Umkhiqizi we-Taconic RF-30 PCB wamabhodi e-Antenna namabhodi e-Low-PIM
I-Highleap Electronics ikhiqiza ama-Taconic RF-30 PCB assemblies ama-antenna asesiteshini esiyisisekelo, amanethiwekhi e-RF angasebenzi, izihlungi, ama-combiners, amabhodi okuphakelayo kanye namamojula okuxhumana. Sisekela ama-prototypes, ukwakhiwa kwe-pilot kanye nokuphinda ukukhiqizwa nge-geometry ye-RF elawulwayo, ukuphathwa kwamaphaneli amakhulu, ukwenziwa ngocingo, ukuhlanganiswa kwezixhumi, ukulawulwa kwenqubo ye-PIM ephansi kanye nokuhlolwa okuchazwe ngamakhasimende.
I-RF-30 iyigama elidala, kuyilapho i-RF-30A iyizinto ze-antenna ze-AGC zamanje ezinevolumu ephezulu. I-Highleap iqinisekisa ukuthi yiliphi ibanga elilawulwa umdwebo, iqinisekisa ukujiya, ithusi, imithetho yesitifiketi kanye nokushintshana, bese ikhipha umzila wokukhiqiza ovikela izidingo ezikhona zokulungiswa kwe-antenna kanye ne-PIM.
Izici ze-RF-30 kanye ne-RF-30A yamanje yokwakhiwa kwe-Antenna
I-AGC RF-30A yamanje iyi-laminate ye-PTFE eqiniswe ngengilazi, egcwele i-ceramic ebekwe kuma-antenna anevolumu ephezulu kanye nezingxenye ze-RF ezingasebenzi. I-AGC ibala i-Dk 2.97 ± 0.05 kanye ne-Df 0.002, kanye ne-PIMD ethuthukisiwe, ikhwalithi ye-PTH kanye nokuzinza komshini. I-RF-30 yefa kusamele ikhishwe ngokumelene nedathashidi elilawulwa yikhasimende futhi ayikwazi ukuqanjwa kabusha i-RF-30A ngaphandle kwemvume.
| isici | Inzuzo yokukhiqizwa kwe-antenna | Ukulawula okuphezulu |
|---|---|---|
| Ukulahlekelwa okuphansi, cishe isigaba se-Dk-3 | Isekela amanethiwekhi okuphakelayo kwe-antenna kanye nezakhiwo ze-RF ezingasebenzi ezinobukhulu besekethe obusebenzayo. | Sebenzisa imodeli ye-Dk evunyiwe, i-dielectric eqediwe kanye ne-copper in geometry review. |
| Ukuqinisa okulukiwe ku-RF-30A | Isekela ukuzinza kwemishini kwamaphaneli amakhulu e-antenna kanye nokukhiqizwa kwevolumu. | Ukuqondiswa kwephaneli yokulawula, isikali sokuthwebula izithombe, ukubhaliswa kanye nokuba yisicaba. |
| Ukubekwa kwezinto eziqondiswe ku-PIM | Kuwusizo ezikhungweni zesisekelo kanye namanethiwekhi angasebenzi lapho kufanele kulawulwe khona izinkundla ezingezona eziqondile. | Chaza isikhombikubona se-PIM esiphelele, ukuqeda, izixhumi, ukuhlanza kanye nendlela yokuhlola. |
| Izinzuzo ze-PTH kanye nokuqina kwesikhumba | Isekela izakhiwo eziqinile zesisekelo kanye nezixhumi uma zicutshungulwa kahle. | Izimfuneko zokubhoboza ukukhishwa, ukulungiswa kwemigodi, ukufakwa kweplati kanye nokufakwa kwe-microsection. |
Bheka ikhasi lomkhiqizo elisemthethweni le-AGC RF-30A. I-Highleap iphinde ixhumanise ukukhiqizwa kwe-antenna nesiqondiso sokuklama i-antenna ye-PCB.
Amandla Okukhiqiza e-Taconic RF-30 PCB
I-Highleap ikhiqiza amabhodi e-RF-30 acacisiwe ngamakhasimende ama-antenna asesiteshini esiyisisekelo, izingxenye ze-RF ezingasebenzi, ama-splitter, ama-couplers, ama-filters, amanethiwekhi okuphakelayo, ama-repeater kanye nama-assemblies ezokuxhumana ahlobene. Amaphrojekthi angaba amasekethe e-microstrip anezingqimba ezimbili, amabhodi e-antenna afakwe imbobo ehlanganisiwe, amaphaneli efomethi ende noma ukwakhiwa kwe-RF/control okuhlanganisiwe, kuye ngokuthi i-DFM yasefektri iyatholakala yini kanye nokutholakala kwezinto.
Ukusekelwa kwe-Highleap kwe-Antenna kanye nemikhiqizo ye-Passive RF
| Indawo yephrojekthi | Ukusekelwa kwephrojekthi ye-Highleap |
|---|---|
| Amafomethi ebhodi | Amasekethe e-antenna ahlangothi olulodwa/oluphindwe kabili, amabhodi e-PTH, ama-array, amanethiwekhi okuphakelayo kanye nama-hybrid amaningi avunyiwe amakhasimende |
| Ukuphathwa kwephaneli | Amasekethe amakhulu noma amade anezinhlelo zokubhalisa, ukuthamba kanye nokuphatha ezihambisana nomkhiqizo |
| Kuyashuba | Kuminyene ngokusebenzisa uthango, izindawo zokuxhuma, izindawo zokufaka kanye nezindawo zokuxhumanisa zemishini |
| Izilawuli ze-PIM ephansi | Izinto zokwakha, ithusi, ukuqeda, ukuhlanzeka, i-torque/interface yesixhumi kanye nencazelo yokuhlola kubukezwe ndawonye |
| Assembly | Izixhumi ze-RF, izintambo, izihlangu, izingxenye ezingasebenzi kanye nehadiwe yemishini |
| Ukuqinisekiswa kwe- | Ukuhlolwa kukagesi, ukuhlolwa kobukhulu, ubufakazi bokuvinjelwa okuvunyelwene ngakho/ubufakazi be-PIM kanye nokuhlolwa kokusebenza okuchazwe ngamakhasimende |
Amandla Okukhiqiza e-Highleap Rigid RF PCB
Izibalo ezingezansi ziyimikhawulo yefektri ye-Highleap eqinile-PCB. Amaphaneli amakhulu e-antenna e-RF-30, amaphethini aqinile angaphansi komhlaba kanye nezidingo ze-PIM ephansi zingabeka iwindi lenqubo elincane eliqondene nephrojekthi ethile, eliqinisekiswa ngesikhathi se-DFM. Bheka ithebula eliphelele lamandla e-PCB eqinile ye-Highleap ukuze uthole imininingwane yefektri eshicilelwe.
| Into yokukhiqiza | Amandla e-Highleap ashicilelwe | Isimo sephrojekthi ye-RF/PTFE |
|---|---|---|
| Isibalo esiphezulu sesendlalelo | Kufika ku-60 izendlalelo | Inani lezingqimba ze-RF/PTFE ethile noma i-hybrid stackup liyaqinisekiswa ngemuva kokuncishiswa, ukubhaliswa, ukubuyekezwa kwezinto kanye nokwengezwa kwezinto. |
| Umkhondo/isikhala esincane esingaphakathi | 2/2 mil (0.05/0.05 mm) | I-geometry ye-RF ekhishwe incike nasekujiyeni kwethusi, uhlobo lwe-foil, isinxephezelo se-etch kanye nokubekezelelana kobukhulu obubalulekile. |
| Umkhondo/isikhala esincane esingaphandle | 2/2 mil (0.05/0.05 mm) | Izikhala ezincane ze-RF kanye nezakhiwo ezihlangene zidinga izindlela zokuhlola kanye nokwenzeka kwephrojekthi ethile. |
| Ibanga lokujiya kwebhodi | I-0.2-8.0 mm | Ubukhulu obutholakalayo bokwakhiwa kwe-Taconic/AGC okuqanjwe ngegama buxhomeke ku-laminate gauge, indlela yokubopha kanye ne-stackup evunyiwe. |
| Ukubekezelelana kobukhulu bebhodi | ± 0.1 mm ngaphansi kuka-1.0 mm; ± 10% ku-1.0 mm nangaphezulu | Ukuqaliswa kwesixhumi se-RF kanye nezixhumi ezivalekile kufanele kuveze noma yiziphi izidingo eziqinile ezingeni lomkhiqizo. |
| Usayizi webhodi oqediwe okungenani | 10 × 10 mm | Amasekethe amancane angadinga ukulethwa kuphaneli yokukhiqiza noma i-array ukuze kwenziwe futhi kuhlanganiswe. |
| Usayizi webhodi ophelele oqediwe | 22.5 × 47.5 in (571.5 × 1206.5 mm) | Amabhodi e-PTFE amakhulu adinga ukubuyekezwa okuhlukile kosayizi weshidi lezinto, ukubhaliswa, ukuba yisicaba, ukuhanjiswa kanye nokuthunyelwa. |
| Indandatho encane yomshini wokubhoboza / indandatho ejikelezayo | 0.15 mm / 0.127 mm | Umklamo wokugcina uncike ekujiyeni kwebhodi, isilinganiso sesici, isidingo sokufaka iplati kanye nenqubo yokubhoboza eqondene nezinto ezithile. |
| Indandatho encane ye-laser drill / indandatho ye-annular | 0.075 mm / 0.075 mm | Ama-microvia e-laser angaphansi kobukhulu be-dielectric, ukwakheka kwe-capture-pad, ukwakheka kwethusi kanye nokubuyekezwa kwe-sequentially-lamination. |
| Isilinganiso sesici sokubhoboza ngomshini | Kuze ku-20: 1 | Isilinganiso esingafinyeleleka sokwakhiwa kwe-RF/PTFE kumele siqinisekiswe ngosayizi wembobo oqediwe, ukujiya kwebhodi kanye nesidingo sokufaka iplati. |
| Isilinganiso sesici se-laser-drill | 1:1 | I-Microvia geometry ikhishwa kuphela ngemva kokubuyekezwa kwe-stackup nokuthembeka. |
| Ithusi elingaphakathi/elingaphandle eliphezulu | Kufika ku-10 oz | Ithusi elikhulu alikwazi ukuhlanganiswa ngokuzenzakalelayo nomkhondo/isikhala esihle kakhulu noma yonke into eyakhiwe nge-PTFE. |
| Ukubekezelelana kwe-PTH / NPTH | I-PTH ±0.075 mm; I-NPTH ±0.05 mm | Izimbobo zokuxhuma kanye ne-RF grounding kufanele zibone ububanzi obuqediwe kanye nanoma yisiphi isidingo sokulingana okuqinile. |
| Ukubekezelelana kwe-contour | ± 0.1 mm | Ukuqaliswa komphetho, imigodi, izikhala kanye nezindawo zokuxhuma kungadinga uhlelo olukhethekile lokulawula ubukhulu. |
| Ukubekezelelana kwe-impedance okulawulwayo | I-single-end kanye ne-differential: ±5 Ω ku-≤50 Ω; ±7% ngaphezu kwama-50 Ω | Ukubekezelelana okucashuniwe kusebenza endleleni evunyiwe yokuqoqa ama-stackup, isu lekhuphoni kanye nendlela yokulinganisa. |
| Ukuqedwa kwendawo okutholakalayo | I-ENIG, i-ENEPIG, i-OSP, i-HASL, isiliva lokucwilisa, ithini lokucwilisa, igolide elikhanyayo, iminwe yegolide eqinile negolide | Ukukhethwa kokuqeda kubuyekezwa ngokulahlekelwa yi-RF, ukushiswa kwe-solder, ukubopha ucingo, ukuxhumana kwesixhumi kanye nezidingo zemvelo. |
Isaziso sokuhlanganiswa kwamandla: amanani etafuleni ayimingcele yamandla efektri ngayinye. Inani lezingqimba, i-geometry engu-2/2 mil, ithusi elingu-10 oz, usayizi wephaneli ophezulu, isilinganiso sesici esingu-20:1 kanye nokwakhiwa kwebhodi elincane kakhulu akucatshangwa ukuthi kungafezeka ngasikhathi sinye. I-Highleap iqinisekisa inhlanganisela esebenzisekayo ngemuva kokubukeza izinto eziqondile, i-stackup, ithusi, i-drill, ukubekezelelana kwe-RF, ukuqeda kwendawo kanye nephakheji yokuhlanganisa.
Iphothifoliyo yamanje ye-AGC ibala i-RF-30A kune-RF-30 eyifa. Ngakho-ke i-Highleap iqinisekisa ukuthi umdwebo olawulwayo udinga i-RF-30 yokuqala, uvumela i-RF-30A, noma uvumela enye into efanelekile. Ikhasi elisemthethweni le-AGC RF-30A lichaza into yamanje ye-antenna enevolumu ephezulu, kuyilapho ithebula lomkhiqizo we-AGC RF/microwave libonisa umndeni womkhiqizo osebenzayo. Akukho shintsho olwenziwe ngaphandle kwemvume yamakhasimende.
Ngomongo wokukhiqiza, i-Highleap isebenzisa izilawuli zenqubo ezichazwe ekukhiqizweni kwe-RF PCB futhi ibuyisela ukukhishwa okubhaliwe kwe-stackup/material ngaphambi kokukhiqizwa.
Ukukhiqizwa kwe-Low-PIM Kuqala Nge-Interface Ephelele
I-RF-30 ibilokhu isetshenziswa kuzinhlelo zokusebenza ze-antenna kanye ne-RF ezingasebenzi lapho ukuguquguquka okungasebenzisi kungabaluleka khona. I-PIM ephansi ayidalwa ngokukhethwa kwe-laminate kuphela. I-foil yethusi, isimo somphezulu, izici ezifakwe ipulasitiki, ukuqeda, ukungcola, ukwakheka kwesixhumi, amalunga e-solder, ingcindezi yehadiwe kanye ne-interface yokugcina yokuhlola konke kungafaka isandla.
| Indawo yomthombo we-PIM | Ukulawulwa kokukhiqiza | Imfuneko ye-RFQ |
|---|---|---|
| Imiphetho yethusi neqoshiwe | I-foil evunyiwe, i-etch elawulwayo, ukuphathwa okuhlanzekile kanye nemiphetho ye-trace engekho eyonakele | Uhlobo/iphrofayili yethusi kanye ne-geometry yomqhubi obalulekile. |
| Ukuqedwa kwendawo | Isiphetho esifanayo, esihambisanayo nenqubo elawulwayo kanye nesitoreji | Ukuqeda okucacisiwe kanye nanoma yimuphi umlando wokufaneleka kwe-PIM. |
| Imigodi nezindawo ezimboziwe | Ithusi elihlala likhona, indawo ehlanzekile yomhlabathi futhi elawulwa ngesakhiwo | Izimbobo eziqediwe, imfuneko yethusi kanye ne-microsection. |
| Izixhumi kanye nehadiwe | Izingxenye ezivunyiwe, izindawo zokuhlangana ezihlanzekile, ukulawula i-solder/torque | Inombolo yengxenye yesixhumi, indlela yokufaka kanye ne-torque. |
| Izinsalela zomhlangano | Ukulawulwa kokushintshashintsha, ukuhlanza kanye nokuphatha | Inqubo yokuhlanzeka kanye ne-chemistry evunyelwe. |
| Ukuhlolwa kwe-PIM | Imvamisa echaziwe, amandla, i-fixture, i-oda kanye nomkhawulo wokwamukelwa | Indlela yokuhlola ephelele ngaphambi kwekhotheshini. |
I-Highleap ivumelanisa i-DFM kanye nokukhiqiza nezimiso zokuklama i-PCB ene-PIM ephansi kanye nokukhethwa kwezinto ezine-PIM ephansi . Isiqinisekiso se-PIM esingenalutho noma esihlanganisiwe sikhishwa kuphela ngendlela yokuhlola evunyelwene ngayo.
Amaphaneli Amakhulu E-Antenna, Ukubhaliswa, kanye Nokuthamba
Amabhodi okuphakelayo e-antenna angaba makhulu ngokomzimba, abe mancane, aphindaphindwayo noma abhekiselwe ngomshini ezindlini nasezindlini ze-radiator. I-Highleap ibuyekeza usayizi wephaneli, ibhalansi yethusi, isiqondiso sezinhlamvu, imigodi yamathuluzi, ama-fiducial, ukwesekwa komzila kanye nokupakishwa ngaphambi kokusebenzisa umzila.
- Ubukhulu be-radiator ebalulekile kanye ne-feed-network buhlukaniswe nokubekezelelana kohlaka okungasebenzi;
- isinxephezelo sephaneli sibangela ukunyakaza kwezinto kanye nokusatshalaliswa kwethusi;
- ukubhaliswa phakathi kobuciko be-RF, izindawo ezibholiwe kanye nedatha yemishini kuyachazwa;
- Izidingo zokuthamba nokusonta zihambisana ne-assembling kanye ne-enclosure interface;
- ukuqondisa, ukufaka amaphuzu angu-V noma ukuhambisa amathebhu kukhethwa ukulawula ikhwalithi yomkhawulo kanye nokuphathwa kwawo;
- ukwesekwa kokuthunyelwa kuvimbela ukugoba, ukuklwebheka kanye nomonakalo wesixhumi.
Ubukhulu bomugqa wokudlulisa buyabuyekezwa ngemodeli ye-RF yekhasimende kanye nokucatshangelwa komklamo ekwakhiweni kwe-antenna ye-PCB kanye nezakhiwo ze-antenna ye-RF . I-Highleap ikhiqiza ngokwejiyometri ekhishwe; ayiklami kabusha iphethini ye-antenna ngaphandle kwesicelo sokushintsha ubunjiniyela.
Ukulawula Izinto ze-RF-30, Ithusi, kanye Nokuqedwa Komphezulu
Ukukhishwa kwezinto ezibonakalayo kukhomba ibanga eliqondile, ukujiya kwe-dielectric, isisindo/uhlobo lwethusi, imibhalo yenqwaba kanye nezinye izindlela ezivunyelwe. Nge-RF-30 yefa, i-Highleap iqinisekisa ukuthi isitoko nezitifiketi ngaphambi kwentengo nosuku ziwukugcina. Uma kuphakanyiswa i-RF-30A noma enye into, umnikazi womklamo kumele avume imodeli entsha ye-Dk/yokulahlekelwa, ukujiya kanye nohlelo lokufaneleka.
Ukutholakala Kwezinto ze-RF-30 kanye Nokulawulwa Kokuguquka kwe-RF-30A
I-Highleap ingacaphuna ukuqhubeka kwe-RF-30 yokuqala, izinto ezinikezwe amakhasimende noma ushintsho lwe-RF-30A oluvunyiwe. Ushintsho luhlolwa ngemodeli ye-Dk, ukujiya, ithusi, ubukhulu be-antenna, i-PIM, ukuziphatha kwe-PTH, isitifiketi kanye nokulungiswa. Ukukhiqizwa akuqali kuze kube yilapho umzila ogunyaziwe ubhaliwe phansi.
Iphrofayili yethusi kanye nokuqeda kuthinta ukulahlekelwa komqhubi kanye ne-PIM. I-Highleap ibuyekeza izinketho isebenzisa isiqondiso se-copper foil esivame kakhulu kanye nokukhethwa kokuphela kobuso be-RF PCB . Umhambi wokukhiqiza urekhoda izinto ezivunyiwe kanye nokuqeda ukuze ama-oda aphindaphindwayo angakhiwa kabusha kusukela enkumbulweni.
| Irekhodi lokulawula | Injongo |
|---|---|
| Ubunikazi bezinto ezingenayo kanye nenqwaba | Iqinisekisa ibanga, ukujiya, ithusi kanye nesitifiketi kufana ne-oda elikhishwe. |
| Irekhodi lesinxephezelo se-CAM | Igcina umugqa obalulekile kanye nobukhulu begebe ngemva kokufakwa kwe-etch. |
| Umbiko wesigaba sokuqala olinganiselayo | Iqinisekisa i-RF ekhethiwe kanye nezici zemishini ngaphambi kokukhishwa okugcwele. |
| Imiphumela kagesi kanye ne-impedance | Iqinisekisa ukuqhubeka kanye nokulawulwa komugqa wokudlulisela okucacisiwe. |
| Indawo yokuhlanganisa kanye nokulandelela isixhumi | Ixhumanisa izingxenye, ukunamathisela kanye nehadiwe neyunithi eqediwe. |
| Ukungalandeli imithetho kanye nesenzo sokulungisa | Ihlinzeka ngokulawula, ukubuyekezwa kwesizathu kanye nokulungiswa okuvunyiwe. |
Ukuhlolwa Kokuhlanganiswa Kwe-PCB Ye-Antenna kanye Nokukhiqizwa
I-Highleap ingaletha amabhodi e-antenna e-RF-30 angenalutho noma izinhlangano eziphelele ezinezixhumi ze-RF, izintambo, izihlangu, amabakaki, ama-passive kanye nezingxenye zokulawula. Inqubo yokuhlanganisa ilandela izingozi ezichazwe ekuhlanganisweni kwe-PCB yezokuxhumana kanye nokulawulwa kwenqubo ye-RF PCBA.
- Ukuqinisekiswa kwe-BOM kanye nesixhumi ngokumelene nomdwebo okhishwe;
- ukulawula i-stencil/ukunamathisela kwama-ground pads, izihlangu kanye ne-mixed thermal mass;
- ukwesekwa kwe-fixture ukuvikela izifunda ze-antenna ezinkulu noma ezincane ngesikhathi sokugoqa;
- ukulungiswa kwesixhumi esilawulwayo kanye ne-torque lapho kuchazwe khona;
- I-AOI, ukuhlolwa okubonakalayo kanye ne-X-ray yamalunga afihliwe uma kudingeka;
- ukuqhubeka, umsebenzi we-DC, ukuhlolwa kwe-RF noma kwe-PIM ngokwendlela yamakhasimende;
- ukulandelelanisa idatha, ukuhlanganiswa kwedatha yokuhlola kanye nokupakishwa kokuthunyelwa kwamanye amazwe okuvikelayo.
Ngemva kokuthunyelwa, i-Highleap isekela ukubuyekezwa kwamarekhodi, ukulawulwa, ukuhlanganiswa kokuhlaziywa kokwehluleka kanye nesenzo sokulungisa. Ama-oda aphindaphindwayo alawulwa ukubuyekezwa okuvunyiwe, indlela yezinto ezibonakalayo kanye nokucaciswa kokuhlolwa.
Isikhathi Sokuhola kanye Nephakheji Yesilinganiso Se-RF-30
I-Highleap inikeza ukuhlela okujwayelekile noma okusheshayo ngemuva kokuqinisekiswa kokusebenza kwezinto kanye nosayizi wephaneli. Indlela ingasebenzisa ukwenziwa okubalulekile, ukukhishwa kwesihloko sokuqala noma ukuthunyelwa okuhlukanisiwe. Bheka ukukhiqizwa okusheshayo kwe-PCB okuvama kakhulu ukuze uthole indlela yokuhlela.
Ukuze uthole umzila ophelele we-PCB kanye ne-PCBA, i-Highleap ingahlanganisa ukubuyekezwa kwe-RF laminate nobunjiniyela bokuhlanganisa be-RF PCB kanye nesilinganiso sokukhiqiza esisemthethweni.
Ngemva kokuthola amafayela aphelele, i-Highleap iqinisekisa izinto zokwakha, ukusetshenziswa kwephaneli, amathuluzi akhethekile, ukutholakala kwesixhumi kanye nokulungela i-PIM/ukuhlola ngaphambi kokulungisa ikhotheshini kanye nesheduli yokuthunyelwa. Amaphaneli amakhulu e-antenna kanye nezinto ze-PIM zihlelwe njengezinyathelo ezibalulekile kunokuba kube yizibikezelo ezifihliwe.
Thumela i-Gerber/ODB++, umdwebo wokwenziwa olawulwayo, i-stackup, i-RF-30 eqondile noma imfuneko ehlukile evunyiwe, ithusi, ubukhulu be-RF obubalulekile, idatha yokubhoboza/yomzila, izidingo zephaneli/ukuthamba, ukuqeda, ubuningi, indawo yokulethwa, i-BOM, imidwebo yokuhlanganisa kanye nendlela yokuhlola ye-PIM/RF nge- Highleap Electronics . Ikhasi elibanzi lokukhiqiza izinto ze-Taconic lingasetshenziswa lapho ibanga lisahlolwa.
Ingabe iHighleap isengakwazi ukwenza iTaconic RF-30 PCB?
I-Highleap ingabuyekeza ukukhiqizwa kwe-RF-30 okudlule, kodwa ukutholakala kwezinto ezibonakalayo, izitifiketi kanye nemithetho yokushintshana kwamakhasimende kumele kuqinisekiswe ngaphambi kokuzibophezela okuqinile.
Ingabe i-RF-30A ingasetshenziswa esikhundleni se-RF-30?
Kuphela ngemvume ebhaliwe yomnikazi womklamo ngemva kokubuyekezwa komehluko kagesi, wemishini, wokucubungula kanye noweziqu.
Ingabe i-Highleap ingaqinisekisa i-PIM ephansi?
Isiqinisekiso singaxhunyaniswa kuphela nezinto ezichaziwe, ukuhlanganiswa, ukwakheka, imvamisa, amandla kanye nendlela yokwamukela. I-Highleap ingacaphuna leyo ndlela yokuhlola elawulwayo.
Ingabe i-Highleap ingakwazi ukuhlanganisa amabhodi amakhulu e-antenna?
Yebo, kuncike ekuphathweni kwephaneli, ukufakwa kwayo, ukuba yisicaba, isixhumi kanye nokubuyekezwa kokuhlolwa. Lezi zidingo kufanele zifakwe ku-RFQ.
Yiluphi ulwazi oludingekayo ukuze kutholakale isilinganiso se-RF-30 antenna PCB?
Nikeza imidwebo yephaneli neyemishini i-Gerber noma i-ODB++, imininingwane yezinto ezibonakalayo nezethusi, ubukhulu obubalulekile be-RF, izidingo ze-PIM noma ze-impedance, ulwazi lwesixhumi, ubuningi, amafayela omhlangano kanye nendawo yokulethwa.
Ingabe i-Highleap inikeza ukwesekwa kwangemva kokuthengisa kwama-oda aphindaphindwayo e-antenna?
Yebo. I-Highleap igcina amarekhodi okubuyekeza, okuhlanganisa kanye nenqubo, isekela ukubuyekezwa kokulawula kanye nesenzo sokulungisa, futhi ilawula izinto ezivunyiwe noma izinguquko zenqubo yokwakha okulandelayo.
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Ungasithola kanjani isilinganiso sama-PCB
Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:
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- Gerber, ODB++, noma .pcb, spec.
- Uhlu lwe-BOM uma udinga ukuhlangana
- Ubuningi
- Isikhathi sokushintsha
Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.
