Ubunjiniyela be-PCB be-AI Server engu-10 Layer ye-Accelerator Hardware

I-“AI server PCB” iyincazelo yesistimu, hhayi isigaba sokukhiqiza. Leli gama lingabhekisela ebhodini lesisekelo, ikhadi lokwengeza i-accelerator, idivayisi yememori ye-CXL, ikhadi le-retimer, isikhombimsebenzisi senethiwekhi, isithwali se-optical-module, isilawuli sokuphatha, ibhodi lokusabalalisa amandla noma ibhodi elincane lokulawula ngaphakathi kwesistimu yokupholisa uketshezi. Le mikhiqizo ayihlanganyeli ngenani lesendlalelo esisodwa, i-laminate, ukubekezelelana kwe-impedance, ukwakheka kwe-HDI noma uhlelo lokuthembeka.

Ukwakhiwa kwezingqimba eziyishumi kungafaneleka kumabhodi akhethiwe engqalasizinda ye-AI, kodwa akufanele kukhangiswe njengeplatifomu yendawo yonke yamabhodi esisekelo asheshayo aphezulu noma izinhlelo zokushintsha. Ukubalwa kwezingqimba okulungile kuvela ekuphumeni kwezingxenye, inani leziteshi, izidingo zendiza yokubhekisela, ukusatshalaliswa kwamandla, i-topology yokuxhuma, ukujiya komshini kanye nezidingo zokufaneleka. Ezimweni eziningi, ibhodi evamile enezingqimba eziyishumi nambili, eziyishumi nesithupha noma ngaphezulu iyingozi ephansi kunokuphoqelela imijikelezo eminingana ye-HDI elandelanayo kanye nezindiza zamandla ezihlukanisiwe zibe izingqimba eziyishumi.

Lo mhlahlandlela uchaza ukuthi izingqimba eziyishumi zithembeke kuphi ngokobuchwepheshe nokuthi yini okumele inikezwe ngaphambi kokwenziwa. Ugwema ngamabomu izimangalo eziqinile ezifana nokuthi “i-Tachyon ilingana namasentimitha ayisithupha,” “i-0.4 mm BGA ihlala idinga u-3+4+3,” noma “wonke amabhodi e-AI adinga iKlasi 3.” Lezo zinqumo zingezemodeli yesiteshi ekhishwe, isifundo sokuphunyuka kwephakheji kanye nemibhalo yokuthenga. Isiqondiso sokwakha esijwayelekile siyatholakala kusibukezo sobunjiniyela be-PCB esinezingqimba eziyi-10 , kuyilapho umsebenzi kagesi onemininingwane umbozwa umhlahlandlela wesiteshi esinesivinini esikhulu.

Lapho i-PCB enezingqimba eziyi-10 ifanelana khona ne-AI Infrastructure

Izendlalelo eziyishumi zithembeke kakhulu uma ibhodi linenani elilinganiselwe lezindawo zokuxhumanisa ezinesivinini esikhulu, isifunda somzila esincane kanye nokwakhiwa kwamandla okungadingi izindiza eziningi ezibanzi nezihlukanisiwe. Izibonelo zifaka phakathi amabhodi okuphatha kanye nama-BMC, amakhadi okufaka i-accelerator noma isitoreji anenombolo elawulwayo yemizila ye-PCIe noma ye-CXL, amakhadi okubuyisela isikhathi, amakhadi okuvula i-optical-module, amadivayisi okukhulisa inkumbulo ye-CXL, ama-subassemblies esibonakalayo senethiwekhi, abalawuli befeni kanye nephampu, amabhodi e-telemetry kanye nemikhiqizo ekhethiwe yokulawula amandla.

Ukubalwa kwezingqimba okufanayo kuba nzima lapho ibhodi kufanele liphume emaphaketheni amaningi amakhulu kakhulu, liphathe iziteshi eziningi zememori, lihambise imizila eminingi engu-112 Gb/s noma imizila emincane engu-224 Gb/s, lisekele imigwaqo eminingana yamandla aphezulu, noma lixhume i-mezzanine eminingi enobukhulu obuphezulu kanye ne-optical interfaces. Kulezo zimo, indawo yomzila kanye nendawo yendiza esetshenziswa ama-antipad, ngokusebenzisa amasimu kanye neziqhingi zamandla ingenza izingqimba eziyishumi zibe buthaka ngogesi ngisho noma izinsalela zingenziwa zilingane.

Isinqumo kufanele siqhathanise okungenani izakhiwo ezintathu: ibhodi evamile enezingqimba eziyishumi, ibhodi ye-HDI enezingqimba eziyishumi kanye nebhodi evamile enezingqimba eziphakeme. Ukubalwa kwezingqimba eziphansi kakhulu akuzona izindleko eziphansi ngokuzenzakalelayo noma ezithembeke kakhulu. Ukufakwa kwe-lamination okulandelanayo, ukubhoboza nge-laser, ukugcwaliswa kwethusi kanye nokwehla kwesivuno kungadlula izindleko zezinye izingqimba ezivamile.

Hlela Ibhodi Ngaphambi Kokukhetha I-Stackup

I-stackup kufanele ikhethwe endimeni yebhodi ohlelweni. Ikhadi lokwengeza i-accelerator, ikhadi lememori le-CXL kanye ne-optical-module carrier konke kungabizwa ngokuthi i-AI hardware, kodwa imikhawulo yabo ebalulekile ihlukile.

Amabhodi okuphatha nokulawula

Lawa mabhodi avame ukubuswa ama-microcontroller, amadivayisi e-BMC, ukulandelana kwamandla, ukulawula ifeni noma iphampu, izixhumi zenzwa kanye nokuxhumana ngesivinini esimaphakathi. I-stackup enezingqimba eziyishumi ezicebile ngereferensi inganikeza izindlela zokubuya ezihlanzekile, ukuhlukaniswa phakathi kwamandla okushintshana kanye namasekethe okulinganisa, kanye nokusatshalaliswa kwamandla okwanele ngaphandle kokusebenzisa izinto ezisezingeni eliphezulu zokulahlekelwa okuphansi kulo lonke ibhodi.

Amadivayisi e-PCIe kanye ne-CXL

Izixhumanisi ze-PCI Express kanye ne-CXL zabelana ngesisekelo esinongqimba olubonakalayo, kodwa ukubuyekezwa okubusayo kanye nesici sefomu kusabalulekile. I-PCIe 5.0 isebenzisa i-32 GT/s NRZ, i-PCIe 6.0 isebenzisa i-64 GT/s PAM4, kanti i-PCIe 7.0 Version 1.0 yakhishwa ku-128 GT/s PAM4. I-CXL 4.0 yakhishwa ngo-2025. La maqiniso asungula umongo wokubonisana; awanikezi isabelomali sokulahlekelwa kwebhodi jikelele. Imininingwane yesisekelo esebenzayo, ikhadi elingeziwe noma i-topology yangokwezifiso, imodeli yesixhumi, ukubekwa kwe-retimer kanye nokwabiwa kwephakheji kumele kutholakale ngaphambi kokuba kukhethwe ukwakhiwa kwebhodi.

Amabhodi okuxhumana kwenethiwekhi kanye ne-optical

I-IEEE 802.3df-2024 i-Ethernet ejwayelekile engu-400 Gb/s kanye ne-800 Gb/s kanye nezendlalelo zomzimba. Ibhodi elichazwa ngokuthi “i-800G” lisakwazi ukusebenzisa ukubalwa kwemizila ehlukene, ukufinyelela kukagesi, izixhumi kanye nezixhumi ze-optical-module. Kulokhu kubuyekezwa, i-IEEE P802.3dj isathuthukisa ukusebenza kwe-1.6 Tb/s kanye nezendlalelo zomzimba ze-200/400/800 Gb/s; imiklamo esebenzisa lowo msebenzi kumele isho okusalungiswa noma isidingo samakhasimende. Ngokufanayo, amaphrojekthi ekilasi le-OIF 224G ahlukanisa ukufinyelela okufushane kakhulu, okufushane kakhulu, okuphakathi kanye nokude esikhundleni sokuchaza isiteshi esisodwa se-PCB esijwayelekile.

Kuzo zonke izinhlobo ezintathu zamabhodi, umhlinzeki udinga incazelo yangempela yesiteshi. Ilebula lokumaketha elifana nelithi “Gen7,” “800G” noma “224G” alanele ukukhulula inqubo ye-laminate noma yokubhoboza ngemuva.

Ukupakishwa kwe-Accelerator, i-HBM kanye nomngcele we-PCB

Imemori ye-bandwidth ephezulu esetshenziswa ama-accelerator anamuhla ivame ukuhlanganiswa ne-processor ngephakheji ethuthukisiwe, i-interposer noma i-substrate yezinga lephakheji. Ngakho-ke, i-interface ye-HBM ayivame ukuhanjiswa njengebhasi elijwayelekile lokuhlukanisa kulo lonke i-PCB yeseva. Ibhodi liphethe amandla angaphandle ephakheji ye-accelerator, i-PCIe/CXL, i-chip-to-chip, ukuphathwa, i-clock kanye ne-service interfaces. Ukuphatha imizila ye-HBM njengomugqa ojwayelekile we-PCB kuyiphutha eliyisisekelo lokwakha.

Umngcele wephakheji ushintsha inkinga ye-PCB ngezindlela ezimbili. Okokuqala, ibhodi kungenzeka lingathwali isikhombimsebenzisi se-HBM esibanzi kakhulu, kodwa kusamele lisekele ukuphunyuka kwe-BGA okuxinene kakhulu kanye nenethiwekhi yokulethwa kwamandla kagesi aphezulu. Okwesibili, ukuphunyuka kwephakheji, i-socket noma i-land geometry kanye nokubekwa kokuhlukaniswa kungase kulawule inani lezingqimba ngisho noma inani lemizila yangaphandle yesivinini esikhulu liphansi.

Ulwazi lwephakheji luyadingeka ekuhleleni ibhodi

• imephu yebhola, iphimbo, ububanzi bomhlaba kanye nephethini yokususwa kwabantu;
• ukusatshalaliswa kwamandla kanye nebhola elisemhlabathini ngesitimela;
• izindawo zangaphandle zomzila wesivinini esikhulu kanye nephethini yebhola lokubhekisela;
• kuvunyelwe i-feniout, nge-in-pad kanye nezindawo zokuhlukanisa izinhlangothi zangemuva;
• ukugcina izinto ngomshini, ukuqinisa, ukufaka i-heatsink noma i-cold-plate;
• amamodeli ephakheji kanye nokuphuma kokulingisa isiteshi;
• iphrofayili yomhlangano kanye nezidingo zokubambisana.

Umklamo onezingqimba eziyishumi kufanele wenqatshwe kusenesikhathi uma ucwaningo lokuphunyuka lwe-BGA ludla izindiza zokubhekisela, luqhekeza ukusatshalaliswa kwamandla noma ludinga amazinga okwakha amaningi kunalokho uhlelo lokufaneleka olungakusekela. Umhlahlandlela wobunjiniyela be-HDI onezingqimba eziyi-10 uchaza ukuthi kungani iphimbo lodwa lingakwazi ukunquma u-1+8+1, 2+6+2 noma u-3+4+3.

Ubunjiniyela beziteshi ze-PCIe, CXL kanye ne-Ethernet

Kumelwe kusungulwe ukuthi kungenzeka yini ngesivinini esikhulu kusukela kusiteshi esiphelele: ukuphuma kwephakheji, ngokushintsha, umugqa oqondisiwe, isixhumi noma ukuqaliswa kwekhebula, i-retimer uma ikhona kanye nephakheji yokwamukela. Ukukhethwa kwezinto kuyinguquko eyodwa kuphela.

Ukubhoboza ngemuva kufanele kucaciswe lapho i-stub engasetshenziswanga ekhishwe yephula imfuneko yesiteshi futhi isixazululo esingabonakali singakhethwa. Inothi kumele lichaze uhlangothi lokubhoboza, ungqimba oluqondiwe, i-stub ephezulu esele, ububanzi bethuluzi, ukuqhekeka okuvunyelwe kanye nendlela yokuqinisekisa. Isimangalo "esiphezulu sama-mil angu-3" esinqunyiwe asifaneleki kuwo wonke amaphaneli kanye nefasitela lokubhalisa.

Ngokufanayo, ukufanisana kwe-differential-pair kanye nesikhala semizila kufanele kuvele kumodeli yokusetshenziswa ebusayo kanye nesiteshi. Imithetho efana ne-+/-1 mil intra-pair noma isikhala se-10W akuzona izinkomba ezijwayelekile zokuthobela imithetho. Umhlahlandlela wokuqondisa uchaza indlela yokuguqula isikhathi, i-crosstalk kanye nezidingo zokuguquka zibe yimingcele yesakhiwo.

Izinqumo Zokuqoqwa Kwezinto Ezibalulekile, Izinto Ezibalulekile kanye Nethusi

I-stackup yengqalasizinda ye-AI enezingqimba eziyishumi esebenzayo ivame ukukhetha izindiza zokubhekisela kunesibalo esiphezulu sezingqimba zesignali. Ukwakheka kwamandla okunezignali ezine, ezine, kunganikeza izendlalelo ezimbili zangaphandle ze-microstrip kanye nezendlalelo ezimbili ze-stripline ezibhekiselwe kahle ngenkathi kugcinwa ukusatshalaliswa kwamandla okubanzi. Ukuhlelwa kwezindiza ezinezignali eziyisithupha/ezine kunikeza umthamo omkhulu womzila kodwa kungadala izendlalelo zesignali eziseduze noma indawo enganele yendiza; kufanele zisetshenziswe kuphela uma uhlelo lokubuyela emuva kanye nohlelo lokuxoxa luzisekela.

Izinto ezilahlekelwa kancane kufanele zibekwe lapho imodeli yesiteshi ibonisa ukuthi iyadingeka. Ukwakhiwa okuhlanganisiwe kungasebenzisa i-core kanye nesistimu yokubopha elahlekelwa kancane ezungeze izendlalelo ezikhethiwe ze-stripline ezinesivinini esikhulu ngenkathi kusetshenziswa olunye uhlelo oluhambisanayo kwenye indawo. Ukwakhiwa okuhlanganisiwe kumele kusanelise ukubopha, ukubhoboza, ukunyakaza kobukhulu, ukunamathela kwethusi kanye nezidingo zomjikelezo wokushisa. Imindeni emibili ye-laminate ekilasini elifanayo lokulahlekelwa kokumaketha ayishintshi ngokuzenzakalelayo.

Okokufaka kokukhishwa kwezinto ezibonakalayo

• uhlu oluqondile lwebanga elivunyiwe noma lwezinto ezivunyiwe;
• ukwakhiwa okuyisisekelo nokwangaphambi kokulungiswa, okuqukethwe kwe-resin kanye nesitayela sengilazi;
• iphrofayili yethusi esetshenziswa kumodeli yokufaka nokulahlekelwa;
• umklamo we-Dk kanye nomthombo we-Df, indlela kanye nobubanzi bemvamisa;
• igunya lokufaka esikhundleni kanye nendlela yokufaneleka;
• umlando wokushisa kusukela ekushiseni okulandelanayo, ngokugcwalisa, ukuqeda kanye nokuhlanganisa;
• ukutholakala, inani elincane lokuthenga kanye nemikhawulo yokuphakelwa kwesikhathi eside.

Umhlahlandlela wezinto ezingqimba eziyi-10 uhlanganisa lezi zilawuli ngokuningiliziwe. I-impedance elawulwayo kumele ibalwe kabusha ngokuqhathaniswa nokwakhiwa kokukhiqiza okuhlongozwayo, hhayi ukukopishwa etafuleni elijwayelekile elingu-5 mil/50 Ω.

I-HDI, i-BGA Escape kanye ne-Via Architecture

I-HDI ifanelekile uma idala ukufinyelela komzila noma ukusebenza kukagesi okungenakuhlinzekwa yinkambu evamile ye-via. Imephu yephinikhodi yephakheji, inani lemigqa, isidingo samandla-ngokusebenzisa kanye nezendlalelo zesignali ezitholakalayo zibaluleke kakhulu kune-pitch ngokwayo.

Kumaphakheji e-accelerator, retimer kanye ne-switch, i-via-in-pad ingasetshenziswa ukubuyisa iziteshi eziphumayo. Umdwebo wokwenziwa kufanele uhlukanise i-microvia egcwele ithusi, ukugcwalisa okungaholeli, i-resin plug, i-planarization kanye ne-copper cap. Ama-microvia ahlanganisiwe adinga ubufakazi bokuthembeka obuqondene nesakhiwo ngoba ukuxhumana phakathi kwama-via agcwele kanye nezindawo eziqondiwe kungaba yindawo yokukhathala ngaphansi kokuvezwa okuphindaphindiwe kokushisa.

Noma iyiphi i-HDI enezingqimba noma eningi akufanele ikhethwe ngoba nje itholakala. Izinga ngalinye lokwakheka lengeza izithombe, i-lamination, ukubhoboza nge-laser, i-metallization kanye nokugcwaliswa/ukuhlela kwethusi ngokuvamile. Umklamo kufanele uqhathanise ibhodi evamile enezingqimba eziphakeme nebhodi eliyinkimbinkimbi le-HDI elinezingqimba eziyishumi kusetshenziswa umzila, ukukhiqizwa, ukuthembeka kanye nezindleko - hhayi nje kuphela inani lezingqimba ezijwayelekile.

Ukuhlolwa kokukhishwa kwe-HDI

• bonisa yonke into engaboni, efihliwe, eyeqile kanye ne-explore-by-by-span etafuleni lokubhoboza;
• thola ubudlelwano obuhlanganisiwe nobuhlanganisiwe ngokwezingqimba;
• qinisekisa ububanzi be-microvia, ukujiya kwe-dielectric kanye nomhlaba wokubamba njengewindi lenqubo eyodwa;
• chaza izidingo zokugcwalisa, isivalo, i-dimple kanye nobuso bokuhlanganisa;
• incazelo yomkhiqizo wesifundazwe, ikilasi, ikhuphoni lokufaneleka kanye nezimfuneko zokwamukelwa kwenqwaba;
• ungasebenzisi i-IPC-6016 njengendinganiso yokwamukelwa kwe-HDI yamanje; sebenzisa incazelo yomkhiqizo yamanje esebenzayo kanye nokubuyekezwa kokuthengwa.

Inethiwekhi Yokulethwa Kwamandla Nokusatshalaliswa Kwamanje

Amandla okusheshisa awakwazi ukwakhiwa kusukela esihlokweni samanje kuphela. Ibhodi le-PDN kumele lihlangabezane nokwehla kwamandla kagesi e-DC, impedance yesikhashana, ukufakwa kwe-converter, ukufakwa kwephakheji, imikhawulo yesixhumi noma yebha yebhasi, ukukhuphuka kwezinga lokushisa lethusi kanye nemikhawulo yemishini. Amandla kagesi angalethwa ngokuxhumana okusemaphethelweni, izixhumi zamandla aphezulu, amabha yebhasi, amamojula wamandla aqondile noma abalawuli bendawo; isakhiwo ngasinye sisebenzisa i-PCB ngendlela ehlukile.

Ubudlelwano phakathi kwe-target-impedance ne- target Z _target = ΔV / ΔI buyindawo yokuqala, hhayi incazelo ephelele ye-PDN. I-transient spectrum efanele, i-voltage-regulator control loop, i-package capacitance kanye ne-droop evunyelwe kumele ichazwe. Ngaphezu kobubanzi bemvamisa lapho ama-capacitor afakwe ebhodini ehlala esebenza kahle, izakhiwo ze-package kanye ne-on-die zibusa.

Imibuzo ye-DC ne-AC ethinta ukwenziwa

• Yimaphi ama-rails adinga izindiza ezibanzi, ithusi elisindayo, i-inlay yethusi noma ama-conductor angaphandle?
• Iyini ubukhulu obuncane bethusi obuqediwe, kunesisindo se-foil esijwayelekile?
• Ingakanani indawo yendiza elahleka ngenxa yama-antipad, ama-slots, ama-thermal cutouts kanye ne-hardware yokufaka?
• Kungabekwa kuphi ukuhlukanisa uhlangothi lwangemuva, futhi ingabe kudingeka ama-via agcwalisiwe ezindaweni zezingxenye?
• Yikuphi ukwehla kwamandla kagesi kanye nokwenyuka kwezinga lokushisa okuvunyelwe kumandla kagesi kanye ne-ambient embi kakhulu?
• Ingabe ibhodi lidinga izakhiwo zemizwa yamanje, ama-shunt alinganisiwe noma i-Kelvin routing?

I-IPC-2152 inikeza isiqondiso somthamo wokuthwala ugesi kanye nokuziphatha kokushisa, kodwa ayinciphisi indiza eyinkimbinkimbi noma insimu ibe umkhawulo owodwa wobuningi bamandla kagesi. Sebenzisa idatha yokuhlola yokulingisa noma yokuhlola eqinisekisiwe yamabhodi okusheshisa ugesi aphezulu. Kweminye imikhiqizo, i-busbar, i-leadframe noma i-power module ifaneleka kakhulu kunokuphoqelela amakhulu ama-ampere ngezindiza ze-PCB ezivamile.

Ukuhlanganiswa Kwe-Thermal kanye Nemishini

I-PCB iyisici esisodwa sendlela yokushisa. Amaphakheji anamandla aphezulu avame ukwenqaba ukushisa okuningi ngesembozo sephakheji, i-heatsink noma ipuleti elibandayo eliwuketshezi kunokuba adlule ebhodini. Izindiza zethusi nama-via kungasakaza ukushisa kwendawo futhi kunciphise ukulahlekelwa ugesi, kodwa ukubalwa okulula kwe-via-count akuqinisekisi ukusebenza kahle kokushisa kwephakheji.

Ukulayisha ngomshini kungabaluleka njengokuqhutshwa kokushisa. Amaphakheji amakhulu, izinti zokuqinisa, amapuleti abandayo kanye namakheji okuxhumanisa kudala izikhathi zokugoba ezingacindezela amalunga e-solder kanye nama-microvia. Umdwebo webhodi kufanele uchaze ukujiya, ukuba yisicaba, ukugcina izinto zingena, ukubekezelelana kwemigodi yokufaka kanye nanoma yikuphi ukujiya kwendawo okulawulwayo. Ukuhlaziywa kokuhlanganiswa kufanele kucabangele i-warpage ngokusebenzisa ukugeleza kabusha kanye nokushisa kwesevisi.

Okokufaka kokukhishwa kokushisa/komshini

• amandla ephakheji kanye nesikhombikubona sokushisa esivunyiwe;
• ukunamathisela i-heatsink noma i-cold-plate kanye nomthwalo wokubopha;
• ingxenye kanye nangokugcina izinto ngaphansi kwehadiwe yemishini;
• ukwesekwa kwebhodi, ukuqina kanye nemikhawulo yeshasi;
• umnsalo/ukujiya okuvunyelwe kanye nokulingana kwendawo;
• izinga lokushisa kanye nemijikelezo yokushisa elindelekile;
• i-CTE yezinto ezibonakalayo kanye nokulingana kwe-hybrid-stack.

I-geometry ye-etch eguquguqukayo yethusi esindayo, ukugcwaliswa kwe-resin kanye nokuziphatha kwe-lamination. Izinhlamvu zemali zethusi kanye ne-inlays kuyizinto ezikhethekile ezidinga ubukhulu obucacile, indlela yokubopha, ukuba yisicaba kanye nezindlela zokuhlola; akufanele zethulwe njengezinketho ezijwayelekile kuwo wonke amabhodi e-AI.

Ukuthembeka, Ukuhlolwa kanye Nokulandelela

Ukusetshenziswa kwesikhungo sedatha akusho ngokuzenzakalelayo i-IPC Class 3, futhi umkhiqizo we-AI wezohwebo awuzuzi isitifiketi sezimoto, sezokwelapha noma sezindiza esivela egameni elithi “AI.” Isigaba sokusebenza esisebenzayo kanye nohlelo lwekhwalithi luvela engcupheni yomkhiqizo, izidingo zamakhasimende kanye nemibhalo yokuthenga.

Kumabhodi aqinile, i-IPC-6012 ngokuvamile iwumndeni ofanele wokusebenza komkhiqizo; amabhodi aqinile asebenzisa i-IPC-6013, futhi ukwakheka okuvame kakhulu kungasebenzisa i-IPC-6018 lapho kufanele khona. I-IPC-A-600 inikeza incazelo ebonakalayo kodwa ayithathi indawo yencazelo yomkhiqizo. Ukubuyekezwa, ikilasi, izengezo kanye nokukhishwa kwamakhasimende kumele kushiwo ku-oda.

Ubufakazi bokuthembeka bungafaka phakathi ukususwa kwe-thermal-stress microsections, ukuhlolwa kokucindezeleka kokuxhumana, i-HATS, ukujikeleza kokushisa, ukulingisa kabusha, ukuhlolwa kwe-CAF, amakhuphoni okufakwa kokulahlekelwa noma izimfanelo zemvelo ezingeni lomkhiqizo. Lezi zindlela ziphendula imibuzo ehlukene. Izindlela zokuhlola izingxenye ze-JEDEC azichazi ngokuzenzakalelayo ukwamukelwa kwe-lot ebhodini elingenalutho, futhi i-IST akuyona nje umjikelezo wekamelo le-−40 deg C kuya ku-+125 deg C.

Amarekhodi avame ukucatshangelwa izinhlelo ezinobungozi obukhulu

• isitifiketi sokuhambisana nokuqinisekiswa kokuhlolwa kukagesi;
• ukuqoqwa okukhishwe kanye nokulandeleka kwezinto/inqwaba;
• Imiphumela ye-TDR yamakhuphoni e-impedance acacisiwe;
• imiphumela yesigaba esincane sezakhiwo kanye nohlelo lwesampula olu-odiwe;
• ukuqinisekiswa kokujula okulawulwayo noma kokubhoboza emuva lapho kudingeka khona;
• imibiko yesihloko sokuqala noma yeziqu zezakhiwo ezintsha ze-HDI;
• ukulandelelana kwe-serialization kanye nokulandelelwa kwenqubo-abahambi lapho kudingeka ngokwesivumelwano.

Akuwona wonke ukuthunyelwa odinga umbiko ngamunye. Isilinganiso kufanele sihlukanise amarekhodi ajwayelekile, imibiko yokuzikhethela, ukuhlolwa okubhubhisayo kanye nomsebenzi wokufaneleka odinga amakhuphoni azinikele noma amaphaneli engeziwe.

Iphakheji Yokukhishwa Nokucaphuna Kokukhiqiza

Ikhotheshini ewusizo ayikwazi ukukhiqizwa kusukela ku-“board yeseva ye-AI yezendlalelo eziyi-10” kanye nohlaka. Umhlinzeki udinga ulwazi olwanele lokuhlukanisa ibhodi yokuphatha kusuka ku-retimer noma ikhadi le-accelerator elinesivinini esikhulu nokubona ukuthi ingozi yenqubo igxile kuphi.

Impendulo ye-DFM kufanele ibuyisele i-stackup yokukhiqiza ehlongozwayo, i-geometry ye-impedance eqediwe, okuhlukile okutholiwe, izibikezelo zenqubo ekhethekile kanye nezinto zokugunyazwa. Ikhotheshini eshintsha buthule izinto, ishintsha ukwakheka kwe-via noma isusa umbiko odingekayo ayilingani ngokobuchwepheshe.

Thumela i-AI Infrastructure PCB ukuze ibukezwe njengobunjiniyela