Ukwakhiwa Nokuhlanganiswa kwe-PCB Ehambayo

Ama-PCB e-Smartphone aphakathi kwamabhodi wesekethe adinga kakhulu akhiqizwa ngesikali—izingqimba zethusi eziyi-10 kuya kweziyi-12 ezicindezelwe zibe ngaphansi kuka-1mm wobukhulu, zithwala izimpawu ezivela kuma-DC power rails kuya kuma-antenna feed angu-40GHz 5G ngesikhathi esisodwa. Ukuwakhiqiza ngokwethembeka kudinga uhlobo oluhlukile lwemishini, ukulawula izinqubo, kanye nokusekelwa kobunjiniyela kunokukhiqiza kwe-PCB okujwayelekile kwezentengiselwano.

I-Highleap Electronics igxile ekwakhiweni nasekuhlanganisweni kwe-PCB yeselula yamakhasimende e-OEM kanye ne-ODM, iphatha yonke into kusukela kumasampula okuqala obunjiniyela kuya ekukhiqizweni okuphezulu ngaphansi kophahla olulodwa. Amandla ethu okukhiqiza ibhodi yesekethe yocingo ahlanganisa lonke uhla lwezidingo zesikhulumi samanje se-smartphone.

Yini Eyenza I-PCB Ehambayo Ihluke Kuma-PCB Ajwayelekile

I-PCB yeselula—ebizwa nangokuthi i-PCB ye-smartphone, ibhodi lesekethe yocingo, noma ibhodi lomama lefoni ephathekayo—akuyona nje inguqulo encane yebhodi lezinto zikagesi zezimboni noma zabathengi. Inhlanganisela yemingcele okumele ihlangabezane nayo ngesikhathi esisodwa ayitholakali kwenye indawo ekukhiqizweni kwezinto zikagesi.

Ukubalwa kwezingqimba kugijima ku-10-12 uma kuqhathaniswa no-2-6 ojwayelekile wamabhodi ezentengiselwano ajwayelekile. Ubukhulu bebhodi lonke kumele buhlale ku-1.0mm noma ngaphansi. Ububanzi obuncane bokulandelela bungu-50μm (2 mil) uma kuqhathaniswa no-100-150μm kumabhodi ajwayelekile. Ngobuchwepheshe kushintsha kusuka ezimbobeni ezisebenzisa imishini kuya kuma-micro-via e-laser e-HDI kububanzi bokubhoboza obungu-0.1mm. Futhi amaza esignali afinyelela ku-40GHz ku-5G mmWave—uma kuqhathaniswa no-1GHz ngokuvamile kumabhodi ajwayelekile.

Lezi zithiyo ziyahlangana. Ukufaka izingxenye ezingu-1,000–1,500 ebhodini elincane kunekhadi lesikweletu ngenkathi kugcinwa ukuhlukaniswa kwe-5G RF, izindlela zokushisa ze-10W SoC, kanye nomzila wememori we-LPDDR5X ku-8,533 Mbps kudinga izinqubo zokwenziwa nokuhlanganiswa izimboni eziningi ze-PCB ezingenakukwazi ukuzisekela.

Ubuchwepheshe be-HDI: Kungani Ama-Smartphones Ebudinga

Ubuchwepheshe be-PCB be-High Density Interconnect (HDI) abuyona into ongayikhetha ekwakhiweni kwe-smartphone yesimanje—yiyona ndlela kuphela yokukhiqiza esekela ubuningi bephakheji ye-SoC yamanje. Iprosesa yohlelo lokusebenza oluphambili kuphakheji ye-BGA ye-pitch engu-0.4mm ayikwazi ukuqondiswa kusetshenziswa imbobo evamile ngokusebenzisa ubuchwepheshe; asikho isikhala esanele esibonakalayo ezingqimbeni zangaphakathi zokusakaza imikhondo yesignali.

I-HDI ixazulula lokhu ngokufaka ama-vias amakhulu omshini esikhundleni sama-vias amancane abhobozwe nge-laser (ububanzi obungu-0.1mm) axhumanisa kuphela izendlalelo ezizidingayo, okushiya isikhala somzila wangaphakathi sezendlalelo sitholakala. Izakhiwo ze-micro-via ezihlanganisiwe—lapho ama-vias amaningi angaboni akhiwe khona ngokuqondile ngemijikelezo ye-lamination elandelanayo—zivumela ubuningi bomzila wokuphunyuka obudingwa amaphakheji esimanje eselula e-SoC.

Ukucushwa kokwakheka kunqunywa yi-pitch yephakheji ye-SoC kanye nenani le-interface: 1+N+1 (izendlalelo ezingu-6–8) zama-smartphone aphakathi nendawo; 2+N+2 (izendlalelo ezingu-8–10) zokuhlanganiswa kwe-SoC okuhamba phambili; ELIC 3+N+3 (izendlalelo ezingu-10–12) zama-flagship e-5G mmWave. Ukuze uthole imininingwane yokwenziwa kanye nezindlela zokufaneleka zesigaba esibanzi, bheka ikhasi lokukhiqiza le-HDI PCB le-Highleap Electronics.

Okufanele Ukubheke Kumkhiqizi We-PCB Ehambayo

Akuwona wonke amafektri e-PCB afaka phakathi ikhono le-HDI angakhiqiza amabhodi ebanga leselula ngamanani okukhiqiza okwenza ukukhiqizwa kwevolumu kusebenze. Uma kufaneleka umhlinzeki we-PCB yeselula, izinto ezine zihlukanisa abakhiqizi abanekhono kulabo abazokhiqiza ama-respin:

• Ukubhoboza nge-laser okungenani okungu-0.1mm — ububanzi be-micro-via bukhawulela ngqo ubuningi bomzila we-BGA; amafektri akhawulelwe ku-drill engu-0.15mm awakwazi ukusekela amaphakheji e-SoC amanje ahamba phambili
• Ukulawulwa kwe-Impedance ngokuqinisekiswa kwe-TDR — ukuvimba kokulingisa kuphela akwanele kuma-interface ememori e-5G RF kanye ne-LPDDR5X; idatha yekhuphoni elilinganisiwe kumele ithunyelwe nayo yonke indawo yokukhiqiza
• I-100% AXI kumaphakheji e-BGA — ukuhlolwa kwe-X-ray okuzenzakalelayo kwamalunga onke kuyindlela kuphela yokuthola amaphesenti angenalutho ngaphambi kokuba amabhodi afinyelele ukuhlolwa kokusebenza; ukusampula akwanele ekukhiqizweni okuhambayo
• Ukwakhiwa nokuhlanganiswa ngaphansi kophahla olulodwa — iziteshi zokuhlinzeka ezihlukanisiwe ziletha ukungalingani kwephrofayili yokugeleza kabusha kanye nezikhala zokuzibophezela lapho kuvela izinkinga zokukhiqiza

I-Highleap Electronics: Ukwakhiwa Nokuhlanganiswa kwe-PCB Ehambayo

I-Highleap Electronics ikhiqiza ama-PCB eselula ama-OEM nama-ODM asebenzisa amapulatifomu e-Qualcomm Snapdragon, MediaTek Dimensity, kanye ne-Samsung Exynos.

Kumadizayini e-5G sub-6GHz kanye ne-mmWave, sichaza i-laminate ekhethekile ene-low loss noma i-LCP ezingqimbeni ze-RF—imininingwane efanayo yezinto eziphansi loss ezisetshenziswa kulo lonke ulayini wethu wokukhiqiza we-PCB ovame kakhulu . Siphinde sakha amabhodi aqinile-flex amamojula ekhamera kanye nama-hinge axhumaniswayo, kanye nama-PCB okushaja angenantambo e-Qi assemblies—ahlanganisa ububanzi be-PCB obuphelele be-smartphone yesimanje ebudlelwaneni bokuphakelwa okukodwa.

I-Mobile PCB Prototype eya Ekukhiqizweni Okukhulu: Indlela Inqubo Esebenza Ngayo

Amaphrojekthi amaningi e-PCB aselula aqala ngokubuyekezwa kwefayela le-Gerber. Isethi ye-Gerber, imininingwane yokuhlanganisa eyinkimbinkimbi, kanye namavolumu alindelekile anele ukuthola umbiko we-DFM kanye nesilinganiso sokuqala zingakapheli amahora angama-24-48. Ukwakhiwa kwesampula yobunjiniyela kuvame ukusebenza izinsuku eziyi-7-14 ebhodini elingenalutho, kanye nezinsuku ezi-3-5 ezengeziwe zeprototype ehlanganisiwe. Ukufaneleka komklamo kulandela—isigaba se-X-ray, ukuqinisekiswa kwe-impedance, ukusampula umjikelezo wokushisa—ngaphambi kokuba ukukhiqizwa kwevolumu kukhiye imingcele yenqubo. Ukuze uthole umbono ogcwele wokuthi amabhodi ahamba kanjani efektri yethu, bheka ikhasi lethu lenqubo yokukhiqiza ye-PCB.

Sisekela kokubili i-turnkey (sithola izingxenye) kanye nokuhlanganiswa kwezinto ezithunyelwe. Kumakhasimende asuka komunye umhlinzeki, sinikeza isibuyekezo samahhala se-DFM semiklamo ekhona—lokhu kuvame ukukhomba imbangela yezinkinga zokukhiqiza ezazihlotshaniswa nomklamo ngaphambilini.

Imibuzo Evame Ukubuzwa Mayelana Nokukhiqiza Ama-PCB Eselula

Zingaki izendlalelo i-PCB ye-smartphone evame ukuba nazo?

Ama-smartphone amaningi anamuhla ahamba phambili asebenzisa ama-PCB anezingqimba eziyi-10-12. Amadivayisi aphakathi nendawo ngokuvamile asebenzisa izingqimba eziyi-6-8. Inani lezingqimba liqhutshwa yipulatifomu ye-SoC: Imiklamo ye-Qualcomm Snapdragon 8-series kanye ne-MediaTek Dimensity 9000-series ngokuvamile idinga izingqimba eziyi-10+ ukuze iqondise zonke izixhumi zesivinini esikhulu ngaphandle kokuphazamiseka kobuqotho besiginali.

Yiliphi inani elincane kakhulu le-oda lokwenziwa kwe-PCB yeselula?

I-Highleap Electronics ayinayo inani elincane kakhulu le-oda lokwakha ama-prototype. Amasampula obunjiniyela aqhutshwa ngamabhodi angu-5-20 ayizindawo zokuqala ezivamile. Intengo yokukhiqiza umthamo isebenza kusukela kumayunithi angaba ngu-500, kanye nokuthuthukiswa kokukhiqiza ngobuningi okugcwele okutholakala kusukela kumayunithi angu-5,000 nangaphezulu.

Yimaphi amafayela engidinga ukuwathumela ukuze ngithole isilinganiso se-PCB yeselula?

Amafayela e-Gerber (ifomethi ye-RS-274X) kanye nencazelo ye-stack-up kwanele ukuqala. I-BOM iyadingeka ukuze kuhlanganiswe izingcaphuno. Singasebenza namafayela e-ODB++, futhi ithimba lethu lobunjiniyela lizocela noma yiluphi ulwazi olungekho ngesikhathi sokubuyekezwa kwe-DFM—awudingi iphakheji ephelele ukuze uqale ingxoxo.

Ungakwazi yini ukukhiqiza ama-PCB eselula asekela i-5G mmWave?

Yebo. Imiklamo ye-5G mmWave idinga izinto ze-dielectric ezilahlekelwa kancane (i-laminate ekhethekile elahlekelwa kancane noma i-LCP) ezingqimbeni ze-RF, ezinemikhondo ye-impedance elawulwayo eqinisekiswe yisilinganiso se-TDR. Sakha ama-hybrid stack-ups ahlanganisa lezi zinto ne-FR4 ejwayelekile ezingqimbeni zangaphakathi, futhi siqinisekisa i-RF section impedance ngedatha yekhuphoni ethunyelwa nayo yonke indawo yokukhiqiza.

Yiziphi izitifiketi eziphethwe yi-Highleap Electronics zokukhiqizwa kwe-PCB yeselula?

I-Highleap Electronics inesitifiketi se-ISO 9001:2015 futhi ikhiqiza ngokwe-IPC-A-610 Class 2 njengesisekelo. Izindlela zokuhlola ze-IPC Class 3 ziyatholakala uma ziceliwe kumaphrojekthi anezidingo zokuthembeka eziphakeme. Zonke izindawo zokukhiqiza zithunyelwa ngemibhalo ephelele yokulandelela okuhlanganisa amarekhodi ezindawo zezinto ezibonakalayo, imibiko yokuhlola, kanye nedatha yokuhlolwa kwe-impedance.