Ukuphathwa Okushisayo ku-RF kanye ne-Microwave PCBs

Ukuphathwa kokushisa kuma -RF nama-PCB e-microwave kudlala indima ebalulekile ekuqinisekiseni ukusebenza okuzinzile nokuthembeka ngaphansi kokusebenza kwemvamisa ephezulu. Njengoba amandla esignali kanye nobuningi bezingxenye kukhuphuka, ukushabalaliswa kokushisa okuphumelelayo kuba yinto ebalulekile ukuvimbela ukukhukhuleka kokusebenza, ukushintshashintsha kwe-impedance, kanye nokuwohloka kwedivayisi.

Inselele iyaqina kuma-microwave frequencies lapho ngisho nokuguquguquka okuncane kwezinga lokushisa kungase kuphazamise ukuziphatha kwesekhethi. Onjiniyela abaklama amasistimu e-RF kufanele babhekane nokucatshangelwa okushisayo kusukela ezigabeni zokuqala zokuklama ukuze kugcinwe ubuqotho besignali futhi bandise ingxenye yokuphila kwezinhlelo zokusebenza ezifunwayo.

Kungani Ukuphathwa Kwe-Thermal Kubalulekile ku-RF kanye ne-Microwave Circuits

Ukushisa kuthinta ngqo ukusebenza kwemvamisa ephezulu ngokusebenzisa izindlela eziningi. Amazinga okushisa aphezulu abangela ukushintshashintsha okungaguquki kwe-dielectric ezintweni ze-substrate, okushintsha ukufaniswa kwe-impedance kanye nokuqina kwesigaba kuyo yonke indlela yesignali. Ama-amplifiers kagesi, ama-amplifiers anomsindo ophansi, izihlungi, kanye namanethiwekhi afanayo e-antenna abonisa ukuzwela okuphezulu ekushintsheni kokushisa, kanye namapharamitha okusebenza akhuphuka ngaphandle kwamafasitela okucaciswa njengoba amazinga okushisa e-junction ekhuphuka. Kumabhodi e-TC600 emiklamo ye-RF edinga ukushisa , ukucabanga kokugeleza kokushisa kufanele kuhlolwe ngokumelene nokwakhiwa kwangempela kwe-laminate, ukwakheka kwethusi kanye ne-interface yokupholisa yemishini.

Ukusatshalaliswa kokushisa okungalingani kuletha ukuphambuka kwesignali futhi kusheshise ukuguga kwedivayisi. Ukuthembeka kokushisa kwe-RF PCB kuncike ekugcineni amaphrofayili okushisa afanayo kuzo zonke izingxenye ezisebenzayo kanye nezakhiwo zomugqa wokudlulisela. Lapho kuvela izindawo ezishisayo zasendaweni, zidala ukungaqhubeki kwe-impedance okonakalisa ukulahlekelwa kokufakwa kanye nezilinganiso zokulahlekelwa kokubuya. Ukusatshalaliswa kokushisa kumasekethe e-microwave kumele kuphathwe ngendlela ehlelekile ukuze kulondolozwe ukusebenza kukagesi kanye nobuqotho bomshini phakathi nomjikelezo wokuphila komkhiqizo.

Imithombo Yokushisa Ebalulekile ku-RF kanye ne-Microwave PCBs

Izingxenye ezisebenzayo

Izikhulisamandla kanye namamojula okudlulisa amandla akhiqiza ukushisa okukhulu ngesikhathi sokusebenza, ngokulahleka okusebenzayo okuguqula amandla e-RF abe okukhiphayo okushisayo. Izihlanganisi nezigaba zokuguqulwa kwemvamisa zifaka umthwalo owengeziwe wokushisa, ikakhulukazi ekwakhiweni kwe-transceiver enezigaba eziningi. Lezi zingxenye ezisebenzayo ngokuvamile zibusa isabelomali esishisayo kumasistimu e-RF.

Ulayini Wokudlulisa kanye Nokulahleka Kwe-Substrate

Ukulahlekelwa kwekhondatha ekulandeleni ithusi elinemvamisa ephezulu kudala ukushisa ngokulingana nokuminyana kwamanje kanye nokumelana nomkhondo. Ukulahleka kwe-Dielectric ezintweni ezingaphansi kwe-substrate kuhlakaza amandla engeziwe njengoba amasimu kagesi ehlangana nesakhiwo se-laminate. Lokhu kulahlekelwa kunqwabelana kuwo wonke amalayini wokudlulisa amade futhi kube abahlanganyeli ababalulekile kuzimo zokulahla ukushisa kwe-microwave PCB.

Ezemvelo kanye Nokupakishwa Effects

Izihlangu zensimbi kanye nezakhiwo zendiza ephansi zenza izindawo zokuhlushwa ezishisayo zendawo. Ukumelana nokushisa kwephakheji kungeza uchungechunge lwe-impedance ezindleleni zokugeleza kokushisa, okukhawulela indlela ukushisa okudluliswa kahle ngayo kusuka endaweni efile kuya endaweni ezungezile. Izimo zokushisa zangaphandle ziqhubeka nokugcizelela amasistimu okulawula okushisayo ezinhlelweni ezivezwe ezindaweni zokusebenza ezinokhahlo.

Ukucatshangelwa kwe-Thermal Design yamabhodi e-RF kanye ne-Microwave

Ukukhetha Izinto

Ama-substrate okushisa aphezulu ayisisekelo ekuphathweni kokushisa kwe-RF. Izinto ezifana ne-laminate ekhethekile ene-low-loss low 92ML, i-Taconic RF-35TC, kanye nama-laminate agcwele i-ceramic akhipha ukushisa kahle kakhulu kune-FR4 ngenkathi egcina izakhiwo ze-dielectric ezizinzile.

Ama-laminates ane-metal-backed athuthukisa ukudluliswa kokushisa ngokunikeza izindlela zokuqondisa eziqondile kumasinki okushisa. Njengoba izinhlanganisela ezigcwele i-ceramic zinganikela ngokuphindwe kahlanu kokusebenza okushisayo kwezinto ezisekelwe ku-PTFE, ukukhethwa kwezinto ezifanele kubalulekile kumiklamo yamandla aphezulu.

Ukuphathwa kwe-Stack-up kanye ne-Copper

Izendlalelo zethusi eziwugqinsi zithuthukisa kokubili umthamo wamanje kanye nokusabalalisa okushisayo. I-stack up ebhalansile inciphisa i-warpage futhi inike amandla ukushisa okufanayo kusuka ezingxenyeni kuya ezindizeni eziphansi. Izindiza zaphansi eziklanywe kahle ezinesisindo esanele sethusi zisebenza njengezisakazi zokushisa eziphumelelayo, zinciphisa izindawo ezishisayo ngaphandle kokwehlisa ukusebenza kwe-RF.

I-Thermal Vias kanye nokusabalalisa ukushisa

Ama-array angaphansi kwezingxenye zamandla adala izindlela zokuqhuba ezisebenza kahle kusukela kuma-pad kuya ezindaweni zangaphakathi zomhlaba. Ama-vias agcwalisiwe—asebenzisa ithusi noma i-epoxy eqhuba ukushisa—anciphisa ukumelana nokushisa futhi athuthukise ukudluliselwa kokushisa. Ukwenza ngcono ngobubanzi, isikhala, kanye nendlela yokugcwalisa kuqinisekisa ukugeleza kokushisa okusebenzayo futhi kugcina ukuthembeka kwengxenye. Uma i-stackup evunyiwe ichaza i-TC350, ukukhiqizwa kwe-TC350 kwamabhodi kagesi e-RF kufanele kuhambisane ne-geometry kagesi nendlela yokudlulisela ukushisa ehlosiwe.

I-Metal Core noma i-Metal-backed PCBs

Ama-RF PCB asekelwe ku-aluminium noma asekelwe yinsimbi anikeza ukushabalalisa ukushisa okuphezulu kanye nokuqina kwesakhiwo, afanelekela ama-amplifier nama -antenna ezinhlelweni ze-microwave ezinamandla aphezulu. Ngokubopha izendlalelo ze-RF ngqo enkabeni yensimbi, lawa mabhodi avumela ukudluliselwa kokushisa okuphumelelayo kuma-chassis noma kuma-heat sink angaphandle, kunciphisa ukuxhumana kokushisa kanye nokuthuthukisa ukuthembeka.

Ukulingisa kanye Nesikali Sokuqinisekisa Okushisayo

Ukuqinisekisa okushisayo okusebenzayo kuhlanganisa ukunemba kokulingisa nokulinganisa komhlaba wangempela ukuze kuqinisekiswe ukusebenza okuthembekile kwe-RF ne-microwave PCB. Amathuluzi athuthukile njenge-ANSYS Icepak ne-FloTHERM asiza ukubikezela ukusatshalaliswa kokushisa ngaphambi kokwenziwa kwesibonelo, okuvumela ukwenziwa ngcono kwedizayini kusenesikhathi. Izinqubo Ezibalulekile Zokuqinisekisa Ukushisa:

• Indlela eshisayo emfishane – Ukugeleza kokushisa okuqondile kusuka ezingxenyeni ezithile kuya esisekelweni sensimbi kunciphisa amazinga okushisa okuhlangana.
• Idatha yempahla enembile - Ukusebenzisa i-conductivity enembile yokushisa kanye namanani okuchithwa kwamandla kuthuthukisa ukwethembeka kokulingisa.
• Kulungiselelwe ngedizayini - Ukulingisa okushayelwa ngokubeka kuthuthukisa ukusebenza kahle kokudlulisa ukushisa okuqondile.
• Isithombe se-infrared thermal - Inikeza imephu yesikhathi sangempela sokushisa kwendawo ukukhomba izindawo ezishisayo zendawo.
• Izinzwa zokushisa ezishumekiwe - Nika amandla ukuqapha okuqhubekayo kwezindawo ezibucayi ngesikhathi sokuhlolwa kokwethembeka.
• I-Parallel RF nokuqinisekiswa okushisayo - Ukusebenza okushisayo kanye nogesi kumele kuqinisekiswe kanyekanye ukuze kuqinisekiswe i-impedance ezinzile futhi uthole izici.

Ukulingisa okuphelele nokuhlola kuqinisekisa ukuthi izixazululo ezishisayo zisebenza ngendlela ehlosiwe ngaphansi kwezimo zangempela zokusebenza ze-RF, kunciphisa ukusebenza kabusha futhi kuthuthukisa ukwethembeka kwesikhathi eside.

Izindlela Zokukhiqiza Zokuqeda Ukushisa Okungcono

Ukulawulwa kwenqubo yokucwenga kuvimbela ukunqwabelana kwe-resin okwandisa ukumelana nokushisa ezindaweni ezihlanganayo. Ingcindezi elawulwayo nemijikelezo yokushisa iqinisekisa ukugeleza kwe-resin okuphelele ngenkathi kunciphisa ukwakheka kwe-void phakathi kwezingqimba zethusi neze-dielectric. Ukulawulwa kokukhiqiza kwe-RF PCB kunwebeka kuzo zonke izinyathelo zokwenziwa, kusukela ekulungiseni izinto kuya ekuhlanganisweni kokugcina.

I-Thermal ngokusebenzisa ukugcwalisa idinga imishini ekhethekile kanye nobuchwepheshe bokucubungula ukuze kuzuzwe imiphumela engaguquki. Okunamathiselwe kwe-metal backing kudinga ukuqondanisa okunembayo nezindlela zokubopha ezigcina ukucaciswa kokusebenza okushisayo nokukagesi. Ukukhethwa kokuqedwa kobuso kuthinta ukudluliswa kokushisa ezindaweni zokusebenzelana kwezingxenye, nge-ENIG ne-ENEPIG platings enikeza ukuhwebelana okuhlukile kokushisa nogesi uma kuqhathaniswa nokuqedwa okusekelwe esiliva.

Amathiphu Okuklama Okusebenzayo

Ukubeka amadivayisi anamandla amakhulu eduze kwamasinki okushisa noma ama-thermal vias kunciphisa ukumelana nokushisa emigwaqweni yokushisa ebalulekile. Izindiza ezinkulu ezingaphansi komhlaba zihlinzeka ngokusabalaliswa kokushisa okusabalalisiwe okunciphisa izinga lokushisa lasendaweni ngenkathi kugcinwa ubuqotho be-RF phansi. Ngokubala kanye nokwenza kahle kokubekwa kudinga ukulinganisa ukusebenza okushisayo ngokumelene nezindleko zokukhiqiza nokucatshangelwa kobuqotho besignali.

Izinto ezilahlekelwayo eziphansi, eziphezulu ze-thermal-conductivity zinika amandla ukuthuthukiswa ngesikhathi esisodwa kuwo womabili amamethrikhi okusebenza kagesi nokushisa. I-RF ehlanganisiwe nokuqinisekiswa kokulingisa okushisayo kubamba izinkinga zedizayini ngaphambi kokwenziwa kwesibonelo, kunciphisa isikhathi somjikelezo wokuthuthukiswa kanye nezindleko. Ukubuyekezwa kwedizayini kufanele kuhlole ukusebenza kahle kokuphatha okushisayo okuhambisana nokufanisa i-impedance kanye nezidingo zokulahlekelwa kokufakwa.

Isiphetho

Ukuphatha okushisayo okusebenzayo kubalulekile ekugcineni ukusebenza kwe-RF, ukuzinza kwesignali, nokuthembeka kwesikhathi eside kumasekhethi anemvamisa ephezulu kanye nama-microwave. Kusukela ekukhethweni kwe-substrate kuya ekuhlelweni kwethusi kanye nezakhiwo ezisekelwe ngensimbi, yonke inketho yokuklama ithonya ngokuqondile ukugeleza kokushisa kanye nokusebenza kahle kohlelo lonke. Ukuhlanganisa ukuhlaziya nokuhlola okushisayo kusenesikhathi enqubweni yokuthuthukiswa kusiza onjiniyela balinganisele ukunemba kukagesi nobuqotho bemishini nokushisa.

Amandla okuphatha okushisayo kwe-Highleap Electronics:

• Izinto ezisebenzisa ugesi ophezulu – Ubuchwepheshe ekucubunguleni ama-laminate akhethekile anokulahlekelwa okuncane, ama-Taconic, kanye nama-laminate agcwele i-ceramic ukuze kuthuthukiswe ukushabalaliswa kokushisa.

• Izixazululo ze-PCB ezisekelwe ngensimbi kanye ne-metal-core - Izakhiwo ezisekelwe ku-aluminium noma zethusi ze-RF enamandla amakhulu kanye ne-microwave assemblies.

• Ukunemba ngobunjiniyela - Ama-vias okushisa agcwele futhi afakwe ipulasitiki ukuze kuncishiswe amazinga okushisa okuhlangana futhi kuthuthukiswe ukuthembeka.

• Ukuhlelwa kwe-lamination okulawulwayo kanye nokwakheka kwe-stack-up - Ibhalansi yethusi elungiselelwe kanye namasu okubopha ukuqinisekisa ukusabalala kokushisa okufanayo kanye nokuqina komshini.

• Ukusekelwa kokuhlola okuhlanganisiwe - Ukuqinisekiswa kwe-impedance yangaphakathi, ukushisa, kanye nokuthembeka kokusebenza okulinganayo kuwo wonke amaqoqo okukhiqiza.

Ukubambisana ne-Highleap Electronics kuqinisekisa ukuthi imiklamo yakho ye-RF kanye ne-microwave PCB ifinyelela kokubili ukusebenza kahle kukagesi kanye nokuthembeka kokushisa okuthembekile. Ubuchwepheshe bethu bobunjiniyela kanye namakhono okukhiqiza athuthukile ahlinzeka ngesisekelo esiqinile sezinhlelo zokusebenza zemvamisa ephezulu zesizukulwane esilandelayo.