Kuomarara kwePCB Copper: Kurasikirwa neSignali, Kusarudzwa kweZvinhu uye Kudzora Kugadzirwa

Kukombama kwemhangura yePCB ndiko kuumbwa kwepamusoro pepurasitiki yemhangura uye nzvimbo dzakagadziriswa. Pakukwira kwemhepo, simba remagetsi rinoungana pedyo nepamusoro pemuchina wekufambisa, saka kukombama kunowedzera kureba kwenzira inoshanda uye kurasikirwa nemuchina wekufambisa. Izvi zvinogonawo kukanganisa kunonoka kwechikamu uye muenzaniso weimpedance unoonekwa.

Highleap Electronics haigadziri foil yemhangura. Isu tinotenga uye tinogadzirisa chivakwa chefoil/laminate chakatenderwa, tinogadzira PCB uye tinounganidza PCBA.

Ko kushata kwemhangura kwakaderera kunogara kuchigadzira PCB iri nani here? Mhangura yakapfava yemagetsi inowanzo deredza kurasikirwa kwemuchina wekufambisa mhepo. Kugadzira kuchiri kuda kunamira kwakakwana, kuenderana nemaitiro, kuwanikwa uye hunyanzvi. Foil chaiyo inyaya inodzorwa, kwete chiratidzo chekushambadzira.

Chii chinonzi PCB Copper Roughness?

Mhangura yakachengetwa nemagetsi ine divi redhiramu nedivi rakagadziriswa, uye vatengesi velaminate vanogona kupa zvivakwa zvakajairwa, zvakagadziriswa shure, zvisina kunyatsotsanangurwa kana kuti zvisina kunyatsotsanangurwa . Kutumidza mazita hakuenderane zvakakwana nevatengesi, saka dhizaini yakaburitswa inofanira kuratidza foil chaiyo kana muganho wekuoma wakatenderwa.

HTE / mhangura yakajairika

Kunamatira kwakasimba uye kuwanikwa kwakakura, asi kazhinji kurasikirwa kwakanyanya kwemuchina.

RTF

Inofambisa kurapwa kuderedza nzvimbo isina kurongeka inoonekwa nechiratidzo, zvichienderana nekuvakwa kwayo.

VLP

Dhigirii repasi kuti rivandudze mashandiro epamusoro-soro.

HVLP / foil yakatsetseka yepamusoro

Inoshandiswa apo 112G, 224G, mmWave kana nzira refu dzinotsigira mari yekuwedzera uye kutonga.

Kune mutengi, musiyano unobatsira uri pakati pezita retekinoroji nezvinodiwa pabhodhi rakapedzwa. Bhodhi richiri kufanira kudzora kudyidzana pakati pekuomarara, resin nekunamatira, base-foil profile, treated-side roughness uye finished copper thickness. Highleap inoverenga zvinodiwa izvozvo kubva padata rekugadzira chaiyo uye inozvishandura kuita stackup, process route uye viewing plan, pane kufunga kuti izwi guru chete ndiro rinotsanangura kuti PCB inofanira kuvakwa sei.

Kukanganiswa kweCopper Kunokanganisa Sei Kushanda kwePCB

Kukosha kwedata remagetsi hakukwani kana bvunzo dzemagetsi dzisingakwanise kuona shanduko isina kutenderwa yefoil yakaoma kana kurasikirwa kwakanyanya kupfuura zvakamboitwa. Ongororo yacho inofanira kushandisa core chaiyo kana prepreg, copper profile, finished thickness uye via route. Apa ndipo panodzivirira mutengi kubva kune mumwe nemumwe kuti asakwanise kududzira magwaro akawanda emutengesi ari ega.

Kukosha kwedata remagetsi hakukwani kana bvunzo dzemagetsi dzisingakwanise kuona shanduko yekugadzirwa kana kuti kuchinjana kwefoil isina kubvumidzwa. Ongororo yacho inofanira kushandisa core chaiyo kana prepreg, copper profile, finished thickness uye via route. Apa ndipo panodzivirira mutengi kubva kune mumwe chete kuti akwanise kududzira magwaro akawanda emutengesi ari ega.

Kana Kukosha Kwemhangura Kwava Kunonetsa

• Nzira dzemagetsi refu dze56G, 112G kana 224G.
• 800G uye 1.6T optical-module host kana mabhodhi emodule.
• 77 GHz radar uye mmWave antenna/feed structures.
• Magadzirirwo elaminate asinganyanyi kurasikirwa apo kurasikirwa kweconductor kuri chikamu chikuru chekurasikirwa kwese.
• Zvidimbu zvakatetepa kana kuti mageometri akamanikana ane huwandu hwakawanda hwemagetsi.
• Magadzirirwo anoda hukama pakati pekuenzanisa nekuyera kweS-parameter.

Kudzokorora ndiyo bvunzo huru yekugadzira. Muenzaniso unogona kushanda kunyangwe hwindo rekugadzirisa rakafara, asi kugadzirwa kwehuwandu kunoratidza kusiyana kwezvinhu, kugoverwa kwemhangura, kurodha mapaneru uye kuputira. Tinoisa kudzora kwemhangura kwakagadzirwa, hukama hwemakuponi nemuenzaniso wakaburitswa, kusimbiswa kwefoil yemutengesi uye kuteverwa kwezvinhu mukuburitswa kwekugadzirwa kuti tipe kuenzanisa kwakasimba pakati pezvinhu.

Kudzokorora ndiyo bvunzo huru yekugadzira. Muenzaniso unogona kushanda kunyangwe hwindo rekugadzirisa rakafara, asi kugadzirwa kwehuwandu kunoratidza kusiyana kwenzvimbo dzezvinhu, kugoverwa kwemhangura, kurodha mapaneru uye kuputira. Tinoisa hukama hwemakuponi nemuenzaniso wakaburitswa, kuongororwa kwefoil yemutengesi, kuteverwa kwenzvimbo dzezvinhu uye kudzora kwemhangura yakapedzwa mukuburitswa kwekugadzirwa kuti tipe kuenzanisa kwakasimba pakati penzvimbo.

Data reCopper Roughness uye Modeling

Kuomarara kweRMS chete kungasanyatsotsanangura pamusoro. Mamodheru akadai seHammerstad , Huray uye nzira dzematanho akawanda anoshandisa maparamita akasiyana. Mugadziri nemugadziri vanofanira kubvumirana kuti ndeapi pamusoro pefoil nedata zvinomiririrwa.

Zvikanganiso zvinowanzo sanganisira kutevedzera divi re laminate nepo chiratidzo chichiona chimwe chinhu chakasiyana, uchishandisa kukosha kweVLP, kana kuregeredza mhangura yakaputirwa yakawedzerwa panguva yekugadzira.

Kubuda kweongororo kunofanirwa kunge kuri muunganidzwa unogona kugadzirwa uye runyorwa rupfupi rwezvinhu zvinodzorwa. Highleap inonyora hunhu hwezvinhu zvakabvumiranwa, geometry, nzira yemaitiro uye hwaro hwekuongorora, yobva yabatanidza zvimwe zvese mukati meCAM, kugadzirwa, mhando uye kubatanidzwa.

Zvinhu zvakasiyana-siyana zvehunyanzvi muchikamu chino hazvigone kuongororwa zvakazvimirira. Kuchinja kwekuomarara kwemativi akagadziriswa kunogona kuchinja mhedzisiro yeukobvu hwemhangura hwakapedzwa, nepo kusangana pakati pekuomarara, resin nekunamatira uye base-foil profile kuchikanganisa geometry uye mhedzisiro yebvunzo inoonekwa pabhodhi rakapedzwa. Highleap inoongorora kuvakwa chaiko kwekugadzira saka stackup uye muripo zvinobva pazvinhu zvinotengwa kwete mienzaniso yemazita.

Kurasikirwa Nemagetsi Kana Kuenzaniswa Nekunamatira Kwemhangura

Kugadziriswa kwakaomarara kunobatsira kuti mhangura ibatane ne dielectric. Foil yakapfava zvakanyanya isina resin/system yekugadzirisa yakakodzera inogona kuderedza simba rekubvisa kana kusimba kwekugadzirisa. Masisitimu emazuva ano e laminate anoshandisa mishonga yemakemikari uye dhizaini ye resin kuti inamire zvakanaka.

Highleap haibvisi kana kupukuta copper mushure mekuiswa lamination. Mhinduro chaiyo ndeyekutenga simbi yakagadzirwa necopper kubva kumutengesi wezvinhu.

Chinangwa chekugadzira uye muripo wefekitori zvine varidzi vakasiyana. Mutengi anotsanangura zvinodiwa zvemagetsi nekuvimbika; Highleap inoshandisa CAM yakatenderwa, kuchera, kuputira uye kugadzirisa lamination kunodiwa kuti isvike pamutengo wapera. Chero shanduko inokanganisa zvivakwa kana hunyanzvi inounzwa kuti ibvumidzwe pachinzvimbo chekuvanzwa mukati mekugadzirisa CAM.

Kuenzana kwakakodzera kunowanikwa kuburikidza nekugadzirwa kwelaminate-and-foil kwakakodzera, kwete nekukumbira fekitori yePCB kuti ibvise kurapwa kunopa kunamira. Kemikari yeResin, kurapwa kwemakemikari uye foil profile zvakagadzirwa sehurongwa. Highleap inoongorora nzira yekuvaka yakatenderwa uye yekugadzirisa, yobva yadzora mhangura nejometri. Chero kutamira kune foil yakatsetseka kunofanirwa kuongororwa kuti kuonekwe kuti kune zvese zvinobatsira zvemagetsi uye kuti michina inokodzera sei.

Zvinokonzera Kusiya Mhando Yemhangura Isina Kutaurwa

• Fekitori inogona kutaura nezve foil yakajairika isingaenderane nemuenzaniso wechiteshi.
• Kutsiva zvinhu kunogona kuchengetedza resin Dk/Df asi kuchichinja kurasikirwa kwemuchina.
• Mhando dzemaprototype nedzekugadzira dzinogona kushandisa foil dzakasiyana dziripo.
• Makuponi ekurasikirwa nekuisa anogona kutadza kushanda kunyangwe impedance ichipfuura.
• Maumbirwo eRF anogona kuchinja nekuti roughness inochinja kurasikirwa uye kureba kwemagetsi kunoshanda.

Kukundikana kukuru kunowanzoonekwa mushure mekunge zvikamu zvaunganidzwa. Bhodhi rinogona kuramba richienderera mberi uye richiratidza kurasikirwa kwakanyanya kwekupinza kupfuura kuenzaniswa, kusawirirana kwechikamu kana shanduko yeprototype-to-production panguva yekusimbisa sisitimu. Saka DFM yekutanga haina kudhura zvakanyanya pane kuongorora PCBA yakapedzwa, nekuti zvinhu, geometry, kugadzirwa uye zvikonzero zvekuunganidza zvinogona kupatsanurwa usati waisa maturusi uye kuiswa kwezvikamu.

Kudzokorora kugadzirwa kunounza imwe njodzi: imwe inogona kushandisa imwe nzira yekuvaka iripo asi iyo mhando yezvinhu zvemhando yepamusoro isingachinji. Highleap inonyora zvakatenderwa zve stackup, copper, process assumptions uye nzira yekuongorora kuitira kuti prototypes nekugadzirwa zvienzaniswe zvichienderana nehukuru hwakafanana hwekuburitswa.

Mashandisirwo Anoitwa Highleap Pakuumbwa Kwemhangura

1. Simbisa chimiro che laminate nefoil nemutengesi.
2. Nyora mhando yemhangura, huremu hwehwaro uye mhangura yakapedzwa muchikamu chakaunganidzwa.
3. Shandisa hunyanzvi hwakafanana neukobvu hwemhangura uye maitiro acho.
4. Kuisa mapurasitiki ekudzora kuitira kuti geometry nemhangura zvapera zvirambe zviri mukati memuenzaniso.
5. Chengetedza zvinhu zvinotsiviwa nevatengi zvichidzorwa nekuchinja kwezvinhu.
6. shandisa kuponi dzemumiriri we impedance uye kurasikirwa kana zvataurwa.
7. Batanidza data rekugadzira nefungidziro dzekufananidzira dzakaburitswa.

Ruzivo rwekugadzira rwakatenderwa runochengetwa kuti rudzokororwe. Kuzivikanwa kwezvinhu, kukura, nzira yekuboorera, chinangwa chekuputira uye nzira yekuongorora zvinoramba zvichidzorwa nekuchinja. Izvi zvinodzivirira chigadzirwa kubva pakutsiviwa kwefoil isina kutenderwa kana kurasikirwa kwakanyanya kwekuisa kupfuura kwakaedzwa kunokonzerwa nemaitiro asina kunyorwa kana shanduko yekugovera.

Chikumbiro chekugona chinokosha chete kana chakabatana nenzira inodzorwa nechitoro. Highleap inobatanidza kuteverwa kwenzvimbo yezvinhu, kudzora mhangura kwakagadzirwa, hukama hwemakuponi nemuenzaniso wakaburitswa uye kusimbiswa kwefoil yemutengesi nekuongorora kuri kuuya, lamination, drilling, plating, imaging uye kusimbiswa kwekupedzisira. Kutevedzana chaiko kunoramba kuri pasi pekuvakwa kwezvinhu zvakatenderwa uye bhodhi.

Kugadzira uye Kugadzira PCB yeHighleap Yekukurumidza

Highleap inotsigira masisitimu ezvinhu zvinorasikirwa zvishoma uye zvinorasikirwa zvishoma , mhangura isina chimiro chakanaka, ipedance inodzorwa, etching yemutsara wakanaka, HDI, kuchera kumashure, AOI, cross-section uye bvunzo dzeS-parameter/insert-loss. Masevhisi ePCBA anosanganisira SPI, BGA assembly, AOI, X-ray, connectors uye functional test.

Kugadzira kunotanga nekugadzirwa kwebhodhi risina chinhu. Warpage, copper balance, pad finish, via condition uye thermal mass zvinokanganisa kudhinda, kuisa uye kuyererazve. Highleap inoongorora PCB ne component layout pamwe chete kuitira kuti bhodhi rinosangana nemiedzo yebhodhi risina chinhu risave PCBA ine goho shoma mushure mekunge zvikamu zvine mutengo wakakwira zvaiswa.

Imwe mainjiniya wepurojekiti inoronga kugadzira uye mibvunzo yeSMT. Izvi zvinodzivirira kutadza kunowanzoitika apo PCB inogadziriswa pasina kufunga nezvekubatanidza, kana kuti hurongwa hwekubatanidza hunofunga kuti pad, warpage uye mamiriro ekupisa ayo kuvakwa kwebhodhi risina chinhu hakugone kupa nenzira yakavimbika.

Kudzora kuomarara kwemhangura kunotanga usati wagadzira nekuti foil inopihwa sechikamu chelaminate yakaputirwa nemhangura. Munguva yekugadzira, kuputira nekunamira kunoramba kuchichinja ukobvu hwemuchina uye chimiro, saka trace yapera inofanira kuramba ichiwirirana nemuenzaniso. Pamabhodhi akabatanidzwa, kuburitswa kwema launcher, ma pads uye kuchinja kwezvikamu zvinogona kukonzera kusagadzikana kwenzvimbo kunyangwe chikamu chakareba chichishandisa mhangura yakatsetseka. Saka ongororo iyi inofukidza PCB nePCBA interfaces.

Tumira Kugadzira PCB Kutanga; Tichasimbisa Chinodiwa Chemhangura

Kutenga hakudi kusarudza modhi ye copper-roughness usati wakumbira mutengo. Tumira mafaira eGerber kana mafaira ePCB kutanga. Kana zvakanyorwa zve copper kana zvinhu zvatovepo, hapana specification yakasiyana ye roughness inodiwa pakuongorora kwekutanga.

Mainjiniya edu anobatanidza chinangwa chemagetsi nezvinhu zviripo pakugadzira

Mainjiniya weHighleap akazvipira achaongorora nzira dzekufambisa, huwandu hwema frequency uye kuvakwa kwezvinhu nechikwata chedu chekugadzira zvinhu zvinomhanya. Tichasimbisa kana mhangura yakajairwa, VLP, HVLP kana imwe profile yakatenderwa inofanira kukurukurwa, uye tichakubata zvakananga kana ruzivo rwemutengesi kana mvumo yemutengi ichidikanwa.

Mainjiniya akapihwa basa anochengetedza kutaurirana kwese munzira imwe chete yepurojekiti. Zvinhu, zvinhu zvakaunganidzwa, CAM, kugadzira, mhando uye mibvunzo yekubatanidza zvinobatanidzwa kuitira kuti mutengi asafanirwe kuendesa matambudziko ehunyanzvi pakati pemadhipatimendi akawanda efekitori.

Zvinhu Zvinokonzera Mutengo weMhangura

VLP/HVLP foil inogona kuwedzera mutengo we laminate uye kuderedza kuchinjika kwekutsvaga. Kudzora foil zvakasimba kunogona kuwedzera nguva yekutungamira. Mutengo unofanirwa kururamiswa nekuongorora nzira; kutaura kuti mhangura yakapfava inowanikwa pane zvisingakoshi kazhinji hazvidiwi.

Kotesheni inoratidza nzira yakazara inodiwa kuti uwane goho rinogamuchirika. Zvinhu zvikuru zvinosanganisira kuwanikwa kweVLP kana HVLP, zvivakwa zvakatenderwa, huremu hwemhangura, nguva yekutsvaga zvinhu uye kuyedzwa kwekurasikirwa kunodiwa. Mutengo wezvinhu chikamu chimwe chete; kuwedzera lamination, kuchera kwakakosha, kunyoreswa kwakasimba, nguva yekuongorora uye makuponi ekuyedza zvinogona kuva nemigumisiro yakaenzana kana yakakura.

Nguva yekushanda inowanzo dzorwa nekuwanikwa kwezvinhu, mhangura yakakosha, huwandu hushoma hwemutengesi, kugadziriswa kwakatevedzana kana hunhu hwekunze. Mainjiniya anoona chirambidzo chaicho chenguva uye anotarisa kana imwe nzira yakatenderwa inogona kuchibvisa pasina kuchinja zvinodiwa zvechigadzirwa.

Kutsanangura VLP kana HVLP padanho rega rega kunogona kuwedzera mutengo wezvinhu pasina kuvandudza zvikamu zvisina kukosha zvedhizaini. Zvimwe zvinhu zvinowanikwa chete muhukobvu hwakasarudzwa, huremu hwemhangura kana nzvimbo dzevatengesi, izvo zvinogonawo kukanganisa nguva yekutungamira uye huwandu hushoma hweodha. Highleap inogona kubatsira kuona kuti ndeapi mapeya edanho akakosha kurasikirwa uye kana mhuri yezvinhu zvakatenderwa ichipa chivakwa chinoshanda chakapfava-chemhangura.

Mhangura Chikamu cheSisitimu Yezvinhu uye Mugero weChiteshi

Laminate ine low-Df ine mhangura isingadzoreki haisi PCB inodzorwa inomhanya zvakanyanya. Highleap inoita kuti foil, plating, geometry uye test plan zvive chikamu chekugadzirwa kwayo.

Kukosha kwedata remagetsi hakukwani kana bvunzo dzemagetsi dzisingakwanise kuona kusawirirana kwechikamu kana shanduko yemuenzaniso nekugadzirwa. Ongororo yacho inofanira kushandisa core chaiyo kana prepreg, copper profile, finished thickness uye via route. Apa ndipo panodzivirira mutengi kubva kune mumwe chete kuti akwanise kududzira magwaro akawanda emutengesi ari ega.

Sisitimu yeresin, magadzirirwo egirazi uye profile yemhangura zvinofanirwa kuburitswa pamwe chete. Kuchinja foil chete kunogona kuchinja kurasikirwa kwekuisa, kunonoka kwechikamu, maitiro ekunamatira uye kuwanikwa kwezvinhu kunyangwe zita remhuri re laminate rikaramba risina kuchinja. Pakugadzirwa kwacho zvakare, Highleap inonyora chivakwa chaicho chakatengwa uye inobata shanduko yeprofile yemhangura sekutsiva kwakadzorwa pane sarudzo yekutenga yenguva dzose.

Mibvunzo Inonyanya Kubvunzwa

Ndeupi musiyano uripo pakati peVLP neHVLP copper?

Ose anotsanangura mhando dzefoil dzisina kunyatsotsanangurwa, asi mazita nemiganhu zvinosiyana zvichienderana nemutengesi. Taura data chairo refoil kana kuti roughness.

Ko mhangura yakapfava inoderedza kurasikirwa kwePCB here?

Kazhinji hongu kana paine frequency yakakwira, asi geometry yakazara yemuchina wekufambisa, plating, adhesion uye system ye dielectric zvichiri kukosha.

Highleap inogona kuyera kukora kwemhangura here?

Kusimbiswa kwezvinhu uye ruzivo rwemutengesi ndizvo zvinhu zvakajairika zvinodzora. Kuyera kwenzvimbo kwakakosha kunogona kukurukurwa kana zvichidikanwa nekondirakiti.

Kupedzwa kwechinhu pamusoro pechinhu kunokosha kupfuura kukweshana kwemhangura here?

Zvese zvinogona kukosha, asi kuomarara kwebase-foil kunowanzo kukanganisa kureba kwetrace ukuwo kupera kuchikanganisa nzvimbo dzakaratidzwa nemapedhi.

Ko Highleap inogadzira foil yemhangura here?

Kwete. Tinogadzira maPCB tichishandisa ma laminates akaputirwa nemhangura uye mafoil akagadzirwa.

Ndinofanira here kutaura nezve VLP kana HVLP copper ndisati ndataura neHighleap?

Kwete. Tumira mafaira eGerber kana mafaira ePCB kutanga. Mainjiniya weHighleap achaongorora chiteshi nekugadzirwa kwezvinhu nechikwata chedu chehunyanzvi uye osimbisa kana paine chikonzero chekugadzira mhangura chaiyo.