Mutengesi wePCB weMec Server weAI

Mutengesi wePCB weSevha yeMEC

Mufananidzo 1. Mupi weMEC Server PCB – Highleap Electronic 5G multi-access edge computing high-speed multilayer PCB uye backplane assembly

Kutsvaga mupi wePCB weMulti-access Edge Computing (MEC) server kwakasiyana nekutsvaga bhodhi redatacenter rakajairika. Mapuratifomu eMEC ari pakati penetwork yeredhiyo necloud — vEPC/UPF loadloads, O-RAN DU/CU, edge AI inference, uye low-latency vertical applications zvese zvinosangana pacomputer hardware inofanira kusangana nekuwanikwa kwetelecommunication uku ichitumirwa muhuwandu hunotungamirirwa neoperator.

Highleap Electronic inopa maPCB nePCBA kumapurogiramu eMEC server anotungamirwa nenetwork appliance OEMs, ODMs, uye private-5G integrators. Peji rino ndere mainjiniya wekutsvaga kana mutungamiriri wehardware anosarudza kana tiri veAVL yenyu. Rinofukidza kugona kwehunyanzvi kunokosha kune MEC hardware — high-speed laminates, backplane construction, controlled impedance paPCIe Gen5 / 25G+ rates — uye maitiro e supply-chain anoongororwa nechikwata chekutengesa ma telecom.

Chii Chinogadzira PCB "MEC-Kirasi"

Maseva eMEC akasiyana-siyana — midziyo ye1U/2U iri pamahofisi makuru, mabhokisi akasimba panzvimbo dzemasero dziri kure, mayuniti akabatana zvakanyanya mumakamuri ekutakura — asi zvinodiwa nePCB zvinoenderana neprofile yakafanana:

  • Makomputa ane huwandu hwakawanda: Xeon-D, EPYC Embedded, Ampere Altra, kana maSoC ekutengesa akabatanidzwa nemaGPU/SmartNIC accelerators, ese ari pabhodhi rimwe chete kana akapatsanurwa nebhodhi guru pamwe nemezzanine/riser.
  • Kutonga kweI/O kwekumhanya kwakanyanya: PCIe Gen4/Gen5, CXL, DDR5, 25G/100G/400G Ethernet kubva kumaports epamberi kuenda kuSerDes-heavy backplane.
  • Nzvimbo dzekubatanidza dzine waya uye dzisina waya: SFP28/QSFP28/QSFP-DD macage, optical timing, uye mune mamwe magadzirirwo akabatanidzwa O-RAN front-haul.
  • Kuwanikwa kwemhando yemuchina wekutakura zvinhu: NEBS Level 3 thermal uye shock targets, ma power feeds asina simba, ma hot-swap fans, uye kushanda kwenguva refu kwemakore mashanu.
  • Kuongorora kwemushandisi: MaPCB anofanira kuteverwa neboka rimwe nerimwe; mapurogiramu mazhinji efoni anoda kugamuchirwa kweIPC Kirasi 3 uye kupatsanurwa kwakazara kwezvinhu zvekutanga.

Saka mutengesi weMEC server PCB anofanira kunge achinyatsogona kugadzira zvinhu zvine hunyanzvi, kugadzirisa zvinhu zvisinganyanyi kurasikirwa, uye kudzora maitiro - kwete kungoshandura Gerbers kuita mabhodhi chete.

Kugona Kugadzira PCB yeMec Server

Pazasi pane ma parameter atinoshandisa pamabhodhi emhando yeMEC. Pepa rakazara re specs riri papeji redu rePCB rigid.

Parameter Capability
Layer count Mabhodhi makuru eMEC anowanzova 16–28
Bhodhi gobvu 0.4 mm kusvika 6.0 mm; mapuranga emusana anowanzova 4.0–6.0 mm
Saizi huru yebhodhi kusvika 610 × 1100 mm (paneru)
Nzvimbo diki/nzvimbo 2.5 / 2.5 mil (yemukati), 3 / 3 mil (yekunze)
Huremu hwemhangura 0.5 kusvika ku10 oz
Dhayamita ye microvia 0.075 mm yakaboorwa nelaser, yakarongwa kana yakatatamurwa
Chiyero cheAspect (kuburikidza nemechanical) kusvika ku20: 1
Impedance kushivirira ±5 Ω (≤50 Ω) kana ±7%; musiyano ±7%
Kudzora stub yekuboorera kumashure ± 0.1 mm
Surface kupera ENIG, ENEPIG, kunyudza sirivha, goridhe rakaoma, OSP

Zvinhu Zvinorasikirwa Nemutengo Wakaderera Uye Zvakasanganiswa Zvatinochengetera Basa reMEC

Nzira dzeSerDes dziri pamusoro pe25 Gbps hadzikanganwiri — zvinhu zveDk/Df uye copper roughness zvinofambisa dhayagiramu yeziso rako kupfuura zvinoita routing. Tine zvinhu zvema laminates anoonekwa paMEC neO-RAN BOMs:

Kune mapuratifomu eMEC anobatanidza zvikamu zveredhiyo zvemasero madiki kana kuti O-RAN front-haul, tinogara tichigadzira mastackup elaminate ane low-loss + FR-4 hybrid kuitira kuti nzvimbo yeRF iwane special low-loss laminate nepo nzvimbo yedhijitari ichiramba iri palaminate ine mutengo wakaderera.

MaPCB eBackplane neMidplane eMEC Chassis

Mapuratifomu eMEC anotevera modhi yeO-RAN isina kupatsanurwa — mablade ekuverenga akapatsanurwa, jira rekuchinja, uye makadhi ekuwedzera simba — anoenderana nebhodhi rekumusoro rinomhanya zvakanyanya kuti rinamate zvese pamwe chete. Mabhodhi eBackplane ndiwo mamwe emabhodhi akaomarara atinovaka, uye ruzivo rwekuvaka runokosha:

  • Kuverengwa kwepamusoro-soro (Zvikamu 24–48 zvakajairika) kuti zviendeswe kune mazana emapeya akasiyana ane reference-plane isolation.
  • Mabhodhi akakora ine maburi akadzika anokwana pakudzvanya — maitiro edu anotsigira ukobvu hwebhodhi hunosvika 6 mm nekuboorera kumashure kwakadzorwa.
  • Chinhu chinorasikirwa zvishoma pasi rose maSerDes layers, nekuti ma backplane traces akareba uye bhajeti rekurasikirwa rakamanikana.
  • Zvikamu zvemhangura zvinorema kuti magetsi aendeswe; tinovaka zvidimbu zvemhangura zve3–6 oz pasi penzvimbo dzinobatanidza magetsi kuti zvibate magetsi emabhazi.
  • Chitupa chekukwana muPress-fit: maburi ekukombama uye ukobvu hweplating zvinodzorwa zvichienderana nezvinodiwa nemutengesi wezvinobatanidza zvakaita seAmphenol ExaMAX, TE Strada Whisper, uye Molex Impel.

Kana uri kushandisa blade compute + switch fabric pane imwe chassis, tinogona kutaura mainboard, riser, uye backplane sechirongwa chimwe chete chakabatanidzwa — maitiro akafanana, kuteverwa kwekugadzirisa kumwe chete, mutengesi mumwe chete.

Mutengesi wePCB weSevha yeMEC

Mufananidzo 2. Mupi wePCB weMEC Server

MEC Server PCBA: Kubva paPilot kusvika paVolume

Makambani eTelecom OEM anowanzo mhanyisa chirongwa cheMEC kuburikidza nezvikamu zvitatu — EVT/DVT prototype, pilot (50–500 units), uye kugadzirwa kunotungamirwa nevashandi. Tinotsigira ese matatu pamutsetse mumwe chete weSMT, nemainjiniya mamwe chete, saka shanduko dzekugadzirisa pakati pezvikamu dzinoramba dzichiteverwa.

  • Kurongeka kwechokwadi: ±25 µm @ 3σ, inotsigira 01005 passives uye BGAs dzakaderera kusvika pa 0.35 mm pitch.
  • Kugona kweBGA: onai zvedu Musangano weBGA peji — kusanganisira maBGA e-flip-chip anoshandiswa pa edge SoCs neSmartNICs.
  • Nzvimbo yekutsikisa press-fit: kuisirwa kwesimba rinodzorwa rekubatanidza backplane ine huwandu hwakanyanya.
  • X-ray kuongorora: 5 µm resolution pane yega yega BGA, BTC, uye via-in-pad area.
  • Inoshanda bvunzo: tinovaka zvigadziriso zvekuyedza zvinoenderana nespec yako, kana kumhanyisa boundary scan / JTAG / ICT zvichienderana nekuwana.
  • IC programming: BMC, EEPROM, FPGA bitstream inorodha — ona IC programming services.
  • Kufananidza kupfeka: kune nzvimbo dzekunze kana dzemumugwagwa dzemakabhineti eMEC uko kunyorova kuri dambudziko.

Nguva dzekutungamira: PCB yemuenzaniso mazuva 7-14 ekushanda, PCBA mazuva 15-25 ekushanda kubva pakugadzirira kwechikamu; nguva dzekutungamira dzekutanga nekugadzira dzakatorwa papurojekiti imwe neimwe.

Maitiro Ekutengesa Zvinhu Anonyanya Kutariswa Nekutengeswa KweTelecom

Rondedzero dzezvinokwanisa dziri nyore kuburitsa. Chinosiyanisa mutengesi wePCB weMEC server chaiye kubva kuchitoro che generic ndicho chinoitika panguva yechirongwa:

  • Material traceability: batch yega yega ine tag ine laminate mugadziri, lot, uye date code. Mutengi wako wemushandi achabvunza.
  • Revision control: mirairo yekuchinja mainjiniya inogadziriswa ichipesana neBOM yakatarwa uye stackup; hapana zvinotsiviwa zvisingatauriki.
  • Mishumo yenyaya yekutanga: microsection, impedance TDR, kugona kusundidzira, uye kuongororwa kwemativi kunoitwa nekuvandudzwa kwega kwega.
  • Kutevedzera mitemo yekirasi yeIPC: mapurogiramu mazhinji eMEC anoda IPC-6012 Kirasi 2 kana Kirasi 3 yePCB neIPC-A-610 Kirasi 2/3 yekubatanidza. Tinovaka zvese zviri zviviri.
  • RoHS / REACH: kutevedzera zvizere, kuzivisa kunowanikwa nekutumira.
  • Imba yekuchengetera vanhu vane mutoro: kana mushandi akashandisa dunhu uye iwe uchida kuyera 3× mukota, mutsetse unogona kuutora.

Highleap ine zvitupa zveISO 9001, ISO 14001, IATF 16949, uye UL, uye sisitimu yedu yemhando yepamusoro inotsanangurwa papeji redu rePCB rekusimbisa mhando.

Zvishandiso zveMEC neCommunication PCB zvine chekuita nazvo

Tanga Mutengo Wako wePCB weMEC Server

Titumirei Gerber/ODB++ yenyu, stackup ine impedance targets, BOM (yekuungana), uye huwandu hwetarget. Kune mapurogiramu ebackplane kana chassis, sanganisira connector spec uye press-fit hole drawing. Muchawana ongororo yakanyorwa yeDFM uye mutengo mukati memazuva 1-2 ebhizinesi. Kana chirongwa chenyu chichida kuongororwa kwemutengesi musati matora mutengo, timu yedu yekutengesa icharonga izvozvo.

Tora mutengo weMEC Server PCB kana kuti bata timu yedu yeinjiniya kuti mukurukure nezvekuvakwa kwemapuranga akaunganidzwa, zvinhu, kana kuti kuvakwa kwemapuranga emusana.

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Ngatimhanyei DFM/DFA ongororo yenyu todzokera kwamuri nereport. Unogona kurodha mafaera ako zvakachengeteka kuburikidza newebhusaiti yedu. Isu tinoda ruzivo rwunotevera kuti tikupe iwe quote:

    • Gerber, ODB++, kana .pcb, spec.
    • BOM rondedzero kana iwe uchida kusangana
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Pamusoro pekugadzira PCB, isu tinopa huwandu hwakakwana hwemagetsi masevhisi, anosanganisira PCB dhizaini, PCBA, uye turnkey mhinduro. Kunyangwe iwe uchida rubatsiro neprototyping, dhizaini yekusimbisa, kutsvagisa chikamu, kana kugadzirwa kwakawanda, isu tinopa yekupedzisira-kusvika-kumagumo rutsigiro kuti uve nechokwadi chekubudirira kweprojekiti yako.

Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.






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