Izindleko Zokukhiqiza ze-PCB zika-2026: Kungani I-BOM Yakho Yonke Ibiza Kakhulu Ngesikhathi Esisodwa

Ingxoxo mayelana nezindleko zokukhiqiza i-PCB ngo-2026 idlule kakhulu ithusi negolide. Lezo zinto ezimbili zokusetshenziswa kwakuyindaba eyinhloko kuze kube ngu-2025. Okwenzekayo njengamanje - ngo-Ephreli 2026 - kuyinto ehlukile ngokwekhwalithi futhi kunzima kakhulu ukuyiphatha: yonke into enkulu ku-bill yezinto ze-elekthronikhi iyanda ngasikhathi sinye, ngesivinini nobubanzi ochwepheshe bokuthenga abachaza njengento engafani nanoma yini kusukela ekuswelekeni kwama-chip ka-2021-2022. Kodwa lapho inkinga ka-2021 yayiwukuswela kwe-semiconductor ngokuyinhloko, inkinga ka-2026 iyinkinga ephelele ye-BOM - ama-substrate e-PCB, ama-laminate, izingxenye ezingasebenzi, inkumbulo, kanye nama-microcontroller konke kungaphansi kwengcindezi ngesikhathi esifanayo, kusukela ezinhlotsheni ezahlukene zesakhiwo ezingabelani ngesikhathi esifanayo sokuxazulula.

Thola Isilinganiso Sezindleko ze-PCB Zemakethe Yamanje →

Ngale Kwethusi Negolide: Kungani Unyaka Ka-2026 Uyinkinga Yezindleko Ehlukile

Umehluko ubalulekile. Izingcindezi zezindleko zokukhiqiza i-PCB zango-2025 — yize zinzima — zazigxile ezintweni ezimbili zokusetshenziswa ezibonakalayo ezinezimbangela ezibonakalayo. Ithusi landa ngoba ukutholakala kwezimayini kwakungahambisani nengqalasizinda ye-AI, i-EV, kanye nesidingo sokwandiswa kwegridi. Igolide landa ngenxa yendima yalo emibili njengempahla yezimboni kanye nempahla ephephile yezezimali. Zombili zazibuhlungu. Zombili, ngomqondo wesakhiwo, zazixilongwa.

Isimo sezindleko sika-2026 sinzima ukusixilonga futhi kunzima ukusilawula ngoba amaphuzu okucindezela aphindaphindekile. Kusukela ngo-Ephreli 2026, i-oda lokuhlangana kwe-PCB libhekene nokwenyuka kwezindleko kungqimba lwe-substrate (ithusi ne-CCL), ungqimba lwe-laminate (indwangu ye-fiberglass entulekayo ngempela), ungqimba lwememori (i-DRAM iphindwe kabili ngaphezu kwekota eyodwa), kanye nongqimba lwezingxenye ezisebenzayo (abahlinzeki abaningi abakhulu be-MCU abasebenzisa ukwenyuka kwamaphesenti amadijithi amabili ngesikhathi esisodwa, kuyilapho umhlinzeki oyedwa omkhulu ohlukile enokuhlinzekwa okuqandisiwe ngokuphelele). Lawa ma-vector ezindleko azimele ngokwawo - anezimbangela ezahlukene, izikhathi ezihlukene, kanye nezindlela ezahlukene zokuxazulula ezingaba khona. Lokho kuzimela yikho kanye okwenza lesi simo sibe nzima kangaka kumaqembu okuthenga asebenze izinqubo ezizungeze ukuphatha okuguquguqukayo okukodwa ngesikhathi.

"Izindleko ze-BOM eziphelele ze-PCBA yeseva ye-AI kulinganiselwa ukuthi zikhuphuke ngo-25-40% uma kuqhathaniswa nemiklamo efanayo ku-H2 2025. Amakhasimende ayakwamukela ukwanda ngoba ezinye izindlela zokunikezwa zilinganiselwe."

— Ukuhlaziywa kwemakethe yezingxenye ze-elekthronikhi, Q1 2026

Umshayeli oyisisekelo uyafana kuzo zonke lezi zingcindezi: ubukhulu kanye nesivinini sokwakhiwa kwengqalasizinda ye-AI kudlule amandla eketanga lokuhlinzeka nge-elekthronikhi ukuze liphendule. Izindleko ze-CSP capital eziphelele ngo-2026 zibikezelwa ukuthi zizodlula amaRandi ayizigidigidi ezingama-60 - ukwanda okungu-40% unyaka nonyaka. Idola ngalinye laleyo zindleko ze-capital lidinga ama-semiconductor, amabhodi wesekethe, ama-substrate, ama-laminate, kanye nezingxenye ezingasebenzi. Iketanga lokuhlinzeka alizange lakhelwe le phrofayili yesidingo, futhi alikwazi ukwakhiwa kabusha ngesivinini esikhula ngaso isidingo.

Ukuntuleka Kwe-Fiberglass Akekho Okhuluma Ngayo — Kodwa Kufanele Kube Yiyo

Ithusi liba yindaba esematheni. Indwangu ye-fiberglass ayikwenzi lokho — kodwa ngezindleko zokukhiqiza i-PCB ngo-2026, isimo se-fiberglass singase sibe yisithiyo esibaluleke kakhulu ngokwesakhiwo, ngoba sithinta amanani e-CCL ngochungechunge lokuphakelwa oluhlukile ngokuphelele kunethusi.

I-CCL ngayinye — i-substrate ye-laminate embozwe ngethusi lapho kwenziwa khona amabhodi wesekethe — idinga indwangu yefayibha yeglasi njengesisekelo sayo se-dielectric. Indwangu yefayibha yeglasi yebanga le-elekthronikhi, futhi ikakhulukazi izinhlobo ze-CTE ephansi (i-coefficient of thermal expansion) ezidingekayo ekusetshenzisweni kwe-PCB ephezulu, manje isekuswelekeni kwangempela kokunikezwa. Izindleko ze-CCL zibona ukwenyuka okufika ku-45% uma kuqhathaniswa nezikhathi zangaphambilini, okubangelwa inhlanganisela yezindleko eziphezulu zethusi kanye nokuntuleka okukhulu kwendwangu ye-fiberglass. Umkhawulo we-fiberglass awuxhomekile kuthusi — noma ngabe amanani ethusi angalungiswa kusasa, ukushoda kwe-fiberglass kuzoqhubeka nokuvimbela ukuhlinzekwa kwe-CCL futhi kugcine ingcindezi ephezulu ezindlekweni ze-PCB substrate.

Okwamanje kukhona ukushoda okukhulayo kwendwangu yefayibha yengilazi ephansi ye-CTE, okuyingxenye enganakwa kodwa ebalulekile yokukhiqizwa kwe-semiconductor yokuxhumana. Izinhlobo ze-CTE eziphansi zibaluleke kakhulu ezinhlelweni zokusebenza ze-PCB ezithuthukisiwe — amabhodi eseva ye-AI, ingqalasizinda yokuxhumana esheshayo, kanye ne-elekthronikhi yezimoto — lapho ukuzinza kobukhulu ngaphansi kokujikeleza kokushisa kuyimfuneko yokuklama, hhayi inketho. Abakhiqizi balezi zindwangu zefayibha yengilazi ezikhethekile babhekene nezikhathi ezinde zokuhola zokutshalwa kwezimali okusha kwamandla, futhi ukukhiqizwa kwefayibha yengilazi ekhethekile kunzima kakhulu kunokukhiqizwa kwefayibha yengilazi ejwayelekile.

Umphumela osebenzayo kumthengi we-PCB ngo-Ephreli 2026 ukuthi ukutholakala kwe-CCL — hhayi intengo ye-CCL kuphela — kuyisithiyo sokuthengwa. Abanye abenzi be-substrate ye-IC babika ukuthi amandla okukhiqiza alinganiselwe endwangu yefayibha yengilazi kanye ne-foil yethusi kuholele ekutheni izikhathi zokuhola ze-CCL zande ziye ezinyangeni eziyi-6, ngohlelo lwesilinganiso olubekiwe. Isikhathi sokuhola se-CCL sezinyanga eziyi-6 sisho ukuthi i-oda lokukhiqiza elibekwe namuhla lomkhiqizo odinga izinto ze-laminate ezithuthukisiwe lingase lingatholi i-substrate kuze kube ngu-Okthoba 2026 — isikhathi esiqeda amandla ukucabanga okuningi kokuhlela ukukhiqiza okujwayelekile.

Izikhathi Zokuhola ze-CCL Zifinyelele Ezinyangeni Eziyi-6: Lapho Intengo Iba Ukutholakala

Kukhona umehluko obalulekile phakathi kwemakethe lapho izindleko zokukhiqiza ze-PCB zikhuphuka khona kanye nemakethe lapho izinto ezidingekayo zokukhiqiza ze-PCB zingatholakali ngokuthembekile nganoma iyiphi intengo. Engxenyeni yokuqala ka-2026, imakethe ye-CCL isuke esimweni sokuqala yaya kwesesibili samabanga athile ezinto ezibonakalayo.

Izigaba ze-CCL eziphezulu ezithinteke kakhulu yi-laminate ephansi kakhulu yokulahlekelwa — i-M6, i-M7, i-M8, kanye namazinga asanda kufaneleka e-M9 kanye ne-M10 — adingekayo kumabhodi eseva ye-AI, ingqalasizinda ye-5G/6G, kanye nezinhlelo zokusebenza zezimoto ezithuthukisiwe. Isidingo salezi zinto sikhula ngokushesha kunomthamo womphakeli ngesizathu esiyinkimbinkimbi: akukhona nje kuphela ukuthi inani lokukhiqizwa kweseva ye-AI liyakhula, kodwa isizukulwane ngasinye esilandelayo sokwakhiwa kweseva ye-AI sidinga i-laminate ecacisiwe kakhulu. Ngamazinga okubonisa angu-224 Gbps, i-M7 ultra-low-loss CCL iyimpoqo ku-6–9× izindleko ze-FR-4 ejwayelekile. Ku-448 Gbps+ yesakhiwo se-Vera Rubin sesizukulwane esilandelayo, izinto ze-M9/M10 zizobiza u-15–20× FR-4. Isinyathelo ngasinye sokukhiqiza ipulatifomu sidala igagasi elisha lesidingo sesigaba sezinto ezingakafaneleki ngokugcwele noma ezikhushuliwe.

Kuma-FR-4 ajwayelekile nasezingeni lezimboni kanye ne-FR-4 ephezulu - izigaba ze-laminate ezihambisana neningi lemikhiqizo ye-PCB yezimboni, yezentengiselwano, kanye neyabathengi - isimo asisibi kangako kodwa sisaqinile kakhulu kunezinyanga eziyishumi nambili ezedlule. Isidingo esikhulu sama-PCB aphezulu aqhutshwa amaseva e-AI kanye nama-switch kwandisa ukungalingani kokuhlinzekwa kwezinto zokwakha ezisezingeni eliphezulu, kanti intengo ye-CCL ikhuphuka ngokushesha uchungechunge lokuhlinzekwa futhi ikhuthaza abakhiqizi be-PCB ukuthi balungise izingcaphuno. Ukuqina kokuhlinzekwa kwe-laminate ephezulu kudala ingcindezi yokwabiwa ethinta izinto ezisezingeni elijwayelekile njengoba abahlinzeki be-CCL bebeka phambili amakhasimende abo anenani eliphezulu kanye nemikhiqizo ephezulu kakhulu.

I-DRAM ikhuphuke ngo-105%, ama-MCU ku-Crisis-Era Lead Times: I-Active Component Layer

Uma indaba ye-PCB substrate kanye ne-laminate bekuyiyona kuphela ingcindezi yezindleko ngo-2026, bekuyoba inselele elawulekayo kumaqembu amaningi okuthenga — engakhululekile, kodwa exilongwayo futhi engaxazululwa ngokulungiswa kwesikhathi sokuhola kanye nokuthenga kwangaphambili. Okwenza u-2026 uhluke ngokwekhwalithi ukuthi ungqimba lwengxenye esebenzayo ye-BOM lungaphansi kwengcindezi ngesikhathi esisodwa, enzima evela ezinhlotsheni ezihlukene ngokuphelele.

I-DRAM: Imakethe Enezinkinga Zesakhiwo

Amanani e-DRAM akhuphuke ngo-90–95% ikota ngaphezu kwekota ku-Q1 2026. I-PC DRAM ithinteke kakhulu, ikhuphuke ngo-105–110% QoQ — okungaphezu kokuphindwe kabili kwikota eyodwa. I-High Bandwidth Memory (HBM) ithengiswe ngokuphelele kuze kube sekupheleni kuka-2026.

Imbangela iwukwakheka, hhayi ukujikeleza. Ukwakhiwa kwengqalasizinda ye-AI kuqondise kabusha amandla okukhiqiza abakhiqizi abakhulu bememori baye ku-HBM kanye ne-DDR5 enamandla aphezulu, okushiya ukuhlinzekwa okuvamile kwe-DRAM kanye ne-NAND kuvinjelwe emakethe ye-elekthronikhi ejwayelekile. Njengoba ukwakheka kwe-hyperscale kukhipha inani elikhulu le-DRAM kanye ne-NAND likhanya ezimakethe zendabuko, amanani akhuphuke futhi abenzi be-elekthronikhi abathengi baphoqeleke ekuncipheni kokunikezwa okungase kufinyelele ku-2026. Kumaqembu emikhiqizo ye-OEM aklama i-elekthronikhi yabathengi, imishini yezimboni, noma ihadiwe yokuxhumana yezentengiselwano ehlanganisa noma iyiphi i-DRAM, isimo sezindleko kanye nokutholakala sehle ngezinga elingakaze libonwe kusukela ekushodeni kuka-2021-2022.

Ama-MCU: Ukwenyuka Kwentengo Ngesikhathi Esifanayo Kubahlinzeki Abaningana

Isimo se-MCU senezela ubukhulu obuhlukile bobunzima: akusikho umcimbi owodwa womhlinzeki, kodwa ukwenyuka kwentengo okuhlanganisiwe kubahlinzeki abaningi abakhulu okuzoqala ukusebenza phakathi kwamasonto omunye nomunye. Ukwenyuka kwentengo ye-Texas Instruments ngo-15% kuya ku-85% kuyo yonke imigqa yomkhiqizo ethintekile kwaqala ukusebenza ngomhlaka-1 Ephreli 2026. Ama-Infineon MCU namadivayisi kagesi asesikhathini sokuhola samaviki angu-20-30 kanti ukwenyuka kwentengo kuhlelelwe usuku olufanayo. Ama-NXP Semiconductors asesikhathini sokuhola samaviki angu-12-20.

Isimo se-Nexperia sidinga ukunakwa okuhlukile. Ukunikezwa kwe-Nexperia kuye kwamiswa ngempumelelo ngenxa yezinyathelo zokulawula ukuthunyelwa kwamanye amazwe, kanti ukunikezwa kwe-wafer kumisiwe kusukela ngo-Okthoba 2025. Kumiklamo ethembele kuma-semiconductor e-Nexperia ahlukile, ama-transistors, noma ama-IC e-logic, kudingeka isibuyekezo esiphuthumayo sobunjiniyela kanye nesu lokuthola okunye. Akukho sikhathi esibekiwe sokuqalisa kabusha ukunikezwa. Kunoma iyiphi inhlangano ye-PCB esebenzisa izingxenye ze-Nexperia - futhi leso sigaba sibanzi, sihlanganisa ama-semiconductor amaningi ajwayelekile ahlukile - lokhu akuyona inkinga yezindleko. Kuyinkinga yokutholakala engenandlela yokuxazulula yamanje.

Izingxenye Ezingasebenzi: Igagasi Elizayo

Ukwenyuka kwentengo ye-MLCC (i-multilayer ceramic capacitor) akukabonakali ngezinga lenkumbulo kanye nokwenyuka kwe-MCU, kodwa izinkomba ezihamba phambili ziyakhathaza. Izinto zokwakha umhlaba ezingavamile — ikakhulukazi i-yttrium, isandulela esibalulekile se-ceramic MLCC dielectrics — zisalokhu zivinjelwe kakhulu ukunikezwa. Ukubusa kweShayina kokuhluzwa komhlaba ongavamile kudala ingozi yokuhlinzekwa kwesakhiwo kwezingxenye ze-ceramic okungenakuxazululwa ngqo ngokutshalwa kwezimali kwamandla okukhiqiza kuphela. Ubuhlakani bezimboni busikisela ukuthi izinqumo zamanani ze-MLCC ezivela kubakhiqizi abakhulu zizokwenziwa ngaphambi kokuphela kuka-2026, futhi isiqondiso salezo zinqumo cishe asizukuba sihle kubathengi.

Okushiwo Yinkinga Egcwele Ye-BOM Yezindleko Eziphelele Ze-PCBA ngo-2026

Umphumela ohlangene wokucindezela kwezindleko ngasikhathi sinye ezingqimbeni eziningi ze-BOM awuyona into eyengeziwe - uyaphindaphinda emthonjeni wawo kwisabelomali sephrojekthi. Umklamo owabizwa ngezindleko ku-Q3 2025 ungabhekana nesimo sezindleko esilandelayo uma wenziwe ku-Q2–Q3 2026:

Umphumela ophelele ku-oda le-PCBA elijwayelekile lezimboni noma lezentengiselwano — ibhodi lezingqimba ezingu-6-10 eline-FR-4 ejwayelekile, i-MCU, i-DRAM ethile, kanye nezingxenye ezijwayelekile ezingasebenzi — ukwanda kwezindleko ze-BOM okungu-30-60% uma kuqhathaniswa nentengo ye-H2 2025, kuye ngengxube ethile yezingxenye. Kumadizayini ane-DRAM kanye nemindeni ye-MCU ethintekile, ukuphela okuphezulu kwalolo hlu kungokoqobo. Kumadizayini agweme imindeni yezingxenye ethintekile ngezinqumo zokucacisa kwangaphambilini, umthelela uphansi kodwa usabalulekile.

Izinyathelo Ezinhlanu Zokuthenga Ezisebenza Ngempela Kule Nsizakalo

Impendulo ejwayelekile yokuthengwa kwempahla ekukhuphukeni kwezindleko zezinto ezibonakalayo - ukulinda amanani ukuthi azinze, ukuthola abanye abahlinzeki, ukuxoxisana ngezaphulelo zevolumu - ayisho kahle inkinga ephelele ye-BOM. Lapho wonke umugqa we-BOM ungaphansi kwengcindezi ngesikhathi esisodwa evela ezizathwini ezahlukene, isu lokuthengwa kwempahla kudingeka lishintshe ngesimo, hhayi nje ngamaqhinga.

Ingcindezi Iyancipha Nini? Umbono Oqotho Ka-2026–2027

Impendulo iyahlukahluka ngokunengqondo ngokwesigaba se-BOM, okuyisibonakaliso semvelo yezimbangela eziningi zendawo yamanje.

Ngokuphathelene nentengo yethusi kanye ne-CCL, amandla esakhiwo aqhuba izindleko - isidingo sengqalasizinda ye-AI, ugesi we-EV, ukunwetshwa kwegridi - ngeke kwehle kakhulu ngo-2026. Ukuntuleka kwemakethe yethusi kulindeleke ukuthi kwande ngo-2026 uma kuqhathaniswa no-2025. Amandla amasha okumba athatha iminyaka eyi-10-15 kusukela esinqumweni kuya ekukhiqizweni. Isimo esithembeke kakhulu sokunciphisa intengo yethusi sihilela inhlanganisela yokuncishiswa kwesidingo (okungenakwenzeka uma kubhekwa izibopho zokutshalwa kwezimali ze-AI zamanje) noma isixazululo sokuphazamiseka kokuhlinzekwa (okungabikezeleki ngokwemvelo). Ukuhlolwa okuqotho ukuthi ingcindezi yezindleko ze-CCL eqhutshwa yithusi izoqhubeka okungenani kuze kube sekupheleni kuka-2026 futhi cishe kuze kube ngu-2027.

Ku-DRAM, isikhathi sichazwe kakhudlwana. Izikhungo ezintsha ezingu-18 zokukhiqiza ama-semiconductor zihlelelwe emhlabeni wonke phakathi kuka-2025 no-2026, kodwa iningi lazo ngeke lifinyelele umthamo ophelele wokusebenza kuze kube ngu-2027 noma kamuva. Umthamo omusha wememori uzotholakala ku-inthanethi, kodwa hhayi ngaphambi kwe-H2 2026 ngokushesha - okusho ukuthi isimo samanje samanani e-DRAM cishe sizoqhubeka unyaka wonke. Ukulinganisela okuthile kusuka emazingeni aphezulu amanje kungenzeka ku-H2 2026 njengoba umthamo omusha uqala ukufaka isandla, kodwa ukubuyela emazingeni amanani ka-2024 ngaphambi kuka-2027 akunakwenzeka.

Ngokuphathelene nezikhathi zokuhola ze-MCU kanye namanani, imboni ibonise emijikelezweni yangaphambilini ukuthi ingangeza umthamo ngokushesha kunememori ethuthukisiwe. Inkinga ye-MCU ka-2021-2022 yaxazululeka cishe ezinyangeni eziyi-18-24 kusukela ekucindezelekeni okukhulu. Uma isimo samanje se-MCU silandela umugqa ofanayo, i-H2 2026 kanye ne-H1 2027 zizomelela isikhathi sokujwayelekile kancane kancane - ngesaziso sokuthi ukumiswa kokunikezwa kwe-Nexperia kwethula isici sokungaqiniseki esingekho ekushodeni okuvamile okuvinjelwe umthamo.

Ngendwangu ye-fiberglass — okuyiyona mingcele engaxoxwa kakhulu — ukwengezwa kwamandla kuhamba kancane ngenxa yohlobo olukhethekile lokukhiqizwa kwefayibha yengilazi ye-CTE ephansi. Lokhu kungenzeka ukuthi kuyimingcele enesikhathi eside kakhulu sokuxazulula, okwenza isimo sokutholakala kwe-CCL esiphezulu sibe yimingcele eyodwa eqhubekayo kakhulu kuchungechunge lokuhlinzekwa kwe-PCB substrate kuze kube ngu-2026 futhi mhlawumbe kube ngu-2027.

Umphumela wokuhlela okusebenzayo: izinqumo zokuklama ezenziwe manje zokuthunyelwa kwemikhiqizo ku-H1 2027 zisengathonywa ukukhethwa komndeni wezingxenye kanye nokukhetha kokucaciswa kwezinto. Imiklamo evalelwe emindenini yezingxenye ezinqunyelwe noma amamaki athuthukile e-laminate ngaphandle kwezinye izindlela izobhekana nesikhathi esiphelele salezi zithiyo. Imiklamo enokuguquguquka kobunjiniyela ukucacisa izingxenye ezihlukile noma amamaki ezinto inezinketho ezinengqondo zokuphatha izindleko kanye nengozi yokutholakala.

Xoxa Ngezindleko Zakho Zokukhiqiza Zango-2026 nge-Highleap Electronics →

Imithombo: I-Digitimes (Ukunyuka Kwentengo ye-CCL Kudlulela Ku-2026, Ephreli 15, 2026; Izikhathi Zokuhola ze-CCL Zifinyelele Izinyanga Eziyi-6 Ngesistimu Ye-Quota, Mashi 27, 2026); I-J2 Sourcing AB (Isibuyekezo Sokuntuleka Kwezingxenye Ze-elekthronikhi, Mashi 2026); Ukutholakala Komthombo (Ukunyuka Kwentengo ye-DRAM kanye Nesidingo Sethusi Se-AI, Januwari 2026); I-Minnitron Ltd (Izindleko Zezinto Ze-PCB Ezikhuphukayo ngo-2026, Ephreli 2026); I-TrendForce (Ukuhlaziywa Kokukhuphuka Kwentengo Yegolide Ne-CCL; I-CSP CapEx Forecast 2026); Iqembu Lokufunda Lethusi Lamazwe Ngamazwe (Umbono Wokunikezwa Kwezimayini Ka-2025–2026); I-IDC (Ukuhlaziywa Kwezinkinga Zokuntuleka Kwememori Yomhlaba Wonke, Februwari 2026); I-Prismark Partners (Ukuhlaziywa Kwezindleko Zezinto Ze-PCB, Q3 2025).