqala kanye nokusampula kwezibalo. Kuyadingeka kumamojula e-RF, amasekethe e-antenna, kanye namanethiwekhi okuhlunga angaphezu kwe-1 GHz.

I-AOI, i-X-Ray, kanye nokuhlolwa kokusebenza ngemva kokuhlanganiswa

I-AOI

Ukuhlolwa okuzenzakalelayo kwe-optical kusebenza ngemva kokudlula kwe-SMT reflow njalo ngemizuzwana engama-30-120 ebhodini ngalinye, amaphaneli angu-100%. Ibamba izingxenye ezingekho, i-polarity eguquliwe, ama-passive aqoshiwe, amabhuloho okusonta abonakalayo, kanye nokungahambisani kahle kokubekwa kwe-BGA. Ayikwazi ukubona ngaphansi kwemizimba yephakheji, amalunga abandayo abukeka elungile, izingxenye ezinenani elingalungile, noma izikhala ze-solder ngaphakathi kwamalunga.

X-Ray

Izithombe ze-X-ray zihlanganisa amalunga okufaka i-solder ngaphansi kwamaphakheji e-BGA, QFN, kanye ne-LGA — zithola amabhuloho ngaphakathi kwe-ball array, zivuleka, futhi zivuleke ngaphezu kwama-25% endawo yebhola. Sebenzisa i-100% emikhiqizweni enokwethenjelwa okuphezulu kanye nayo yonke imisebenzi yokuvuselela ye-BGA; isampula yesihloko sokuqala kanye nezibalo zokukhiqiza okujwayelekile.

Ukuhlolwa Kwesekethe Okusebenzayo

Ukuhlolwa kwesekethe okusebenzayo kunika amandla ibhodi futhi kusebenze ukusebenza kwalo kwangempela. Kubamba lokho okungekho ukuhlolwa kukagesi okungakwenza: amabhodi anezingxenye ezifanele kanye nokuhlanganiswa okuhlanzekile okusahluleka ukucaciswa kwawo — i-firmware engalungile, isikhathi esingaphansi, ukuphunyuka okuhlobene nomklamo. Izindleko zefektri ngokwezifiso: $5,000–$50,000+. Kuqondaniswe ngaphezu kwamayunithi angaba yi-1,000 ngonyaka lapho izindleko zokubuyiselwa kwensimu zidlula ukuthuthukiswa kwefektri.

Indlela Unjiniyela we-CAM Akha Ngayo Uhlelo Lokuhlola Ugesi

Iningi lonjiniyela liphatha ukuhlolwa kukagesi kwe-PCB njengento eyenzeka ebhodini eliqediwe. Empeleni, izinqumo ezinquma ikhwalithi yokuhlola zenziwa kusenesikhathi - ngunjiniyela we-CAM, ngaphambi kokuba kuqale ukukhiqiza.

Izinto Ezine Unjiniyela we-CAM Azenzayo Ngaphambi Kokuqala Kwebhodi

Ukukhishwa nokuqinisekiswa kwe-Netlist. Unjiniyela we-CAM ukhipha i-netlist yethusi kumafayela akho e-Gerber noma e-ODB++ bese eyiqhathanisa ne-netlist yakho yokuklama ye-IPC-356. Ukungafani — ama-pads esendlalelo esingalungile, ukuxhumana okungekho, ukuxhumana okwengeziwe — kuyabanjwa ngaphambi kokuba ibhodi lakhiwe. Ngaphandle kwefayela le-IPC-356, uhlelo lokuhlola lwakhiwe nge-geometry ye-Gerber kuphela, okusho ukuthi noma yikuphi ukungafani phakathi kwe-Gerber nokuklama akubonakali kuze kube yilapho ibhodi lihluleka.

Ukumapha kokufinyeleleka kwezindawo zokuhlola. Inethi ngayinye imaphapha ngokuhambisana nezindawo zokufinyelela ze-probe ezitholakalayo. Amanethi angenandawo yokufinyeleleka aphawulwa ngokusemthethweni njengangahlolwa. Unjiniyela we-CAM oweqa buthule amanethi angafinyeleleki uveza umbiko obonisa ukuthi amanethi ahlolwe adlula ngo-100% - kuyilapho ingxenye ebalulekile ingakaze ihlolwe. Lo mehluko umehluko phakathi kombiko wokumbozwa kanye nesimangalo sokumbozwa.

Ukwabiwa kwe-Threshold ngesigaba se-net. Ama-power rails, ama-signal net, ama-high-voltage isolation networks, kanye nama-RF networks ngalinye liphethe izidingo ezihlukile zokuqhubeka kanye nokuhlukaniswa. Unjiniyela we-CAM unikeza ama-thresholds net-by-net ngokwencazelo yakho. Uma ucacisa kuphela i-“IPC-9252,” asebenzisa okuzenzakalelayo okujwayelekile, okungase kungahambisani nezidingo zangempela zomklamo wakho.

Ukulungiswa kwendlela yokuhlola endizayo. Unjiniyela we-CAM uhlela ukulandelana kwe-probe — ehlanganisa izindawo zokuhlola eziseduze ukuze anciphise ukuhamba kwezingalo. Ukulungiswa kwendlela okungekuhle kunezela u-20-40% esikhathini sokuhlola ibhodi ngalinye kumiklamo eyinkimbinkimbi.

Indlela Ubunjiniyela Bokuhlola I-CAM Ebuthakathaka Obubukeka Ngayo

• Imibiko yokuhlolwa ekhombisa ukuphasa okungu-100% ngaphandle kwenani eliphelele elingahlolwa elidaluliwe
• Izinhlelo zokuhlola ezakhiwe nge-Gerber kuphela, ngaphandle kokuqhathaniswa kohlu lokuklama
• Umkhawulo owodwa wokuqhubeka kwe-10Ω usetshenziswa kuwo wonke amanethi kungakhathaliseki ukuthi umsebenzi unjani
• Akukho ukuqinisekiswa kwe-impedance okuvuliwe imiklamo ye-PCB enesivinini esikhulu ngoba akekho owabuza

Uma uhlola umhlinzeki we-PCB wokuhlola kagesi, buza: “Uwaphatha kanjani amanethi ngaphandle kwendawo yokuhlola efinyelelekayo, futhi lokho kubonakala kanjani embikweni wokuhlola?” Impendulo yembula ukuthi inqubo yabo ye-CAM ikhiqiza yini idatha yangempela yokumbozwa noma ukumbozwa okubukeka kuphelele kuphela.

Faka Njalo Ifayela Le-IPC-356 Netlist

I-IPC-356 iyifomethi ejwayelekile ye-netlist ethunyelwa kwamanye amazwe kusuka kumathuluzi amaningi e-PCB EDA. Ibala yonke inethi ngamagama ayo yonke i-pad kanye nomhlaba ongowayo. Uma nje ivumela unjiniyela we-CAM ukuqinisekisa i-netlist ye-Gerber ngokumelene nenhloso yokuklama, anikeze imingcele ethile ye-net ngegama kunokuba anikeze nge-geometry inference, futhi akhiqize umbiko wokumbozwa kwe-net oqanjwe ngamagama abaklami abangawufunda ngempela. Ngaphandle kwayo, yonke inethi iyithusi elingaziwa futhi uhlelo lokuhlola lwakhiwe nge-geometry kuphela. Kuthatha imizuzwana engama-30 ukuthumela ngaphandle futhi kuvimbela ukungaqondakali okubangela ukuphunyuka kokuhlolwa.

Imininingwane Yokuhlolwa Kukagesi kwe-PCB: Okudingayo Kumkhiqizi Wakho

"Ukuhlolwa kukagesi okungu-100% ku-IPC-9252" kuyinkomba yendlela yokusebenza - hhayi incazelo. Indinganiso inikeza uhlaka; kumele uchaze amanani okwamukelwa. Imininingwane ephelele ifaka:

• Umkhawulo wokuqhubeka: ≤10Ω okuzenzakalelayo. Amandla noma amanethi anomsinga ophezulu: ≤5Ω noma aqinile. Cacisa ngesigaba senethi, hhayi inani elilodwa lebhodi lonke.
• Umkhawulo wokuhlukaniswa: ≥10MΩ ku-250VDC okuzenzakalelayo. I-analog ye-high-impedance: ≥500MΩ kuma-net pair athile.
• I-voltage yokuhlola: Izinga elijwayelekile le-250VDC. Cacisa i-500V+ yezidingo ze-voltage yokusebenza ephezulu noma zokuhlukanisa ezilawulayo.
• Ukuqinisekiswa kwe-Impedance: I-geometry yekhuphoni ye-TDR, inhloso, ukubekezelelana, kanye nokubika kwe-lot ngayinye. Uma kushiywe ngaphandle, abukho ubufakazi bokuvinjelwa kwe-lot ethile.
• Indlela yokuhlola kanye nokuhlanganiswa kwayo: I-probe noma i-fixture endizayo; amanethi akhishwe kanye nokufaneleka; iphesenti elincane lokumboza elamukelekayo.
• Ukuhlolwa kwangemva kokuhlanganiswa: isikopu se-AOI (100% noma esithathwe isampula); isikopu se-X-ray; ukubuyekezwa kohlelo lwe-ICT; ukuhlolwa kwesihloko sokuqala izidingo.
• Ukulungiswa kokwehluleka: Susa, phinda usebenze, noma wamukele ngokwemibandela — kanye nezimfuneko zemibhalo yomphumela ngamunye.
• Ukugcinwa kwamarekhodi: Ifomethi yombiko wokuhlolwa kwephaneli ngayinye, isikhathi sokugcina, kanye nendlela yokufinyelela yokuhlaziya ukwehluleka kwensimu.

Amaphutha Amathathu Okucacisa Adala Ingozi Yekhwalithi Efihliwe

• Awekho amanani okwamukelwa: I-“IPC-9252” iyodwa isho ukuthi umenzi usebenzisa okuzenzakalelayo kwakhe kwangaphakathi, okungase kungafani nomklamo wakho.
• Akukho TDR kumabhodi okulawula ukuvimba: Ngaphandle kwencazelo yekhuphoni, awunabo ubufakazi bokukhiqiza bokuthi i-impedance ingaphakathi kwe-spec — izibalo zenqubo yomenzi kuphela.
• Ukufuna ukumbozwa okuhlanganisiwe okungu-100% ngaphandle kokuhlaziywa: Izikhala zokumbozwa kwe-BGA ezingaqashelwanga zidala izindlela zokuphunyuka ezibonakala zamukelekile ephepheni futhi zehluleke ensimini.

Amakhono Okuhlola Ugesi we-PCB we-Highleap

I-Highleap Electronics ifaka ukuhlolwa kukagesi okungu-100% njengokujwayelekile kuwo wonke ama-oda angenalutho:

• Ukuhlolwa kokundiza: Izinhlelo ezi-4, ukunemba okungu-±15µm — ukumbozwa okuphelele okungu-100% kuphaneli ngayinye, isibonelo sokukhiqiza
• Abahloli begridi be-Universal: Ukuze uthole ama-oda aphezulu kakhulu angaphezu kwamabhodi angu-500 ngebhetshi ngayinye
• Ukuvimba kwe-TDR: ukubekezelelana okungu-±5%; umbiko wesimo segagasi esithile ufakiwe nazo zonke i-PCB elawulwa yi-impedance ama-oda ngaphandle kwenkokhiso eyengeziwe
• I-Hipot: Kufika ku-3,000VDC yezinhlelo zokusebenza zokuhlukanisa zezokwelapha nezinamandla aphezulu
• I-AOI yangemva kokuhlanganiswa: 100% ngemva kokudlula ngakunye kokuphinda kugeleze
• I-X-ray: Ukuqinisekiswa okuhlangene kwe-2D kanye ne-2.5D BGA kanye ne-QFN — 100% noma kuthathwe isampula ngokwencazelo ngayinye
• Ukuhlolwa okusebenzayo: Ukuthuthukiswa kohlelo ngokwezifiso kanye nokulandelela izinombolo ze-serial ngeyunithi ngayinye
• Imibhalo yokuhlola: Imibiko yokuhlolwa kukagesi ngesabelo ngasinye, izingobo zomlando ze-TDR, amaphakheji esihloko sokuqala — okulethwayo okujwayelekile, hhayi okungeziwe

Thola i-PCB ngokuhlolwa kukagesi okungu-100% okufakiwe