TU-933+ High-Speed PCB Material ye100G/400G Backplanes & Networking
High-speed PCB yakagadzirwa neTU-933+ laminates. Superior Dk kugadzikana uye kuderera kwekuisa kurasikirwa kwekuda data centre uye telecom application.
Nyanzvi PCB Kugadzira Yepamusoro-Kumhanya Zvishandiso - Kusanganisira TU-933+ Zvishandiso
KuHighleap Electronics, isu tiri yakazara-sevhisi PCB mugadziri uye imba yekuungana, inokwanisa kubata ese makuru uye epamusoro laminate zvinhu-kubva payakajairwa FR4 kusvika TU-933+, RO4003C, MEGTRON6, uye kupfuura.
Fekitori yedu yakagadzirirwa kuomarara, HDI, RF, uye multilayer PCB kugadzirwa, uye isu tinoshanda nevagadziri mumaindasitiri kuunza yavo yekumhanya-mhanya, yakaderera-kurasikirwa PCB dhizaini kuhupenyu nehusina kufananidzwa nemazvo.
TU-933+ (ThunderClad 3+), yakagadzirwa neTaiwan Union Technology Corporation, chimwe chezvinhu zvakawanda zvatinotsigira. Iro sarudzo yakanakisa ye:
- High-speed backplanes
- 5G uye telecom zvivakwa
- Sevha, kuchengetedza & AI komputa PCBs
- Yakaderera-kurasikirwa multilayer chiratidzo kutapurirana
Hazvina mhosva kuti dhizaini yako inoda chii—TU-933+, TU-883, TU-872 SLK, Rogers, Taconic, kana FR4 - tichavaka mabhodhi ako nekukurumidza, kurudyi, uye kutsanangura.
Mamiriro ehunyanzvi eTU-933+ Laminate
| pfuma | ukoshi | Mamiriro / Nzira |
|---|---|---|
| Tg (DMA) | 220 ° C | E-2/105 |
| Tg (TMA) | 170 ° C | E-2/105 |
| Td (TGA) | 390 ° C | E-2/105 |
| CTE (x/y) | 12 / 13 ppm/°C | Ambient kuTg |
| CTE z-axis (α1) | 35 ppm/°C | Pre-Tg |
| CTE z-axis (α2) | 240 ppm/°C | Post-Tg |
| CTE z-axis (%) | 2.5% | 50 kusvika 260 ° C |
| Thermal Stress (288°C) | > 120 sec | Solder Float |
| T260/T288/T300 | > 60 min (imwe neimwe) | E-2/105 |
| Kupisa | 94V-0 | E-24/125 |
| Mvumo (Dk) | 3.08 @ 10 GHz | SPC nzira (RC70%) |
| Simulated Dk | 2.54 | Impedance Simulation |
| Kurasika Tangent (Df) | 0.0020 @ 10 GHz | SPC nzira |
| Kusagadzikana kweVolume | > 10¹⁰ MΩ·cm | C-96/35/90 |
| Kumusoro Kugadziriswa | > 10⁸ MΩ | C-96/35/90 |
| Electric Strength | > 40 kV/mm | A |
| Dielectric Kuparara | > 50 kV | A |
| Modulus wechidiki | 23 GPa (Warp), 21 GPa (Zadza) | A |
| Flexural Simba | > 60,000 psi (L) / >50,000 psi (W) | A |
| Simba rePeel (1 oz Cu) | 4–7 lb/in | A |
| Kunyorova Kusviba | 0.06% | E-1/105 + D-24/23 |
CHERECHEDZA
1. Zvose zvehutekinoroji zvakaratidzwa pamusoro apa zveTU-933+ (ThunderClad 3+) laminates zvivakwa zvakajairwa zvakadhindwa neTaiwan Union Technology Corporation (TUC) uye zvinopihwa zvakaringana kutariswa kweinjiniya. Kuita chaiko kunogona kusiyana zvichienderana neyako chaiyo PCB dhizaini, dhizaini dhizaini, kuburikidza nedhizaini, uye maitiro ekugadzira.
2. PaHighleap Electronics, tinoshandisa chete echokwadi TU-933+ laminates akacheneswa zvakananga kubva kuTUC-akatenderwa migero, kuve nechokwadi chemhando uye traceability mune yega yega kugadzirwa.
3. Unoda rubatsiro nezve TU-933+ PCB stackup kuronga, kusarudza zvinhu, kana kuti unoda kukumbira zviri pamutemo TU-933 database (PDF)?
Mainjiniya edu ari pano kuti akubatsire ne:
- Yakaderera-kurasikirwa PCB zvinhu kuenzanisa
- TU-933+ impedance modelling & stackup optimization
- Zano rekusanganisa TU-933+ neFR4 kana mamwe ma substrates
- Kurumidza, makotesheni ehunyanzvi ekugadzira yakazara turnkey uye kuungana
Nei Mainjiniya Vachisarudza TU-933+ yePamusoro-Kumhanya, Yakaderera-Kurasikirwa PCB Projects
Kunyange isu tichitsigira marudzi ese ePCB substrates, tinowanzo kurudzira TU-933+ laminates kune vatengi vanoshanda neakakwira-kumhanya masaini, kunyanya avo vanogadzira 10G, 25G, kana 56G bandwidths.
TU-933+ akakosha maficha anosanganisira:
- Dk 3.08 ±2%, Df 0.0020 @ 10 GHz - yakanakira kuchengetedza chiratidzo.
- Yakaderera z-axis yekuwedzera - inovimbisa yakavimbika vias mune multilayer stackups
- Yakakwira CAF kuramba - inotsigira kuvimbika kwenguva refu munzvimbo dzakaoma
- Inopindirana neyakajairwa lamination maitiro - kubatsira kuderedza mutengo
Izvi zvivakwa zvinoita kuti TU-933+ ive inodhura-inoshanda imwe kune Ultra-premium zvinhu seMEGTRON6 kana RO4835 kune akawanda telecom, datacom, server, uye maindasitiri RF application.
KuHighleap, isu tinopa emahara stackup kubvunza uye kubatsira vatengi kusarudza kuti TU-933+ kana chimwe chinhu chiri chakanyanya kuenderana nekuita kwavo, mutengo, uye zvinodiwa zvekugadzira.
Yakazara PCB Kugadzirwa & Masevhisi eGungano - Haina kuganhurirwa kuTU-933+
Highleap Electronics inopfuura mugadziri weTU-933+ PCB-isu tiri shamwari yako yakazara-sevhisi yezvese kubva pa2-layer FR4 prototypes kusvika yepamusoro 60-layer HDI uye multilayer PCBs.
Kana zvasvika kune TU-933+ nezvimwe zvinhu zvekumhanya-mhanya, masevhisi edu anosanganisira:
- Chaiyo impedance control (± 5%) yekusiyanisa pairi & RF mitsetse
- HDI board processing ine microvias, via-in-pad, uye kuburikidza neplugging
- Akaomesesa multilayer stackups ane hybrid zvinhu (semuenzaniso, TU-933+ + FR4)
- Surface inopedza inosanganisira ENIG, ENEPIG, goridhe rakaomarara, OSP
- Yakazara turnkey SMT musangano, kusanganisira BGA, QFN, 01005, RF nhovo kuiswa
- Kuomarara QA kuyedzwa: AOI, X-ray, bvunzo dzinoshanda, uye probe yekubhururuka
Isu tinongoshandisa chaiyo TU-933+ laminates kubva kuTUC, uye yega yega inotsigirwa neIPC Kirasi 2/3 zviyero zvekuvimbika uye kuenderana.
Kunyangwe purojekiti yako inoshandisa TU-933+, RO4350B, Isola, kana FR4-Highleap Electronics ine ruzivo uye zvivakwa zvekuunza.
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