Okuqukethwe kwe-PCB Resin: Umhlahlandlela Wokuqongelela, Ukuhlanza kanye Nokukhiqiza

Okuqukethwe kwe-resin ye-PCB kuyisilinganiso se-resin ekwakhiweni kwe-laminate noma i-prepreg, okushiwo ngokuvamile njengephesenti ngesisindo. Kuthinta izakhiwo ze-dielectric, ukujiya okucindezelwe, ukugeleza kwe-resin, ukugcwaliswa kwethusi, ukunyakaza kobukhulu kanye nokuthembeka kwezingqimba eziningi.

I-Highleap Electronics ayikhiqizi i-resin noma i-prepreg. Sikhetha futhi sicubungule izakhiwo zezinto ezivunyelwe amakhasimende, sihlanganise i-PCB nge-laminate, sihlanganise i-PCBA futhi siqinisekise izidingo ezikhishwe.

Kungani okuqukethwe kwe-PCB resin kubalulekile? Ngoba isitayela esifanayo sengilazi esinokuqukethwe kwe-resin okuhlukile singakhiqiza ukujiya okuhlukile kwe-Dk, Df, ukujiya okucindezelwe kanye nokuziphatha kokugcwalisa. Ukucaphuna kuphela isitayela somndeni wezinto ezibonakalayo kanye nengilazi akwanele ukuze kuhlanganiswe i-multilayer elawulwayo.

Okushiwo Okuqukethwe Kwe-PCB Resin

I-Prepreg iyi -resin ephiliswe kancane ethwalwa yingilazi elukiwe. Ngesikhathi sokulayina, ukushisa kanye nengcindezi kubangela ukuthi i-resin igeleze, igcwalise i-topography yethusi futhi iphiliswe ibe ungqimba lwe-dielectric bond. Okuqukethwe kwe-resin kuthonya ukuthi kungakanani okutholakalayo ukugcwalisa izikhala nokuthi kungakanani ingilazi esele ku-dielectric yokugcina.

Okuqukethwe okuphezulu kwe-resin

I-resin eningi iyatholakala ukuze kugcwaliswe ithusi futhi i-Dk engasebenzi kahle ingase ibe ngaphansi, kodwa ukugeleza okukhulu, ukushintshashintsha kobukhulu noma ukuphuma kungase kwenzeke.

Okuqukethwe kwe-resin okuphansi

Ingxenye yengilazi eningi, ivame ukusebenza kahle kakhulu i-Dk kanye nokuqina okungcono kobukhulu, kodwa kuncishisiwe umkhawulo wokugcwalisa wethusi elisindayo noma izindawo ezivulekile.

Lokhu kuyimikhuba, akuzona iziqinisekiso ezijwayelekile. I-resin chemistry, isitayela sengilazi, umjikelezo wokwelapha, iphethini yethusi kanye nokucindezela konke kuyasebenzisana.

Lokhu akuyona into noma isinqumo esizimele sodwa. Ukuziphatha kokugcina kukhiqizwa ukusebenzisana kokugeleza kwe-resin ngesikhathi sokucindezela ngokuqina kwe-dielectric okuqediwe kanye nokulawula i-void, kuyilapho iphesenti le-resin kanye nesitayela sengilazi kanye nokusatshalaliswa kwendawo yethusi kunquma ukuthi umklamo ofanayo ungaphindaphindwa yini kuwo wonke amaphaneli kanye nezindawo zokwakha. Yingakho i-Highleap iqala ngamafayela ebhodi esikhundleni semibuzo yomkhiqizo ejwayelekile.

Indlela Okuqukethwe Kwe-Resin Okuthinta Ngayo Ukusebenza Kukagesi Nokwemishini

Ukuphindaphinda kuyisilingo esiyinhloko sokukhiqiza. I-prototype ingasebenza ngisho noma iwindi lenqubo libanzi, kodwa ukukhiqizwa kwevolumu kuveza ukuhlukahluka kwezinto zokwakha, ukusatshalaliswa kwethusi, ukulayisha amaphaneli kanye nokufaka iplati. Sibeka ukulawula umjikelezo wokucindezela kanye nokulawula i-layup, ikhuphoni kanye nokubuyekezwa kwe-microsection, ukulungiswa kwe-stackup ngemuva kwe-DFM kanye nokukhethwa kokwakhiwa kwangaphambili ekukhishweni kokukhiqiza ukuze kunikezwe ukuqhathanisa okuzinzile phakathi kwezindawo zokwakha.

Okuqukethwe okuphezulu kwe-resin ngokuvamile kusho ingxenye enkulu ecebile nge-resin ngemva kokucindezela, kodwa umphumela oqediwe uncike esitayeleni sengilazi, ukumbozwa kwethusi kanye nokugeleza kwe-resin. Ushintsho lungathinta i-Dk esebenzayo , ukujiya kwe-dielectric, ukunyakaza kobukhulu, ukwanda kokushisa kanye nekhono lokugcwalisa izici zethusi ezizungezile. I-Highleap ihlola okuqukethwe kwe-resin njengengxenye yokwakhiwa kwe-stackup, hhayi njengephesenti elihlukanisiwe elikopishwe etafuleni elilungiselelwe kusengaphambili.

Indlela Okuqukethwe Kwe-Resin Okukhethwa Ngayo Ukuze Kuhlanganiswe

1. Buyekeza ukusatshalaliswa kwethusi: izindiza eziqinile, izendlalelo zesignali eziminyene kanye nezindawo ezinkulu ezicacile zidinga amavolumu ahlukene e-resin.
2. Hlola isisindo sethusi: ithusi elinzima lidinga ukugcwaliswa okwengeziwe.
3. Ubukhulu obucindezelwe bokuhlosiwe kwethagethi: ukujiya kwe-dielectric kuwumphumela we-lamination, hhayi ukujiya kweshidi okungakaphekwa.
4. Qinisekisa ukuvimba: U-Dk kanye nobukhulu bokugcina kumele kufane ne-field-solver stackup.
5. Linganisa iphaneli: i-resin engalingani kanye nethusi kungandisa ukugoba kanye nokusonta.
6. I-lamination elandelanayo efanelekile: umjikelezo ngamunye ushintsha umlando wokushisa kanye nokunyakaza kobukhulu.

Amanani edatha ajwayelekile awanele lapho ukuhlolwa kukagesi okuvamile kungakwazi ukubona ukushintsha kwe-impedance kanye nokucindezeleka kwembobo ehlanganisiwe noma ukuntuleka kwe-resin. Ukubuyekezwa kumele kusebenzise i-core noma i-prepreg eqondile, iphrofayili yethusi, ukujiya okuqediwe kanye nomzila odlulayo. Yilapho ukwesekwa kobunjiniyela komuntu ngamunye kuvimbela umthengi ekuchazeni amadokhumenti amaningi omhlinzeki kuphela.

Umphumela wokubuyekezwa kufanele ube yi- stackup ekwazi ukwakheka kanye nohlu olufushane lweziguquguquko ezilawulwayo. I-Highleap ibhala phansi ubunikazi bezinto ezivunyelwene ngazo, i-geometry, umzila wenqubo kanye nesisekelo sokuhlola, bese ihlanganisa imininingwane esele ngaphakathi ku-CAM, ukwenziwa, ikhwalithi kanye nokuhlanganiswa.

Imiphumela Yokusebenzisa Okuqukethwe Okungalungile Kwe-Resin

• Indlala ye-resin: amaqabunga e-resin anganele agcwalisiwe kahle, abophekile noma agcwele ingilazi.
• Ukucindezela ngokweqile: ukugeleza okuningi kakhulu kunganciphisa ukujiya kwe-dielectric yendawo futhi kudale ukulahlekelwa yi-resin yomphetho.
• Ukushintsha kwe-Impedance: kushintshiwe i-Dk futhi kwacindezelwa ubukhulu kunyakaza i-geometry yomugqa wokudlulisela.
• I-Voids: Umoya ovalelekile noma ukugcwaliswa okungaphelele kunciphisa ukuthembeka.
• Ikhasi lempi: ukusatshalaliswa kwe-resin nokwethusi okungalingani kudala ukucindezeleka.
• Iphutha lokubhalisa: ukunyakaza okunesilinganiso kungahlukanisa kahle izici ezinhle nama-via.

Lezi zingozi kufanele zehlise umzamo odingekayo wokuxhumana nefektri, hhayi ukuwuphakamisa. Uma i-Highleap isithole amafayela e-Gerber noma okuklama, sihlola ukulungiswa kwe-stackup ngemuva kwe-DFM, ukukhethwa kokwakhiwa kwangaphambilini, ukulawulwa komjikelezo wokunyathelisa kanye nokuhlelwa kwe-layup kanye nokubuyekezwa kwekhuphoni kanye ne-microsection. Izinqumo kuphela ezithinta kakhulu umsebenzi, ukuthobela imithetho, intengo noma ukulethwa ezibuyiselwa kumakhasimende.

Inhloso yokuchaza le miphumela akusikho ukuthi wonke umsebenzi uzohluleka. Kuwukukhombisa ukuthi yiziphi iziguquguquko ezifanelwe ukubuyekezwa ngaphambi kokuthenga. Unjiniyela obekiwe uchaza ukuvezwa okukhethekile komklamo othunyelwe futhi uqondisa noma yiluphi ushintsho oludingekayo namaqembu okukhiqiza, ikhwalithi kanye nokuhlanganisa.

Isitayela Sengilazi Yokulungiselela Ngaphambi Kokukhulelwa, Okuqukethwe Kwe-Resin Nobukhulu Obucindezelwe

Ukuqokwa kwe-prepreg akuphelele ngaphandle kokwakhiwa kanye nokuqukethwe kwe-resin. Isibonelo, ama-prepreg amabili esitayela se-1080 angaba namaphesenti ahlukene e-resin futhi akhiqize ukuziphatha okuhlukile kukagesi nokugeleza.

I-Highleap isebenzisa idatha yokwakha yabaphakeli kanye nolwazi lwangaphakathi lwenqubo ukuphakamisa iphakheji yokunyathelisa, bese iqinisekisa i -stackup eqediwe ngokulinganisa ubukhulu, ukuhlangana kwesigaba kanye nokuhambisana kwe-impedance lapho kudingeka khona.

Inhloso yokuklama kanye nesinxephezelo sefektri kunabanikazi abahlukene. Ikhasimende lichaza izidingo zikagesi kanye nokuthembeka; I-Highleap isebenzisa ukulungiswa kwe-CAM okuvunyiwe, ukubhoboza, ukubopha kanye nokulungiswa kwe-lamination okudingekayo ukuze kufinyelelwe amanani aqediwe. Noma yiluphi ushintsho oluthinta ukwakheka noma iziqu luphakanyiswa ukuze luvunyelwe esikhundleni sokufihlwa ngaphakathi kokucutshungulwa kwe-CAM.

Ukuphindaphinda kuyisilingo esiyinhloko sokukhiqiza. I-prototype ingasebenza ngisho noma iwindi lenqubo libanzi, kodwa ukukhiqizwa kwevolumu kuveza ukuhlukahluka kwezinto zokwakha, ukusatshalaliswa kwethusi, ukulayisha amaphaneli kanye nokufaka iplati. Sibeka ukukhetha ukwakhiwa kwangaphambili, umjikelezo wokucindezela kanye nokulawula ukuhlelwa, ikhuphoni kanye nokubuyekezwa kwe-microsection kanye nokulungiswa kwe-stackup ngemuva kwe-DFM ekukhishweni kokukhiqiza ukuze sinikeze ukuqhathanisa okuzinzile phakathi kwezindawo.

Okuqukethwe kwe-Resin kuma-PCB e-High-Speed ​​​​kanye ne-RF

Ngesivinini esikhulu, okuqukethwe kwe-resin kushintsha ingxube ye-dielectric esebenzayo futhi kungathinta ukuziphatha kokulukwa kwengilazi , ukugoba kanye nokulahleka. Imodeli yesiteshi esebenzisa i-Dk eyodwa enkulu kungqimba ngayinye ingaphuthelwa umehluko othize wokwakhiwa.

Ngezakhiwo ze-RF kanye ne-mmWave, ukugeleza kwe-resin kanye nobukhulu bokugcina kungashintsha ngqo i-impedance kanye nemvamisa ye-resonant. Ukulawula okuqinile kungadinga ukwakheka okubalulekile okucacisiwe kunezendlalelo ze-dielectric ezibalulekile ezichazwe ngaphambilini.

Izinguquko zobuchwepheshe kulesi sigaba azikwazi ukuhlolwa ngokuzimela. Ushintsho ekusabalalisweni kwendawo yethusi lungashintsha umphumela wokugeleza kwe-resin ngesikhathi sokucindezela, kuyilapho ukujiya kwe-dielectric okuqediwe kanye nokulawula i-void kanye nephesenti le-resin kanye nesitayela sengilazi kuthinta i-geometry kanye nomphumela wokuhlolwa obonwe ebhodini eliqediwe. I-Highleap ibuyekeza ukwakhiwa kwangempela kokukhiqiza ngakho-ke i-stackup kanye nesinxephezelo kusekelwe ezintweni ezingathengwa kunezibonelo eziqanjiwe.

Ukuze kube ne-impedance elawulwayo kanye nezendlalelo eziphansi zokulahlekelwa, ubukhulu be-dielectric obucindezelwe kanye nokusatshalaliswa kwe-resin/ingilazi kumele kuhambisane nokuqagelwa kwe-field-solver. Ukwakhiwa okucebile nge-resin kunganciphisa ithonya lengilazi lendawo kodwa kungandisa ukushintshashintsha kobukhulu noma ukunyakaza uma iphethini yethusi kanye nomjikelezo wokucindezela kungalingani. Ngakho-ke i-RF kanye namaphrojekthi esivinini esikhulu adinga ukwakhiwa okuqondile kwangaphambilini, hhayi nje ubukhulu bebhodi eliqediwe.

I-Highleap Multilayer Lamination Controls

• ukuqinisekiswa kwezinto zokwakha kanye nokwakhiwa kwangaphambilini;
• ukubuyekezwa kokuminyana kwethusi kanye nokufunwa kwe-resin;
• i-vacuum lamination enokushisa okulawulwayo, ingcindezi kanye nokwelapha;
• isinxephezelo sokulinganisa iphaneli kanye nokubhalisa;
• ukujiya kokugcina kanye nokuhlolwa komnsalo/ukujika;
• ingxenye encane yokuhlola i-dielectric, i-plating kanye ne-void;
• ukuhambisana kwekhuphoni ye-impedance;
• inani lezinto ezibonakalayo kanye nokulandeleka kwenqubo uma kudingeka.

Isimangalo samandla sinenani kuphela uma sixhunywe emzileni olawulwayo wesitolo. I-Highleap ixhumanisa ukukhethwa kokwakhiwa kwangaphambilini, umjikelezo wokucindezela kanye nokulawula ukuhlelwa, ukubuyekezwa kwekhuphoni kanye nesigaba esincane kanye nokulungiswa kwe-stackup ngemuva kwe-DFM nokuhlolwa okungenayo, i-lamination, ukubhoboza, i-plating , i-imaging kanye nokuqinisekiswa kokugcina. Ukulandelana okuqondile kuhlala kuncike ekwakhiweni kwezinto ezivunyiwe kanye nebhodi.

Imiklamo ehlukene idinga amafasitela enqubo ahlukene. Ubukhulu bebhodi, ikhemikhali yezinto ezibonakalayo, ibhalansi yethusi, ukwakheka kwemigodi kanye nosayizi wephaneli kungashintsha izimo zokulungiselela, ukucindezela kanye nokufaka iplati. Unjiniyela obelwe uhlela i-CAM, ukukhiqizwa kanye nekhwalithi ukuze ikhasimende lithole impendulo eyodwa yokukhiqiza esikhundleni semibuzo ehlukile evela emnyangweni ngamunye.

Kungani Okuqukethwe Kwe-Resin Kusabalulekile Ngemva Kokwenziwa

I-dielectric elungisiwe ithinta ukuqina kwebhodi, impendulo yomswakama, ukunwebeka kwe-Z-axis kanye nokuziphatha kokugeleza kabusha . Ama-assembly aphezulu, ama-BGA amakhulu kanye nemijikelezo yokushisa ephindaphindwayo ingaveza i-lamination ebuthakathaka noma i-warpage. I-Highleap ibukeza ukwakhiwa kwebhodi elingenalutho kanye nephrofayili yokuhlanganisa ndawonye.

Isimangalo samandla sinenani kuphela uma sixhunywe emzileni olawulwayo wesitolo. I-Highleap ixhumanisa ukulawulwa komjikelezo wokucindezela kanye nokuhlelwa kwesakhiwo, ukubuyekezwa kwekhuphoni kanye nesigaba esincane, ukulungiswa kwe-stackup ngemuva kokukhethwa kokwakhiwa kwe-DFM kanye nokulungiselela ukuhlolwa okuzayo, i-lamination, ukubhoboza, ukufaka amapulangwe, ukuthwebula izithombe kanye nokuqinisekiswa kokugcina. Ukulandelana okuqondile kuhlala kuncike ekwakhiweni kwezinto ezivunyiwe kanye nebhodi.

Umphumela we-lamination uthinta ukusebenza kamuva. Ukuntuleka kwe-resin noma izikhala kungenza buthaka ukubopha phakathi kwezingqimba futhi kuveze izindonga zemigodi ezinkingeni zokuthembeka, kuyilapho ukugeleza kwe-resin ngokweqile kungashintsha ukujiya, ukubhaliswa kanye nokuba yisicaba kwebhodi. Ngesikhathi sokuhlanganiswa, ukumuncwa komswakama kanye nemijikelezo yokushisa ephindaphindwayo kusebenza ohlelweni lwe-resin olulungisiwe. Idatha ye-microsection kanye nobukhulu inikeza ubufakazi bokuthi ukwakhiwa okuhlosiwe kufeziwe ngempela.

Thumela amafayela e-Gerber noma e-PCB Design ukuze abuyekezwe nge-Stackup

Akudingeki ukubala okuqukethwe kwe-resin ngaphambi kokucela i-Highleap ukuthi ikunike ikhotheshini. Thumela amafayela e-Gerber noma amafayela okuklama e-PCB endabuko kuqala. Uma amanothi okuqoqa kanye nokukhiqiza esefakiwe kakade, angabuyekezwa ngqo ngaphandle kwefomu elihlukile.

Onjiniyela bethu be-lamination baqedela ingxoxo yokukhiqiza

Unjiniyela wakho we-Highleap uzobuyekeza ukusatshalaliswa kwethusi, isakhiwo sesendlalelo, ukujiya kwethagethi kanye ne-impedance nethimba lethu le-stackup kanye ne-lamination. Sizobona ukwakhiwa okufanele kokulungiselela futhi sixhumane nawe kuphela uma kudingeka ukukhetha umklamo noma imvume yamakhasimende.

Idatha yokuqala engaphelele ayimisi ngokuzenzakalelayo ikhotheshini. Sithola ukuthi yini eseyichaziwe kakade, sihlukanise okuthandwayo nezidingo eziphoqelekile, futhi sichaze ukuthi yisiphi isinqumo esingaxazululiwe esivimba ngempela. Uma kudingeka ukuhlanganiswa, amafayela e-BOM kanye nokubekwa anganikezwa ngemva kokuba ububanzi bebhodi elingenalutho sebuqondwe.

Imiphumela Yezindleko Nesikhathi Sokuhola

Ukwakhiwa okukhethekile kokuqukethwe kwe-resin, ama-prepreg amaningi, izitayela zeglasi ezilawulwayo kanye ne-lamination elandelanayo kungandisa izindleko zezinto kanye nobunzima bokucindezela. Kodwa-ke, ukwakhiwa okungagcwalisiwe noma okungazinzile kudala izindleko ezinkulu kakhulu ngokusebenzisa izinsalela, ukufaneleka kabusha kanye nokwehluleka kwensimu.

Isikhathi sokulethwa sivame ukulawulwa ukutholakala kwezinto ezibonakalayo, ithusi elikhethekile, ubuncane bomhlinzeki, ukucutshungulwa okulandelanayo noma ukuhlukaniswa kwangaphandle. Unjiniyela ubona umkhawulo wangempela weshejuli futhi uhlola ukuthi ngabe enye indlela evunyelwe ingawususa yini ngaphandle kokushintsha imfuneko yomkhiqizo.

Isivuno kumele sicatshangelwe kusukela ku-prototype kuya ku-volume. Izici ezihambisana nokushintsha kwe-impedance kanye nokucindezeleka kwemigodi ehlanganisiwe noma ukushintshashintsha kobukhulu ngokweqile kungandisa izinsalela, ukulungiswa kabusha kanye nokulahlekelwa yizingxenye. Ukwakhiwa okuqoshiwe okuzinzile ngokuvamile kunezindleko eziphansi kunezomklamo onamandla odinga izinguquko eziphindaphindwayo ngemva kokuhlanganiswa.

Isimo esinzima sokugcwalisa i-resin singadinga ukulungiswa okuhlukile, ama-plies engeziwe, ukwebiwa kwethusi, ibhalansi yethusi ebuyekeziwe noma umjikelezo wokunyathelisa oguquliwe. Lezi zinguquko zithinta ukusetshenziswa kwezinto, isikhathi sobunjiniyela kanye nesivuno. I-Highleap ivame ukunciphisa izindleko ngokulungisa izinkinga zokusabalalisa ithusi lendawo kunokwengeza i-resin eyengeziwe noma ukwandisa ubukhulu bebhodi eliphelele.

Okuqukethwe kwe-Resin Kuyinguquko Yokukhiqiza, Akuyona I-Datasheet Footnote

Okuqukethwe kwe-resin kuxhumanisa ukukhethwa kwezinto ezibonakalayo ne-lamination, ukusebenza kukagesi kanye nokuthembeka. I-Highleap ilawula ukwakhiwa okuvunyiwe futhi iqinisekisa ibhodi lokugcina esikhundleni sokuphatha zonke izinto ezilungiselelwe ngesitayela esifanayo sengilazi njengezingashintshaniswa.

Iphesenti eliphrintiwe etafuleni lokulungiselela alisho ngokuqondile ubukhulu bokugcina be-bond-line noma ukusatshalaliswa kwe-resin ku-PCB. Leyo miphumela idalwa ngesikhathi se-lamination ngesitayela sengilazi esikhethiwe, iphethini yethusi, ingcindezi, izinga lokushisa kanye nomjikelezo we-vacuum. I-Highleap iguqula umklamo ube yi-layup ekhiqizwayo futhi iqinisekisa umphumela ngokucindezela okulawulwayo, ukulinganisa ubukhulu kanye ne-microsection lapho kudingeka khona.

Ukuze kubuyekezwe okokuqala, umthengi udinga ukuthumela amafayela okuklama e-Gerber noma e-PCB kuphela. Onjiniyela bethu be-stackup kanye ne-lamination bangabona ukuthi iphethini yethusi idala isidingo se-resin esingavamile bese bexoxa nganoma yiluphi ushintsho oludingekayo lokwakha olulodwa kuya kolunye. Ikhasimende alidingi ukubala amaphesenti e-resin ngaphambi kokucela ikhotheshini.

imibuzo ejwayelekile ukubuzwa

Ingabe okuqukethwe yi-resin kuyafana nokugeleza kwe-resin?

Cha. Okuqukethwe kwe-resin inani le-resin ekwakhiweni kwayo; ukugeleza kwayo kuchaza ukuthi ihamba kanjani ngaphansi kokuhlolwa noma inqubo echaziwe ye-lamination.

Ingabe okuqukethwe okuphezulu kwe-resin kuhlale kusho ukuthi i-Dk iphansi?

Ngokuvamile i-Dk esebenzayo iyancipha njengoba ingxenye ye-resin ikhuphuka ngoba i-E-glass ivame ukuba ne-Dk ephezulu, kodwa umphumela oqondile uncike ohlelweni lwe-resin kanye nokwakhiwa kwalo.

Ingabe ama-prepreg amabili anesitayela esifanayo sengilazi angashintshwa?

Hhayi ngokuzenzakalelayo. Okuqukethwe kwe-resin, i-resin chemistry, ukugeleza, ukujiya okulungisiwe kanye nezakhiwo zikagesi kungahluka.

Ubukhulu obucindezelwe bulawulwa kanjani?

Ngokukhetha ukwakhiwa kanye nenani lama-ply, ukuhlaziya isidingo sethusi, kanye nokulawula izinga lokushisa le-lamination, ingcindezi, i-vacuum kanye nokwelapha.

Ingabe i-Highleap ikhiqiza kusengaphambili?

Cha. Sakha ama-PCB nama-PCBA sisebenzisa i-laminate evunyiwe kanye ne-prepreg evela kubahlinzeki abafanelekayo.

Ingabe ngidinga ukubala okuqukethwe kwe-resin ngaphambi kokucela ikhotheshini ye-PCB?

Cha. Thumela amafayela e-Gerber noma amafayela okuklama e-PCB endabuko kuqala. I-Highleap izobuyekeza ukusatshalaliswa kwe-stackup ne-copper nethimba le-lamination futhi iqinisekise noma yiziphi izinqumo ezidingekayo zokulungiselela noma zokuqukethwe kwe-resin nawe.