TU-933+ High-Speed PCB Material ye100G/400G Backplanes & Networking
High-speed PCB yakagadzirwa neTU-933+ laminates. Superior Dk kugadzikana uye kuderera kwekuisa kurasikirwa kwekuda data centre uye telecom application.
Kugadzira PCB Yekukurumidza Kwemapurojekiti Achishandisa TU-933+
Highleap Electronics inopa mabasa ekugadzira maPCB uye kugadzira maPCB emapurojekiti epamusoro-soro, RF, HDI, uye multilayer circuit board. Basa redu rekugadzira rakavakirwa pakugadzirwa kwePCB kwakatenderwa, kuunganidzwa kwezvinhu, zvinodiwa nezvinhu, zvinangwa zve impedance, uye magwaro ekugadzira.
TU-933+, inozivikanwawo mumhuri yezvinhu zveThunderClad 3+ kubva kuTaiwan Union Technology Corporation (TUC), ilaminate ine kurasikirwa kwakaderera inoshandiswa mukugadzira magadzirirwo epamusoro-soro uye maRF PCB. TU-933+ ndiyo core yelaminate, ine TU-933P+ seyakagadzirirwa.
Mapurojekiti ePCB ane chekuita nechinhu ichi anogona kusanganisira:
- Mapurani ekumashure anomhanya zvikuru uye mabhodhi emakombiyuta
- MaPCB eseva, nzvimbo yekuchengetera zvinhu, uye makadhi emutsara
- Mabhodhi edunhu reTelecom nebase-station
- RF uye mashandisirwo ekutumira masaini
- Magadzirirwo ePCB ane jira rakawanda ane jira rakawanda
Pamapurojekiti aya, Highleap Electronics inotarisa pane zvinodiwa paPCB zvakaita sekuvaka nematanda akawanda, kudzorwa kweimpedance, kuburikidza nekugadzira, kunyoresa machira, kuboora, zvinhu zvemhangura, kupedzisa pamusoro, uye kuungana kwePCB. Hunhu hwezvinhu uye zvivakwa zviripo zvinofanirwa kusimbiswa zvichienderana nemagwaro aripo anopiwa nemugadziri wezvinhu.
Mabasa edu ekugadzira maPCB anofukidzawo mapurojekiti achishandisa mamwe masisitimu e laminate anotenderwa ane kurasikirwa kushoma uye anomhanya zvakanyanya, anosanganisira TU-883 , TU-872 SLK , zvinhu zvemhando yepamusoro zvine kurasikirwa kushoma , uye zvinhu zveTaconic.
Mamiriro ehunyanzvi eTU-933+ Laminate
| pfuma | ukoshi | Mamiriro / Nzira |
|---|---|---|
| Tg (DMA) | 220 ° C | E-2/105 |
| Tg (TMA) | 170 ° C | E-2/105 |
| Td (TGA) | 390 ° C | E-2/105 |
| CTE (x/y) | 12 / 13 ppm/°C | Ambient kuTg |
| CTE z-axis (α1) | 35 ppm/°C | Pre-Tg |
| CTE z-axis (α2) | 240 ppm/°C | Post-Tg |
| CTE z-axis (%) | 2.5% | 50 kusvika 260 ° C |
| Thermal Stress (288°C) | > 120 sec | Solder Float |
| T260/T288/T300 | > 60 min (imwe neimwe) | E-2/105 |
| Kupisa | 94V-0 | E-24/125 |
| Mvumo (Dk) | 3.08 @ 10 GHz | SPC nzira (RC70%) |
| Simulated Dk | 2.54 | Impedance Simulation |
| Kurasika Tangent (Df) | 0.0020 @ 10 GHz | SPC nzira |
| Kusagadzikana kweVolume | > 10¹⁰ MΩ·cm | C-96/35/90 |
| Kumusoro Kugadziriswa | > 10⁸ MΩ | C-96/35/90 |
| Electric Strength | > 40 kV/mm | A |
| Dielectric Kuparara | > 50 kV | A |
| Modulus wechidiki | 23 GPa (Warp), 21 GPa (Zadza) | A |
| Flexural Simba | > 60,000 psi (L) / >50,000 psi (W) | A |
| Simba rePeel (1 oz Cu) | 4–7 lb/in | A |
| Kunyorova Kusviba | 0.06% | E-1/105 + D-24/23 |
CHERECHEDZA
- Zvinodiwa zvehunyanzvi zviri pamusoro apa zvinopihwa kuti zvishandiswe pakugadzira maPCB. Zvinodiwa zvekupedzisira zvekuvaka nekugadzira maPCB zvinofanirwa kusimbiswa zvichienderana nedhizaini yakatenderwa, kuunganidzwa, uye magwaro epurojekiti akakodzera.
- TU-933+ (ThunderClad 3+) chigadzirwa che laminate chinobva kuTaiwan Union Technology Corporation (TUC). Highleap Electronics inogadzira nekubatanidza maPCB uye haigadziri TU-933+ laminate.
- Highleap Electronics inopa rutsigiro rwemainjiniya nekugadzira zvinhu padanho rePCB, kusanganisira ongororo yeDFM, kuongororwa kwematanho akawanda, ongororo ye controlled-impedance, kuronga kugadzirwa kwezvinhu, kuunganidza maPCB, kuongorora, uye kuyedza.
Kune mapurojekiti eTU-933+ PCB, rutsigiro rwedu runosanganisira:
- Ongororo yePCB yekumhanya kwakanyanya uye kurasikirwa kushoma
- Zvinodiwa zvekutonga-kupindira uye nzira yekutumira masaini
- Kugadzirwa kwe multilayer, HDI, uye complex via-structure
- Kuungana, kuongorora, uye kuyedza kweSMT/THT
- Chinyorwa chekugadzira PCB uye vhoriyamu
Bata Highleap Electronics kuti uongorore uye utore mutengo wePCB.
Nei Mainjiniya Vachisarudza TU-933+ yePamusoro-Kumhanya, Yakaderera-Kurasikirwa PCB Projects
Kunyange isu tichitsigira marudzi ese ePCB substrates, tinowanzo kurudzira TU-933+ laminates kune vatengi vanoshanda neakakwira-kumhanya masaini, kunyanya avo vanogadzira 10G, 25G, kana 56G bandwidths.
TU-933+ akakosha maficha anosanganisira:
- Dk 3.08 ±2%, Df 0.0020 @ 10 GHz - yakanakira kuchengetedza chiratidzo.
- Yakaderera z-axis yekuwedzera - inovimbisa yakavimbika vias mune multilayer stackups
- Yakakwira CAF kuramba - inotsigira kuvimbika kwenguva refu munzvimbo dzakaoma
- Inopindirana neyakajairwa lamination maitiro - kubatsira kuderedza mutengo
Zvinhu izvi zvinoita kuti TU-933+ ive imwe nzira inodhura zvishoma pane zvinhu zvepamusoro-soro zvakaita seMEGTRON6 kana kuti hydrocarbon laminate ine low-loss yakawanda yemafoni, datacom, server, uye maindasitiri eRF applications.
KuHighleap, isu tinopa emahara stackup kubvunza uye kubatsira vatengi kusarudza kuti TU-933+ kana chimwe chinhu chiri chakanyanya kuenderana nekuita kwavo, mutengo, uye zvinodiwa zvekugadzira.
Kugadzira & Kuunganidza PCB Yekukurumidza Yepamusoro kubva paPrototype kuenda kuKugadzirwa
Highleap Electronics inopa mabasa ekugadzira maPCB uye kugadzira maPCB kumapurojekiti anomhanyisa, ane kurasikirwa kwakaderera, HDI, uye akaomarara, kusanganisira magadzirirwo ePCB ane TU-933+ nedzimwe nzira dzakatenderwa dze laminate. Chinangwa chedu ndechekushandura ma stack-up akatenderwa, zvinodiwa zve impedance, data rekugadzira, uye magwaro ekugadzira kuita maitiro ekugadzira akadzorwa.
Kune magadzirirwo ePCB ane zvidimbu zvakawanda uye anomhanya zvakanyanya, zvinodiwa pakugadzira nekugadzira zvinogona kuongororwa pamwe chete kuti pave nekubatana pakati pebhodhi risina chinhu nePCBA yekupedzisira.
- Kugadzirwa kwePCB inodzorwa-impedance uye musiyano-pair
- Kugadziriswa kweHDI nema microvia, via-in-pad, uye plug-by structures
- Kugadzirwa kwemaPCB akawanda kwakaoma uye kugadzirwa kwemaPCB akawanda
- ENIG, ENEPIG, goridhe rakaoma, OSP, nezvimwe zvinhu zvakatsanangurwa pamusoro pezvinhu
- Musangano weSMT/THT weBGA, QFN, fine-pitch, nezvimwe zvikamu zvemapakeji
- AOI, X-ray, flying-probe, electric, uye bvunzo dzekushanda dzinoshanda
Kubva pakuongorora mainjiniya uye kuvaka kwemaprototype kuburikidza nekugadzira uye kugadzira maPCB ehuwandu, Highleap Electronics inotsigira mapurojekiti apo kuvimbika kwemasaini, kuvaka kwakawanda, kudzora maitiro, uye kugara kwenguva refu kwekugadzirwa kwakakosha.
Kana purojekiti yenyu ichisanganisira TU-933+, imwe laminate isinganyanyi kurasikirwa, kana FR-4 yakagadzirwa nenzira yechinyakare, titumirei mafaira enyu eGerber, stack-up, BOM, uye zvinodiwa pakugadzira ongororo yekugadzira uye quotation.
Bata Highleap Electronics kuti uwane purojekiti yako yekugadzira nekugadzira maPCB inokurumidza.