I-Solder Paste vs i-Solder Flux: Umehluko Obalulekile Ekuhlanganisweni kwe-PCB

Isingeniso

Ikhwalithi yokushisela inquma ukuthembeka kwayo yonke imikhiqizo kagesi. Kodwa-ke enye yezinto ezivame kakhulu ukudideka ekuhlanganisweni kwe-PCB ihilela izinto ezimbili eziyisisekelo: i-solder paste kanye ne-solder flux. Onjiniyela namaqembu okuthenga bavame ukubuza ukuthi kungani ezinye izinqubo zidinga i-solder paste kanti ezinye zifuna i-flux yodwa. Impendulo ayikho ekushintsheni, kodwa ekuqondeni ukuthi lezi zinto zikhonza izendlalelo ezahlukene zokusebenza kuhlu lwe-soldering.

Lesi sihloko sichaza umehluko phakathi kwe-solder paste kanye ne-solder flux, izindima zazo, kanye nendlela ezisebenzisana ngayo ekukhiqizweni kwe-PCB kobungcweti.

Kuyini i-Solder Paste?

Incazelo kanye Nomsebenzi Oyisisekelo

I-Solder paste iyinto ehlanganisiwe equkethe izinhlayiya ze-solder alloy ezincane ezilengiswe endaweni yokushintshashintsha. Isebenza njengento eyinhloko yokujoyina ubuchwepheshe be-surface mount (SMT) reflow soldering. I-Solder paste yenza imisebenzi emibili ebalulekile ngesikhathi esisodwa: ihlinzeka ngokugcwalisa kwensimbi okwakha isibopho sikagesi nesomshini, futhi iletha umsebenzi wamakhemikhali odingekayo ukuze kube nokumanzisa okufanele. Leli khono eliphindwe kabili lenza i-solder paste ibe yitshe lesisekelo lemigqa yokuhlangana ye-SMT yanamuhla.

Ukwakheka kwe-Solder Paste

Ingxenye ye-solder alloy ngokuvamile iqukethe amafomula asekelwe ku-tin njenge-Sn63Pb37 yezinhlelo zokusebenza ezifakwe i-lead noma i-SAC305 (Sn96.5Ag3Cu0.5) yezinqubo ezingenayo i-lead. Uhlelo lwe-flux ngaphakathi kwe-solder paste luqukethe ama-activators, ama-solvents, kanye nama-rheological agents alawula i-viscosity kanye nokuziphatha kwe-thixotropic. Le ngxenye ye-flux ehlanganisiwe yilokho okuvumela i-solder paste ukuthi ilungiselele ngamakhemikhali izindawo zensimbi ngesikhathi somjikelezo wokuphinda igeleze. Isilinganiso sensimbi ne-flux—ngokuvamile insimbi engu-85-90% ngesisindo—sithinta ngqo ukusebenza kokuphrinta kanye nokwakheka kwamalunga.

Indima ye-Solder Paste ku-SMT Assembly

Ekukhiqizweni kwe-SMT , i-solder paste ifakwa kuma-PCB pads ngokunyathelisa nge-stencil. Izingxenye zibe sezibekwa ngqo kuma-paste deposits, ahlinzeka ngokunamathela kwesikhashana ngesikhathi sokuphatha. Ngesikhathi sokugeleza kabusha, i-paste ishintsha ngezigaba ezihlukile zokushisa: ukushisa kuqala kuvula i-flux, ukucwilisa kuvumela ukulingana kokushisa, ukugeleza kabusha kuncibilikisa i-alloy ukuze kwakhiwe amalunga, futhi ukupholisa kuqinisa ukuxhumana. I-solder paste iyinto yokubopha yesakhiwo, hhayi nje usizo lokucubungula.

Kuyini i-Solder Flux?

Incazelo Nenhloso

I-Solder flux iyi-ejenti yamakhemikhali eyenzelwe ukuthuthukisa izimo zokusonta ngaphandle kokufaka isandla esakhiweni sokugcina sejoyinti. Ngokungafani ne-solder paste, i-flux ayinakho okuqukethwe kwe-solder yensimbi. Inhloso yayo kuphela ukudala indawo evumela ukubopha kwe-metallurgical ngokususa ukungcola okungaphezulu nokuvimbela i-oxidation ngesikhathi sokushisa. I-Flux yenza i-solder—kungakhathaliseki ukuthi ivela ku-paste, ucingo, noma ama-preform—igeleze futhi imanzise izinsimbi eziyisisekelo ngempumelelo.

Imisebenzi Yamakhemikhali ye-Solder Flux

I-Flux yenza imisebenzi emithathu eyinhloko yamakhemikhali ngesikhathi sokugoqa.

• Okokuqala, kunciphisa ngamakhemikhali ama-oxide ensimbi ezindaweni ezimboziwe kanye nezingxenye, okuveza insimbi ehlanzekile ukuze ihlangane.
• Okwesibili, yakha isithiyo esivikelayo esivimbela ukuphinda kufakwe i-oxidation njengoba amazinga okushisa enyuka eqonde endaweni yokuncibilika kwe-solder.
• Okwesithathu, i-flux inciphisa ukucindezeleka kobuso be-solder encibilikisiwe, okukhuthaza ukugeleza kwe-capillary kanye nokumanzisa okuphelele kwe-joint interface.

Lezi zindlela zibalulekile kungakhathaliseki ukuthi iyiphi indlela yokulethwa kwe-solder esetshenzisiwe.

Izinhlobo Ezivamile Ze-Solder Flux

I-flux esekelwe ku-rosin inikeza umsebenzi olinganiselayo futhi ishiya izinsalela ezingenobungozi, okwenza ifaneleke ezinhlelweni eziningi ze-elekthronikhi. I-flux encibilikayo emanzini isusa i-oxide enamandla kodwa idinga ukuhlanzwa kahle ngemva kokudayiswa ukuze kuvinjelwe ukugqwala. I-flux engahlanzekile yenzelwe ukushiya izinsalela ezincane, ezingaboli ezingasala ekuhlanganisweni, yize amazinga ezinsalela ehluka ngokwesakhiwo. Ukukhetha kuncike ezingeni lomsebenzi elidingekayo, imininingwane yokuhlanzeka, kanye nezidingo zokuthembeka ezingezansi.

Umehluko Obalulekile: I-Solder Paste vs i-Solder Flux

Iqhaza Lokusebenza

Umehluko oyisisekelo phakathi kwe-solder paste kanye ne-solder flux usekuhlelekeni kwayo okusebenzayo. I-solder paste iyinto ephelele yokunamathisela eyakha isakhiwo sejoyinti elingokoqobo. I-solder flux iyindlela evumela inqubo ukuthi ilungise ubuso ukuze buhlangane kodwa inganikeli lutho ekuxhumaneni okuqediwe. Enye yakha ijoyinti; enye ilungiselela izimo zokwakheka kwejoyinti okuphumelelayo.

Ifomu Lomzimba kanye Nendlela Yokufaka Isicelo

I-solder paste ikhona njengento ewugqinsi, enamathelayo esetshenziswa ngokuphrinta nge-stencil, ukusabalalisa, noma ukuphrinta nge-jet ezindaweni ezithile zephedi. I-Flux itholakala ngezindlela zoketshezi, ijeli, noma ukunamathisela futhi isetshenziswa ngokuxubha, ukufutha, ukucwilisa, noma ukusabalalisa ngokunemba. Ukunemba kokusetshenziswa okudingekayo ku-solder paste kuphakeme kakhulu njengoba ivolumu yokunamathisela inquma ngqo i-geometry yamalunga kanye nokuthambekela kokwakheka kwebhola le-solder.

Umnikelo Ekubunjweni Kwamalungu Ahlangene

Uma i-solder paste iphinda igeleze, izinhlayiya zensimbi ziyahlangana futhi zakhe ukuxhumana okuhlala njalo phakathi kwengxenye kanye ne-pad. Ukugeleza okungaphakathi kwe-paste kuyashintshashintsha noma kuthuthelwe emngceleni we-joint. Ukugeleza okuzimele, ngokuphambene nalokho, akushiyi mnikelo wesakhiwo—kuyahwamuka noma kuhlala njengensalela ngenkathi kuvumela i-solder enikezwe ngaphandle ukuthi yakhe isibopho. Lo mehluko ubalulekile lapho kubalwa amavolumu e-solder ukuze kuqinisekiswe ukuthembeka kwe-joint.

Amacala Okusetshenziswa Okujwayelekile

Ukuhlanganiswa kabusha kwe-SMT kudinga ukunamathiswa kwe-solder njengomthombo womsebenzi we-solder kanye ne-flux. Ukunamathisela ngesandla, ukunamathisela amagagasi ngokusebenzisa imbobo, kanye nemisebenzi yokulungisa kabusha ngokuvamile kusebenzisa i-wire solder ehlanganiswe ne-flux esetshenziswa ngokwehlukana. Ukuphinda kufakwe i-BGA kanye nokuphinda kusetshenziswe kabusha kwezingxenye kuvame ukudinga ukusetshenziswa kwe-flux eyengeziwe ngisho nalapho kukhona ama-preform noma ama-sphere e-solder. Izidingo zenqubo ziqondisa ukukhethwa kwezinto.

Ingabe i-Solder Paste ingathatha indawo ye-Solder Flux?

I-Solder paste ayikwazi ukufaka esikhundleni se-solder flux ezimele kuzo zonke izinhlelo zokusebenza. Nakuba i-paste iqukethe uhlelo lwe-flux oluhlanganisiwe, okuqukethwe kwayo kwe-flux kulungele izimo zokugeleza kwe-single-pass. Ngesikhathi sokuphinda kusetshenziswe, ukugeleza kwesibili, noma imisebenzi ehilela izindawo ezifakwe i-oxidized kakhulu, amandla okushintsha ngaphakathi kwe-paste avame ukunganele.

Ukugeleza kungenzeka ukuthi sekuvele kudliwe noma kwashintsha ngesikhathi sokucubungula kokuqala. Izitezi zokukhiqiza zivame ukufaka ukugeleza okwengeziwe kanye ne-solder paste ngesikhathi sokulungisa kabusha i-BGA , ukugoqa okuhlanganisiwe, kanye nemisebenzi yokulungisa lapho kudingeka khona umsebenzi wamakhemikhali othuthukisiwe ukuze kumanziswe ngendlela ethembekile.

Umbono Wezinga Lenqubo

Ukwakheka kwephrofayili yokugeleza kabusha kuthinta ngqo ukusebenza kokugeleza ngaphakathi kwe-solder paste. Isikhathi eside ngaphezu kwe-liquidus singaqeda umsebenzi wokugeleza ngaphambi kokuba kwenzeke ukumanzisa okuphelele. Imijikelezo eminingi yokushisa, njengokugeleza kabusha okunezinhlangothi ezimbili noma ukushisa kabusha, kunciphisa kancane kancane ukusebenza kahle kokugeleza okusele.

Amaphutha avamile afaka phakathi ukumanzisa okunganele, ukugoba kwe-solder, kanye nokuphuma kwe-voiding kuvame ukubuyela emuva emsebenzini onganele we-flux kunezinkinga zokwakheka kwe-alloy. Ukuqonda isabelomali sokushisa esisetshenziswa yi-flux kuvumela onjiniyela ukuthi bathuthukise amaphrofayili futhi banqume ukuthi ukusetshenziswa kwe-flux eyengeziwe kuyadingeka nini.

Ukungaqondani Okuvamile Ekuhlanganisweni Kwe-PCB

Kunemibono eminingana eyiphutha eqhubekayo mayelana ne-solder paste kanye ne-flux. Inkolelo yokuthi i-flux imane nje iyindlela encishisiwe ye-solder paste ayiqapheli ukwakheka kwayo okuhluke ngokuphelele. Uma sicabanga ukuthi ivolumu eyanele ye-solder isusa isidingo se-flux ayizinaki izidingo zamakhemikhali zokubopha kwe-metallurgical.

Umbono wokuthi i-flux engahlanzekile ishiya insalela engenalutho awunembile ngokobuchwepheshe—izindlela zokwakheka ezingahlanzekile zishiya insalela encane, engaboli kunokuba zingabikho. Ukuqaphela lokhu kuhlukanisa kusekela izinqumo zenqubo ezingcono.

Isiphetho

I-solder paste kanye ne-solder flux zithatha izikhundla ezihlukile kuhlu lwezinto zokunamathisela. I-solder paste inikeza isisekelo sesakhiwo salo lonke ijoyinti le-SMT ngokusebenzisa uhlelo lwayo oluhlanganisiwe lwe-alloy kanye ne-flux. I-solder flux isebenza njengesivuseleli samakhemikhali esilungisa izindawo zokubopha okuphumelelayo ngaphandle kokufaka isandla ebuningini bamajoyinti. Ukuhlanganiswa kwe-PCB okuphumelelayo kudinga ukuqonda ukuthi impahla ngayinye ifaneleka nini—nokuthi kokubili kudingekile nini. Isimiso sobunjiniyela siqondile: i-solder paste ichaza ijoyinti; i-solder flux ivumela ijoyinti.