Umhlinzeki we-PCB we-MEC Server ngokwezifiso we-AI

Ukuthola umhlinzeki we-PCB weseva ye-Multi-access Edge Computing (MEC) kuhlukile ekutholeni ibhodi le-datacenter elijwayelekile. Amapulatifomu e-MEC ahlala phakathi kwenethiwekhi yokufinyelela umsakazo kanye nefu — imithwalo yemisebenzi ye-vEPC/UPF, i-O-RAN DU/CU, i-edge AI inference, kanye nezinhlelo zokusebenza eziqondile ze-low-latency konke kuhlangana kwihadiwe yokubala okumele ihlangabezane nokutholakala kwe-telecom-grade ngenkathi ithunyelwa ngamavolumu aqhutshwa yi-opharetha.

I-Highleap Electronic inikeza ama-PCB kanye nama-PCBA ezinhlelo zeseva ze-MEC eziqhutshwa ama-OEM ezinsizakusebenza zenethiwekhi, ama-ODM, kanye nabahlanganisi be-5G abazimele. Leli khasi lingelonjiniyela wokuthola noma umholi wehadiwe onquma ukuthi singaba yini ku-AVL yakho. Lihlanganisa ikhono lobuchwepheshe elibalulekile kwihadiwe ye-MEC — ama-laminate asheshayo, ukwakhiwa kwe-backplane, i-impedance elawulwayo ngamanani e-PCIe Gen5 / 25G+ — kanye nokuziphatha kwe-supply-chain okuhlolwa yithimba lokuthenga le-telecom.

Yini Eyenza I-PCB “I-MEC-Class”

Amaseva e-MEC ahlukene ngokomzimba — izinto zikagesi ze-1U/2U ezimfushane emahhovisi amakhulu, amabhokisi aqinile ezindaweni zamaseli ezikude, amayunithi ahlanganisiwe kakhulu ezindaweni zokufaka ezithwalayo — kodwa izidingo ze-PCB ziyahlangana kuphrofayili efanayo:

• Ikhompyutha yokubala enobuningi obukhulu: Xeon-D, EPYC Embedded, Ampere Altra, noma ama-SoC omthengisi ahlanganiswe nama-accelerator e-GPU/SmartNIC, konke ebhodini elilodwa noma kuhlukaniswe phakathi kwebhodi elikhulu kanye ne-mezzanine/riser.
• Ukubusa kwe-I/O okushesha kakhulu: I-PCIe Gen4/Gen5, CXL, DDR5, 25G/100G/400G Ethernet kusukela emachwebeni ephaneli engaphambili kuya eplanini elisindayo le-SerDes.
• Izixhumi ezixhunywe ngocingo nezingenantambo: Amakheji e-SFP28/QSFP28/QSFP-DD, isikhathi sokubona, kanye neminye imiklamo ehlanganisiwe ye-O-RAN front-haul.
• Ukutholakala kwesigaba senkampani yenethiwekhi: Ama-thermal kanye nama-shock target e-NEBS Level 3, ama-power feed aphindaphindayo, ama-hot-swap fans, kanye nokusebenza okuqhubekayo kweminyaka engu-5+.
• Ukuhlolwa komqhubiAma-PCB kumele alandelelwe ngeqoqo ngalinye; izinhlelo eziningi ze-telecom zidinga ukwamukelwa kwe-IPC Class 3 kanye nokususwa okuphelele kwezingxenye ezincane ezihlokweni zokuqala.

Ngakho-ke, umhlinzeki we-PCB weseva ye-MEC kufanele abe nekhono ekwakhiweni kwenani eliphezulu, ukuphathwa kwezinto ezilahlekelwa kancane, kanye nokulawula inqubo okuhlelekile — hhayi nje ekuguquleni ama-Gerber abe amabhodi.

Amandla Okukhiqiza e-MEC Server PCB

Ngezansi kunemingcele esiyishayayo kumabhodi e-MEC-class. Ishidi eliphelele lemininingwane lihlala ekhasini lethu eliqinile lekhono le-PCB.

Izinto Ezinokulahlekelwa Okuphansi Nezihlanganisiwe Esizigcinayo Zomsebenzi We-MEC

Imizila ye-SerDes engaphezu kuka-25 Gbps ayithetheleli — izinto ze-Dk/Df kanye nokungaguquguquki kwethusi kuqhuba umdwebo wamehlo akho ngaphezu kokwenza kwe-routing. Siphethe uhlu lwama-laminate avela ngempela kuma-MEC nama-O-RAN BOM:

• Panasonic - I-Megtron 6, I-Megtron 7, I-Megtron 8
• I-ITEQ - I-IT-968, I-IT-988
• I-TUC - I-TU-872 SLK, I-TU-883, I-TU-933
• Isiqhingi - I-Tera MT40, IS620i, ikilasi le-Tachyon lama-SerDes athuthukile
• i-laminate ekhethekile yokulahlekelwa okuphansi - i-laminate ekhethekile ephansi yokulahlekelwa, i-laminate ekhethekile ephansi yokulahlekelwa, i-laminate ekhethekile ephansi yokulahlekelwa kwezingxenye ezincane ze-RF kanye ne-antenna

Kumapulatifomu e-MEC ahlanganisa izingxenye zomsakazo we-small-cell noma we-O-RAN front-haul, sakha njalo ama-stackups e-laminate aphansi okulahlekelwa okukhethekile + i-FR-4 hybrid ukuze i-RF zone ithole ukusebenza kwe-laminate okuphansi okulahlekelwa okukhethekile kuyilapho i-digital zone ihlala ku-laminate ephansi yokulahlekelwa okuphakathi engabizi kakhulu.

Ama-PCB e-Backplane kanye ne-Midplane e-MEC Chassis

Amapulatifomu e-MEC alandela imodeli ye-O-RAN engahlukaniswanga — ama-blade e-compute ahlukene, indwangu yokushintsha, namakhadi okusheshisa — ancike ku-backplane yesivinini esikhulu ukuze anamathisele konke ndawonye. Ama-PCB e-Backplane angamanye amabhodi aqinile esiwakhayo, futhi imininingwane yokwakha ibalulekile:

• Izibalo zesendlalelo esiphezulu (Izendlalelo ezingu-24–48 ezijwayelekile) ukuhambisa amakhulu ama-differential pairs ane-reference-plane isolation.
• Amabhodi aqinile enezimbobo ezijulile zokulingana ngokucindezela — inqubo yethu isekela ubukhulu bebhodi obufika ku-6 mm ngokubhoboza emuva okujulile okulawulwayo.
• Umongo wokulahlekelwa okuphansi kuyo yonke indawo izingqimba ze-SerDes, ngoba imikhondo ye-backplane inde futhi isabelomali sokulahlekelwa sincane.
• Ama-sub-stackup ethusi elisindayo ukuze kusatshalaliswe ugesi; sakha izendlalelo zethusi ezingama-3–6 oz ngaphansi kwezindawo zokuxhuma ukuze siphathe imisinga yebha yamabhasi.
• Iziqu zokufaneleka kwabezindaba: i-geometry yembobo kanye nobukhulu beplati okulawulwa ku-spec yomthengisi wezixhumi ezifana ne-Amphenol ExaMAX, i-TE Strada Whisper, kanye ne-Molex Impel.

Uma usebenzisa indwangu ye-blade compute + switch ku-chassis eyodwa, singacaphuna i-mainboard, i-riser, kanye ne-backplane njengohlelo olulodwa oluhlanganisiwe — inqubo efanayo ye-fab, ukulandelela okufanayo kokubuyekeza, umhlinzeki oyedwa.

I-MEC Server PCBA: Kusukela ku-Pilot kuya ku-Volume

Ama-OEM e-Telecom avame ukuqhuba uhlelo lwe-MEC ngezigaba ezintathu — i-prototype ye-EVT/DVT, i-pilot (amayunithi angu-50-500), kanye nokukhiqizwa okuqhutshwa yi-opharetha. Sisekela zonke ezintathu emgqeni ofanayo we-SMT, ngonjiniyela abafanayo, ngakho izinguquko zokubuyekezwa phakathi kwezigaba zihlala zilandeleka.

• Ukunemba kokubeka: ±25 µm @ 3σ, isekela ama-passive angu-01005 nama-BGA afinyelela ku-pitch engu-0.35 mm.
• Amandla e-BGA: bheka eyethu Umhlangano we-BGA ikhasi — kufaka phakathi ama-BGA e-flip-chip athambile asetshenziswa kuma-SoCs asemaphethelweni kanye nama-SmartNIC.
• Isiteshi sokufaka umfutho: ukufakwa kwamandla alawulwayo kwezixhumi ze-backplane ezixinene kakhulu.
• Ukuhlolwa kwe-X-ray: 5 µm resolution kuyo yonke indawo ye-BGA, i-BTC, kanye ne-via-in-pad.
• Ukuhlolwa okusebenzayo: sakha izinto zokuhlola ku-spec yakho, noma sisebenzise i-boundary scan / JTAG / ICT kuye ngokufinyelela.
• Uhlelo lwe-IC: I-BMC, i-EEPROM, i-FPGA bitstream iyalayisha — bheka Izinsizakalo zokuhlela ze-IC.
• Ukumboza okuhambisanayo: ezindaweni zokuvala ze-MEC zangaphandle noma zasemgwaqweni lapho ukufuma kuyinkinga khona.

Izikhathi zokuhola: i-PCB eyisibonelo izinsuku zokusebenza ezingu-7-14, i-PCBA izinsuku zokusebenza ezingu-15-25 kusukela ekulungelweni kwengxenye; izikhathi zokuhola zokuhlola nezokukhiqiza ezicashuniwe ngephrojekthi ngayinye.

Ukuziphatha Kochungechunge Lokunikezela Okukhathalelwa Ngempela Ukuthengwa Kwe-Telecom

Uhlu lwamakhono kulula ukulushicilela. Okuhlukanisa umhlinzeki we-PCB weseva ye-MEC yangempela nesitolo esijwayelekile yilokho okwenzeka phakathi nohlelo:

• Ukulandeleka kokubalulekile: yonke inqwaba ephawulwe ngomkhiqizi we-laminate, inqwaba, kanye nekhodi yosuku. Ikhasimende lakho lomqhubi lizobuza.
• Ukulawula ukubuyekeza: ama-oda okushintsha ubunjiniyela acutshungulwe ngokumelene ne-BOM ehleliwe kanye ne-stackup; akukho ukushintshana okuthule.
• Imibiko yesihloko sokuqala: ukususwa kwe-microsection, i-impedance TDR, ukushintshwa kwe-soldering, kanye nokuhlolwa kobukhulu okulethwa ngokubuyekezwa okusha ngakunye.
• Ukuthobela imithetho yekilasi le-IPC: izinhlelo eziningi ze-MEC zidinga I-IPC-6012 Isigaba 2 noma Isigaba 3 ye-PCB kanye ne-IPC-A-610 Class 2/3 yokuhlanganisa. Sakha kokubili.
• I-RoHS / REACH: ukuthobela imithetho ngokugcwele, izimemezelo ezitholakala ngokuthunyelwa.
• Indlu yokuphatha abantu abaningi: uma umqhubi evula isifunda futhi udinga ukukala u-3× ngekota, umugqa ungawumunca.

I-Highleap inezitifiketi ze-ISO 9001, ISO 14001, IATF 16949, kanye ne-UL, futhi uhlelo lwethu lwekhwalithi luchazwe ekhasini lethu lokuqinisekisa ikhwalithi ye-PCB.

Izinsizakusebenza ze-MEC kanye ne-PCB Zokuxhumana Ezihlobene

• Izixazululo ze-PCB Zokuxhumana
• Ukukhiqizwa kwe-PCB Ejwayelekile Ephezulu
• Izinto ze-PCB zesivinini esiphezulu
• I-Server Motherboard PCB Assembly
• I-AI Server PCB Manufacturing
• I-Turnkey PCB Assembly

Qala Isilinganiso Sakho Se-PCB Seseva ye-MEC

Sithumelele i-Gerber/ODB++ yakho, i-stackup ene-impedance target, i-BOM (yokuhlanganisa), kanye nenani le-target. Ngezinhlelo ze-backplane noma ze-chassis, faka imininingwane yesixhumi kanye nomdwebo wembobo ofanele ukucindezela. Uzothola isibuyekezo esibhaliwe se-DFM kanye nentengo zingakapheli izinsuku ezingu-1-2 zebhizinisi. Uma uhlelo lwakho ludinga ukuhlolwa komhlinzeki ngaphambi kokucaphuna, ithimba lethu lobunjiniyela bokuthengisa lizohlela lokho.

Thola i-MEC Server PCB Quote noma uxhumane nethimba lethu lobunjiniyela ukuze nixoxe ngokwakhiwa kwe-stackup, izinto zokwakha, noma i-backplane.