I-NP-175F PCB Laminate: Umhlahlandlela Wokukhiqiza Nokuhlanganisa Ama-PCB Athembekile Kakhulu

Uma ithimba lobunjiniyela licacisa i-NP-175F PCB laminate, isidingo sivame ukuba sicacile kakhulu kunokukhetha nje enye into ye-FR-4. I-NP-175F iyisistimu ye-epoxy laminate egcwele i-Tg ephezulu, esebenza ngezindlela eziningi kanye ne-prepreg eyenzelwe izinhlelo zokusebenza lapho ukuzinza kokushisa, ukuziphatha kobukhulu kanye nokuthembeka kokuxhumana kubalulekile. Ngakho-ke umbuzo obalulekile wokuthola ulwazi awukona nje kuphela ukuthi ifektri ingathola i-NP-175F, kodwa ukuthi ingakha yini ukwakhiwa kwe-PCB okuphelele nxazonke kwezinto ezivunyiwe futhi ithwale lokho kwakhiwa njalo ekukhiqizweni nasekuhlanganisweni. Uma ucabangela ukwenziwa kwe-FR408HR kwezakhiwo ezigxile ekuthembekeni , qinisekisa izidingo zokushisa kanye nokuxhumana ezithile zephrojekthi esikhundleni sokuphatha izinto ze-Tg ephezulu njengezilingana.

I-Highleap Electronics ingumkhiqizi we-PCB kanye nomhlinzeki wokuhlanganiswa kwe-PCB. Asikhiqizi i-NP-175F laminate. Sakha ama-PCB kanye nezinhlangano ze-PCB sisebenzisa izinto zokwakha, izakhiwo kanye nemininingwane yokukhiqiza evunyelwe amakhasimende. Kuphrojekthi ye-NP-175F, lokho kusho ukuthi umthwalo wethu wemfanelo ukuhumusha isidingo sezinto ezivunyiwe sibe yi-stackup ekhiqizwayo, inqubo elawulwayo yezingqimba eziningi, ibhodi elingenalutho elihloliwe, futhi uma kudingeka, i-PCBA eqediwe.

Kungani Kufanele Ukhethe i-NP-175F PCB Laminate Yokukhiqiza i-PCB Ethembekile Kakhulu?

I-NP-175F iba yinto efanelekile lapho iphrojekthi ye-PCB idinga umkhawulo wokushisa nowomshini owengeziwe kunalokho okunganikezwa ukwakhiwa okuyisisekelo kwe-FR-4 okujwayelekile. Imininingwane yayo eshicilelwe ihlanganisa izinga lokushisa eliphakeme kakhulu lokuguquka kwengilazi nokwanda kokushisa okulawulwayo kanye nohlelo lwe-epoxy olugcwele. Kumenzi we-PCB, lezo zici zibalulekile ngoba ibhodi kumele lisinde hhayi kuphela ekukhiqizweni, kodwa futhi nasekufakweni kwe-solder okulandelayo kanye nokuvezwa kokushisa ngaphandle kokulahlekelwa ubuqotho bomshini bokuxhumana kwalo.

Incazelo yomphakathi ye-NP-175F ibala i-Tg engu-173°C yi-DSC kanye ne-165°C yi-TMA njengamanani ajwayelekile, kanye nencazelo encane engu-170°C ezimweni ezibalwe. Iphinde ibike ukuqala kokushisa kokubola kwe-TGA cishe ku-349–351°C, kuye ngesimo esibekiwe. Lezi zinombolo zinikeza izinkomba zobunjiniyela eziwusizo lapho ibhodi lihloselwe ukuhlanganiswa okungenalo i-lead noma ezinye izinhlelo zokusebenza ezibandakanya ukuvezwa okuphindaphindiwe kokushisa okuphezulu.

Izici zezinto ezibalulekile ngesikhathi sokukhiqizwa kwe-PCB

• Phezulu Tg: I-Tg eshicilelwe isekela imiklamo edinga ukuzinza okukhulu kokushisa kunezakhiwo ezivamile ze-Tg FR-4 eziphansi.
• Uhlelo lwe-epoxy olugcwele: Le ncazelo ikhomba izigcwalisi ezingaphili, ezakha ingxenye yokuziphatha kokushisa nobukhulu besistimu yezinto ezibonakalayo.
• Ukulawulwa kwe-CTE ye-Z-axis: Amanani ajwayelekile abhalwe ku-40–60 ppm/°C ngaphambi kwe-Tg kanye no-250–270 ppm/°C ngaphezu kwe-Tg, okwenza ukwanda kwe-Z-axis kube yinto ebalulekile yokucatshangelwa ukuthembeka.
• Ukuzinza kwe-Dimensional: Izici zokwanda kokushisa kwezinto zihlobene nokubhaliswa kwezingqimba eziningi kanye nokuthembeka kwembobo edlulayo.
• Ukumelana Thermal: Imiphumela yokuhlolwa kwe-T260 kanye ne-T288 inikeza amaphuzu okubhekisela awusizo lapho kuhlolwa ukuchayeka emazingeni okushisa okuhlangana angenalo i-lead.

I-NP-175F kufanele isahlulelwe ngokumelene nokusetshenziswa kwe-PCB yangempela. I-laminate ene-Tg ephezulu ayenzi ngokuzenzakalelayo ibhodi lifaneleke kuyo yonke idizayini evame kakhulu, enamandla aphezulu noma enokwethenjelwa okuphezulu. I-stackup ephelele, isakhiwo sethusi, ukubhoboza, ukubopha, ukuqeda ubuso, iphrofayili yokuhlanganisa kanye nezidingo zemvelo konke kunegalelo ekusebenzeni kokugcina.

Kumakhasimende asevele azibophezele ku-NP-175F, isinyathelo esilandelayo esisebenzayo ukwenza izidingo zezinto zicace kuphakheji yokukhiqiza. Insizakalo yezinto ze-PCB laminate ze-Highleap yakhelwe ngokuhambisana nezidingo ze-laminate ezichazwe ngamakhasimende, ngakho izinga lezinto lingacatshangelwa kanye nokwakhiwa kwe-PCB kwangempela esikhundleni sokuphathwa njengento yokuthenga ehlukanisiwe.

Kufanele Isetshenziswe Kanjani i-NP-175F Ku-Multilayer PCB Stackup?

Uma i-NP-175F isikhethiwe, umbuzo olandelayo wobunjiniyela uthi kufanele ifakwe kanjani ku-stackup yezingqimba eziningi. Yilapho incazelo yezinto ezibonakalayo iba incazelo yokukhiqiza. Ubukhulu be-core, ukwakhiwa kwangaphambili, okuqukethwe kwe-resin, isisindo sethusi kanye nobukhulu bokugcina be-dielectric kunquma isakhiwo somzimba okumele sikhiqizwe umenzi we-PCB.

I-NP-175F inikezwa njenge-laminate kanye ne-prepreg kuncazelo eshicilelwe. Lokho kwenza ubudlelwano phakathi kwezinto eziyinhloko kanye ne-prepreg ecindezelwe bubaluleke kakhulu. Ubukhulu obujwayelekile be-prepreg ngaphambi kokucindezela abufani ngempela nobukhulu bokugcina be-dielectric ngemva kwe-lamination. Ukugeleza kwe-resin, ukusatshalaliswa kwethusi kanye nokwakhiwa okuzungezile kuthinta umphumela wokugcina.

Imininingwane yokuhlanganisa okufanele kuvunyelwane ngayo ngaphambi kokwenziwa

• Ukubalwa kwezingqimba kanye nokulandelana kwezingqimba okuphelele
• Ukwakhiwa okuyisisekelo nokwangaphambi kwesikhathi kwesendlalelo ngasinye se-dielectric
• Ubukhulu bebhodi eliqediwe kanye nokubekezelelana okuvumelekile
• Izisindo zethusi ezingaphakathi nangaphandle
• Izindawo zokubhekisela zezibonakaliso ezibalulekile
• Izidingo zokulawulwa kwe-impedance kanye nokubekezelelana okuqondiwe
• Ngohlobo, isakhiwo sokubhoboza kanye nanoma yisiphi isidingo sokubhoboza ngemuva

Kumiklamo ene-impedance elawulwayo, indawo esebenza kahle ye-dielectric ibaluleke ngaphezu kwenani elilodwa lesihloko i-Dk. Idatha kagesi ye-NP-175F eshicilelwe iyahlukahluka kuye ngokwakhiwa kanye nesimo sokuhlola, ngakho-ke umenzi we-PCB kufanele asebenzise ukwakhiwa okuvunyiwe lapho ebala ububanzi bokulandelela, isikhala kanye ne-impedance. Izinsiza zokukhetha izinto ze-PCB ze-Highleap ezisheshayo zinikeza uhlaka oluwusizo lokuhlobanisa ukukhethwa kwe-laminate nezidingo zangempela ze-stackup.

I-stackup kufanele futhi ihlolwe ukuthi iyakwazi yini ukwenziwa ngaphambi kokukhululwa. Amandla obunjiniyela be-PCB layer stackup ye-Highleap angaxhumanisa isidingo sikagesi nokuhlelwa kwesendlalelo, ukwakhiwa kwe-dielectric kanye nemikhawulo yokwenziwa. Lokhu kubaluleke kakhulu lapho ikhasimende linikeza umklamo okhona kodwa lishintsha umenzi we-PCB ohlosiwe.

Umgomo ukugwema inkinga evamile yokuthola izinto: i-oda lokuthenga libiza i-NP-175F, kodwa inqwaba yokukhiqiza ishiywa ivulekile ekuhunyushweni. Ukwakhiwa okuvunyelwe ngokucacile kunikeza ikhasimende kanye nomenzi isisekelo esiqinile kakhulu sokukhiqiza okuphindaphindwayo.

Yini Okufanele Abakhiqizi Bayilawule Lapho Bekhiqiza Ama-PCB e-NP-175F?

Ukucaciswa kwezinto ezibonakalayo kusungula ukuziphatha okulindelekile kwe-NP-175F, kodwa ukukhiqiza kunquma ukuthi lokho kucaciswa kuhunyushwa ebhodini eliqediwe elihambisanayo. Kwi-PCB enezingqimba eziningi, i-lamination, ukubhaliswa, ukubhoboza, i-desmear, i-copper plating kanye nokuhlolwa kokugcina konke kuyasebenzisana. Ngakho-ke ibhodi eliqondene nezinto ezibonakalayo liyazuza ekuhleleni inqubo ngaphambi kokukhiqiza kunokuthembela ezimpahleni zezinto kuphela.

Ukubhaliswa kwe-lamination kanye ne-multilayer

I-Lamination ilawula isibopho phakathi kwezingqimba ngazinye futhi ithonya kakhulu i-geometry yokugcina ye-dielectric. Ku-NP-175F, ukwakhiwa kwe-prepreg okuvunyiwe kanye nokusatshalaliswa kwethusi kudingeka kucatshangelwe kanye nomjikelezo wokunyathelisa. Inqubo ye-lamination ye-PCB ye-Highleap isekela ukukhiqizwa kwezingqimba eziningi lapho ukubopha okuhlala njalo, ukujiya kwe-dielectric kanye nokubhaliswa kubalulekile.

Ukubhoboza, ukukhipha i-desmear kanye nokufaka i-plated emigodini

Ukuthembeka kwembobo edlulayo kungenye yezizathu zokuhlola ukuziphatha kokushisa kwe-NP-175F kwe-Z-axis. Umenzi kusamele akhiqize imbobo ehlanzekile, ebekwe kahle kanye nokuxhumeka okunokwethenjelwa okunamapulangwe. Ukukhethwa kokubhoboza, ikhwalithi yembobo nodonga, i-desmear kanye ne-copper plating kufanele kuhambisane nobukhulu bebhodi, isilinganiso sesici kanye nezidingo zembobo eqediwe.

I-DFM kanye nokulawula okunezilinganiso

Ngaphambi kokukhipha ibhodi eliyinkimbinkimbi le-NP-175F, isibuyekezo se-PCB DFM singabona ukungqubuzana phakathi komklamo kanye nenqubo yokukhiqiza ehlosiwe. Izindawo ezijwayelekile zokubuyekeza zifaka phakathi isikhala sokubhoboza sibe yithusi, amasongo ahlanganisiwe, ibhalansi yethusi, ukubhaliswa kwesendlalelo, ukujiya kwebhodi kanye nokubekezelelana kokwenziwa. Ukuthola lezi zinkinga ngaphambi kokusebenzisa amathuluzi kanye ne-lamination ngokuvamile kusebenza kahle kunokuzilungisa ngemva kokuqala kokukhiqiza.

Insizakalo yokwenziwa kwe-PCB ye-Highleap ihlanganisa ukugeleza okubanzi kokukhiqiza kwebhodi elingenalutho. Nge-laminate echazwe yikhasimende, inhloso ukulondoloza ukwakhiwa okuvunyiwe ngokwenziwa esikhundleni sokushintsha into ehlukile noma ukushintsha i-stackup buthule ukuze kube lula ukukhiqiza.

Ukulawulwa kwekhwalithi kufanele kulandele izidingo zangempela zebhodi

Ukuhlolwa kufanele kuhlotshaniswe nezingozi zomklamo. Kuye ngephrojekthi, lokhu kungafaka i-AOI, ukuhlolwa kobukhulu, ukuhlolwa kwemigodi, ukuhlolwa kukagesi kanye nokuqinisekiswa kwe-impedance. Uhlelo lokuhlola oluqondile kufanele lulandele ukucaciswa kwekhwalithi yekhasimende kanye nesigaba somkhiqizo kunokucabanga ukuthi uhlu lokuhlola olulodwa lufanelana ne-NP-175F PCB ngayinye.

Ingabe i-NP-175F Ifanelekile Kuzinhlelo Zokusebenza ze-PCB Ezinezingqimba Eziningi Nezingenalo I-Lead?

I-NP-175F iyindlela efanelekile yokusetshenziswa kwe-PCB enezingqimba eziningi lapho i-Tg ephezulu, ukuzinza kokushisa kanye nokuthembeka kokuxhumana kubalulekile. Imininingwane eshicilelwe iphinde iveze ukuthi izinto azinayo i-lead futhi inikeza imiphumela yokumelana nokushisa kwe-T260 kanye ne-T288. Lezi zici zenza kube yinto efanelekile kumabhodi okumele adlule ekuhlanganisweni okungenalo i-lead ngaphandle kokuphatha i-laminate njengengxenye elahlwayo yenqubo.

Lapho izakhiwo zezinto zinganezela khona inani

• Amabhodi Ezendlalelo Eziningi: Ukwanda kokushisa okulawulwayo kanye nokuziphatha okunobukhulu kungasekela ukwakhiwa kwezingqimba eziningi ezidinga amandla ngomshini.
• Umhlangano ongenalo i-lead: Idatha eshicilelwe yokumelana nokushisa inikeza ireferensi ewusizo yezinga lezinto ezibonakalayo zokuchayeka ekushiseni okuphezulu.
• Izakhiwo ezihlanganisiwe eziqinile: Ukwandiswa kokushisa kwe-Z-axis kubalulekile uma ukufakwa kwe-plated ngemigodi kumele kuhlale kuthembekile ngesikhathi sokuvakasha kokushisa.
• Izinto zikagesi zezimboni: Izinto ezibonakalayo zingacatshangelwa lapho ukuzinza kokushisa nokomshini kuyingxenye yencazelo ye-PCB.

Ngesikhathi esifanayo, i-NP-175F akufanele imakethwe ngokuzenzakalelayo njenge-laminate ezinikele kakhulu ephansi kakhulu yokulahlekelwa. Izakhiwo zayo zikagesi ezishicilelwe ziwusizo ekubhekiseleni kobunjiniyela, kodwa izinhlelo zokusebenza ezinezidingo eziqinile zokufakwa kwesivinini esiphezulu noma ukulahlekelwa yi-RF kufanele zihlolwe ngokuhambisana nobubanzi bemvamisa edingekayo, ukwakhiwa kwangempela kwe-dielectric kanye nesabelomali sokulahlekelwa yizinga lesistimu. Ukukhethwa kwezinto kufanele kulandele uhlelo lokusebenza kunokuba kulandele okuphambene nalokho.

Ukucutshungulwa okungenalo i-lead kusadinga ukuhlolwa kwezinga lebhodi

Ukuhambisana okungenalo umthofu akuyona nje indaba ye-laminate. Iphrofayili yokushisa kabusha, ukujiya kwebhodi, ukusatshalaliswa kwethusi, ubuningi bezingxenye kanye nokufakwa kwamaphaneli konke kungathinta ukuziphatha kokushisa kwe-PCBA eqediwe. Ngakho-ke indlela efanele yokukhiqiza ukuhlola i-NP-175F kanye nenqubo yokwakhiwa kwebhodi langempela kanye nokuhlanganiswa.

Lokhu kubaluleke kakhulu lapho umklamo ushintsha kusuka ekukhiqizweni kweprototype kuya ekukhiqizweni kwevolumu. I-stackup esebenza ekucushweni kwephaneli eyodwa ingadinga ukubuyekezwa kokukhiqiza lapho ukusetshenziswa kwephaneli, ibhalansi yethusi noma ukulayisha kwenhlangano kushintsha. Ukugcina ukwakhiwa kwezinto ezivunyiwe kulungisiwe ngenkathi kulawulwa lezi ziguquguquko zokukhiqiza kusiza ukunciphisa ukuhlukahluka okungalindelekile.

Izinto ze-PCB ze-NP-175F Zithinta Kanjani Ukuhlanganiswa kwe-PCB?

Uma ikhasimende lidinga i-PCBA eqediwe, imfuneko ye-NP-175F iyaqhubeka ngale kokwenziwa kwebhodi elingenalutho. I-laminate iyingxenye yesisekelo lapho izingxenye zihlanganiswa khona, zihlolwe futhi zihlolwe. Insizakalo yokuhlanganisa i-PCB ye-Highleap ingaxhuma ibhodi le-NP-175F elenziwe nge-SMT, THT, ukutholakala kwezingxenye, ukuhlolwa kanye nokuhlolwa ngokwezidingo zokuhlanganisa zekhasimende.

Izici zokuhlanganisa okufanele zibuyekezwe ngaphambi kokukhiqiza

• Ubukhulu bebhodi kanye nokufakwa kwamaphaneli: Lokhu kuthonya ukuphathwa kanye nokuziphatha kokushisa ngokugeleza kabusha.
• Ukusatshalaliswa kwethusi: Ukulayisha kwethusi okungalingani kungathinta ibhalansi yokushisa kanye nokuziphatha kwebhodi.
• Izingxenye ze-Fine-pitch: I-geometry yephedi kanye nokuqedwa kobuso kudingeka kufane nomklamo wokuhlanganisa.
• Geza kabusha iphrofayela: Iphrofayili yangempela kufanele ifanele isethi yezingxenye kanye nokwakhiwa kwebhodi okuphelele.
• Ukuhlolwa: Ukuhlolwa kwe-AOI, i-X-ray kanye nokuhlolwa kukagesi noma okusebenzayo kungakhethwa ngokuya ngobuningi bephakheji kanye nezidingo zomkhiqizo.

Ku-NP-175F PCBA, kuyasiza futhi ukugcina i-PCB kanye nemibhalo yokuhlanganisa kuvumelanisiwe. Iphakheji yokukhiqiza kufanele ibone izinto ezivunyiwe kanye ne-stackup, kuyilapho iphakheji yokuhlanganisa kufanele ibone i-BOM efanele, idatha yokubeka, imidwebo kanye nezidingo zokuhlola. Lokhu kuvimbela ingozi evamile yokukhiqiza lapho ukubuyekezwa kwebhodi kushintsha khona kodwa amadokhumenti okuhlanganisa angashintshi.

I-impedance elawulwayo ingenye yezizathu zokuphatha ukwenziwa nokuhlanganiswa kwe-PCB njengephrojekthi eyodwa. Izidingo zikagesi zisungulwa ekwakhiweni kwebhodi elingenalutho, ngakho-ke imigomo ye-stackup ne-impedance evunyiwe kufanele ihlale ilandelelwa ngokukhiqiza. Insizakalo yokukhiqiza i-PCB elawulwa yi-impedance ye-Highleap ingasekela amaphrojekthi lapho izidingo zobuqotho besignali kumele zihunyushwe zibe izidingo zokwenziwa ezilinganiswayo.

Kumakhasimende akhetha umhlinzeki oyedwa wochungechunge lokukhiqiza oluphelele, ukuhlanganiswa kwe-turnkey PCB kungahlanganisa ukwenziwa kwe-PCB, ukutholakala kwezingxenye kanye nokuhlanganiswa. Lokhu kuwusizo ikakhulukazi lapho i-NP-175F iyinto edingekayo echazwe ngamakhasimende futhi umthengi efuna ithimba elifanayo lobunjiniyela ukuthi liphathe ukuguquka kusuka kudatha ye-PCB kuya ku-PCBA eqediwe.

Yini Okufanele Uyicacise Lapho U-oda Ama-PCB e-NP-175F?

Isicelo sekhotheshini se-NP-175F esingcono kakhulu yiphakheji yokukhiqiza, hhayi nje igama elibalulekile. Umhlinzeki udinga ulwazi olwanele ukuqinisekisa ukuthi ukwakhiwa okuceliwe kungenziwa ngaphakathi kwezindinganiso ezidingekayo nokuthi ngabe ibhodi elifanayo lingaqhubeka nokuhlanganiswa ngaphandle kwezinguquko ezingagwenywa.

Ulwazi okufanele lufakwe ku-NP-175F PCB RFQ

• I-Gerber, i-ODB++ noma enye idatha yokukhiqiza evunyiwe
• Amafayela okubhoboza aphelele kanye nezidingo zomgodi oqediwe
• Inani lezingqimba kanye nokuqoqwa okuvunyiwe
• Ulwazi lwengxenye ye-NP-175F yokwakhiwa okuyisisekelo/okwangaphambi kokukhulelwa noma izinto ezivunyiwe
• Ukujiya kwebhodi okuqediwe kanye nokubekezelelana
• Izisindo zethusi ezingaphakathi nangaphandle
• Izidingo zokuqeda ubuso kanye nemaski ye-solder
• Izinhloso zokuvimbela okulawulwayo kanye nokubekezelelana, lapho kufanele khona
• Ubuningi bebhodi, izidingo zeprototype kanye nesibikezelo sokukhiqiza
• Izidingo zokuhlola, ukuhlola kanye nemibhalo yekhwalithi

Uma impahla iyimpoqo, yisho lokho ngokucacile. Uma ikhasimende livumela enye indlela efanayo, lokho kufanele kuchazwe ngokucacile futhi kuvunyelwe ngaphambi kwanoma yikuphi ukushintshwa kwezinto. I-Highleap ayikhiqizi i-NP-175F ngokwayo, ngakho-ke ubudlelwano obufanele bokukhiqiza buqondile: ikhasimende lichaza uhlelo lwezinto oluvunyiwe, bese i-Highleap yakha i-PCB ngokwaleyo mfuneko.

Uma ukuhlanganiswa kwe-PCB kuyingxenye yemfuneko

Engeza ifayela le-BOM, i-centroid noma i-pick-and-place, imidwebo yokuhlanganisa, izidingo zokuthola izingxenye, ulwazi lokuhlela kanye nezidingo zokuhlola ukusebenza. Lokhu kuvumela i-Highleap ukuthi ihlole ibhodi elingenalutho kanye ne-PCBA ndawonye. Kuphinde kunikeze isisekelo esicacile sesikhathi sokuhola kanye nezindleko ngoba ukwenziwa kwe-PCB, ukuthengwa kwezingxenye kanye nokuhlanganiswa kungahlelwa njengokugeleza okukodwa kokukhiqiza.

Kumaphrojekthi ashintsha kusuka ku-prototype kuya ekukhiqizweni, kuyasiza kakhulu ukucela isibuyekezo sokukhiqiza ngaphambi koku-oda kwevolumu yokuqala. Lokhu kuvumela ukwakhiwa kwe-NP-175F okuvunyiwe ukuthi kuhlolwe maqondana nokufakwa kwamaphaneli, amathuluzi, ukuhlolwa kanye nezidingo zokuhlanganiswa ngaphambi kokuba inani lokukhiqiza lande.

Kungani Kufanele Usebenze Ne-Highleap Electronics Ekukhiqizweni Nokuhlanganiswa Kwe-PCB ye-NP-175F?

Kumakhasimende asevele ekhethe i-NP-175F, inani lomkhiqizi we-PCB alikho ekuthengiseni kabusha izinto. Lisekusebenzeni kokwakhiwa okuvunyiwe ngokunembile nangokungaguquguquki. I-Highleap Electronics isekela indlela ephelele kusukela ekwakhiweni kwe-PCB kuya ekuhlanganisweni kwe-PCB, ngokubuyekezwa kobunjiniyela okutholakalayo kwe-stackup, i-DFM, i-impedance kanye nezidingo zokukhiqiza.

Indima yethu icacile: asikhiqizi i-NP-175F laminate; sakha ama-PCB nama-PCBA sisebenzisa imininingwane yezinto ze-NP-175F ezivunyelwe yikhasimende. Lowo mehluko ugcina uchungechunge lokuhlinzeka lunembile ngokobuchwepheshe ngenkathi uvumela ikhasimende ukuthi lisebenze nomthombo owodwa wokukhiqiza wamabhodi angenalutho noma izinhlangano eziqediwe.

Uma usuvele unephakheji ye-NP-175F stackup kanye ne-fabrication, thumela amafayela ukuze akhotheshini. Uma izinto zikhethiwe kodwa i-stackup isadinga ukubuyekezwa kokukhiqiza, nikeza izidingo zikagesi, inani lezingqimba, ukujiya, isisindo sethusi kanye nesicelo esiqondiwe ukuze ukwakhiwa kuhlolwe ngaphambi kokukhiqiza.

Inkomba yobuchwepheshe: Ishidi lemininingwane yomphakathi le-Nan Ya NP-175F. Amanani ezinto ezishicilelwe anikezwa ukuze abhekiselwe ngaphansi kwezimo zokuhlola ezishiwo. Imininingwane yakamuva yomkhiqizi evunyelwe amakhasimende kanye nokwakhiwa kwe-PCB okuvunyelwene ngakho kufanele kulawule ukukhiqizwa.