Ukukhiqizwa kwe-PCB Yomugqa Omncane Kakhulu Wokwenza Umzila Ophakeme

Ukukhiqizwa kwe-PCB Yomugqa Omncane Kakhulu Kuqala Ngemithetho Yokuklama

“Umugqa omncane kakhulu” awulona uhlobo olujwayelekile. Inhloso yangempela yomugqa/isikhala, ukujiya kwethusi, izinto zokwakha, uhlobo lwesendlalelo kanye nokulindela kwesivuno kumele kuchazwe kuphrojekthi ngayinye.

Sho ububanzi obuncane bokulandelela kanye nesikhala ngeleveli, bese ukhomba ukuthi amanani ayasebenza yini ngaphambi noma ngemva kokucubungula. Buyekeza ama-targets omugqa omncane ngesisindo sethusi kanye nendlela yokwenza amaphethini kunokuba abe inombolo ehlukanisiwe. Uma ukulahlekelwa kwesignali nakho kubalulekile, hlanganisa umklamo nezidingo ze-PCB ezivame kakhulu.

“Umugqa omncane kakhulu” uyincazelo ehlobene, hhayi incazelo yokukhiqiza ebanzi. Izidingo ezinengqondo ububanzi obuncane bomqhubi oqediwe kanye nesikhala kungqimba ngayinye, ubukhulu bethusi, umzila wenqubo ohlosiwe, kanye nokwehluka okwamukelekayo. Inhloso engafinyeleleka kungqimba yangaphakathi yethusi elincane ingase ingalingani nomugqa/isikhala esifanayo kungqimba yangaphandle ene-copper plating eyengeziwe. Ngaleso sizathu, imithetho yokuklama kufanele ishiwo ngengqimba kanye nesimo senqubo.

Hlukanisa futhi i-geometry ye-CAD ejwayelekile kumqhubi oqediwe. Iphethini ingathinteka yincazelo yokumelana, ukuqopha, ukubopha, kanye nobuningi bethusi bendawo, ngakho umugqa oqediwe ungahluka kumugqa odwetshiwe. Uma isekethe ifaka phakathi umzila wokuphunyuka we-fine-pitch, amasimu e-dense pad, noma i-neck-downs encane, gqamisa lezi zindawo ngesikhathi sokubuyekezwa kwe-DFM. Kungcono ukuxazulula inani elincane loshintsho olubalulekile kusenesikhathi kunokuthembela esitatimendeni esijwayelekile sokuthi wonke umklamo "umugqa oqondile."

Ubukhulu Bethusi, Amaphethini kanye neJiyomethri Yomugqa

Izici ezincane ziba nzima ukuzilawula njengoba ubukhulu bethusi bukhula uma kuqhathaniswa nobubanzi bomugqa. Ithusi lokuqala, ukwakheka kweplati, ukumelana nephrofayili, izimo zokuqopha noma zokuqopha nge-flash kanye nobuningi bephethini yendawo kungathinta i-geometry yokugcina yomqhubi. Umhlinzeki kufanele abukeze iwindi lenqubo ngaphambi kokuqinisekisa ubukhulu obuncane.

Uma kudingeka ukucutshungulwa kwe-semi-additive okuguquliwe, kusho ngokucacile kunokuba ucabange ukuthi bonke abahlinzeki basebenzisa indlela efanayo. Ukususa okuvamile kanye nokudweba kwe-mSAP kusebenzisa ukulandelana kwenqubo okuhlukile.

1. Kungani ukujiya kwethusi kushintsha i-geometry yomugqa ofinyelelekayo

Amandla omugqa omncane awachazwa ububanzi bomugqa kanye nesikhala kuphela. I-foil yethusi yokuqala, ithusi elingeziwe ngesikhathi sokucwebezela, ukujiya kanye nephrofayili yokumelana, isinxephezelo se-etch, kanye nokwelashwa kokugcina kwendawo konke kuthinta ukuma komqhubi. Njengoba ukujiya kwethusi kwanda uma kuqhathaniswa nobubanzi bomugqa oqondiwe, iphrofayili yodonga oluseceleni iba nzima kakhulu ukuyilawula futhi isikhala esiphakathi kwabaqhubi abaseduze singancipha noma sihluke. Ngakho-ke, inani lomugqa/lesikhala kufanele lihlale libuyekezwa ngesisindo sethusi kanye nohlobo lwesendlalelo olunamathiselwe kulo.

Buza ukuthi ubuncane obushiwo bubhekisela kudatha yomklamo, isithombe esiku-resist, noma isici sethusi esiqediwe. Lokhu akufani ngempela. Ikhotheshini esekelwe kubukhulu be-CAD obujwayelekile ingadinga imvume yenqubo ukuze ibhodi eliqediwe lihlangabezane nesidingo sikagesi nesobukhulu. Yisho ubuncane kungqimba ngayinye ngokwehlukana lapho i-plating yangaphandle kanye ne-etching yangaphakathi kusebenzisa ukwakheka okuhlukile kwethusi.

2. Ukucubungula okususayo, i-mSAP kanye ne-SAP akuzona amalebula angashintshaniswayo

Ekucubungulweni okuvamile kokususa, isisekelo esimbozwe ngethusi siyabekwa emaphethini bese kususwa ithusi elingafuneki. Ukucubungulwa kwe-semi-additive okuguquliwe ngokuvamile kusebenzisa ungqimba lwembewu oluncane oluqhubayo, ukumelana nephethini, i-copper plating ezimbotsheni, ukumelana nokukhumula nokususwa kwethusi lembewu eveziwe. Ukucubungulwa kwe-semi-additive kwakha nezici zomqhubi kusetshenziswa ungqimba lwembewu kanye ne-plating, kodwa i-substrate yayo enemininingwane kanye nokulandelana kwenqubo kungahluka. Amagama enqubo aqondile kanye namafasitela enqubo atholakalayo kufanele aqinisekiswe ngumenzi okhethiwe.

Uma uthenga, ungacacisi i-mSAP ngoba nje umklamo ubizwa ngokuthi “umugqa omncane.” Nikeza izidingo ze-geometry eziqediwe kanye nezethusi, bese ucela umenzi ukuthi ancome umzila wenqubo ofanelekayo. Uma inqubo ethile iphoqelekile kumklamo, yisho ngokucacile bese uqinisekisa ukuthi ifektri ingasekela izinto eziceliwe, ukwakhiwa kwesendlalelo, usayizi wephaneli kanye nomthamo.

3. Ububanzi bomugqa, isikhala kanye ne-geometry yangempela kagesi

Ububanzi be-trace buthinta ukumelana kanye nomthamo wamanje; isikhala sithinta ukuhlanzwa kukagesi kanye nokuxhumanisa; kanti iphrofayili yesigaba esinqamulayo ithinta kokubili. Nge-impedance elawulwayo, i-trace iyingxenye yesakhiwo somugqa wokudlulisela esihlanganisa nobukhulu be-dielectric, izakhiwo ze-dielectric, i-geometry yendiza yokubhekisela kanye nama-conductor aseduze. Umugqa omncane awuqinisekisi ngokwawo i-impedance eqondiwe, futhi ukunciphisa isikhala kungandisa i-crosstalk noma kudale izingozi zokukhiqiza.

Lapho kuhileleke khona izimpawu zesivinini esikhulu, nikeza i-target impedance kanye nokubekezelelana, ungqimba lwereferensi, i-stack-up efanele, kanye nanoma yisiphi isikhala se-differential-pair. I-geometry yokugcina kufanele ihlolwe ngokuhambisana nokwakhiwa kwangempela kwethusi kanye ne-dielectric okuqediwe. Uma ubukhulu be-laminate noma ungqimba bushintsha, ubukhulu bomkhondo kungadingeka ukuthi buphinde bubalwe kunokukopishwa kungashintshiwe kusukela ekubuyekezweni kwangaphambilini.

4. Imithetho yokuhlelwa evikela isivuno esihle

Buyekeza izintambo zendawo, amakhona abukhali, izingcezu zethusi ezincane, iziqhingi zethusi ezihlukanisiwe, izindawo zokuphunyuka ezixinene, ukubhaliswa kwemaski yesolder, indawo yokususa ithusi emaphethelweni kanye nendawo yokususa indiza. Umklamo ungase uhlangabezane nomthetho womugqa/isikhala ojwayelekile kodwa usaqukethe izindawo ezihlukanisiwe lapho i-geometry kunzima kakhulu ukuyithatha isithombe noma ukuyiqopha njalo. Naka kakhulu ukushintshashintsha okuzungeze ama-BGA pads acwebezelayo, ngama-capture pads kanye nezinyathelo zokuxhuma.

Ukufakwa kwamaphaneli kanye nokusatshalaliswa kwethusi nakho kubalulekile. Izindawo ezinkulu zethusi eduze kwamaphethini amancane kakhulu zingadala izimo zenqubo yendawo ezahlukene. Faka imikhawulo yephaneli ehlosiwe uma ithinta umklamo bese uvumela umenzi ukuthi ancome isinxephezelo lapho kudingeka khona. Impendulo ye-DFM kufanele ikhombe indawo eqondile kanye nobukhulu okukhulunywa ngabo ukuze ithimba lokuklama likwazi ukwenza isinqumo esinolwazi kunokusebenzisa ukukhululeka okubanzi ebhodini lonke.

5. Ukuhlolwa nokwamukelwa kwezici ezinhle

Vumelana ngokuthi yini ezolinganiswa, ukuthi izolinganiswa kuphi, nokuthi umphumela uzobikwa kanjani. I-AOI ingathola amaphutha amaningi ephethini, kodwa ayithathi indawo yencazelo yokwamukelwa okulinganiselwe kuyo yonke imikhondo ebalulekile. Kuye ngephrojekthi, uhlelo lungafaka amakhuphoni, ukubuyekezwa kwesigaba esiphambene, ukuhlolwa kwe-impedance noma okunye ukuqinisekiswa kukagesi. Thola ukuthi yiziphi izinto ezidingekayo kulo lonke uhlu nokuthi yiziphi ezidingekayo kuphela ukuze kuqinisekiswe iziqu noma kuvunyelwe isihloko sokuqala.

Ukuze uthole ikhotheshini ye-PCB enomugqa ocolekile kakhulu, nikeza iphakheji yedatha, i-stack-up, izinsimbi zethusi, ama-target omugqa/isikhala ngeleveli, izinto zokwakha, ukuqeda, ithebula le-impedance, ubuningi kanye namarekhodi okwamukelwa okulindelekile. Impendulo yobunjiniyela ewusizo kufanele ibhekane nomzila wenqubo ohlongozwayo futhi ihlonze noma yiziphi izindawo zokuklama ezidinga ukucaciswa ngaphambi kokukhishwa. Lokhu kwenza ikhotheshini ithembeke kakhulu kunokukhetha umhlinzeki kusuka enombolweni eyodwa encane yomugqa/isikhala.

Ubukhulu bethusi kanye ne-geometry yomugqa kumele kuhlolwe ndawonye ngoba ukwakheka kwephethini kususa noma kwenezela ithusi ngokwenqubo ekhethiwe. Ekucubungulweni kokususa, ithusi lokuqala liyahlelwa futhi liqoshwe; iphrofayili ye-etch ingathinta ububanzi bomqhubi kanye nesimo sodonga oluseceleni. Ezindleleni ezengeziwe noma eziguquliwe ze-semi-additive, ungqimba lwembewu oluncane kanye nochungechunge lwe-plating olunephethini lungasekela izici ezinhle kakhulu, kodwa ifasitela lenqubo langempela lincike ku-substrate, ukwakhiwa kwembewu, ukumelana, i-plating, kanye nezinyathelo zokususa imbewu. Igama lenqubo lodwa alimiseli umugqa/isikhala esiqediwe esiqinisekisiwe.

Uma ucela ikhotheshini, nikeza kokubili umugqa/isikhala esincane somklamo kanye nezidingo zethusi. Khomba ukuthi inani liyinhloso yomklamo noma umkhawulo wokwamukelwa ebhodini eliqediwe. Khombisa futhi ukuthi izendlalelo zangaphandle zidinga ithusi elengeziwe elifakwe ipulasitiki nokuthi ngabe umklamo uhlanganisa izifunda zethusi esindayo eduze kwezici ezincane. Izinguquko ezingazelelwe ebubanzini bomkhondo, izindawo zethusi ezixinene, kanye nezikhala ezincane zingenza ukulawulwa kwenqubo yendawo kube nzima kakhulu, ngakho-ke isampula yokukhiqiza emele noma ikhuphoni ingaba usizo lapho uhlelo lokusebenza lukuthethelela khona.

Impedance, Crosstalk kanye nobuqotho besignali

Izimpawu ezincane azithuthukisi ngokuzenzakalelayo ubuqotho besiginali. Ukungapheleli kuncike ku-geometry yokulandelela, ukujiya kwethusi, izakhiwo ze-dielectric, isikhala se-reference-plane kanye ne-stack-up ezungezile. Isikhala esincane singakhulisa nokuxhumanisa kanye nokuxoxa uma i-routing kanye ne-reference planes zingaklanywanga ngendlela efanele.

Nikeza i-target impedance, ukubekezelelana, izendlalelo zokubhekisela kanye nomongo ofanele wemvamisa noma wezinga lomkhawulo. Sebenzisa isibuyekezo se-PCB se-impedance esilawulwayo ukuze ucabangele i-geometry kanye nokuhlanganiswa ndawonye.

Umzila womugqa oqondile kufanele uklanywe ngokomongo wejiyometri yomugqa wokudlulisa ogcwele. I-impedance yesici incike ebubanzini bokulandelela kanye nobukhulu, i-dielectric constant, ukuphakama kwe-dielectric, kanye nokucushwa kwe-reference-plane. Uma noma yikuphi kwalokhu kuguquguquka kushintsha ngesikhathi sokwenziwa noma ukulungiswa kwe-stack-up, i-impedance ephumelayo ingashintsha ngisho nalapho ububanzi be-CAD trace buhlala bufana. Nikeza i-impedance eqondiwe kanye nokubekezelelana kanye nesendlalelo sereferensi kanye nohlelo lwezinto ezibonakalayo.

Isikhala futhi siyindlela yokuklama kagesi. Imizila esondelene kakhulu ingandisa ukukhuluma okuphambene, futhi ukungaqhubeki okuzungeze ama-pad, ama-neck-downs, ama-vias, kanye nokuhlukaniswa kwe-reference-plane kungathinta ukuziphatha kwesignali. Kuma-differential pairs, chaza i-pair geometry kanye nobudlelwano obudingekayo be-impedance; kuma-net ane-single-end asheshayo, thola ama-critical nemibandela yawo ye-reference. Lezi zidingo kufanele zibuyekezwe ngesevisi ye-PCB ye-impedance elawulwayo njengenkinga yokuhlanganisa kanye nokuqondisa, engaxazululwa ngokushintsha ububanzi bomugqa kuphela.

Ukuhlolwa kwe-DFM Okuvikela Ukukhiqizwa Okuhle

Ukubuyekezwa kwe-DFM okunemigqa emincane kufanele kuhlole isikhala esincane, ukwehla kwentamo, amakhona abukhali, izingcezu zethusi ezihlukanisiwe, ukubhaliswa kwemaski yesolder, ukuguqulwa kwephedi ukuze kulandelelwe kanye nokukhiqizwa okuqondile kwesendlalelo. Ukulinganisa kwethusi kanye nokuhlelwa kwephaneli nakho kungathinta ukuzinza kwenqubo.

Ungathembeli esimangalweni esijwayelekile "esikwazi umugqa oqondile" ngaphandle kweqoqo elichaziwe kanye nesethi yedatha. Yabelana ngemiphumela yokukhiqiza bese usebenzisa isibuyekezo se-DFM ukuze uthole ukungqubuzana kokuklama nemithetho ngaphambi kokuba kukhishwe amathuluzi.

Ukubuyekezwa kwe-DFM okuwusizo kuhlola okungaphezu kobubanzi obuncane bokulandelela. Kufanele kuhlonze izingcezu zethusi ezihlukanisiwe, izintamo ezincane, amakhona abukhali, ukuvuleka okunganele, ukushintshashintsha kwe-pad-to-trace, izici zethusi eduze kwemiphetho yebhodi, izingozi zokubhalisa imaski ye-solder, kanye nama-shorts angaba khona ngemva kokwenza amaphethini. Umhloli kufanele futhi abheke ukusebenzisana phakathi kwesifunda somugqa oqondile kanye nokusatshalaliswa kwethusi okubanzi kwenye indawo kungqimba olufanayo. Ubuningi bendawo kanye nokushintsha okungazelelwe kungathinta ukuhambisana kwenqubo.

Buyekeza izidingo zebhodi eliqediwe kanye nomsebenzi wobuciko: ukuqeda ubuso, ukuvuleka kwemaski e-solder, ukufinyelela kwephedi yokuhlola, kanye ne-geometry yephedi yokuhlanganisa kungase kubeke imingcele ezicini ezincane kakhulu. Uma iphrojekthi isebenzisa izisindo eziningi zethusi, qinisekisa ukuthi imithetho yokuklama ifanele ungqimba ngalunye esikhundleni sokukopisha inani elilodwa elincane kulo lonke i-stack-up. Ukubuyekezwa kwe-DFM kufanele kuphele ngemibuzo ethile noma izinguquko ezingamukelwa, zenqatshwe, noma zicaciswe ngumnikazi womklamo.

Imibandela Yokuhlola Nokwemukelwa

Vumelana ngokuthi ububanzi bomugqa kanye nesikhala kuzoqinisekiswa kanjani nokuthi yini edala ukwamukelwa. I-AOI ingathola amaphutha amaningi abonakalayo ephethini, kodwa uhlelo lokuhlola kufanele luhambisane nokwakhiwa kwebhodi, usayizi wesici kanye nezidingo zamakhasimende.

Ukuze uthole izakhiwo ezibalulekile, chaza izidingo zekhuphoni, izindawo zokulinganisa, ukubika kanye nokuhlolwa kukagesi. Uma ibhodi lizogcwala, hlanganisa i-pad geometry ne -PCB assembly.

Izindlela zokuhlola kufanele zikhethwe ngokuya ngobukhulu besici kanye nohlobo lwesici esibalulekile. I-AOI ingabona amaphutha amaningi ephethini, kodwa uhlelo lokwamukela kufanele lusho ubukhulu obufanele bomqhubi, isikhala, kanye nezindinganiso zesici. Ngejometri ebalulekile, ikhasimende kanye nomenzi kungadingeka bavumelane ngezindawo zokulinganisa, ukwakheka kwekhuphoni, ifomethi yokubika, kanye nendlela izilinganiso zomngcele eziphathwa ngayo.

Chaza ukuhlolwa kukagesi okudingekayo ngokwehlukile ekuhlolweni kwephethini ebonakalayo. Ukuhlolwa kokuqhubeka kukagesi kanye nokuhlukaniswa kungakhomba izifunda ezivulekile noma ezimfushane, kodwa akuvezi ngempela konke ukuhlukahluka kobubanzi bomugqa. Uma ukuvimba kuyisidingo esilawulwayo, chaza ikhuphoni noma indlela yokuhlola kanye nokulindela ukubika. Kumabhodi ahlanganisiwe, qiniseka ukuthi ukwakheka komugqa omncane kusekela nokubhaliswa kwemaski yesolder, amaphethini omhlaba wezingxenye, kanye nesu lokuhlola ukuhlanganiswa.

Cela Isilinganiso se-Ultra Fine Line PCB

Thumela idatha ye-Gerber noma ye-ODB++, ukuhlanganiswa, izisindo zethusi, umugqa/isikhala esincane ngesendlalelo, izinto zokwakha, ukuqeda kobuso, ithebula le-impedance, ubukhulu bebhodi, ubuningi kanye nosuku lokuqondisa. Uma umklamo usesigabeni sokuqala, nikeza ubukhulu bokuqondisa kanye nezidingo zikagesi ukuze kuxoxwe ngokwenzeka ngaphambi kokuba umzila uqandwe.

Ukuze kwenziwe futhi kuhlanganiswe, faka idatha ye-BOM kanye nedatha yokukhetha nokubeka. Qala ekhasini lesilinganiso se-PCB bese ubuyekeza izinsizakalo zokwenziwa kwe-PCB.

Ukuze uthole ikhotheshini ewusizo, nikeza idatha ye-Gerber noma ye-ODB++, inqwaba ephelele, isisindo sethusi ngesendlalelo, umugqa/isikhala esincane ngesendlalelo, izinto zokwakha, ukujiya okuqediwe, ukuqeda kobuso, izidingo ze-impedance, uhlaka lwebhodi, ubuningi, kanye nomgomo wokulethwa. Khomba izici ezibaluleke kakhulu bese uchaza ukuthi amanani omugqa/isikhala acacisiwe ayimithetho yokuklama noma imikhawulo yokwamukelwa kwebhodi eliqediwe eqinisekisiwe. Uma kukhona ukucaciswa kwekhasimende noma indinganiso yokudweba, faka ukubuyekezwa kwayo.

Uma umklamo usathuthukiswa, yabelana ngomsebenzi ohlosiwe, iphimbo lengxenye, izidingo ezibalulekile zenethi, kanye nanoma yikuphi ukuguquguquka emgqeni/esikhala noma ezintweni. Lokhu kusiza ukubuyekezwa kobunjiniyela ukuhlukanisa izidingo ezibalulekile nezintandokazi ezingalungiswa ukuze kuthuthukiswe ukukhiqizwa noma izindleko. Uma ukuhlanganiswa kufakiwe, engeza i-BOM, idatha yokubekwa, umdwebo wokuhlanganiswa, kanye nezidingo zokuhlola ukuze ububanzi bephrojekthi bucashunwe kunokuphatha ibhodi elingenalutho njengokuphela kwalo elilethwayo.

imibuzo ejwayelekile ukubuzwa

Yimuphi umugqa nendawo ongawenza?

Ubuncane obungenzeka buxhomeke ekujiyeni kwethusi, ungqimba, izinto zokwakha, indlela yenqubo, ukwakheka kwephaneli kanye nemibandela yokwamukelwa. Thumela inqwaba kanye nedatha ukuze ibukezwe ngobunjiniyela.

Ingabe umugqa ocolekile kakhulu udinga i-mSAP njalo?

Cha. Inqubo efanele incike ku-geometry eceliwe kanye nokwakhiwa. Umenzi kufanele abukeze ukuthi inqubo yokususa, i-mSAP noma enye inqubo efanelekile iyafaneleka.

Yiluphi ulwazi olubaluleke kakhulu ekucaphuneni?

Umugqa/isikhala esincane ngokwesendlalelo, izisindo zethusi, inqwaba, izinto zokwakha, izidingo ze-impedance, usayizi webhodi, ubuningi, ukuqeda kanye nomgomo wokulethwa.