Ukukhethwa Kwezinto Eziphansi ze-PIM PCB: Isisekelo Sobunjiniyela Sezinhlelo Ze-Antenna Ezisebenza Kakhulu

Isingeniso

Ukuthola i-Passive Intermodulation (PIM) ephansi kubalulekile ezinhlelweni zesimanje ze-antenna ze-RF lapho ngisho nezinto ezincane ezingezona umugqa zingehlisa izinga lesignali futhi zethule ukuphazamiseka okuyinkohliso kuwo wonke amabhendi efrikhwensi aseduze. Kuma-antenna asesiteshini, ezokuxhumana ngesathelayithi, nezinhlelo ze-antenna ezisabalalisiwe, ukuhlanekezela okwenziwe yi-PIM kuthinta ngqo ukusebenza kahle kwe-spectral kanye nokuzwela kowamukelayo.

Phakathi kwezici ezahlukahlukene zokuklama, ukukhethwa kwezinto zebhodi lesifunda kudlala indima ebalulekile ekunqumeni ukusebenza kwe-PIM . Ukukhetha izinto ze-PCB ze-PIM eziphansi ezifanele kusiza onjiniyela ukuqinisekisa izici ze-impedance ezizinzile, i-tangent yokulahlekelwa okuncane, kanye nokucindezelwa okuphezulu kwe-intermodulation ezinhlelweni zokusebenza ze-antenna ezisebenzisa imvamisa ephezulu.

Okungaqondile kwezinga lezinto ezibonakalayo, esikhundleni sokuhlanekezelwa kwengxenye esebenzayo, kuvame ukulawula ukuziphatha kwe-PIM emibuthanweni ye-RF engenzi lutho, okwenza ukukhetha kwe-substrate kube ukucatshangelwa kobunjiniyela okuyisisekelo.

Ukuqonda i-PIM kanye Nemvelaphi Yayo Yento

I-Passive Intermodulation ichaza isenzeko lapho amasiginali e-RF amabili noma ngaphezulu ehlangana ezingxenyeni ze-passive ukuze akhiqize amaza angafuneki ngesamba kanye nemikhiqizo ehlukile. Ngokungafani ne-intermodulation esebenzayo ekhiqizwa ama-amplifiers noma izixube, i-PIM ivela ekuziphatheni okungahlosiwe okungaqondile ezintweni nezinto ezihlanganayo okufanele ziziphathe ngendlela efanele.

Izindlela Zesizukulwane Esiyinhloko

Izindlela eziyinhloko zihlanganisa ukumelana nokuxhumana okungaqondile ekuxhumaneni kwensimbi, ukuhlukahluka kwamanje kokuminyana kuzo zonke izindawo zekhondatha, kanye nokugxiliswa kwendawo endaweni ekunqanyulweni kwe-dielectric. Izendlalelo ze-oxidation ezingaphezulu zidala ukuhlangana okulungisayo okubonisa ukusebenza okuncike ku-voltage, kuyilapho ukungcoliswa kwe-ferromagnetic kwethula imithelela kazibuthe ye-hysteresis eshintsha ukugeleza kwamanje ngokungaqondile.

Abanikeli Bezinga Lokubalulekile

I-PIM isuka ezintweni ezimbalwa ezihlobene ne-substrate ehlanganisa i-copper foil surface topology, i-dielectric homogeneity, ukungaguquguquki kwesendlalelo se-bonding, kanye nokwakheka kokuqeda ukucwenga. Ama-Microscopic voids at copper-dielectric interfaces adala imigoqo yomhubhe enezici ze-voltage zamanje ezingaqondile. Lokhu kungapheleli kwezinto ezibonakalayo kuguqula izakhiwo ezingenzi lutho zibe izinto ezingaqondile ezibuthakathaka ngaphansi kwezimo zamandla aphezulu e-RF.

Impahla Ebalulekile Ethinta Ukusebenza Okuphansi kwe-PIM PCB

Ukuqonda ukuthi izici zezinto ezibalulekile zithonya kanjani ukukhiqizwa kwe-PIM kunika amandla ukukhetha kwe-substrate enolwazi. Ukuzinza okungaguquki kwe-Dielectric kanye nesici sokulahla sithinta ngokuqondile ukuhambisana kwesignali ngokunquma ukusatshalaliswa kwensimu namaphethini okuhlakazeka kwamandla ngaphakathi kwe-substrate. Izinto ezisetshenziswayo ezinamavelu ka-Dok alawulwa ngokuqinile zinciphisa ukuhluka kwe-impedance okungagxilisa ukuminyana kwamanje futhi kudale ukushisisa okungekho emthethweni okwenziwe kwasendaweni.

Ukuqina Kobuso kanye Nekhwalithi Ye-Conductor

I-Copper surface topology ithinta kakhulu ukuziphatha kwe-PIM ngakho kokubili kokungaxhunywanga komshini kanye nemiphumela yamanje yokusabalalisa. Ithusi eligoqiwe elinobushelelezi obungaphansi kwama-micrometer angu-2 inikeza ukusebenza okungcono kakhulu kwe-PIM kunethusi elijwayelekile elifakwe yi-electrodeposited elinamaphrofayili angaphezulu okufana nezinyo angaphezu kwama-micrometer angu-5 Ra.

I-Conductivity kanye ne-Metallic Purity

Ithusi le-electrolytic elicwenge kakhulu elinokwakheka okungenawo umoya-mpilo linciphisa imiphumela yomngcele wokusanhlamvu futhi liqinisekise ukusatshalaliswa okufanayo kwamanje. Ukungcola kazibuthe, ikakhulukazi izihlanganisi eziphethe i-nickel noma ukungcoliswa okusekelwe ku-iron, kwethula amaluphu e-hysteresis ashintsha imisinga ye-RF ngokungaqondile. Ngisho nokulandelela okuqukethwe kwe-ferromagnetic ngaphansi kuka-0.1% kungakhuphula amazinga e-PIM ngo-10-15 dB ezinhlelweni zokusebenza zamandla aphezulu.

I-Dielectric Uniformity

I-bonding resin homogeneity kanye ne-ceramic filler distribution distribution control control ukuhluka kwemvume yendawo ngaphakathi kwe-substrate. Ukulayishwa kwesigcwalisi esingafananiyo kudala imingcele ye-dielectric encane lapho ukunqwabelana kweshaja kukhiqiza amandla ancike ensimini. Amasistimu asekelwe ku-PTFE anamatrices e-fluoropolymer abonisa ukufana okuphakeme uma kuqhathaniswa nezinhlelo ze-epoxy ezigcwele, ezihumusha ngokuqondile ukukhiqiza i-PIM ephansi.

Izinto Ezivamile Eziphansi ze-PIM PCB zemiklamo ye-Antenna

Ukukhethwa kwezinto zokusebenza ze-PIM ephansi kudinga ukulinganisela ukusebenza kukagesi, ukuphathwa kokushisa, ukuzinza kwemishini, kanye nokusebenza kahle kokukhiqiza. Ukuqhathanisa okulandelayo kugqamisa imindeni ebalulekile ye-substrate esetshenziswa ekwakhiweni kwe-antenna lapho ukucindezelwa kwe-PIM kubalulekile khona. Ngomklamo ochazwe nge-AD250C, ukwenziwa kwe-AD250C kwama-antenna e-PIM ephansi kuxhuma ukukhethwa kwe-laminate ne-geometry ye-antenna, izindawo kanye nezixhumi zokuxhuma.

Ama-Substrates Asekelwe ku-PTFE

Inhlanganisela ye-matrix ye-PTFE imele ibhentshimakhi yezinto ze-PIM PCB eziphansi kakhulu ngenxa yokuhlanzeka kwazo okungaphakathi kanye nezakhiwo ze-dielectric ezingaguquki. Isakhiwo se-fluoropolymer esingeyona ingxenye ye-polar sibonisa ukulahlekelwa okuncane kokukhululeka kwe-dipole enezici zokushabalalisa ngokuvamile ezingaphansi kuka-0.001, kuyilapho ukubopha kwethusi eligoqiwe okubushelelezi kunciphisa ukungafani kokuxhumana.

I-Ceramic ne-Hydrocarbon Alternatives

Izinhlanganisela ezilayishwe nge-Ceramic zinikeza ukuzinza kwe-dimensional okuthuthukisiwe kanye nokunwebeka okushisayo okuphansi uma kuqhathaniswa nezinhlelo ezihlanzekile ze-PTFE, nakuba ukukhetha kokugcwalisa ngokucophelela kubalulekile ukuze kugwenywe ukwethula ukungcola kazibuthe. Izinhlelo ze-Hydrocarbon resin zinikeza izinzuzo zokucubungula kanye nezindleko zempahla ezincishisiwe kuyilapho kugcinwa ukusebenza kwe-PIM okwamukelekayo kwezinhlelo zokusebenza ezinezidingo eziqinile ezingaphansi kuka -150 dBc.

Ukucatshangelwa Kokuklama Nokukhiqiza Kwezinto Eziphansi ze-PIM PCB

Ngisho nama-premium substrates aletha ukusebenza okuphansi lapho izinqubo zokwenziwa zethula ukuhlangana okungaqondile noma ukungcoliswa kwendawo. Ukulawulwa kwenqubo kunquma ngokuqondile ukuthi ingabe izinto ezisetshenziswayo ze-PIM eziphansi ze-PCB ziyafinyelela yini imikhawulo yazo yokusebenza kwethiyori.

Izidingo Ezibucayi Zokwenziwa

Ukugwema ukuxhumana kwensimbi exubile, ikakhulukazi izendlalelo ezine-nickel ezingaphansi kwegolide noma isiliva, kuqeda ukungahambisani kwe-galvanic junction okungehlisa isithunzi i-PIM ngo-20 dB noma ngaphezulu. Izinqubo ezilandelayo ziqinisekisa imiphumela emihle:

• Qedela ukukhetha - I-ENEPIG ene-palladium barrier noma isiliva lokucwiliswa elihlanzekile inikeza ukusebenza okuphezulu kwe-PIM uma kuqhathaniswa nezinqubo ezijwayelekile ze-ENIG eziqukethe izendlalelo ze-nickel kazibuthe.
• Ubuqotho bokubambisana - Ukucindezela kwe-lamination okulawulwayo kanye namaphrofayili okushisa asusa ama-micro-void ezindaweni zokuhlangana zethusi-dielectric ezidala ukungaqhubeki kwe-capacitive.
• Ukulungiswa kwendawo - Ukuhlanza i-Plasma noma ukufakwa kwamakhemikhali ngokushesha ngaphambi kokubopha kususa izinsalela zezinto eziphilayo nama-oxides angakha izixhumanisi zokulungisa.
• Ukuhlanzeka kwamathuluzi - Imishini enikelwe yokucubungula impahla ye-PIM PCB ephansi iqeda ukungcoliswa kwezinsimbi ezisansimbi ezisetshenziswa ekukhiqizeni okujwayelekile.

Umthelela Wokulawula Inqubo

Ngisho nezinto ezingcono kakhulu zingaveza ukusebenza okungalungile kwe-PIM uma inqubo yokwenziwa yethula amajoyinti angenawo umugqa noma ukungcola okuncane ngokulawulwa kwekhwalithi okunganele. Ikhopha egoqiwe enamanani e-Ra angaphansi kwamabhondi ama-micrometer angu-1.5 ngokungaguquguquki kunethusi elijwayelekile elifakwe yi-electrodeposited, ehlisa ukukhiqizwa kwe-PIM ehlobene nesixhumi esibonakalayo ngo-5-10 dB.

Isibonelo sohlelo lokusebenza: 5G Massive MIMO Antenna Module

I-antenna enkulu yesiteshi se-MIMO enezingxenye ezingu-64 esebenza ku-3.5 GHz enamandla okufaka angu-200W ngesiteshi ngasinye idinga ukusebenza kwe-PIM ngaphansi kuka--153 dBc (okubhekiselwe kumandla okuthwala angu-+43 dBm) ukuze ihlangabezane nemikhawulo yokukhishwa okungamanga engu-3GPP. Ama-prototype okuqala asebenzisa ama-substrate e-laminate ajwayelekile e-hydrocarbon-ceramic aphansi-ukulahlekelwa okune-ENIG aqediwe kuphela ngo--147 dBc, ehluleka ukuhlangabezana nezidingo.

Imiphumela Yokuthuthukisa Okubalulekile

Ukushintshela ku-laminate ephansi esuselwa ku-PTFE enethusi eligoqiwe elibushelelezi kanye nokuphela kwesiliva okucwiliswayo kuthuthukise ukusebenza kwe-PIM kuya ku--162 dBc, okunikeza umkhawulo ongu-9 dB uma kuqhathaniswa nemininingwane. Ushintsho lwezinto lubhekane kokubili ukulahleka kwe-dielectric tangent (kuncishisiwe kusuka ku-0.0037 kuya ku-0.0009) kanye nokungalungi kobuso bethusi. Ukulingisa ukushisa kuqinisekisile ukushabalaliswa okwanele kokushisa naphezu kokuqhuba kwe-PTFE okuphansi kokushisa okungu-0.26 W/mK, okuvunyelwe ukwakheka kwamandla okusatshalaliswa kwe-antenna.

Isiphetho

Ukukhetha izinto ezifanele ze-Low PIM PCB zakha isisekelo sezinhlelo ezithembekile ze-antenna ezisebenza ezindaweni ezifunwa yi-RF. Ubuqotho bezinto ezibonakalayo buthonya ngokuqondile ukuziphatha kwe-intermodulation ngokusebenzisa i-surface topology, ukufana kwe-dielectric, nobumsulwa bensimbi. Ukusebenzisana phakathi kwezakhiwo ze-substrate, ikhwalithi yendawo yethusi, kanye nokwakheka kokuqeda ukucwenga kunquma ukuthi izakhiwo ezingenzi lutho zihlala zilandelana ngempela yini ngaphansi kwezimo ze-RF zamandla aphezulu.

I-Highleap Electronics ihlinzeka ngezisombululo eziphelele ze-PIM PCB ezithuthukisiwe ezilungiselelwe izinhlelo zokusebenza ze-antenna:

• Ukukhetha izinto ezithuthukile – Isekela ama-laminates asekelwe ku-PTFE, izinhlanganisela ezigcwele i-ceramic, nama-substrates asekelwe ngensimbi anokusebenza okuqinisekisiwe kwe-PIM ngezansi -160 dBc.
• Ukunemba kwendawo yokuqedela - I-ENEPIG kanye nezinqubo zesiliva zokucwiliswa ezinamapharamitha wokucwenga alawulwayo ukuze kuqedwe ukungcoliswa kazibuthe kanye nokungahambelani kwe-junction.
• Indawo yokukhiqiza elawulwayo - Izinqubo ezinikelwe zamathuluzi nezinqubo zokuqamba ezingangcolisi ezidizayinelwe izinhlelo zokusebenza ezibalulekile ze-PIM.
• Usekelo lobunjiniyela - Isiqondiso sokukhetha izinto ezibonakalayo, ukwenziwa ngcono kwezitaki, nokuhlaziya okushisayo ukuze kuzuzwe ukusebenza okuphezulu kuma-antenna esiteshi, ezokuxhumana ngesathelayithi, nezinhlelo ze-antenna ezisabalalisiwe.

Xhumana nethimba lethu lonjiniyela be-RF ukuze nixoxe ngokuthi izinto zokwakha ze-Low PIM PCB ezithuthukisiwe kanye nokwakhiwa okunembayo kungathuthukisa kanjani ukusebenza kohlelo lwakho lwe-antenna.