I-Thermal Conductivity ku-MCPCB | Ukuqonda Amabhodlela Okusebenza Kwangempela

Isingeniso

Ukusebenza kokushisa kwe-MCPCB akuxhomekile kuphela ekuqhubeni kwe-substrate yensimbi kodwa futhi nasekujikeni kokushisa kanye nokumelana nokushisa kwe-interfacial. Ngenkathi abaklami abaningi begxila kakhulu ekukhetheni i-substrate ye-aluminium noma yethusi enamanani aphezulu okuqhuba ukushisa, bavame ukunganaki izithiyo ezibalulekile ezinquma ngempela ukusebenza kahle kokudlulisa ukushisa. Ezinhlelweni zokusebenza zamandla aphezulu njengamamojula e-LED lapho ukudluliselwa kokushisa kwe -PCB ye-aluminium kubalulekile, ukuqonda lezi zici ezikhawulelayo kuba yinto ebalulekile ekufezeni ukuphathwa kokushisa okuhle kakhulu.

Ukuqonda I-Thermal Conductivity ku-MCPCB Systems

Indlela Yokudlulisa Ukushisa

Indlela yokuqhuba ukushisa kuma-MCPCB ilandela indlela ebikezelwayo: ukushisa kugeleza kusuka kungqimba yesekethe yethusi ngokusebenzisa ungqimba lokufaka i-dielectric bese ekugcineni kungene ku-substrate yesisekelo sensimbi. Ngenkathi i-aluminium inikeza cishe i-200 W/m·K conductivity yokushisa kanye nethusi lifinyelela ku-400 W/m·K, lezi zibalo ezihlaba umxhwele zilandisa ingxenye nje yendaba.

Ukukhuphuka kwezinga lokushisa kwangempela ezicini zakho kuvame ukuhambisana kancane nalawa manani etiyetha. Ekusebenzeni okushisayo kwe-MCPCB okusebenzayo, isendlalelo se-dielectric siba isici esivelele esichaza ukumelana nokushisa okuphelele. Lokhu ngokoqobo kusiphoqa ukuthi sicabange kabusha indlela yethu yokuklama okushisayo, sisuse ukugxila ekukhethweni kwe-substrate kuya ekuqondeni isitaki esiphelele sokushisa.

I-Thermal Conductivity ku-MCPCB: I-Dielectric Bottleneck

Ukuhlaziywa Kwesendlalelo Esibalulekile

Isendlalelo se-dielectric sethula umgoqo oshisayo obaluleke kakhulu kunoma iyiphi idizayini ye-MCPCB. Ngokusebenza okushisayo okuvamise ukusukela ku-0.8 kuye ku-3 W/m·K, lolu ngqimba lwe-insulation lwenza ukushisa okucishe kube kubi ngokuphindwe izikhathi eziyi-100 kune-aluminium substrate engaphansi kwaso. Lapho ukushuba kwe-dielectric kukhuphuka kusuka ku-50 μm kuya ku-100 μm, ukumelana nokushisa kucishe kuphindeke kabili, kulandela ubudlelwano obuyisisekelo R = t/(k × A).

Umthelela Ongokoqobo Ekusebenzeni

Cabanga ngalo mthelela osebenzayo: i- MCPCB esebenza kahle kakhulu ene-dielectric engu-3 W/m·K enobukhulu obungu-75 μm idala ukumelana nokushisa okukhulu kune-substrate ye-aluminium engu-5mm. Ngisho nama-alloy e-aluminium e-premium anezakhiwo zokushisa eziphakeme awakwazi ukukhokhela ungqimba lwe-dielectric oluchazwe kabi.

Ukunciphisa ukujiya kwe-dielectric noma ukusebenzisa izinto ezisezingeni eliphezulu kuthuthukisa ngokuqondile ukusebenza kahle kokudlulisa ukushisa kwe-aluminium PCB. Lesi simiso esiyisisekelo siqondisa ukusebenza kahle kokushisayo ekuthuthukisweni kwe-MCPCB, nokho sisalokhu singaziswa kangako ekucacisweni kwemiklamo eminingi.

I-Interfacial Thermal Resistance ku-MCPCB Structures

Umgoqo Ofihliwe

Ukumelana nokushisa kwe-interface kuvela kuyo yonke imingcele yezinto ngaphakathi kwesakhiwo se-MCPCB. Izikhala zomoya ezincane kakhulu, ukuhwalala komhlaba, nezingqimba ze-oxidation endaweni ye-copper-dielectric kanye ne-dielectric-aluminium kudala imigoqo eyengeziwe yokushisa. Lezi zindawo zokusebenzelana zinganikela ngo-20-40% wokumelana nokushisa okuphelele, kodwa zihlale zingabonakali ekucacisweni kwe-thermal conductivity evamile.

Umthelela Wokukhiqiza Ekuqhubeni Okushisayo

Ukulawulwa kwenqubo yokukhiqiza kuthinta kakhulu ukumelana nokuhlangana kobuso ekusebenzeni okushisayo kwe-MCPCB. Ukucindezela kokucwasa, ukufana kokuphulukisa, nokulungiswa kwendawo konke kuthonya ikhwalithi yokuxhumana okushisayo phakathi kwezingqimba. Abakhiqizi abathuthukile basebenzisa ukwelapha okuyisipesheli kanye nezinamatheliso ezinokushisa okuphezulu kwe-conductivity ukuze banciphise le miphumela yesixhumi esibonakalayo.

Ngisho nekhono elihle kakhulu lokudlulisa ukushisa kwe-aluminium PCB, ukuhlangana okungalungile kobuso kungathunaza kakhulu ukuqhutshwa kokushisa okuphelele kwemihlangano ye-MCPCB. Lokhu kuhlukahluka kokukhiqiza kuchaza ukuthi kungani imiklamo efanayo evela kubahlinzeki abahlukene ngokuvamile ibonisa ukusebenza okushisayo okuhluke kakhulu.

Ukuhlaziywa Kobuningi be-MCPCB Thermal Conductivity

Ukudiliza Ukumelana Kwe-Thermal

Ingqikithi yokumelana nokushisa ku-MCPCB ilandela imodeli yochungechunge lapho isendlalelo ngasinye sengeza ukumelana kukonke. Ukuqonda lokhu kusatshalaliswa kubalulekile ukuze kuthuthukiswe ukusebenza kahle kwe-thermal kumiklamo ye-MCPCB. Ukuhlukana okujwayelekile kokumelana nokushisa kuveza izilinganiso ezimangazayo:

• I-R_Dielectric ngokuvamile ibalelwa ku-50-70% wengqikithi yokumelana nokushisa
• I-R_Interface inikela ngo-20-30% wengqikithi
• I-R_Metal_Base imele kuphela u-5-15% naphezu kokusebenza kwayo okuphezulu

Okubalulekile Kokuthuthukisa

Lokhu kusatshalaliswa kubonisa ngokusobala lapho imizamo yokuthuthukisa ithela izinzuzo ezinkulu kakhulu zokusebenza okushisayo kwe-MCPCB. Ukushintsha ukusuka ku-aluminium evamile ukuya ku-substrate yethusi kungase kwehlise ukumelana nokushisa okuphelele ngo-5%, kuyilapho ukuthuthukisa ukuqhutshwa kokushisa kwe-dielectric kusuka ku-1 kuye ku-3 W/m·K kunganciphisa ngo-40%.

Umlayezo ucacile: ukuthuthukisa izendlalelo ze-dielectric kanye ne-interface kunikeza umthelela omkhulu kakhulu ekumelaneni nokushisa okuphelele. Lokhu kuqonda kushintsha kakhulu indlela esisondela ngayo ekuphatheni okushisayo ekuthuthukisweni kwedizayini ye-MCPCB.

I-Real-World Thermal Conductivity ku-MCPCB Applications

Imiphumela Yokuhlolwa Kwelabhorethri

Ukuhlolwa kwelabhorethri kwama-substrates e-aluminium afanayo anemininingwane ehlukahlukene ye-dielectric kukhombisa lezi zimiso ngendlela emangazayo. Ama-MCCBB amabili anesisekelo esifanayo se-aluminium engu-1.6mm kodwa izendlalelo ze-dielectric ezihlukene zibonise umehluko omangalisayo wokusebenza. Eyokuqala, enogqinsi luka-50 μm ku-2 W/m·K conductivity, isebenze kakhulu kuneyesibili ngo-100 μm ku-1 W/m·K conductivity.

Ukucushwa kwe-dielectric ezacile, okuphezulu-conductivity kufinyelele amazinga okushisa okuhlangana angu-15°C ngaphansi ngaphansi kwemithwalo efanayo yamandla angu-10W. Lo mehluko we-3.5x ekuphikisweni kokushisayo wenzekile naphezu kokusebenzisa ama-aluminium substrates afanayo, okufakazela ukuthi ukukhetha kwe-substrate kukodwa akunqumi ukusebenza kokushisa kwe-MCPCB.

Interface Quality Effects

Esinye isiqhathaniso esivezayo sihilela amasu okulungisa indawo ethinta ukusebenza okushisayo emihlanganweni ye-MCPCB. Izitaki ezifanayo ze-MCPCB ezicutshungulwe nge-lamination evamile uma kuqhathaniswa nokulungiselelwa zibonise ukuhluka okungu-25% kokumelana nokushisa ngenxa yomehluko wekhwalithi yokuhlangana kobuso.

Lokhu kuqashelwa komhlaba wangempela kuqinisekisa ukuthi amanani okuqhuba ithiyori ewodwa awakwazi ukubikezela ukusebenza kwangempela kokushisa. Imithelela ehlanganisiwe yezakhiwo ze-dielectric kanye nekhwalithi yesixhumi esibonakalayo inquma ukuhanjiswa kweqiniso okushisayo kumasistimu we-MCPCB ngaphezu kwanoma iyiphi impahla eyodwa.

Ukuthuthukisa I-Thermal Conductivity ku-MCPCB Design

Izinkombandlela Ezisebenzayo Zonjiniyela

Ukuphatha okushisayo okusebenzayo kudinga ukulinganisa izici eziningi ngale kokukhethwa kwe-substrate ukuze kuzuzwe ukusebenza okushisayo kwe-MCPCB okuphelele. Qala ngokucacisa ungqimba lwe-dielectric thinnest oluhlangabezana nezidingo zakho zokuhlukanisa ugesi—njalo ukwehlisa ngo-10 μm kungathuthukisa ukusebenza okushisayo ngo-15-20%.

Khetha izinto ze-dielectric ezine-thermal conductivity engaphezu kuka-2 W/m·K uma kungenzeka, noma ngabe lokhu kwandisa izindleko zezinto ezibonakalayo. Izinzuzo zokusebenza ngokuvamile zithethelela ukutshalwa kwezimali ezinhlelweni zokusebenza lapho ukuhanjiswa kwe-thermal ezinhlelweni ze-MCPCB kubalulekile.

Amasu Okuthuthukisa I-interface

Ukwenziwa ngcono kwesixhumi esibonakalayo kudinga ukunakwa phakathi nezigaba zombili zokuklama nezokukhiqiza ukuze kukhuliswe ukudluliswa kokushisa kwe-aluminium PCB. Cacisa ukuqedwa kwendawo efanele futhi usebenze nabakhiqizi abaqonda ukuphathwa kokusebenzelana okushisayo. Cela izilinganiso zokumelana nokushisa kunokuthembela kuphela kumininingwane yedatha yempahla.

Cabangela ukusebenzisa izindlela ezishisayo lapho kufanele khona, njengoba lezi zingadlula isendlalelo se-dielectric ngokuphelele ukuze uthole izindawo ezishisayo zendawo. Kodwa-ke, khumbula ukuthi ngokusebenza ngempumelelo kuncike ekugcwalisweni okufanele kanye noxhumo olushisayo, okuqinisa ukubaluleka kwekhwalithi yokukhiqiza ekuzuzeni ukuqhutshwa kokushisa okuphezulu kumihlangano ye-MCPCB.

Isiphetho

Ukuqonda lezi zici ezikhawulelayo kubalulekile ekuhloleni ngokunembile ukusebenza okushisayo kwe-MCPCB kanye nokuthuthukisa ukudluliswa kokushisa kwe-aluminium PCB ezinhlelweni zokusebenza zomhlaba wangempela. Isendlalelo se-dielectric kanye nokumelana nobuso obuhlangene, hhayi i-substrate yensimbi, inquma uphahla lwangempela lokusebenza okushisayo komklamo wakho.

Ngokugxila emizamweni yokuthuthukisa kulezi zingqinamba ezibalulekile, onjiniyela bangafinyelela intuthuko enkulu ekuphathweni kwe-thermal ngaphandle kwenkokhelo yezindleko zezinto ezingavamile ze-substrate. Impumelelo ekuphatheni okushisayo ekuthuthukisweni kwe-MCPCB idinga ukubuka sonke isitaki esishisayo njengesistimu kunokugxila ezintweni ezibonakalayo ezingazodwana.

Kwa-Highleap Electronics, singochwepheshe ekukhiqizeni i-MCPCB ngokusebenza kahle kokushisa ngokulawula ngokucophelela izici ze-dielectric kanye nekhwalithi yesixhumi esibonakalayo. Xhumana nethimba lethu lobunjiniyela ukuze uxoxe ngokuthi ukwakheka kokushisa okufanele kungathuthukisa kanjani izinhlelo zakho zokusebenza zamandla aphezulu.