Umkhiqizi we-Taconic RF-30 PCB wamabhodi e-Antenna namabhodi e-Low-PIM

Ukukhiqizwa kwe-Taconic RF-30 PCB

I-Highleap Electronics ikhiqiza ama-Taconic RF-30 PCB assemblies ama-antenna asesiteshini esiyisisekelo, amanethiwekhi e-RF angasebenzi, izihlungi, ama-combiners, amabhodi okuphakelayo kanye namamojula okuxhumana. Sisekela ama-prototypes, ukwakhiwa kwe-pilot kanye nokuphinda ukukhiqizwa nge-geometry ye-RF elawulwayo, ukuphathwa kwamaphaneli amakhulu, ukwenziwa ngocingo, ukuhlanganiswa kwezixhumi, ukulawulwa kwenqubo ye-PIM ephansi kanye nokuhlolwa okuchazwe ngamakhasimende.

I-RF-30 iyigama elidala, kuyilapho i-RF-30A iyizinto ze-antenna ze-AGC zamanje ezinevolumu ephezulu. I-Highleap iqinisekisa ukuthi yiliphi ibanga elilawulwa umdwebo, iqinisekisa ukujiya, ithusi, imithetho yesitifiketi kanye nokushintshana, bese ikhipha umzila wokukhiqiza ovikela izidingo ezikhona zokulungiswa kwe-antenna kanye ne-PIM.

Izici ze-RF-30 kanye ne-RF-30A yamanje yokwakhiwa kwe-Antenna

I-AGC RF-30A yamanje iyi-laminate ye-PTFE eqiniswe ngengilazi, egcwele i-ceramic ebekwe kuma-antenna anevolumu ephezulu kanye nezingxenye ze-RF ezingasebenzi. I-AGC ibala i-Dk 2.97 ± 0.05 kanye ne-Df 0.002, kanye ne-PIMD ethuthukisiwe, ikhwalithi ye-PTH kanye nokuzinza komshini. I-RF-30 yefa kusamele ikhishwe ngokumelene nedathashidi elilawulwa yikhasimende futhi ayikwazi ukuqanjwa kabusha i-RF-30A ngaphandle kwemvume.

isici Inzuzo yokukhiqizwa kwe-antenna Ukulawula okuphezulu
Ukulahlekelwa okuphansi, cishe isigaba se-Dk-3 Isekela amanethiwekhi okuphakelayo kwe-antenna kanye nezakhiwo ze-RF ezingasebenzi ezinobukhulu besekethe obusebenzayo. Sebenzisa imodeli ye-Dk evunyiwe, i-dielectric eqediwe kanye ne-copper in geometry review.
Ukuqinisa okulukiwe ku-RF-30A Isekela ukuzinza kwemishini kwamaphaneli amakhulu e-antenna kanye nokukhiqizwa kwevolumu. Ukuqondiswa kwephaneli yokulawula, isikali sokuthwebula izithombe, ukubhaliswa kanye nokuba yisicaba.
Ukubekwa kwezinto eziqondiswe ku-PIM Kuwusizo ezikhungweni zesisekelo kanye namanethiwekhi angasebenzi lapho kufanele kulawulwe khona izinkundla ezingezona eziqondile. Chaza isikhombikubona se-PIM esiphelele, ukuqeda, izixhumi, ukuhlanza kanye nendlela yokuhlola.
Izinzuzo ze-PTH kanye nokuqina kwesikhumba Isekela izakhiwo eziqinile zesisekelo kanye nezixhumi uma zicutshungulwa kahle. Izimfuneko zokubhoboza ukukhishwa, ukulungiswa kwemigodi, ukufakwa kweplati kanye nokufakwa kwe-microsection.

Bheka ikhasi lomkhiqizo elisemthethweni le-AGC RF-30A. I-Highleap iphinde ixhumanise ukukhiqizwa kwe-antenna nesiqondiso sokuklama i-antenna ye-PCB.

Amandla Okukhiqiza e-Taconic RF-30 PCB

I-Highleap ikhiqiza amabhodi e-RF-30 acacisiwe ngamakhasimende ama-antenna asesiteshini esiyisisekelo, izingxenye ze-RF ezingasebenzi, ama-splitter, ama-couplers, ama-filters, amanethiwekhi okuphakelayo, ama-repeater kanye nama-assemblies ezokuxhumana ahlobene. Amaphrojekthi angaba amasekethe e-microstrip anezingqimba ezimbili, amabhodi e-antenna afakwe imbobo ehlanganisiwe, amaphaneli efomethi ende noma ukwakhiwa kwe-RF/control okuhlanganisiwe, kuye ngokuthi i-DFM yasefektri iyatholakala yini kanye nokutholakala kwezinto.

Ukusekelwa kwe-Highleap kwe-Antenna kanye nemikhiqizo ye-Passive RF

Indawo yephrojekthi Ukusekelwa kwephrojekthi ye-Highleap
Amafomethi ebhodi Amasekethe e-antenna ahlangothi olulodwa/oluphindwe kabili, amabhodi e-PTH, ama-array, amanethiwekhi okuphakelayo kanye nama-hybrid amaningi avunyiwe amakhasimende
Ukuphathwa kwephaneli Amasekethe amakhulu noma amade anezinhlelo zokubhalisa, ukuthamba kanye nokuphatha ezihambisana nomkhiqizo
Kuyashuba Kuminyene ngokusebenzisa uthango, izindawo zokuxhuma, izindawo zokufaka kanye nezindawo zokuxhumanisa zemishini
Izilawuli ze-PIM ephansi Izinto zokwakha, ithusi, ukuqeda, ukuhlanzeka, i-torque/interface yesixhumi kanye nencazelo yokuhlola kubukezwe ndawonye
Assembly Izixhumi ze-RF, izintambo, izihlangu, izingxenye ezingasebenzi kanye nehadiwe yemishini
Ukuqinisekiswa kwe- Ukuhlolwa kukagesi, ukuhlolwa kobukhulu, ubufakazi bokuvinjelwa okuvunyelwene ngakho/ubufakazi be-PIM kanye nokuhlolwa kokusebenza okuchazwe ngamakhasimende

Amandla Okukhiqiza e-Highleap Rigid RF PCB

Izibalo ezingezansi ziyimikhawulo yefektri ye-Highleap eqinile-PCB. Amaphaneli amakhulu e-antenna e-RF-30, amaphethini aqinile angaphansi komhlaba kanye nezidingo ze-PIM ephansi zingabeka iwindi lenqubo elincane eliqondene nephrojekthi ethile, eliqinisekiswa ngesikhathi se-DFM. Bheka ithebula eliphelele lamandla e-PCB eqinile ye-Highleap ukuze uthole imininingwane yefektri eshicilelwe.

Into yokukhiqiza Amandla e-Highleap ashicilelwe Isimo sephrojekthi ye-RF/PTFE
Isibalo esiphezulu sesendlalelo Kufika ku-60 izendlalelo Inani lezingqimba ze-RF/PTFE ethile noma i-hybrid stackup liyaqinisekiswa ngemuva kokuncishiswa, ukubhaliswa, ukubuyekezwa kwezinto kanye nokwengezwa kwezinto.
Umkhondo/isikhala esincane esingaphakathi 2/2 mil (0.05/0.05 mm) I-geometry ye-RF ekhishwe incike nasekujiyeni kwethusi, uhlobo lwe-foil, isinxephezelo se-etch kanye nokubekezelelana kobukhulu obubalulekile.
Umkhondo/isikhala esincane esingaphandle 2/2 mil (0.05/0.05 mm) Izikhala ezincane ze-RF kanye nezakhiwo ezihlangene zidinga izindlela zokuhlola kanye nokwenzeka kwephrojekthi ethile.
Ibanga lokujiya kwebhodi I-0.2-8.0 mm Ubukhulu obutholakalayo bokwakhiwa kwe-Taconic/AGC okuqanjwe ngegama buxhomeke ku-laminate gauge, indlela yokubopha kanye ne-stackup evunyiwe.
Ukubekezelelana kobukhulu bebhodi ± 0.1 mm ngaphansi kuka-1.0 mm; ± 10% ku-1.0 mm nangaphezulu Ukuqaliswa kwesixhumi se-RF kanye nezixhumi ezivalekile kufanele kuveze noma yiziphi izidingo eziqinile ezingeni lomkhiqizo.
Usayizi webhodi oqediwe okungenani 10 × 10 mm Amasekethe amancane angadinga ukulethwa kuphaneli yokukhiqiza noma i-array ukuze kwenziwe futhi kuhlanganiswe.
Usayizi webhodi ophelele oqediwe 22.5 × 47.5 in (571.5 × 1206.5 mm) Amabhodi e-PTFE amakhulu adinga ukubuyekezwa okuhlukile kosayizi weshidi lezinto, ukubhaliswa, ukuba yisicaba, ukuhanjiswa kanye nokuthunyelwa.
Indandatho encane yomshini wokubhoboza / indandatho ejikelezayo 0.15 mm / 0.127 mm Umklamo wokugcina uncike ekujiyeni kwebhodi, isilinganiso sesici, isidingo sokufaka iplati kanye nenqubo yokubhoboza eqondene nezinto ezithile.
Indandatho encane ye-laser drill / indandatho ye-annular 0.075 mm / 0.075 mm Ama-microvia e-laser angaphansi kobukhulu be-dielectric, ukwakheka kwe-capture-pad, ukwakheka kwethusi kanye nokubuyekezwa kwe-sequentially-lamination.
Isilinganiso sesici sokubhoboza ngomshini Kuze ku-20: 1 Isilinganiso esingafinyeleleka sokwakhiwa kwe-RF/PTFE kumele siqinisekiswe ngosayizi wembobo oqediwe, ukujiya kwebhodi kanye nesidingo sokufaka iplati.
Isilinganiso sesici se-laser-drill 1:1 I-Microvia geometry ikhishwa kuphela ngemva kokubuyekezwa kwe-stackup nokuthembeka.
Ithusi elingaphakathi/elingaphandle eliphezulu Kufika ku-10 oz Ithusi elikhulu alikwazi ukuhlanganiswa ngokuzenzakalelayo nomkhondo/isikhala esihle kakhulu noma yonke into eyakhiwe nge-PTFE.
Ukubekezelelana kwe-PTH / NPTH I-PTH ±0.075 mm; I-NPTH ±0.05 mm Izimbobo zokuxhuma kanye ne-RF grounding kufanele zibone ububanzi obuqediwe kanye nanoma yisiphi isidingo sokulingana okuqinile.
Ukubekezelelana kwe-contour ± 0.1 mm Ukuqaliswa komphetho, imigodi, izikhala kanye nezindawo zokuxhuma kungadinga uhlelo olukhethekile lokulawula ubukhulu.
Ukubekezelelana kwe-impedance okulawulwayo I-single-end kanye ne-differential: ±5 Ω ku-≤50 Ω; ±7% ngaphezu kwama-50 Ω Ukubekezelelana okucashuniwe kusebenza endleleni evunyiwe yokuqoqa ama-stackup, isu lekhuphoni kanye nendlela yokulinganisa.
Ukuqedwa kwendawo okutholakalayo I-ENIG, i-ENEPIG, i-OSP, i-HASL, isiliva lokucwilisa, ithini lokucwilisa, igolide elikhanyayo, iminwe yegolide eqinile negolide Ukukhethwa kokuqeda kubuyekezwa ngokulahlekelwa yi-RF, ukushiswa kwe-solder, ukubopha ucingo, ukuxhumana kwesixhumi kanye nezidingo zemvelo.

Isaziso sokuhlanganiswa kwamandla: amanani etafuleni ayimingcele yamandla efektri ngayinye. Inani lezingqimba, i-geometry engu-2/2 mil, ithusi elingu-10 oz, usayizi wephaneli ophezulu, isilinganiso sesici esingu-20:1 kanye nokwakhiwa kwebhodi elincane kakhulu akucatshangwa ukuthi kungafezeka ngasikhathi sinye. I-Highleap iqinisekisa inhlanganisela esebenzisekayo ngemuva kokubukeza izinto eziqondile, i-stackup, ithusi, i-drill, ukubekezelelana kwe-RF, ukuqeda kwendawo kanye nephakheji yokuhlanganisa.

Iphothifoliyo yamanje ye-AGC ibala i-RF-30A kune-RF-30 eyifa. Ngakho-ke i-Highleap iqinisekisa ukuthi umdwebo olawulwayo udinga i-RF-30 yokuqala, uvumela i-RF-30A, noma uvumela enye into efanelekile. Ikhasi elisemthethweni le-AGC RF-30A lichaza into yamanje ye-antenna enevolumu ephezulu, kuyilapho ithebula lomkhiqizo we-AGC RF/microwave libonisa umndeni womkhiqizo osebenzayo. Akukho shintsho olwenziwe ngaphandle kwemvume yamakhasimende.

Ngomongo wokukhiqiza, i-Highleap isebenzisa izilawuli zenqubo ezichazwe ekukhiqizweni kwe-RF PCB futhi ibuyisela ukukhishwa okubhaliwe kwe-stackup/material ngaphambi kokukhiqizwa.

Ukukhiqizwa kwe-Low-PIM Kuqala Nge-Interface Ephelele

I-RF-30 ibilokhu isetshenziswa kuzinhlelo zokusebenza ze-antenna kanye ne-RF ezingasebenzi lapho ukuguquguquka okungasebenzisi kungabaluleka khona. I-PIM ephansi ayidalwa ngokukhethwa kwe-laminate kuphela. I-foil yethusi, isimo somphezulu, izici ezifakwe ipulasitiki, ukuqeda, ukungcola, ukwakheka kwesixhumi, amalunga e-solder, ingcindezi yehadiwe kanye ne-interface yokugcina yokuhlola konke kungafaka isandla.

Indawo yomthombo we-PIM Ukulawulwa kokukhiqiza Imfuneko ye-RFQ
Imiphetho yethusi neqoshiwe I-foil evunyiwe, i-etch elawulwayo, ukuphathwa okuhlanzekile kanye nemiphetho ye-trace engekho eyonakele Uhlobo/iphrofayili yethusi kanye ne-geometry yomqhubi obalulekile.
Ukuqedwa kwendawo Isiphetho esifanayo, esihambisanayo nenqubo elawulwayo kanye nesitoreji Ukuqeda okucacisiwe kanye nanoma yimuphi umlando wokufaneleka kwe-PIM.
Imigodi nezindawo ezimboziwe Ithusi elihlala likhona, indawo ehlanzekile yomhlabathi futhi elawulwa ngesakhiwo Izimbobo eziqediwe, imfuneko yethusi kanye ne-microsection.
Izixhumi kanye nehadiwe Izingxenye ezivunyiwe, izindawo zokuhlangana ezihlanzekile, ukulawula i-solder/torque Inombolo yengxenye yesixhumi, indlela yokufaka kanye ne-torque.
Izinsalela zomhlangano Ukulawulwa kokushintshashintsha, ukuhlanza kanye nokuphatha Inqubo yokuhlanzeka kanye ne-chemistry evunyelwe.
Ukuhlolwa kwe-PIM Imvamisa echaziwe, amandla, i-fixture, i-oda kanye nomkhawulo wokwamukelwa Indlela yokuhlola ephelele ngaphambi kwekhotheshini.

I-Highleap ivumelanisa i-DFM kanye nokukhiqiza nezimiso zokuklama i-PCB ene-PIM ephansi kanye nokukhethwa kwezinto ezine-PIM ephansi . Isiqinisekiso se-PIM esingenalutho noma esihlanganisiwe sikhishwa kuphela ngendlela yokuhlola evunyelwene ngayo.

Amaphaneli Amakhulu E-Antenna, Ukubhaliswa, kanye Nokuthamba

Amabhodi okuphakelayo e-antenna angaba makhulu ngokomzimba, abe mancane, aphindaphindwayo noma abhekiselwe ngomshini ezindlini nasezindlini ze-radiator. I-Highleap ibuyekeza usayizi wephaneli, ibhalansi yethusi, isiqondiso sezinhlamvu, imigodi yamathuluzi, ama-fiducial, ukwesekwa komzila kanye nokupakishwa ngaphambi kokusebenzisa umzila.

  • Ubukhulu be-radiator ebalulekile kanye ne-feed-network buhlukaniswe nokubekezelelana kohlaka okungasebenzi;
  • isinxephezelo sephaneli sibangela ukunyakaza kwezinto kanye nokusatshalaliswa kwethusi;
  • ukubhaliswa phakathi kobuciko be-RF, izindawo ezibholiwe kanye nedatha yemishini kuyachazwa;
  • Izidingo zokuthamba nokusonta zihambisana ne-assembling kanye ne-enclosure interface;
  • ukuqondisa, ukufaka amaphuzu angu-V noma ukuhambisa amathebhu kukhethwa ukulawula ikhwalithi yomkhawulo kanye nokuphathwa kwawo;
  • ukwesekwa kokuthunyelwa kuvimbela ukugoba, ukuklwebheka kanye nomonakalo wesixhumi.

Ubukhulu bomugqa wokudlulisa buyabuyekezwa ngemodeli ye-RF yekhasimende kanye nokucatshangelwa komklamo ekwakhiweni kwe-antenna ye-PCB kanye nezakhiwo ze-antenna ye-RF . I-Highleap ikhiqiza ngokwejiyometri ekhishwe; ayiklami kabusha iphethini ye-antenna ngaphandle kwesicelo sokushintsha ubunjiniyela.

Ukulawula Izinto ze-RF-30, Ithusi, kanye Nokuqedwa Komphezulu

Ukukhishwa kwezinto ezibonakalayo kukhomba ibanga eliqondile, ukujiya kwe-dielectric, isisindo/uhlobo lwethusi, imibhalo yenqwaba kanye nezinye izindlela ezivunyelwe. Nge-RF-30 yefa, i-Highleap iqinisekisa ukuthi isitoko nezitifiketi ngaphambi kwentengo nosuku ziwukugcina. Uma kuphakanyiswa i-RF-30A noma enye into, umnikazi womklamo kumele avume imodeli entsha ye-Dk/yokulahlekelwa, ukujiya kanye nohlelo lokufaneleka.

Ukutholakala Kwezinto ze-RF-30 kanye Nokulawulwa Kokuguquka kwe-RF-30A

I-Highleap ingacaphuna ukuqhubeka kwe-RF-30 yokuqala, izinto ezinikezwe amakhasimende noma ushintsho lwe-RF-30A oluvunyiwe. Ushintsho luhlolwa ngemodeli ye-Dk, ukujiya, ithusi, ubukhulu be-antenna, i-PIM, ukuziphatha kwe-PTH, isitifiketi kanye nokulungiswa. Ukukhiqizwa akuqali kuze kube yilapho umzila ogunyaziwe ubhaliwe phansi.

Iphrofayili yethusi kanye nokuqeda kuthinta ukulahlekelwa komqhubi kanye ne-PIM. I-Highleap ibuyekeza izinketho isebenzisa isiqondiso se-copper foil esivame kakhulu kanye nokukhethwa kokuphela kobuso be-RF PCB . Umhambi wokukhiqiza urekhoda izinto ezivunyiwe kanye nokuqeda ukuze ama-oda aphindaphindwayo angakhiwa kabusha kusukela enkumbulweni.

Irekhodi lokulawula Injongo
Ubunikazi bezinto ezingenayo kanye nenqwaba Iqinisekisa ibanga, ukujiya, ithusi kanye nesitifiketi kufana ne-oda elikhishwe.
Irekhodi lesinxephezelo se-CAM Igcina umugqa obalulekile kanye nobukhulu begebe ngemva kokufakwa kwe-etch.
Umbiko wesigaba sokuqala olinganiselayo Iqinisekisa i-RF ekhethiwe kanye nezici zemishini ngaphambi kokukhishwa okugcwele.
Imiphumela kagesi kanye ne-impedance Iqinisekisa ukuqhubeka kanye nokulawulwa komugqa wokudlulisela okucacisiwe.
Indawo yokuhlanganisa kanye nokulandelela isixhumi Ixhumanisa izingxenye, ukunamathisela kanye nehadiwe neyunithi eqediwe.
Ukungalandeli imithetho kanye nesenzo sokulungisa Ihlinzeka ngokulawula, ukubuyekezwa kwesizathu kanye nokulungiswa okuvunyiwe.
I-PCB ye-antenna ye-Taconic RF-30 ephansi ye-PIM

Ukuhlolwa Kokuhlanganiswa Kwe-PCB Ye-Antenna kanye Nokukhiqizwa

I-Highleap ingaletha amabhodi e-antenna e-RF-30 angenalutho noma izinhlangano eziphelele ezinezixhumi ze-RF, izintambo, izihlangu, amabakaki, ama-passive kanye nezingxenye zokulawula. Inqubo yokuhlanganisa ilandela izingozi ezichazwe ekuhlanganisweni kwe-PCB yezokuxhumana kanye nokulawulwa kwenqubo ye-RF PCBA.

  • Ukuqinisekiswa kwe-BOM kanye nesixhumi ngokumelene nomdwebo okhishwe;
  • ukulawula i-stencil/ukunamathisela kwama-ground pads, izihlangu kanye ne-mixed thermal mass;
  • ukwesekwa kwe-fixture ukuvikela izifunda ze-antenna ezinkulu noma ezincane ngesikhathi sokugoqa;
  • ukulungiswa kwesixhumi esilawulwayo kanye ne-torque lapho kuchazwe khona;
  • I-AOI, ukuhlolwa okubonakalayo kanye ne-X-ray yamalunga afihliwe uma kudingeka;
  • ukuqhubeka, umsebenzi we-DC, ukuhlolwa kwe-RF noma kwe-PIM ngokwendlela yamakhasimende;
  • ukulandelelanisa idatha, ukuhlanganiswa kwedatha yokuhlola kanye nokupakishwa kokuthunyelwa kwamanye amazwe okuvikelayo.

Ngemva kokuthunyelwa, i-Highleap isekela ukubuyekezwa kwamarekhodi, ukulawulwa, ukuhlanganiswa kokuhlaziywa kokwehluleka kanye nesenzo sokulungisa. Ama-oda aphindaphindwayo alawulwa ukubuyekezwa okuvunyiwe, indlela yezinto ezibonakalayo kanye nokucaciswa kokuhlolwa.

Isikhathi Sokuhola kanye Nephakheji Yesilinganiso Se-RF-30

I-Highleap inikeza ukuhlela okujwayelekile noma okusheshayo ngemuva kokuqinisekiswa kokusebenza kwezinto kanye nosayizi wephaneli. Indlela ingasebenzisa ukwenziwa okubalulekile, ukukhishwa kwesihloko sokuqala noma ukuthunyelwa okuhlukanisiwe. Bheka ukukhiqizwa okusheshayo kwe-PCB okuvama kakhulu ukuze uthole indlela yokuhlela.

Ukuze uthole umzila ophelele we-PCB kanye ne-PCBA, i-Highleap ingahlanganisa ukubuyekezwa kwe-RF laminate nobunjiniyela bokuhlanganisa be-RF PCB kanye nesilinganiso sokukhiqiza esisemthethweni.

Ngemva kokuthola amafayela aphelele, i-Highleap iqinisekisa izinto zokwakha, ukusetshenziswa kwephaneli, amathuluzi akhethekile, ukutholakala kwesixhumi kanye nokulungela i-PIM/ukuhlola ngaphambi kokulungisa ikhotheshini kanye nesheduli yokuthunyelwa. Amaphaneli amakhulu e-antenna kanye nezinto ze-PIM zihlelwe njengezinyathelo ezibalulekile kunokuba kube yizibikezelo ezifihliwe.

Thumela i-Gerber/ODB++, umdwebo wokwenziwa olawulwayo, i-stackup, i-RF-30 eqondile noma imfuneko ehlukile evunyiwe, ithusi, ubukhulu be-RF obubalulekile, idatha yokubhoboza/yomzila, izidingo zephaneli/ukuthamba, ukuqeda, ubuningi, indawo yokulethwa, i-BOM, imidwebo yokuhlanganisa kanye nendlela yokuhlola ye-PIM/RF nge- Highleap Electronics . Ikhasi elibanzi lokukhiqiza izinto ze-Taconic lingasetshenziswa lapho ibanga lisahlolwa.

Ingabe iHighleap isengakwazi ukwenza iTaconic RF-30 PCB?

I-Highleap ingabuyekeza ukukhiqizwa kwe-RF-30 okudlule, kodwa ukutholakala kwezinto ezibonakalayo, izitifiketi kanye nemithetho yokushintshana kwamakhasimende kumele kuqinisekiswe ngaphambi kokuzibophezela okuqinile.

Ingabe i-RF-30A ingasetshenziswa esikhundleni se-RF-30?

Kuphela ngemvume ebhaliwe yomnikazi womklamo ngemva kokubuyekezwa komehluko kagesi, wemishini, wokucubungula kanye noweziqu.

Ingabe i-Highleap ingaqinisekisa i-PIM ephansi?

Isiqinisekiso singaxhunyaniswa kuphela nezinto ezichaziwe, ukuhlanganiswa, ukwakheka, imvamisa, amandla kanye nendlela yokwamukela. I-Highleap ingacaphuna leyo ndlela yokuhlola elawulwayo.

Ingabe i-Highleap ingakwazi ukuhlanganisa amabhodi amakhulu e-antenna?

Yebo, kuncike ekuphathweni kwephaneli, ukufakwa kwayo, ukuba yisicaba, isixhumi kanye nokubuyekezwa kokuhlolwa. Lezi zidingo kufanele zifakwe ku-RFQ.

Yiluphi ulwazi oludingekayo ukuze kutholakale isilinganiso se-RF-30 antenna PCB?

Nikeza imidwebo yephaneli neyemishini i-Gerber noma i-ODB++, imininingwane yezinto ezibonakalayo nezethusi, ubukhulu obubalulekile be-RF, izidingo ze-PIM noma ze-impedance, ulwazi lwesixhumi, ubuningi, amafayela omhlangano kanye nendawo yokulethwa.

Ingabe i-Highleap inikeza ukwesekwa kwangemva kokuthengisa kwama-oda aphindaphindwayo e-antenna?

Yebo. I-Highleap igcina amarekhodi okubuyekeza, okuhlanganisa kanye nenqubo, isekela ukubuyekezwa kokulawula kanye nesenzo sokulungisa, futhi ilawula izinto ezivunyiwe noma izinguquko zenqubo yokwakha okulandelayo.

Izixazululo ze-Highleap PCB kanye ne-PCBA - cela ikhotheshini

Posts Kunconywe

Ungasithola kanjani isilinganiso sama-PCB

Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:

    • Gerber, ODB++, noma .pcb, spec.
    • Uhlu lwe-BOM uma udinga ukuhlangana
    • Ubuningi
    • Isikhathi sokushintsha
Ngokungeziwe ekwenziweni kwe-PCB, sinikeza uhla olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA, nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho.

Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.

    Sitshele Ngephrojekthi Yakho Ye-PCB

    Awekho amafayela okuklama okwamanje? Akunankinga. Yabelana ngalokho okwaziyo, futhi sizolandela uma kudingeka imininingwane eyengeziwe.



    Faka amafayela (ngokuzikhethela)

    Amafayela e-PCB, i-BOM, i-PDF/STEP, i-TXT, izithombe, i-ZIP/RAR/7Z · Isamba esiphezulu esingu-50 MB