Amaphutha Abalulekile Kumklamo Oshisayo We-LED nokuthi Ungawagwema Kanjani

Kungani i-LED Thermal Design Inquma Impumelelo noma Ukwehluleka

Ubuchwepheshe be-LED bunikeza ukusebenza kahle okumangalisayo, kodwa ukuzwela kokushisa kusalokhu kusengozini enkulu. Ama-LED anamuhla akhiqiza ukushisa okukhulu okugxile ezindaweni ezincane kakhulu, okudala inselele eyisisekelo yokwakhiwa kwe-PCB yokuphathwa kokushisa. Lapho ukulawulwa kokushisa kwehluleka, imiphumela ikhuphuka ngokushesha: ukuwohloka kokukhanya okusheshayo, isikhathi sokusebenza esifushane, kanye nokwehluleka kokuthembeka okungalindelekile.

Amazinga okushisa okuhlanganisa adlula imikhawulo yedizayini adala ukuwohloka kwe-phosphor okuchazile. Ukushintsha kombala kubonakala phakathi nezinyanga, futhi amazinga okuhluleka akhula kakhulu. Ukuqonda amaphutha ajwayelekile edizayini eshisayo ye-LED kwehlukanisa imikhiqizo yezinga lochwepheshe kusukela ekuhlulekeni ngaphambi kwesikhathi.

Amaphutha Ajwayelekile We-Thermal Design

1. Ukubukela phansi ukubaluleka kwezindlela ezishisayo

Abaklami abaningi bagxila ngokukhethekile ekukhetheni usinki wokushisa kuyilapho bebheke umzila oshisayo ophelele osuka ekuhlanganeni kwe-LED kuya emoyeni ozungezile. Lokhu kwengamela okuyisisekelo kokukhishwa kokushisa kwe-LED kudala imigoqo okungekho ukupholisa kwangaphandle okunganqoba. Konke ukusebenzelana ochungechungeni lokumelana nokushisa kwengeza ukumelana okunqwabelana kusuka ku-chip kuye kusinki wokushisa.

Umzila oshisayo uhlanganisa i-chip ye-LED, i-die attach material, izendlalelo zethusi ze-PCB, i-dielectric substrate, i-interface ye-thermal, kanye nokuhlanganiswa kukasinki wokushisa. Ukuthuthukisa idizayini yendlela eshisayo kudinga ukunakwa okuhlelekile kuwo wonke amaphoyinti oshintsho, ikakhulukazi isitaki se-PCB lapho ukwehla kwezinga lokushisa okubaluleke kakhulu kwenzeka.

2. Ukusetshenziswa kwe-substrate engafanele

Ama-substrates avamile e-FR-4 adala imigoqo eshisayo kumiklamo ye-LED enamandla amakhulu. Nge-thermal conductivity ezungeze u-0.3 W/mK, i-FR-4 ivalela ukushisa eduze nemiphetho ye-LED. Lapho ukuminyana kwamandla kudlula i-1W nge-LED ngayinye, amazinga okushisa okuhlangana adlula ngokushesha imikhawulo ephephile, okubangela ukuwohloka okusheshayo.Izixazululo ze-Metal-core PCB zinikeza ukuthuthukiswa okushisayo okudingekayo:

• Aluminium core PCBs - Letha i-1-2 W/mK conductivity eshisayo ngokusebenzisa izendlalelo ze-dielectric ezijwayelekile, ezifanele izinhlelo zokusebenza eziningi zamandla aphakathi nendawo.
• Izilungiselelo ze-IMS ezithuthukisiwe - Finyelela ku-3-5 W/mK ngezinto ezikhethekile ze-dielectric zamalungu afanayo e-LED enamandla amakhulu.
• Izixazululo zethusi-core - Nikeza nge-thermal conductivity engaphezu kuka-200 W/mK kusisekelo sezinto zokuminyana kwamandla ngokwedlulele.

Isinqumo sezinto ezibonakalayo kufanele silinganisele izidingo ezishisayo ngokumelene nezingqinamba zomnotho kanye nobunzima bokukhiqiza.

3. Ukuklama okungalungile kokuqina kwethusi kanye nongqimba olushisayo lwe-conductive

Ithusi elijwayelekile elingu-1 oz linikeza ukushisa okuncane okuseceleni kokusabalalisa, okugxilisa ukucindezeleka okushisayo ezindaweni zokukhweza ze-LED. Lokhu kubangela ukukhathala okuhlangene kwe-solder kanye nama-gradients okushisa asheshisa ukuwohloka kwezinto.

Ukwenyusa isisindo sethusi sibe ngu-2-3 oz kuthuthukisa kakhulu ukusakazeka kwe-thermal lateral, ukusabalalisa ukushisa ezindaweni ezinkulu ze-PCB. Isu lephethini yethusi lidlulela ngalé kwendawo ye-LED eseduze, lidala izindawo zokusiza ezishisayo ezinciphisa izinga lokushisa eliphakeme ngenkathi kulinganisa izindleko zokukhiqiza.

4. Ukushisa okunganele ngokuklama noma ukubekwa okungalungile

Imiklamo eminingi ihlanganisa i-thermal vias encane ngokuqondile ngaphansi kwamaphakheji e-LED, kucatshangwa ukuthi lokhu kubhekana nezidingo zokudlulisa ukushisa. Le ndlela iyehluleka ngoba ukusebenza kahle kuncike ekuminyana, ububanzi, ikhwalithi yokucwenga, kanye nokusabalalisa kwendawo. Idizayini ye-vias eshisayo enganele yenza ukumelana nokushisa okubalulekile phakathi kwezingqimba zethusi.

Idizayini ye-thermal vias esebenzayo idinga ukuhlela amasu:

• Nge-diameter - Ibanga lisuka ku-0.3mm liye ku-0.5mm, elinamadayamitha amancane avumela ukubekwa okuphezulu kokuminyana.
• Isikhala esifanele - Beka nge-vias ezikhungweni eziyi-1.0-1.5mm ngaphakathi kwendawo yephedi eshisayo, idlulele ngale komkhondo we-LED.
• Ngokugcwalisa - Ukugcwalisa i-epoxy conductive eshisayo kunciphisa ukumelana nokushisa ngo-30-50% uma kuqhathaniswa nama-vias agcwele umoya.
• Ngokuminyana - Qondanisa i-15-25 ngesentimitha yesikwele ezindaweni ezishisayo zokusetshenziswa kwamandla aphezulu.

5. Ukudebeselela ukukhethwa nokufakwa kwezinto ezisetshenziswayo ze-thermal interface (TIM)

Ukukhetha okungalungile kwesixhumi esibonakalayo esishisayo kudala imigoqo engenakunqobeka phakathi kwe-PCB nosinki wokushisa. Amaphedi ashibhile ashisayo ane-conductivity engaphansi kuka-2 W/mK ehlanganiswe nokucindezela okunganele okukhuphukayo ashiya izikhala zomoya ezikhuphula ngokuphawulekayo ukumelana nokushisa.Izinketho zokusebenza okuphezulu ngakunye kunikeza izinzuzo ezihlukile:

• Amafutha ashisayo - Nikeza nge-conductivity engu-3-5 W/mK enogqinsi oluncane lwe-bond-line uma isetshenziswe kahle.
• Izinto zokushintsha isigaba - Nikeza ukusebenza okungaguquki kuyo yonke imijikelezo yezinga lokushisa ngaphandle kokukhathazeka kokupompa.
• Amaphedi asekelwe ku-graphite - Hlanganisa i-conductivity ephezulu kalula ukuhlanganisa, nakuba ngezindleko ze-premium.

Ukukhetha kufanele kucabangele ukuqhutshwa kwe-thermal, ukuzinza kwesikhathi eside, ukuhambisana kwenqubo yomhlangano, kanye nezidingo zokuphinda zisetshenzwe.

6. Ukuntuleka kokulingisa okushisayo nokuqinisekisa ukuhlolwa

Ukuthembela ngokukhethekile kokuhlangenwe nakho kwangaphambilini ngaphandle kokumodela okushisayo kuveza imiklamo engcupheni enkulu. Isizukulwane ngasinye se-LED siletha ukuminyana okuphezulu kwe-lumen enezici ezishisayo eziguquliwe. Izixazululo zangaphambilini zingase zehluleke ngokuyinhlekelele ngama-LED amasha agxilisa amandla engeziwe ezindaweni ezincane.

Ukulingisa okushisayo kukhomba izinkinga zokushisa ze-PCB ezingaba khona ngaphambi kokuzibophezela kumathuluzi abizayo. Ngisho nokuhlaziya okuyisisekelo okulinganiselwe kwembula izindawo ezishisayo, kuqinisekisa izindlela zokupholisa, futhi kulinganise umkhawulo ngokumelene nemikhawulo yokushisa. Ukuqinisekiswa kwe-post-prototype kusetshenziswa i-infrared thermal imaging kuqinisekisa ukunemba kokulingiswa futhi kuveza ukuhluka kokukhiqiza.

Izindlela Ezinhle Kakhulu Zokuthuthukisa Idizayini Eshisayo Ye-LED

Idizayini yokushisa esezingeni eliphezulu iqala ngesikhathi sokuthuthukiswa komqondo kunesikhathi sokuxazulula inkinga ye-prototype. Ukukhethwa kwezinto kusungula isisekelo esishisayo, ngokukhetha kwe-substrate eqhutshwa izibalo zokuminyana kwamandla namazinga okushisa okuhlanganisa okuqondiwe.

Imingcele yedizayini ebalulekile inikeza amaphuzu okuqala:

• Isisindo sethusi - Ubuncane obungu-2 oz bezinhlelo zokusebenza zamandla aphezulu ezinezidingo zokusabalalisa okushisayo.
• I-Thermal ngokusebenzisa ukuminyana - 15-25 vias per square centimeter ezindaweni ezibucayi ngaphansi kwama-thermal pads e-LED.
• Izinto zokusebenzisana – I-conductivity engaphezu kuka-3 W/mK yokuhlanganisa kahle kukasinki wokushisa.
• Ukuqinisekiswa kwangaphambi kwesikhathi - Ukuhlaziywa kokushisa ngaphambi kokuzibophezela komklamo, okulandelwa ukuqinisekiswa kokuhlolwa kwe-prototype.

Ukusebenzisa le mihlahlandlela kusenesikhathi kunciphisa imijikelezo yokuklama kabusha, kuqinisekisa amazinga okushisa okuhlangana okuzinzile, futhi kwelule ukuphila kwe-LED. Kumaphrojekthi adinga ukulingisa okujulile okushisayo, ukucwaninga kwedizayini, noma ukwesekwa kokukhetha izinto ezibonakalayo, ithimba lethu lonjiniyela lihlinzeka ngokubonisana okungokwezifiso kokuphathwa kokushisa kwe-LED PCB ukuze kusheshiswe impumelelo yomkhiqizo wakho.

Ukusebenzisana ne-Highleap: Ukugwema Amaphutha Avamile We-Thermal Design

Ukukhipha ukushisa kwe-LED okusebenzayo kudinga ukuqonda ukuthi ukuphathwa kokushisa kudlulela ngalé kokukhethwa kwengxenye kuya kubunjiniyela bezinga lesistimu. Amaphutha ajwayelekile edizayini ye-thermal ye-LED ngokuvamile avela ekwenzeni kube lula lobu bunzima ngokukhetha izinto ezingafanelekile, ukusabalalisa okushisayo okunganele, okunganele ngokusetshenziswa, noma ukuphathwa kabi kokusetshenziswa kubonwa.

Impumelelo idinga ukuhlanganisa izinto ezifanele nejiyomethri ethuthukisiwe, iqinisekiswe ngokulingisa futhi iqinisekiswe ngokuhlolwa. Le ndlela ehlelekile iguqula idizayini ye-PCB yokulawulwa kokushisa isuke ezinkingeni eziphindelelayo ibe yizinqubo zobunjiniyela ezilawulwayo eziletha ukusebenza okuthembekile.

Kwa-Highleap Electronics, ithimba lethu lobunjiniyela ligxile ekwenzeni ngcono ukwakheka kokushisa kwezinhlelo zokusebenza ze-LED ezidingayo. Sinikeza ukuhlaziywa okubanzi kokushisa, isiqondiso sokukhetha izinto, kanye nezinsizakalo zokubuyekezwa komklamo ukuqinisekisa ukuthi imiklamo yakho ye-LED PCB ihlangabezana nemigomo yokusebenza kanye nokuthembeka. Xhumana nathi ukuze uxoxe ngokuthi ubuchwepheshe bethu bungathuthukisa kanjani ukusebenza kokushisa kwe-LED PCB kuphrojekthi yakho elandelayo.