Ukukhiqizwa kwe-RO4835T PCB kwama-Thin RF Cores

Ukukhiqizwa kwe-PCB ye-RO4835T kuyazwela engxenyeni encane ye-stackup. Lapho ungqimba lwe-dielectric luba luncane, ukubhaliswa, incazelo yethusi kanye nobukhulu bokugcina obucindezelwe kuba okubaluleke kakhulu kumphumela we-RF. I-RO4835T iwusizo lapho ungqimba lwe-RF kufanele luhambe ngaphakathi kwe-stack yezingqimba eziningi ngaphandle kokusebenzisa ubukhulu be-core ye-microwave evamile. Ngakho-ke isinqumo sokuthenga sihlobene nokwakhiwa kwebhodi: amamojula omsakazo aminyene, amanethiwekhi okuphakelwa kwe-phased-array, ama-transceivers aqinile kanye namabhodi e-RF anezingqimba eziphakeme adinga ama-dielectric alawulwayo amancane, izinguquko ezimfushane eziqondile kanye nomzila ozinzile wezingqimba zangaphakathi.

I-Highleap Electronics ikhiqiza ama-prototype e-RO4835T kanye nezingqimba eziningi zokukhiqiza ngokubuyekezwa kwe-stackup ethile yobukhulu, ukulawula ingilazi esakazekayo, ukukhetha i-bondply, isinxephezelo sokubhalisa kanye nokuhlanganiswa okukhethwayo. I-Highleap Electronics igxile enkingeni yokwakha eyinhloko encane kunokuphinda incazelo ejwayelekile ye-RF laminate.

Izingqimba eziningi ze-RO4835 ezicijile zidinga ukunakwa okuqinile ekuqineni kwe-dielectric okuqediwe kanye nokubhaliswa kwezingqimba. Ngakho-ke ingxoxo yokukhiqiza igxile ebudlelwaneni phakathi kokwakhiwa kwe-dielectric encane, i-geometry yethusi, i-lamination kanye nokuqinisekiswa kwe-impedance.

Kungani Ama-RF Cores Amancane Ebalulekile Ekwakhiweni Kwe-PCB Ezinezingqimba Eziningi

I-dielectric encane yangaphakathi ingancipha ngobude, ibeke indiza yokubhekisela eduze komugqa olawulwayo futhi ivumele izendlalelo ze-RF ukuthi zihlale ndawonye ne-digital, amandla kanye ne-control circuitry ebhodini elifanayo. Kungaphinde kuthuthukise ubuningi be-routing kumamojula aqinile. Lezi zinzuzo zingokoqobo kuphela uma umklamo usebenzisa ubukhulu be-core ekhethiwe kusukela ekuqaleni; ukufaka esikhundleni se-core encane ekuhleleni kamuva kungashintsha i-impedance, i-coupling kanye ne-geometry yethusi.

Idatha kagesi eqondene nobukhulu

Idatha ye-RO4835T ishicilelwa ngobukhulu obujwayelekile be-core. Ukwakhiwa okungu-2.5, 3, 4 kanye no-5 mil akufanele kuphathwe njengento eyodwa engashintshaniswayo. Ikhodi eqondile ye-core kanye neyethusi kumele ifakwe ku-stackup, ngoba imodeli, ububanzi bomugqa kanye nomphumela we-lamination kuncike kulokho kwakhiwa. Ukuhamba phakathi kokwakhiwa kwe-thin-core kanye nezinye kufanele kubuyekezwe ngokumelene nokukhiqizwa kwebhodi le-RO4835 RF , ngezimfuneko ezihlukile zobukhulu kanye nokubopha.

Kungani ingilazi yokusakaza isiza kodwa ingasusi ukuhlukahluka kwenqubo

Ukwakhiwa kwengilazi esakazekayo kunganciphisa umehluko we-resin yendawo kanye nengilazi uma kuqhathaniswa nokuluka okuqinile. Lokho kusekela umzila we-RF omuhle, kodwa akuqedi ukuzwela ekujiyeni okuqediwe, iphrofayili yethusi noma ukunyakaza kobuciko. I-field solver kufanele isebenzise ukwakhiwa okuqondile, futhi isihloko sokuqala kufanele sihlobanise impendulo ebikezelwe ne-stack eyakhelwe ngaphakathi.

Ukuze uthole umongo obanzi womklamo, bheka isiqondiso se-Highleap se -high-frequency PCB stackup.

Ububanzi bezinto ezibonakalayo: igama lomkhiqizo weRogers lisetshenziselwa ukuhlonza i-laminate echazwe ekwakheni i-PCB. I-Highleap Electronics inikeza ukwenziwa nokuhlanganiswa kwe-PCB, kuyilapho i-laminate itholakala futhi iqinisekiswa ngokwehlukana.

Ukukhiqiza i-Thin RO4835T PCB Ngaphandle Kwezinkinga Zokubhalisa

Inselele enkulu yefektri ukugcina ungqimba lwe-RF oluncane luqondile futhi luzinzile ngokulinganisa izithombe, ukubopha kanye nokuvezwa okuphindaphindiwe kokushisa. Ukubuyiselwa kwengqimba yangaphakathi, isu lamathuluzi, ibhalansi yethusi kanye nokulandelana kokucindezela kufanele kubuyekezwe ngaphambi kokufakwa kwamaphaneli. Umklamo one-lamination elandelanayo, ama-blind vias noma ama-RF cores amaningi amancane udinga isabelomali sokubhalisa umjikelezo ngamunye, hhayi ukubekezelelana kohlaka olulodwa lokugcina.

Izinqumo ze-Etch nezethusi ezingqimbeni ezincane

Isikhala esincane se-dielectric sivame ukukhiqiza i-geometry encane yemigqa. Ngakho-ke ukujiya kokugcina kwethusi, ukuma kodonga oluseceleni kanye ne-plating kumele kufakwe kumodeli ye-impedance. Umdwebo kufanele usho ukuthi okubalulekile ububanzi bomugqa oqediwe, i-impedance noma igebe lokuxhuma elibalulekile. Lapho isihlungi noma i-coupler ihlala khona ungqimba olungaphakathi, ukuhlolwa okuqondile kuba nzima kakhulu ngemva kokubopha, ngakho-ke i-AOI yongqimba olungaphakathi kanye namarekhodi esihloko sokuqala kuba okubaluleke kakhulu. I-Highleap iphatha umongo omncane njengesici sokukhiqiza esichaziwe kunokusebenzisa iresiphi ejwayelekile yezingqimba eziningi. Isinxephezelo se-etch, ukubhaliswa kanye nobukhulu obuqediwe kubuyekezwa ngokumelene nobukhulu be-RF obubalulekile ngaphambi kokuba umsebenzi wobuciko ukhishwe. Amanani empahla eqondile kufanele ahlolwe ngokumelene nemibhalo yamanje yomhlinzeki webanga elichaziwe kanye nokwakhiwa.

Uma ibhodi isebenzisa imijikelezo yokucindezela engaphezu kweyodwa, i-Highleap ibuyekeza ukwakhiwa ngokumelene ne -hybrid lamination kanye nemikhawulo yokukhiqiza i-PCB enezingqimba eziningi esikhundleni sokuthatha umzila ojwayelekile we-HDI.

Lapho i-RO4835T Yengeza Inani Kumikhiqizo Ehlanganisiwe Ye-RF

I-RO4835T inamandla kakhulu emikhiqizweni lapho i-RF core encane ishintsha khona ukwakheka kwephakeji: amamojula e-phased-array, ama-compact radio, izihlungi ze-inner-layer, ama-antenna feed aqinile kanye namabhodi e-mixed-signal ane-RF routing evikelwe. Ingase ingeze ubunzima obungadingekile ebhodini le-antenna elilula elinezingqimba ezimbili noma umklamo ongasebenzisa ukujiya okujwayelekile kwe-RO4835 ngaphandle kokuthinta usayizi we-enclosure noma ngokusebenza.

Iziqu ze-athikili yokuqala

Isihloko sokuqala se-RO4835T esiwusizo kufanele sifakazele ukujiya okwakhiwe, ukubhaliswa kwesendlalelo sangaphakathi, i-geometry yomugqa obalulekile, ngekhwalithi kanye nempendulo kagesi. Uma ibhodi lifaka i-RF assembly, ukuhlangana kufanele kudlulele ekuqalisweni okuhlanganisiwe, isixhumi noma imodyuli. Lobu bufakazi buba yisisekelo sokulawulwa kokukhiqiza okuphindaphindiwe kanye noshintsho.

Ukubuyekezwa kwe-RO4835T Stackup, i-Prototype kanye nokusekelwa kokukhiqiza

Iphakheji yephrojekthi kufanele ifake ukujiya okuqondile kwe-core, ikhodi yethusi, izendlalelo zokubopha, ukujiya kwebhodi lokugcina, impedance elawulwayo noma i-geometry ye-RF, ngesakhiwo, ukulandelana kwe-lamination kanye nobuningi. Ukushintsha izinto noma izinguquko ku-bondply kufanele kuthunyelwe ukuze kuvunywe ngoba kungashintsha isikhala sokugcina se-dielectric kanye nokusatshalaliswa kwe-resin. Lapho ukwakhiwa okukhishwe kudinga lolu ngqimba lokubopha, izidingo ze-RO4460G2 bondply stackup zifanele ukubuyekezwa kobukhulu obuqediwe.

I-Highleap ingahlinzeka ngokwenziwa kwe-prototype, ukukhiqizwa kwevolumu ephansi kanye nokukhiqizwa okuphindaphindiwe, kulandelwe ukutholakala kwezingxenye kanye nokuhlanganiswa kwe-PCB lapho kudingeka khona. Isikhathi sokuhola siyaqinisekiswa ngemva kokuhlolwa kokwakhiwa kwe-thin-core kanye nesitoko sezinto ezibonakalayo. Kumamojula aminyene, uhlelo lokuhlanganisa kufanele lubuyekezwe kanye nebhodi ngoba ukuphuma kwe-BGA, ukuvikela i-RF, ukubekwa kwesixhumi kanye nokusekelwa kokugeleza kabusha kungathinta ukwakheka kwezingqimba eziningi.

Imibuzo emincane kakhulu

Ingabe i-RO4835T ingashintshwa esikhundleni se-RO4835 ejwayelekile ngaphandle kokuklanywa kabusha? Hhayi ngokuzenzakalelayo. Ubukhulu obuyinhloko kanye nedatha eshicilelwe kuqondene nokwakhiwa.

Ingabe umgogodla omncane kakhulu uhlala ungcono kakhulu? Cha. Inzuzo kagesi kanye nokupakisha kumele idlule ukubekezelelana okuqinile, ukuphathwa kanye nokubhaliswa. Ukuze uthole isilinganiso se-RF esinomgogodla omncane, faka i-stackup ephelele, ukujiya okuqondiwe, ithusi, ukubekezelelana kwe-impedance kanye nobuningi. Uma umklamo unesidingo sesigaba noma ubude obuqinile ngokungavamile, khomba lezo zici emdwebweni wokwenziwa.

Ingabe i-RO4835T ingasetshenziswa kuphela ezingqimbeni ezikhethiwe? Yebo, uma nje uhlelo lokubopha kanye ne-full stack zihambisana.