Ukukhiqizwa kwe-Stacked Microvia PCB
I-Highleap ikhiqiza ama-PCB e-HDI anezakhiwo ze-microvia ezihlanganisiwe eShayina. Amandla ethu afaka phakathi ama-microvia abholwe nge-laser, ama-connect agcwele ithusi, ukwakheka okulandelanayo kanye nokwakhiwa kwe-PCB enezingqimba eziningi ezihlobene. Umbuzo wangempela wokufaneleka ukuthi ngabe i-chain ephelele ye-via—hhayi i-microvia eyodwa kuphela—ine-geometry, i-interface yethusi kanye nobufakazi obudingekayo kumkhiqizo wakho.
Sisebenzisana namaqembu okuklama nokuthenga e-OEM ekuphumeni kwe-BGA okune-fine-pitch, ukuxhumana kwe-HDI okuvinjelwe isikhala kanye nokudluliselwa kokukhiqiza. Silethele i-stack-up ehlongozwayo, noma ngabe ingakaqandisi: singaxoxa ngokuthi ukwakhiwa okuhlanganisiwe kuyadingeka yini, lapho ilungiselelo elihlanganisiwe lisebenza khona, nokuthi yikuphi ukuhlolwa kokuthembeka okufanele kuchazwe ekukhiqizweni.
Usuvele unayo imephu ye-layer stack kanye ne-microvia? Thumela idizayini yakho ye-HDI ukuze uthole ikhotheshini yobunjiniyela.
Isinqumo Sokuqala Ukuthi Ama-Vias Adinga Ukufakwa Ezinqolobaneni
I-microvia ehlanganisiwe iyisinqumo sokwakha esinemiphumela yokukhiqiza. Kufanele ixazulule umkhawulo womzila noma wobuningi bokuxhumana, kunokuba ivele njengesici esizenzakalelayo kuwo wonke amabhodi e-HDI.
Ama-microvia e-laser alandelanayo athatha indawo efanayo ye-XY kuzo zonke izendlalelo ze-dielectric ezakhelwe ngaphakathi. Izinga ngalinye elisha liwela ekuxhumekeni okungaphansi, ngokuvamile kudinga isakhiwo esilungisiwe, esigcwele ithusi futhi esinophahla esikwazi ukusekela i-microvia elandelayo. Lokhu kuhlelwa kungagcina iziteshi zokuhambisa ngaphansi kwamadivayisi acwebezelayo. Kuphinde kudale ukuxhumana okwengeziwe kwethusi-kuya-kwethusi okudinga ukunakwa ngesikhathi sokufaneleka kwenqubo.
Ingxoxo yobunjiniyela yeHighleap iqala ngokuxhumeka kwe-fan-out kanye ne-layer: i-component pitch, i-pad field, i-trace/space limits, i-reference planes, i-dielectric thickness, i-copper weights kanye ne-via locations ezivunyelwe. Uma ukushintsha ilungiselelo kushintsha izindlela zokubuyisa noma i-impedance, lokho kushintshana kungokwokubuyekezwa komklamo kagesi wekhasimende.
Bheka izinsiza zethu ezihlobene zokukhiqiza i-HDI PCB kanye nokuklama i-HDI stack-up ukuze uthole izinketho ezibanzi zokwakha. Leli khasi ligxile kakhulu ekwenzeni amaketanga e-microvia ahlanganisiwe akhiqizwe futhi asekelwe ngokufaneleka.
Ingxenye Enzima Yisixhumi Esifihliwe Sethusi
Ama-microvia ahlanganisiwe avame ukwethulwa njengendlela eqondile yokuxhumanisa izintambo eziqinile. Emikhiqizweni ehlala isikhathi eside nesebenza kahle, inkinga ebaluleke kakhulu ubuqotho besikhombimsebenzisi phakathi kokugcwaliswa kwethusi kweleveli eyodwa kanye nephedi noma isivalo esisekela esilandelayo. Ukuvalwa kwendawo, ukugcwaliswa okungaphelele, ukubopha okungekuhle kwensimbi, ukungcola noma ukushintshashintsha kokucubungula kungadala ubuthakathaka bokuxhumana obufihliwe.
Lokhu akuyona into ephikisanayo nenkolelo-mbono yazo zonke izinhlayiya ezincane ezihlanganisiwe. Kuyinkinga eyaziwayo yokufaneleka. Ngo-2019, i-IPC yaxwayisa esidlangalaleni ukuthi ukwehluleka okuthile kwezinhlayiya ezincane kutholakale kuphela ngemva kokwamukelwa kwebhodi elingenalutho—ngesikhathi sokugeleza kabusha, ukuhlolwa kokucindezeleka kokuhlanganiswa noma ukusetshenziswa kwensimu—futhi yaqokomisa ingozi yokuxhumana okubuthakathaka kwe-target-pad-to-copper-fill. Yaphinde yaxwayisa ngokuthi ukuhlolwa okuvamile kwe-microsection kukodwa kungase kungazitholi zonke iziphambeko ezifihliwe.
Lokhu kusho ukuthini nge-oda lokuthenga lokukhiqiza: chaza ukwamukelwa okusekelwe ekusebenzeni kanye nokuhlolwa okumelela ukwakhiwa lapho ingozi yomkhiqizo ikufanele khona. Isithombe esihle sesigaba esiphambene kanye nokuhlolwa kokuqhubeka kokushisa kwegumbi okudlulayo kuyizinto ezibalulekile zedatha, kodwa akukho noyedwa okufanele aphathwe njengobufakazi obuphelele bokuthembeka kwe-stacked-microvia yesikhathi eside.
Inkomba yemboni: Isexwayiso sokuthembeka kwe-microvia ye-IPC , ngoMashi 2019, kanye nephepha elimhlophe le-IPC-WP-023 elibhekiselwe kulo.
Isixhumi esibonakalayo se-Target-pad
Ukunamathela okubuthakathaka noma isikhombimsebenzisi sethusi esibucayi kungavuleka ngaphansi kokwandiswa kokushisa. Chaza indlela yokuhlola ezwela imodi yokuhluleka kwe-stacked-chain ehlosiwe.
Gcwalisa ikhwalithi
Ama-voids, imithungo, ama-dimpling amaningi noma ukugcwalisa ithusi okungaphelele kungathinta izinga elilandelayo elibhobozwe nge-laser. Qinisekisa ukwakhiwa kwe-copper-fill kanye ne-cap okuhlosiwe ngaphambi kokukhishwa kwe-CAM.
Ukubhaliswa kanye ne-geometry
Ubukhulu be-dielectric, i-laser taper, ubukhulu be-target-pad kanye ne-registration margin kuyasebenzisana. I-nominal via diameter iyodwa ayichazi iwindi lokukhiqiza.
Ngezinhlelo ezinokwethenjelwa okuphezulu, xoxa ngamakhuphoni e-via-chain, ukuvezwa kabusha kwe-reflow, ukuqapha ukumelana ngesikhathi sokucindezeleka kokushisa okufanele, izindlela zokuhlukanisa i-microsection kanye nezidingo zokwamukelwa kwekhasimende elithile. Sebenzisa ukubuyekezwa okusebenzayo kwe-IPC yakho yesivumelwano noma imininingwane ye-OEM. Isixwayiso se-IPC noma umphumela owodwa wokuhlola awenzi konke ukwakhiwa okuhlanganisiwe kungaphephile—noma konke ukwakhiwa okuvivinyiwe kufaneleke emhlabeni wonke.
Indlela i-Highleap Ehlola Ngayo I-Production Stack
Ukukhiqizwa kwe-PCB ye-microvia ehlanganisiwe kuyinqubo ephindaphindwayo yokwakha. Izindleko zayo kanye nobunzima bayo bobuchwepheshe buvela ekwenzeni izinga ngalinye lilungele ukusekela elilandelayo—hhayi nje ngokusebenzisa i-drill encane. Indlela eqondile yenqubo incike ohlelweni lwe-laminate kanye nendlela yefektri efanelekile; okulandelayo ukulandelana esikuvumelanisa namakhasimende ekubuyekezweni kobunjiniyela.
- Friza incazelo ye-core kanye ne-layer-pairBhala phansi umongo, yonke i-dielectric eyakhekayo, izisindo zethusi, ukujiya okuqediwe, ukuxhumana okugqitshwe kanye nezindawo zokubeka. Nikeza inombolo yesendlalelo esicacile ekuqaleni nasekuqondisweni kwe-microvia ngayinye.
- Laminate bese uveza ithusi elihlosiweYakha ungqimba olulandelayo lwe-dielectric; faka i-laser drill ku-target pad ngaphansi kwezimo zokubhalisa ezifanele kanye nokujula. Ukulungiswa kwe-target-pad kuthinta ikhwalithi elandelayo ye-interfacial.
- Faka insimbi, ugcwalise futhi ulungiselele indawo yokufikaCacisa ukugcwaliswa kwethusi okufakwe ngogesi kanye nesivalo lapho i-microvia elandelayo kufanele ifike khona ngqo ngaphezulu. Lawula ikhwalithi ye-plating, ukugoba, ukulingana kanye nokulungiswa komphezulu wethusi okulandelayo.
- Phinda kuphela amazinga ahlanganisiwe avunyiweUmjikelezo ngamunye wokwakha owengeziwe unezela ukuphathwa, ukuvezwa kwe-lamination kanye ne-interface yokulawula. Izinguquko ekuphakameni kwe-stack noma ukushintshela kuma-vias ahleliwe kufanele kuthathwe njengokubuyekezwa komklamo.
- Hlola iketanga, bese uhlela ukuhlangana kwaloBuyekeza izindlela zokukhiqiza ezikhishwe kanye nobufakazi bokufaneleka. Uma i-via-in-pad ingaphansi kwe-BGA, hlela indawo eqediwe bese uphinda uveze ukuvezwa kwayo nethimba le-PCBA.
Lokho esifuna ukukubona kuphakheji yokuklama
Ithebula elifanele le-via lihlanganisa i-L1–L2, i-L2–L3 kanye nanoma yimaphi amanye amazinga ngokwehlukana; uphawu lokubhoboza oluthi “okubekwe nge-stacked via” kuphela lushiya okuningi kuvulekile ekuchazeni. Khombisa ukuthi uchungechunge luwela yini ku-buryed via, i-through-hole pad noma esinye isici sethusi. Faka ubukhulu be-capture-pad, ubukhulu be-dielectric, ukuphakama kwe-stack, izidingo zokugcwalisa/i-cap kanye nesimo se-through-in-pad.
Izinsizakalo ezishicilelwe yiHighleap zifaka phakathi i-HDI ebholwe nge-laser, ama-vias angaboni/angcwatshwe, i-lamination elandelanayo kanye nezakhiwo ezihlanganisiwe ezigcwele ithusi. Siyaqinisekisa ukuthi iyiphi inhlanganisela engenzeka ngokuhlelwa kwengqimba yangempela yekhasimende, izinto kanye nomthamo; asishicileli iresiphi eyodwa yokukhiqiza ebanzi yayo yonke i-stack-up ehlanganisiwe.
Ukufaneleka Komhlinzeki We-Stacked-Microvia: Cela Ubufakazi, Hhayi Izichasiso
Inani eliphezulu lezendlalelo zomhlinzeki we-HDI alikutsheli ukuthi inqubo yalo egcwele ithusi iyafana yini nokwakhiwa kwakho. Kubaphathi bokuthenga kanye namaqembu ekhwalithi ye-OEM, ubufakazi obuwusizo buqondene ngqo nokuvezwa kwangempela kwe-via chain, i-laminate kanye nokuhlolwa.
| Umbuzo wokufaneleka | Ubufakazi bokuvumelana nomkhiqizi |
|---|---|
| Ingabe ukuphakama okuqondile kwesitaki kungakhiqizwa? | Umdwebo wokwakha ovunyiwe, ngemephu ye-layer-pair kanye nochungechunge lwe-lamination olubuyekeziwe |
| Ilawulwa kanjani i-interface yethusi? | Isakhiwo esicacisiwe sokugcwalisa ithusi/i-cap, ukulungiswa kwenhloso kanye nezindlela zokwamukelwa ezibanzi |
| Ingabe isampula emele iyasinda ekuvezweni kwenhlangano? | Izimo zokuhlolwa kokugeleza kabusha/ukushisa, amakhuphoni amele, ukuqapha ukumelana lapho kuchazwe khona, ukudlula/ukwehluleka kwemingcele |
| Ifektri izokuvimbela kanjani ukuzulazula kokubuyekezwa? | Ukufakwa kwezinto ezilawulwayo, uhlu lwezinto, idatha yokubhoboza, ukuvunyelwa kwe-ECO kanye nezidingo zerekhodi lokukhiqiza |
| Ingabe i-pilot lot yokuqala ingasekela ukukhishwa kwevolumu? | Imiphumela yesihloko sokuqala, imibiko yokuhlola okuvunyelwene ngayo, inqubo yokungalandeli imithetho kanye nezindlela zokushintsha ivolumu |
Sincoma ukukhiya umgomo wokwamukela esigabeni se-RFQ. Isampula encane iqinisekisa izimo kuleyo ndawo yesampula; ayinakushintshwa nokuhlolwa kokuthembeka okusekelwe ekusebenzeni. Ngokufanayo, ukuhlolwa kukagesi ekushiseni kwegumbi kungase kungabi nobuthakathaka obubonakala ngaphansi kokucindezeleka kokushisa. Inhlanganisela efanele incike engozini yokusetshenziswa kanye nencazelo yamakhasimende.
I-Highleap ingaxhumanisa ukwenziwa kwe-PCB okuthuthukisiwe nokuhlanganiswa kwe-PCB kanye nokuthola izingxenye lapho uhlelo olufanayo ludinga i-SMT, ukubekwa kwe-BGA, ukuhlolwa kanye nokuhlolwa kokusebenza. Ukuhlanganiswa kokwenziwa/ukuhlanganiswa kwasekuqaleni kubalulekile ikakhulukazi uma izakhiwo ezihlanganisiwe nge-pad zihleli ngaphakathi kwezinyathelo ze-BGA eziqondile.
Kusukela ku-HDI Stack-Up Ephakanyisiwe Kuya ku-Quote Enenjongo
Isilinganiso se-stacked-microvia kufanele sichaze ukuthi ibhodi lizokwakhiwa kanjani ngempela: inani lemijikelezo yokwakha, amazinga agcwele ithusi, ubudlelwano obufihliwe, uhlelo lwezinto ezibonakalayo, ukukhiqizwa kwephaneli, ukuhlolwa kanye nokufaneleka kokuthembeka. Amabhodi amabili anohlaka olufanayo kanye nenani lezingqimba angaba nezindlela zenqubo ezihlukene kakhulu kanye nengozi.
Sisebenzisana namaqembu obunjiniyela bamazwe ngamazwe kanye namaqembu okuthola ulwazi, okuhlanganisa nezinhlelo ze-OEM zaseYurophu nezakwa-Israyeli, adinga umlingani wokukhiqiza we-PCB waseShayina othembekile. Kula maqembu, ukuvunyelwa kwabaphakeli kuvame ukuhilela imibhalo yobunjiniyela, ukulandelelwa komkhiqizo, izinto zokwakha kanye nemibhalo ye-RoHS/REACH lapho kufanele khona, imigomo yobumfihlo, kanye nesivumelwano mayelana nobubanzi bokuthunyelwa nokuhlolwa. Leyo mininingwane kufanele ixazululwe kanye nekhotheshini yobuchwepheshe, hhayi ngemva kokuvunyelwa kwephrothokholi.
Thumela la maqembu amane olwazi
- Ukwakhiwa: Iphakheji ye-Gerber noma ye-ODB++, inqwaba egcwele, ama-callout e-dielectric/copper kanye nomdwebo wokwenziwa.
- Ngeketanga: amafayela okubhoboza, amapheya ezingqimba ze-microvia, ukuphakama kwe-stack, ama-capture pads, izidingo zokugcwalisa/zesivalo, ama-junction agqitshwe kanye nokuqeda kobuso.
- Ukwamukela: I-IPC/iklasi yamakhasimende ehlosiwe, izidingo zekhuphoni le-microsection noma le-via-chain, iphrofayili yokugeleza kabusha kwe-assembly kanye nanoma yiluphi uhlelo lokufaneleka.
- Ukuhweba: inani le-prototype/pilot/volume, isheduli edingekayo, indawo okuya kuyo, ezinye izindlela ezivunyiwe zezinto kanye nokuthi i-PCBA ifakiwe yini.
Uma ukuhlanganiswa kungokokuqala, bhala ilebula imikhawulo yakho kagesi, yemishini kanye neyokuthembeka engaxoxiswana ngayo. Impendulo yethu yobunjiniyela ingasiza ekuboneni ukuthi ukuhlelwa kokuqala okuhlanganisiwe kufanele kugcinwe noma kuhlelwe kabusha ngaphambi kokuthunyelwa kokugcina.
Ingabe umklamo we-stacked-microvia usulungele ukubuyekezwa?
Thumela ukwakheka kwakho kwezendlalelo zangempela futhi sizoxoxa ngokwakhiwa okukhiqizwayo kanye nobubanzi be-RFQ.
Kungani Kufanele Uthole Uhlelo Lwe-Stacked Microvia PCB?
I-Highleap Electronics ingumlingani wokukhiqiza we-PCB kanye ne-PCBA oseShayina, ene-HDI laser drilling echazwe esidlangalaleni, egcwele ithusi ehlanganiswe ngezinqubo, i-multilayer lamination kanye nezinketho zokuhlanganisa i-electronics ezihlanganisiwe. Sifanele amaqembu afuna ukuxoxa ngezinqumo zobuningi be-routing kanye nengozi yokukhiqiza nomhlinzeki wobunjiniyela—hhayi ukuthenga ibhodi elijwayelekile elichazwe kuphela ngenani lezingqimba.
Inhloso umklamo ongathuthuka kusukela ekuhlolweni kobunjiniyela kuya ekwakhiweni kokukhiqiza okuvunyiwe, okuphindekayo. Lokho kudinga ukuvumelana nge-geometry yangempela ehlanganisiwe, ukulandelana kwezinto ezifanele kanye nenqubo, kanye nobufakazi bokuthembeka obuhambisana nengozi yomkhiqizo. Yabelana nge-stack-up yakho bese ucela ingxoxo yokukhiqiza ne-Highleap.
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Ungasithola kanjani isilinganiso sama-PCB
Masikwenzele ukuhlaziya kwe-DFM/DFA futhi sibuyele kuwe ngombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunikeze isaphulelo:
-
- Gerber, ODB++, noma .pcb, spec.
- Uhlu lwe-BOM uma udinga ukuhlangana
- Ubuningi
- Isikhathi sokushintsha
Ngokungeziwe ekwenziweni kwe-PCB, sinikeza uhla olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA, nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho.
Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.