Umklamo we-PCB Wemithetho Yokukhiqiza Nezinqumo Zokuklama

Umklamo we-PCB wokukhiqiza usho ukuklama ibhodi lakho lesifunda ukuze inqubo yokukhiqiza ikwazi ukulakha kahle, ngesivuno esikhulu, nangezindleko ezicashuniwe. Isinqumo ngasinye sokuklama — isisindo sethusi, ngobubanzi, isikhala sokulandelela, uhlaka lwebhodi, ukubekwa kwezingxenye, usayizi wezinhlamvu zesikrini se-silk, ukunwetshwa kwemaski ye-solder, isakhiwo sefayela lokubhoboza — sinquma ngqo ukuthi yini umenzi kanye nendlu yokuhlanganisa engayenza noma engenakuyenza, nokuthi ngezindleko ezingakanani. Umklamo onganaki imikhawulo yokukhiqiza awukhiqizi nje ifulegi le-DFM ekubuyekezweni kwesilinganiso; ukhulisa izindleko zamayunithi, wandisa isikhathi sokuhola, unciphisa isivuno sokuqala, futhi ngezinye izikhathi udala ukwehluleka kwensimu okuphasa ukuhlolwa kwefektri. Lo mhlahlandlela uhlanganisa izinqumo zokuklama ezibaluleke kakhulu — ngezinombolo ezithile ngemuva komthetho ngamunye kanye nesizathu sokukhiqiza umthetho ngamunye ukhona — ukuze abaklami bangenza ukuhwebelana okunolwazi kunokuba babambe ngekhanda imikhawulo abangayiqondi.

Thumela Amafayela Ukuze Ubuyekezwe Mahhala nge-DFM

Okushiwo Yidizayini Ye-PCB Yokukhiqiza Empeleni - nokuthi Kungani Iqala Ngaphambi Kokuhlelwa

Umklamo we-PCB wokukhiqiza awulona uhlu lokuhlola ekugcineni kokuhlelwa. Kuwumkhakha wokwenza izinqumo zokuklama — kuzo zonke izigaba kusukela ekuhleleni kuya ekulungiseleleni ifayela — ngokuqonda okucacile kokuthi isinqumo ngasinye siyivimbela noma siyivumela kanjani inqubo yokukhiqiza. Uma kucatshangelwa umkhawulo wokukhiqiza kusenesikhathi, kulapho kushibhile ukuwuhlonipha.

Izindleko Zokulungisa Izinkinga ze-DFM Ezigabeni Ezihlukene

• Ekukhetheni kwe-schematic/ingxenye: Ukukhetha i-QFN esikhundleni se-BGA endaweni efanayo ukuze ugweme ukugcwalisa nge-in-pad konga u-$8–15 ngebhodi ngalinye ezindlekweni zokukhiqiza ze-HDI, ngaphandle kokulungiswa kabusha komklamo. Ukucacisa i-1080 prepreg esikhundleni se-2116 ekwakhiweni kwe-HDI kugcina isilinganiso se-aspect ratio singabonakali ngaphansi kuka-0.8:1 — umehluko phakathi kwe-via ethembekile kanye nokwehluleka kwensimu — ngaphandle koshintsho lomzila kanye noshintsho lwezindleko ezingeni lezinto ezibonakalayo.
• Ku-50% yokwakheka: Ukuqaphela ukuthi ukusatshalaliswa kwethusi okungalingani kuzobangela ukugoba kwebhodi ngesikhathi sokugeleza kabusha, kanye nokwengeza ukugcwaliswa kwethusi okulinganiselayo ezingqimbeni ezilula, kuthatha imizuzu engama-30. Ukuthola lokhu ngemuva kokwakhiwa kwamabhodi kusho ukususa indawo.
• Ekuhleleni kokugcina, ngaphambi kukaGerber: Ukusebenzisa i-silkscreen-to-pad DRC nokuthutha abaklami bezinkomba abangu-15 kuthatha ihora elilodwa. Ukuletha lokhu kwephulwa komthetho kumenzi wezinto kunezela amahora angu-24-48 okubamba futhi kuyingozi ekuchazeni kabi i-CAM.
• Ekukhiqizweni kwesihloko sokuqala noma kwevolumu: Inkinga ye-DFM efinyelele ekukhiqizweni ibiza u-$500–$5,000 kanye nesonto eli-1–3 lesimiso. Uma kuqhathaniswa nomthamo, u-5% wezinto ezingatholakala emabhodini ayi-10,000 ngo-$12 ngalinye u-$6,000 ezintweni ezingatholakala zodwa — ngaphambi kwezindleko zokwehluleka kwensimu.

I-DFM Ikhono Lokuklama, Hhayi Umthetho Wefektri

Umklami oqondayo ukuthi kungani kukhona umkhondo omncane ongu-0.10mm wethusi elingu-½oz (ukusika okungaphansi kwe-etch kuyanda ngokujula kwethusi), kungani isilinganiso se-aspect esingaphezu kuka-10:1 sikhiqiza i-plating engathembekile (i-chemistry ayikwazi ukufinyelela enkabeni yebhareli), noma kungani uhlaka lwebhodi olungenayo idatha echaziwe ludala ukungaqondakali kokwenziwa (iphutha lobukhulu liyaqongelela kusuka kusici kuya kwesinye) angenza ukuhwebelana okuhlakaniphile lapho ukusebenza kudinga imingcele yokusunduza. Umklami ophatha i-DFM njengohlu lokuhlola lokudlula/ukwehluleka oluyi-binary uzohlala ethuthukisa ubumpumputhe.

Izinqumo Ezihlanganisiwe Nezinto Ezibalulekile Ezichaza Imingcele Yokukhiqiza

Izinqumo zokuhlanganisa izinto ezenziwe ngaphambi kokuba kuqale ukwakheka zinquma ukuthi yini engenziwa futhi engakhiqizi ebhodini eliqediwe. Lokhu akunakwenzeka kakhulu ukukushintsha ngemva kokuqondisa ngaphandle kokuphinda kujikelezwe ngokuphelele.

Ukuqoqwa Okulinganayo: Akuxoxiswani Ngamabhodi Amancane

I-stack-up ehambisanayo — lapho ukuhlelwa kwezingqimba kanye nobukhulu be-dielectric ngaphezu komugqa ophakathi webhodi kubonakalisa lokho okungezansi — kuvimbela ukwanda kokushisa okuhlukile ngesikhathi sokulamina nokugeleza kabusha. Lapho ibhodi likhula futhi lincipha ngokungalingani, liyagoba unomphela. Kumabhodi angaphansi kobukhulu obungu-1.0mm, okuvamile kwi- HDI PCB kanye nemiklamo egqokwayo, ama-stack-up angalingani abangela ukwehluleka kokubekwa kwe-SMT kusuka ku-warpage.

Isinqumo sokuklama: ukunikezwa kwesendlalelo sesibuko ngamabomu — uma i-L2 iyindiza yethusi engu-1oz, i-L(N-1) kumele ibe yindiza yethusi engu-1oz. Lapho ukuhanjiswa kwesignali kuvimbela lokhu, engeza ukugcwalisa kwethusi okuqandisiwe ohlangothini olukhanyayo. Akudingi uxhumano lukagesi, akubizi lutho ekwenziweni, futhi kulinganisa ukuziphatha kokukhula kokushisa.

Ukufanisa Izinto ze-Tg nenqubo Yomhlangano

• I-FR4 ejwayelekile (Tg 130–140°C): Kwanele i-SMT enohlangothi olulodwa ngokugeleza kabusha okungenalo uthoshi. Okusemaphethelweni okungenalo uthoshi olunohlangothi olubili — imijikelezo emibili egcwele yokugeleza kabusha ekuphakameni okungu-255–260°C isondeza ibhodi kakhulu ekushiseni kwalo kokuguquka kwengilazi. Ukuze kube nokuhlanganiswa okunohlangothi olubili, chaza i-mid-Tg (150–160°C) njengobuncane.
• Inani eliphakeme kakhulu lama-FR4 (Ukushisa okungu-170°C+): Kuyadingeka ekuhlanganisweni okungenamthofu ohlangothini olubili, ibanga lokusebenza kwezimoto (−40°C kuya ku-+125°C), kanye nezicelo zomjikelezo wokushisa ophezulu. Intengo ephezulu: 10–20% ngaphezu kwe-FR4 ejwayelekile — ngaphansi komjikelezo owodwa wokuphinda usebenze.
• Ama-laminate amelana ne-CAF: Kumiklamo enesikhala semigodi esidlula i-to-via esingaphansi kuka-0.20mm ezindaweni ezinomswakama, i-FR4 ejwayelekile ingathuthukisa ukukhula kwe-anodic filament phakathi kwemigodi ebholiwe eduze ngokuhamba kwesikhathi. Cacisa amazinga amelana ne-CAF (Isola 370HR, Shengyi S1000-2M) lapho kokubili isikhala semigodi eqinile kanye nokuvezwa komswakama kukhona.

Ukuklama Ukucaciswa Okuphelele Kokulawulwa Kwe-Impedance

Umzila wokuvimbela olawulwayo unembile kuphela njengokucaciswa okungemuva kwawo. Ububanzi bomzila kuthuluzi le-EDA bubala ngokuqhathanisa namapharamitha e-dielectric acatshangelwayo. Uma amanothi okukhiqiza ethi “kudingeka i-50Ω kuphela,” umenzi usebenzisa i-stack-up yakhe ezenzakalelayo, okungase kuhluke kulokho ithuluzi lakho le-EDA elikucabangayo — okukhiqiza ukushintshashintsha kokuvimbela kwe-lot-to-lot okubangela ukwehluleka kobuqotho besignali ensimini.

Ukucaciswa okuphelele kwe-impedance kudinga zonke izinto ezinhlanu: inombolo yesendlalelo, ububanzi bokulandelela, i-target impedance (Ω), ukubekezelelana (±%), kanye namagama wesendlalelo sendiza yokubhekisela. Isibonelo: “50Ω ±10% ku-L1, ububanzi bokulandelela 0.127mm, indiza yokubhekisela L2.” Ukulahlekelwa yinoma yisiphi isici kuphoqa umenzi ukuthi acabange.

Isisindo Sethusi Nemiphumela Yaso Yokukhiqiza

Isisindo sethusi sithinta ubuncane bobubanzi bomkhondo, ikhwalithi ye-etch, kanye ne-impedance ngasikhathi sinye:

• ½oz (17µm): Kudingeka ezingqimbeni zokwakheka kwe-HDI zokubhoboza nge-laser (ukugoba imaski okuvumelanayo kudinga ithusi elincane ukuze kube nemiphetho eqondile yefasitela); kusetshenziswa ezingqimbeni zesignali ezinobukhulu obuphezulu lapho kudingeka khona imikhondo engu-0.075–0.10mm
• 1oz (35µm): Okujwayelekile kwezingqimba eziningi zesiginali kanye nezindiza; ubuncane bomkhondo 0.125mm enqubweni ejwayelekile
• 2oz (70µm): Kwezendlalelo zokusatshalaliswa kwamandla ezithwala ugesi oqhubekayo; umkhondo omncane ongu-0.20mm; qinisekisa ikhono lezendlalelo zangaphakathi ngomkhiqizi ngaphambi kokufaka
• Izisindo zethusi ezixubile esendlalelo esifanayo kudala izinkinga zokugcaba — i-etchant isusa ukujula okuhlukene ngasikhathi sinye, okubangela ukugcaba ngokweqile kwezici ezincane noma ukugcaba ngaphansi kwezingxenye zethusi ezisindayo. Yakha ngesisindo sethusi esifanayo ngeleveli ngayinye.

Imithetho Yokuklanywa Kokulandelela, Isikhala, kanye Nokubumba: Okuvela Kunombolo Ngayinye

Ukulandelela kanye nesikhala esincane ngesisindo sethusi

Amanani amancane okulandelela kanye nesikhala avela ku-physics ye-etch undercut: i-etchant ihlasela ithusi eceleni kanye naphansi, kanti i-lateral undercut iyanda ngokujula kwethusi. Umklami ocacisa ama-traces angu-0.10mm kuthusi elingu-2oz ucela isici inqubo yokuqopha engeke ikwazi ukusikhiqiza ngokuthembekile.

Ukwakheka ngokwezindinganiso ezijwayelekile ngaphandle kokuthi ubuningi budinga ngempela ukubekezelelana okuthuthukisiwe. Izindlela ezithuthukisiwe zidinga ukuqinisekiswa kwamandla, zibize kakhulu, futhi zinciphise imingcele yesivuno.

Ama-Angles Okuqondisa Ukulandelela kanye Nezicupho Ze-Acid

Imizila eqondiswa ngama-engeli angaphansi kuka-90° idala izikhwama zethusi ezivalekile lapho i-etchant ihlangana khona futhi iqhubeke nokuncibilikisa ithusi ngemva kokuba izindawo ezizungezile sezihlanzekile. Imfula encishisiwe noma enqanyuliwe ephumelayo ingadlula ukuhlolwa kukagesi kokushisa kwegumbi futhi yehluleke ngaphansi kokucindezeleka kokushisa. Isinqumo sokuklama: umzila ogobile ngama-45° njengokuzenzakalelayo; vumela imikhawulo ye-DRC ye-acute-angle. Ngemingcele yokuthulula ithusi eduze kwezindawo zokuxhumanisa imigqa, qinisekisa ukuthi azikho izikhwama ze-acute-angle ezakhiwe ku-geometry yokuthulula.

Iziqhingi Zethusi Neziqhingi Ezingazodwa

Izici zethusi ezincane nezihlukanisiwe — izingxenye ezincane zokuthulula, imivimbo emincane phakathi kwama-pads aseduze, izingcezu zethusi ezishiywe yimithetho yokususa — yizinqumo zokuklama ezidala izinkinga zokukhiqiza. Izici ezincane kune-0.10mm zingasuka ngesikhathi sokusika futhi zikhuphukele ethusini eliseduze, okubangela amafushane. Iziqhingi zethusi ezihlukanisiwe ezingaphezu kwe-1mm² ezingqimbeni zangaphakathi zidala umthwalo ongalingani we-etch oshintsha ububanzi be-trace futhi uthinte i-impedance elawulwayo.

Isinqumo sokuklama: ngemva kokukhiqiza ithusi elintantayo, sebenzisa i-DRC yethusi elintantayo. Nika, susa, noma ubhale phansi yonke ithusi elingenayo i-net. Setha umthetho wobubanzi besici sethusi obuncane obungu-0.10mm.

Amaconsi ezinyembezi eVia nasePad Connections

Lapho umkhondo uhlangana khona ne-via noma i-pad endaweni yokuhlangana kwe-T, ikona langaphakathi elibukhali liyindawo yokubamba i-asidi kanye nokugxila kokucindezeleka komshini ngesikhathi sokubhoboza. Amaconsi ezinyembezi — ama-fillet ethusi kancane kancane ekushintsheni — asusa izingozi zombili futhi aqinise indandatho ye-annular. Nika amandla ukufakwa kwe-teardrop okuzenzakalelayo emhlabeni jikelele kuthuluzi le-EDA ngaphambi kokukhiqiza amafayela okukhiphayo.

Ukususwa Kwe-High-Voltage (IPC-2221)

Imithetho ejwayelekile yokuhlukanisa umkhondo ilinganiswa amazinga esignali ane-voltage ephansi. Ngaphezu kuka-30V, izidingo zokususa ziyanda nge-voltage ngayinye ye-IPC-2221 — ubuhlobo obungaphoqelelwa yimithetho eminingi ye-DRC yengqimba yesignali. Imiklamo enezitimela zamandla ezingu-48V eceleni kwe-logic engu-3.3V ivame ukuba nokuhlukana okunganele phakathi kwamandla nezizinda zesignali ngoba umklami usebenzise imithetho yezinga lesignali kuyo yonke indawo.

• Kufika ku-30V yangaphandle engagqokwanga: okungenani u-0.10mm
• 31–50V yangaphandle engagqokwanga: 0.60mm; yangaphakathi: 0.10mm
• 51–100V yangaphandle: 1.00mm; ngaphakathi: 0.10mm
• 101–170V yangaphandle: 1.50mm; ngaphakathi: 0.20mm

Isinqumo sokuklama: chaza amakilasi ahlukene e-net amanethi ane-voltage ephezulu kuthuluzi le-EDA anemikhawulo yokususwa okufanele i-voltage.

Izinqumo Zokuklama Nge-Via kanye Nokubhoboza: Isilinganiso Sokubukeka, i-PTH/NPTH, kanye Nemigodi Yesikhala

I-Via Aspect Ratio: Isinqumo Sokuthembeka Esenziwa Ekuhlelweni

Isilinganiso se-aspect (ubukhulu bebhodi ÷ ububanzi bembobo eqediwe) sinquma ukuthi i-plateing chemistry ingasabalalisa ithusi ngokulinganayo ngaphakathi kwe-via barrel. Ngaphezu kwe-10:1, i-chemistry ayikwazi ukufinyelela ngokuthembekile enkabeni ye-barrel - umphumela uba ithusi elincane endaweni ephakathi ye-barrel, eliqhekeka ngemva kwemijikelezo yokushisa engu-50-200. I-via idlula ukuhlolwa kukagesi kokuqala futhi yehluleke ensimini.

• ≤8:1: Okujwayelekile — ukubekwa okuthembekile, iprimiyamu yamahhala
• 8–10:1: Okuthuthukisiwe — kudingeka i-pulse plating, ~15% yezindleko zeprimiyamu
• 10–12:1: Izindleko eziphezulu - izindleko ezinkulu kanye nesikhathi sokuhola; qinisekisa ikhono lomkhiqizi ngaphambi kokuzibophezela
• >12:1: Akunakwenzeka nge-drill-and-plate ejwayelekile; kudinga ama-vias angaboni abhobozwe nge-laser noma ukunciphisa ukujiya kwebhodi

Ukwephulwa okuvamile okungahlosiwe: umklami ukhulisa ukujiya kwebhodi kusuka ku-1.6mm kuya ku-2.4mm ukuze kube nokuqina komshini ngenkathi egcina ama-via esignali angu-0.25mm. Isilinganiso sobukhulu sisuka ku-6.4:1 kuya ku-9.6:1 — kusuka kokujwayelekile kuya kokuthuthukile — ngaphandle kokwazi ukuthi iphrofayili yokuthembeka yayo yonke imbobo ebhodini ishintshile.

Indandatho Ehlanganisiwe: Ukuklama Ngokubekezela Kwemibhobho Engqondweni

Indandatho ejikelezayo imunca iphutha lokuma kwebhobo. Ukubhoboza okujwayelekile kwe-CNC kunokumelana kokubhaliswa okungu-±0.075mm, okusebenzisa ngqo indandatho ejikelezayo: indandatho engu-0.10mm enokumelana okungu-±0.075mm inendandatho esele embi kakhulu engu-0.025mm ezingqimbeni zangaphakathi - ingozi yangempela yokuqhekeka ekukhiqizweni.

• Indandatho ejikelezayo yengqimba yangaphandle: 0.125mm ekhethwayo, 0.10mm okungenani ngokuphelele
• Indandatho ejikelezayo yengqimba yangaphakathi: Kukhethwa u-0.10mm, okungenani u-0.075mm
• Engeza amaconsi ezinyembezi nhlobo ngokuxhumeka ukuze uqinise ukuhlangana ngokumelene nokuqhekeka

I-PTH vs. NPTH: Ukuqonda Isinxephezelo Sokubhoboza

Amabhareli e-PTH athola ithusi elifakwe ngogesi elinciphisa ububanzi bembobo eqediwe ngo-0.05–0.10mm — i-PTH eqediwe engu-0.30mm idinga i-drill engu-0.35–0.40mm. I-NPTH ayitholi sinxephezelo: usayizi we-drill oqediwe wembobo ≈. Uma i-PTH ne-NPTH zixutshwa kufayela elilodwa le-drill ngaphandle kwezimpawu ezicacile zezimfanelo, umenzi kumele anqume uhlobo kusuka ku-geometry. Noma yikuphi ukuhlukaniswa okungalungile kukhiqiza osayizi bembobo abangalungile noma i-plating engahlosiwe.

Isinqumo sokuklama: dala njalo amafayela okubhoboza e-PTH kanye ne-NPTH ahlukene bese usho lokhu kumanothi okukhiqiza. Umugqa owodwa ususa lonke uhlobo lokungacaci.

Izimbobo Zesikhala: Incazelo Ephelele Kufayela Lokubhoboza

Izimbobo zezikhala zama-connector lead, izingxenye zokufaka emaphethelweni, kanye nezici zemishini kumele zichazwe njengezindlela ezihanjiswayo kufayela lokubhoboza (i-syntax ye-Excellon G85 noma isici se-ODB++ esihanjiswayo), hhayi njengezimo ezisesendlalelo sohlaka lwebhodi. Uma ungqimba lwemishini kuphela lubonisa imbobo futhi ifayela lokubhoboza liqukethe izimbobo eziyindilinga kuphela, umenzi kumele abuze umklami ngobukhulu, isimo se-PTH/NPTH, kanye nokubekezelelana ngaphambi kokwakha.

Isinqumo sokuklama: chaza zonke izikhala ngokucacile kufayela lokubhoboza bese ubhala phansi ngayinye emdwebweni wokwenziwa ngezixhumanisi zokuqala nezokugcina, ububanzi, ukubekezelelana kobukhulu, kanye nokuqokwa kwe-PTH/NPTH.

Ukubekwa Kwezingxenye Nomklamo Wezinyawo Zokuhlanganiswa Okuthembekile

Ukunemba Kwezinyathelo Kuyisinqumo se-DFM

Unyawo luchaza ukuthi inqubo yokuhlanganisa isebenza kanjani. Unyawo olungafanele — isikhala esingalungile sephedi, amaphedi amancane, igceke elingekho — kudala izinkinga zokuhlanganisa ezibuyela emuva ngokuphelele esinqumweni sokuklama. Bhekisela ku-IPC-7351 kuzo zonke izindlela ezijwayelekile zomhlaba wephakheji. Abaklami abakha izinyathelo kusukela ekuqaleni ngaphandle kwe-IPC-7351 bavame ukudala amaphedi amancane kakhulu (amalunga anganele), amakhulu kakhulu (ingozi yokushiswa ngamatshe ethuneni kuma-passive amancane), noma ahlukaniswe kabi (amabhuloho kuma-IC amancane).

I-QFN Thermal Pad: I-Footprint Eklanywe Kabi Kakhulu

• Indawo yethusi yephedi yokushisa: 70–80% yephedi eveziwe yephakheji. Ithusi eligcwele (100%) libamba igesi futhi lidale izikhala; ngaphansi kuka-60% akunikezi ukuxhumana okwanele kokushisa nokwemishini.
• Azikho izipikha zokukhululeka kokushisa: Ama-spokes andisa ukumelana nokushisa ngo-2–4×. Sebenzisa uxhumano lwethusi oluqinile.
• I-Vias ku-thermal pad: I-drill engu-0.30mm, engu-4–9 kugridi, chaza njengo ama-via axhunywe nge-resinVula i-vias wick solder ngesikhathi sokugeleza kabusha, unciphise i-thermal pad bese uphakamisa iphakheji — imodi yokwehluleka edlula konke ukuhlolwa kukagesi nokubukwayo kwasefekthri.
• Ukuvulwa kwe-stencil: Faka ifasitela kugridi engu-3×3 noma engu-4×4 enezikhala ezingu-0.15mm ukulawula ivolumu yokunamathisela nokuvimbela ukuphuma kwegazi ngaphansi kwedivayisi.

Ukususwa Kwezindawo Nokuqondiswa Kwezingxenye

• Umzimba we-SMD kuya kumzimba we-SMD: ubuncane obungu-0.15mm, okuthandwayo okungu-0.25mm
• Umzimba we-SMD onqenqemeni lwebhodi: ubuncane obungu-2.5mm — ukukhiqizwa kwesitimela sokuthutha
• Ingxenye ende (>3mm) kuya kwengxenye eqondile: okungenani engu-3.0mm ohlangothini lokugeleza kabusha — izingxenye ezinde zinomthunzi wokunamathisela phansi komfula kumaphedi eqondile
• Imbobo edlulayo eya e-SMD eseduze: okungenani u-2.5mm ukuze kususwe i-wave soldering ekhethiwe

Ama-oven okugeleza kabusha anendlela echazwe kahle. Ukuqondisa ama-passive e-0201 kanye ne-0402 agxilisiwe nge-axis yawo egxilisiwe ehambisana nendlela yokugeleza kabusha kunciphisa ukulahlekelwa kwesivuno setshe lesikhumbuzo. Lesi yisinqumo sokubekwa esingabizi lutho ukuze silungiswe.

Imithetho Yokuklama Isikrini Sesilikhi Ethinta Ikhwalithi Yokukhiqiza

Usayizi Wezinhlamvu Nokunyatheliswa Kwazo

Ukwephulwa kwezinhlamvu zesikrini sobucwebe kukhiqiza izimpawu ezingafundeki ezithinta ukulandelelwa, ukulebula kokuthobela imithetho, kanye nokuhlonza opharetha. Imithetho isuselwa emikhawulweni yokuphrinta ebonakalayo:

Uhlamvu oluyi-1.0mm ubude ludinga okungenani ububanzi bomugqa ongu-0.20mm. Ububanzi bomugqa ongu-0.10mm budinga okungenani ukuphakama okungu-0.50mm. Izinhlamvu ezinobubanzi bomugqa obungaphansi kuka-0.08mm azikwazi ukuphrinta — uyinki awukwazi ukuvala izikhala eziphakathi zokuphrinta — okukhiqiza imivimbo ephukile engabonakali ku-EDA kodwa ebikezelwayo ngokwejiyometri kuphela.

Isinqumo sokuklama: setha okuzenzakalelayo komhlaba wonke kwesendlalelo se-silkscreen se-EDA kube ukuphakama kwezinhlamvu okungenani okungu-1.0mm kanye nobubanzi bomugqa okungenani obungu-0.15mm. Nika amandla umkhawulo we-DRC wokuphrinta kwe-silkscreen ngaphambi kokukhiqiza umphumela.

Izinhlamvu kuma-SMD Pads

Amathuluzi e-EDA abeka abaklami bezinkomba endaweni ephakathi kwengxenye, okuthi kuma-passive angu-0402 no-0201 avame ukufaka imivimbo yezinhlamvu ezindaweni zamaphedi. Uyinki endaweni eshibilikayo uphazamisa ukumanzisa kwe-solder. Lena inkinga yokukhipha ifayela lomklamo — isinqumo sisebenzisa ukuhlolwa kwe-silkscreen-to-SMD-pad DRC njengesinyathelo esibalulekile sokukhipha futhi sithuthe zonke izingxabano ngaphambi kokukhiqiza ama-Gerber.

Isibuko Esisezansi Nokuqinisekiswa Kwefayela

Isikrini sesilika esisezansi kumele siboniswe kumphumela we-Gerber. Qinisekisa kusibukeli se-Gerber esizimele, hhayi umbono wendabuko we-EDA. Futhi qinisekisa ukuthi azikho izakhi zesikrini sesilika ezibekwe ngengozi ezingqimbeni zethusi — imikhondo yethusi enobubanzi obungu-zero kungqimba yesikrini sesilika ikhiqiza izici zethusi ezingabonakali ku-Gerber.

Izinqumo Zokuklama Imaski Yesolder Ezinquma Isivuno Somhlangano

Imithetho Yosayizi Wokuvula Imaski

Imbobo yemaski yokusoda ezungeze iphedi ngayinye inquma indawo yethusi engasetshenziswa ukusoda kanye nedamu lemaski elivimbela amabhuloho okusoda. Lezi izinqumo zokuklama indawo ezinemiphumela eqondile yokuhlanganiswa:

• Ukwandiswa kwemaski okujwayelekile: +0.05mm ngohlangothi ngalunye (isamba esingu-0.10mm phezu kwethusi lephedi)
• I-IC eqondile ku-pitch engu-0.40–0.50mm: Yehlisa ibe ngu-+0.025mm ohlangothini ngalunye ukuze ugcine idamu lemaski phakathi kwama-pad aseduze
• Idamu elincane lemaski phakathi kwama-pad aseduze: Umkhawulo othuthukisiwe ongu-0.10mm; 0.075mm. Ngaphansi kuka-0.075mm, i-sliver iyahlukana ngesikhathi sokugeleza kabusha futhi ibangele amabhuloho okusonta
• Ukuvulwa kwemaski kuncane kunephedi yethusi: Imaski ephezu kwemiphetho yephedi inciphisa indawo ethengiswayo futhi ibamba ukugeleza — ukuvuleka kwemaski kumele kulingane noma kudlule ithusi lephedi

Ama-SMD Pads ku-Copper Pour: Inkinga Yokuqinisekiswa Komphumela Womklamo

Uma ama-pads ezingxenye ze-SMD ehlala ezindaweni zokugcwalisa ithusi, amanye amathuluzi e-EDA akhiqiza izikhala zemaski ye-solder kuphela zama-pads achazwe ngokucacile njengezinto zomtapo wolwazi wohlobo lwe-SMD — hhayi ezethusi ezithathwe ngethusi. Lawo ma-pads athunyelwa embozwe yimaski ye-solder. Ukuhlanganiswa kudala amalunga omile adlula ukuhlolwa kokuqhubeka kokushisa kwegumbi futhi ahluleke ngaphansi kokujikeleza kokushisa.

Isinqumo sokuklama: ngemva kokwenziwa kwe-Gerber, vula ungqimba lwemaski ye-solder kusibukeli esizimele bese uqinisekisa ukuthi yonke i-SMD pad inesikhala — ikakhulukazi ukuhlola ama-pads aseduze noma ngaphakathi kwezindawo zokufaka.

Ukwelashwa Ngemaski

Ngaphandle kwemininingwane ecacile, umenzi wezinto usebenzisa isitolo sakhe esizenzakalelayo. Isinqumo sokuklama: umugqa owodwa kumanothi okukhiqiza uhlanganisa konke: “Izithonjana zesignali: ezifakwe amatende nhlangothi zombili. Izithonjana ze-thermal kuma-component pads: zixhunyiwe futhi zivaliwe ngokwe-IPC-4761 Type VII. Izithonjana zokuhlola: izinhlangothi zombili eziveziwe.”

Uhlaka Lwebhodi, Ukwakheka Kwamaphaneli, kanye ne-SET Array: Ukuklama Iphansi Lefektri

Uhlaka Lwebhodi: Umyalelo Ophelele Wokukhiqiza

Uhlaka lwebhodi i-Gerber luyifayela lokufaka lomshini — litshela i-router ukuthi isike kuphi. Ukuze ibe yimiyalelo ephelele yokukhiqiza, umklami kumele futhi ahlinzeke: incazelo eqediwe yomphetho (hhayi umugqa ophakathi wendlela yokuqondisa — imbobo engu-2mm eqondiswe nge-bit engu-2mm ine-offset engu-1mm), ukubekezelelana kobukhulu kusici ngasinye, iphuzu ledatha elichaziwe (umsuka we-X0/Y0 lapho kulinganiswa khona zonke izilinganiso), kanye nokuqokwa kwe-PTH/NPTH kwazo zonke izikhawu zangaphakathi.

Kumabhodi angunxande, lokhu kulula. Kumabhodi anezimbobo, ama-cutout angaphakathi, amakhona ane-radius, noma imiphetho engekho-orthogonal, umklami kumele anikeze umdwebo womshini eceleni kwe-Gerber yohlaka, echaza zonke izilinganiso ezibalulekile ngokubekezelelana, iphuzu le-datum, kanye nemininingwane yokusika. Ngaphandle kwalo, iphutha lobukhulu liyaqongelela kuzo zonke izici futhi ukwenziwa kudinga umbuzo womklami ngaphambi kokuqala.

Ukuhlelwa Kwamaphaneli kanye nama-SET Arrays: Yiklame Noma Ulahlekelwe Ukulawula

Uma amabhodi edinga ukuhlanganiswa kwephaneli ye-SMT, ukuchaza ukwakheka kwephaneli kungumthwalo wemfanelo wokuklama — akuyona into ezenzakalelayo kumenzi. Umenzi wenza ngcono ukusebenza kwawo kokukhiqiza. Umklami uyazi ukuthi ama-capacitor e-ceramic abekwe kuphi eduze kwamaphuzu okuphuka angaba khona, ukuthi yiziphi izingxenye ezifakwa emaphethelweni ezidinga ukucaciswa eziqondisweni ezithile zokuhlukanisa amaphaneli, nokuthi ubukhulu besitimela sokuhambisa umugqa womhlangano oqondiwe buyini.

Izingozi ezibalulekile zokushiya incazelo yephaneli kumenzi:

• Ama-capacitor e-ceramic abekwe ngaphakathi kwama-5mm ukusuka kuma-tab break points — ukucindezeleka kokususa ama-paneli kuyawaphula, imodi yokwehluleka ibonakala izinyanga kusukela ekusetshenzisweni kwensimu
• Izici zethusi zingaphakathi kwemigqa ye-V-score engu-0.50mm — i-V-score yenza buthaka i-substrate futhi icindezele ithusi lapho iqhuma
• Izimo zebhodi ezingajwayelekile azifakwanga (ezishintshana ngo-0°/180°) ukuze kuncishiswe imfucuza yephaneli
• Ubukhulu besitimela sephaneli abufani nobubanzi bomthumeli womugqa wokuhlanganisa

Isinqumo sokuklama: kunoma yiliphi ibhodi elidinga ukuhlanganiswa kwephaneli ye-SMT, faka ifayela lokwakheka kwephaneli noma umdwebo ochaza izikhundla zebhodi kanye nokuma, izikhundla ze-V-score noma ze-tab-routing nokuthi yimiphi imiphetho ethola ukwelashwa, ubukhulu besitimela (ubuncane obungu-5mm), imininingwane ye-fiducial (indilinga yethusi engu-1.0mm, ukuvulwa kwemaski engu-2.0mm, ubuncane obungu-5mm kunoma yimuphi umphetho, indawo ecacile engu-4mm), kanye nomsuka wereferensi yephaneli echaziwe.

Ukucaciswa kwe-Copper-to-Edge

• Unqenqema lwebhodi lethusi kuya komshini: okungenani u-0.20mm, kukhethwa u-0.30mm
• Umugqa we-Copper kuya ku-V-score: okungenani 0.50mm
• Ama-capacitor e-ceramic kuya endaweni yokuphuka kwamathebhu: okungenani u-5.0mm — chaza ukuhlukaniswa kwe-router lapho lokhu kungenakuhlangatshezwa khona

Ukulungiswa Kwefayela Lokukhiqiza: Ukuhumusha Inhloso Yokuklama Kube Yimiyalelo Yokukhiqiza

Iphakheji yeGerber njengencazelo yokukhiqiza

Iphakheji yefayela le-Gerber iyisethi ephelele yemiyalelo yokukhiqiza. Yonke impikiswano umenzi wezinto okufanele ayixazulule ngaphambi kokwakha yengeza isikhathi sokucubungula futhi iletha ingozi yesisombululo esingahambisani nenhloso yomklami. Ukulungiselela ifayela kuwumthwalo wemfanelo wokuklama, hhayi umsebenzi wokubhala.

Amanothi Okukhiqiza: Cacisa Okudingayo

• Material: Ibanga eligcwele kanye ne-Tg — “Isola 370HR, Tg min 180°C, ayinayo i-halogen,” hhayi “i-High-Tg FR4” (ayicaci kahle phakathi kwamazinga abaphakeli)
• Izisindo zethusi ngesendlalelo ngasinye: “I-1oz yangaphandle ngemva kokufakwa kweplati; izendlalelo zangaphakathi ze-½oz” — hhayi “ithusi elingu-1oz”
• Ukuqeda kobuso ngokubekezelelana: “I-ENIG nge-IPC-4552, i-Ni 3–5µm, i-Au 0.05–0.10µm.” Kwezixhumi ezisemaphethelweni: “Igolide eliqinile elifakwe ngogesi, i-Au 0.75–1.25µm phezu kwe-Ni 3–5µm” — igolide elithambile le-ENIG liyaguga ezindaweni ezingaphansi kwezixhumi eziyi-100.
• Ikilasi le-IPC: Isigaba 2 (esijwayelekile) noma Isigaba 3 (ukuthembeka okuphezulu) — sinquma ukumbozwa kwethusi okuncane ngemigqomo, izidingo zendandatho ye-annular, kanye nezindinganiso zokuhlola
• Ngokwelashwa ngohlobo: Uma kungacacisiwe, umenzi wezinto usebenzisa okuzenzakalelayo okukodwa kuzo zonke izinhlobo
• Isakhiwo sefayela le-Drill: “I-PTH ne-NPTH kumafayela ahlukene” — kususa ukungaqondakali kwefayela lokubhoboza okuvame kakhulu
• I-impedance elawulwayo: Zonke izakhi ezinhlanu — ungqimba, ububanzi bomkhondo, ithagethi, ukubekezelelana, amagama endiza yokubhekisela

Uhlu Lokuhlola Ngaphambi Kokuthumela

1. Ukuphrinta kwesikrini se-silkscreen DRC — izinhlamvu ezingaphansi kokuphakama okungu-1.0mm noma ububanzi bomugqa ongu-0.15mm zifakwe uphawu futhi zaxazululwa
2. I-DRC ye-Silkscreen-to-SMD-pad — konke ukugqagqana kuxazululwe ngaphambi kokukhipha
3. I-engeli ebukhali i-DRC — umkhawulo we-engeli ≥90° uvuliwe; amaconsi ezinyembezi kuzo zonke izinkundla zokuxhumanisa nge-via kanye ne-pad
4. Ithusi elintantayo i-DRC — konke ithusi elingenayo i-net elinikezwe, lisusiwe, noma lichazwe njengokuhlosiwe
5. Isikhala se-inthanethi i-DRC esinokuhlolwa kokugqagqana kwe-inthanethi efanayo kuvuliwe
6. Uhlaka lwebhodi luqinisekisiwe luvaliwe futhi luphelele — idatha ichazwe; izikhala zisefayilini lokubhoboza; konke ukusikwa okubhalwe ngokubekezelelana kanye ne-PTH/NPTH
7. I-PTH kanye ne-NPTH kumafayela okubhoboza ahlukene — kuchazwe kumanothi okukhiqiza
8. Isibukeli se-Gerber esizimele: ukuvuleka kwemaski ye-solder kuqinisekisiwe kuwo wonke ama-SMD pads kufaka phakathi izindawo zokugcwalisa
9. Ngokwelashwa ngemaski okuchazwe kumanothi okukhiqiza
10. Umdwebo wokwakheka kwamaphaneli ufakiwe lapho kudingeka khona ukuhlanganiswa kwamaphaneli e-SMT
11. Ukucaciswa kwe-Impedance kuqediwe — zonke izinto ezinhlanu zikhona
12. Amanothi okwenziwa aphelele — izinto zokwakha, izisindo zethusi ngesendlalelo ngasinye, ukuqeda ubuso, ikilasi le-IPC, ngokwelashwa, inothi lefayela lokubhoboza

Ukubuyekezwa kwe-DFM ye-Highleap kanye nokusekelwa kokukhiqiza

I-Highleap Electronics ifaka phakathi ukubuyekezwa kwe-DFM njengesinyathelo esijwayelekile kuwo wonke ama-oda:

• Ukuhlola okuzenzakalelayo: I-Trace/isikhala, indandatho ejikelezayo, ama-engeli abukhali, ukuphrinta kwesikrini sesilika, ububanzi bebhuloho lemaski, ukubhoboza kube yithusi — kubuyiselwa zingakapheli amahora angama-24 ngezilinganiso zokuxhumanisa nobunzima
• Isibuyekezo sobunjiniyela: Ukuqinisekiswa kwe-stack-up impedance ngokumelene nokulungiselela okutholakalayo, ukuphelela kwembobo yesikhala, idatha yohlaka lwebhodi kanye nokubuyekezwa kokubekezelelana, ukusebenziseka kokuhlelwa kwephaneli - kuhlola ukuthi amathuluzi azenzakalelayo awakwazi ukuphinda
• Umhlangano we-DFM: Isilinganiso sendawo yokuvuleka kwe-stencil, imininingwane yephedi yokushisa ye-QFN, ukucaciswa kwe-high-voltage, ukuqondiswa kwezingxenye — kubukezwa kanyekanye ne-DFM yebhodi elingenalutho lapho kuhlanganiswa
• Umbiko obhaliwe we-DFM: Okubalulekile / okukhulu / okuncane ngezincomo zokulungisa ezithile kanye nezixhumanisi ze-Gerber

Qala ngesilinganiso samahhala esibuyekezwe yi-DFM

Manufacturing data, review tools and release questions

The exported files need to define one consistent board and assembly revision. Layer data, drill information, placement data and drawing requirements should agree before production release.