Ukukhiqizwa kwe-PCB yamaseli amancane e-5G yengqalasizinda ye-RF kanye ne-Telecom

I -PCB yeseli elincane le-5G ingasho ihadiwe ehluke kakhulu kuye ngokuthi umkhiqizo uyiseli elincane elihlanganisiwe, iyunithi yomsakazo ngaphakathi kwesakhiwo esingahlanganisiwe, i-node yebhizinisi langaphakathi, noma okunye ukusetshenziswa kwe-RAN ehlanganisiwe. Izinto zokubhekisela ze-Small Cell Forum ziyaqaphela ngokucacile ukwakheka kwamaseli amancane amaningi e-5G kanye nezinhlobo zomkhiqizo, ngakho-ke akukho "i-5G PCB stackup" ebanzi. Uhlelo lokukhiqiza kumele lulandele ububanzi bangempela bemvamisa ye-3GPP NR, ukwakheka kwe-RF front-end, ukwahlukaniswa kwe-baseband/PHY, izinga lamandla, ukuqaliswa kwe-antenna, i-enclosure, kanye nendlela yokupholisa. I-Highleap Electronics isekela ukukhiqizwa kwe-PCB yokuxhumana ye-5G , ukwenziwa kwe-multilayer ephansi, izakhiwo ze-HDI, kanye nokuhlanganiswa kwe-turnkey kwehadiwe ye-telecom eyakhelwe kudatha ye-RF evunyelwe ngamakhasimende kanye nomklamo wedijithali.

1. Izidingo ze-PCB yamaseli amancane angu-5G zincike kusakhiwo somsakazo

Iseli elincane le-5G lingahlanganisa ukucutshungulwa kwe-baseband, imisebenzi yomsakazo, i-RF front end, isikhathi, ukuguqulwa kwamandla, i-network interfaces, kanye nama-antenna endaweni eyodwa. Amanye aklama imisebenzi ehlukene kuwo wonke amabhodi omsakazo nawedijithali. Umsebenzi we-5G we-Small Cell Forum uchaza nokucushwa komkhiqizo okuhlanganisiwe nokungahlukaniswanga, yingakho umhlinzeki we-PCB kufanele abuze ukuthi ibhodi lenzani ngempela ngaphambi kokuphakamisa izinto noma izinqubo.

1.1 Ibhodi Yomsakazo kanye neBhodi Yedijithali Kungaba Nezakhiwo Ezihlukile Ezinhle

Ibhodi yomsakazo ibeka phambili ukulahlekelwa yi-RF, ukuhambisana kwesigaba, ukuhlukaniswa, ukuphathwa kokushisa, kanye nokuguqulwa kwesixhumi/i-antenna. Ibhodi yedijithali ingase ibeke phambili ama-SerDes asheshayo, inkumbulo ye-DDR, umzila wokuphuma kweprosesa, ubuqotho bamandla, kanye nokuhlanganiswa kwe-BGA eningi. Eminye imikhiqizo ihlangana kokubili ku-PCB eyodwa exubile; eminye isebenzisa amabhodi ahlukene axhunywe ngokusebenzisa izixhumi ezisheshayo.

1.2 Ungasebenzisi i-“5G” njengencazelo yezinto ezibonakalayo

Igama elithi 5G alisho lutho mayelana ne-Dk, i-Df eqondile, iphrofayili yethusi, inani lezingqimba, noma ubuchwepheshe obudingekayo. Lokhu kuncike kuma-band okusebenza, ubude bomzila, isabelomali sokuguquguquka/i-vector-margin, ukwakheka kwezixhumi, kanye ne-interfaces zedijithali. I-laminate elahlekelwa kancane ingaba yinto ebalulekile ekwakhiweni okukodwa futhi ingadingeki kwenye.

1.3 Izimfanelo Zomkhiqizo Zibanzi Kunokukhiqiza i-PCB

Iseli elincane eliqediwe lingadinga umsebenzi wokuhambisana nomsakazo we-3GPP, iziqu zomsebenzisi, i-EMC, ukuphepha, ukuvunyelwa kwemvelo, kanye nezifunda. Ukwenziwa kwe-PCB kanye nokuhlolwa kwe-PCBA kusekela ukuphindaphindeka kodwa akuthathi indawo yalezo zinhlelo zezinga lesistimu.

2. Amabhodi Amancane e-FR1 kanye ne-FR2: Izinto Eziza Kuqala Ezokukhiqiza Ezihlukene

Imininingwane ye-3GPP NR ihlukanisa ukusebenza kwe-FR1 kanye ne-FR2; imininingwane emisha ihlukanisa kakhulu i-FR2-1 kanye ne-FR2-2. Ekukhiqizweni kwe-PCB, okufakiwe okuwusizo yibhendi yokusebenza yangempela, ukwakheka kwe-RF, izixhumi ezibucayi, kanye nezidingo zesiteshi—hhayi ilebula ejwayelekile ethi “5G” noma “FR2”. Ngakho-ke umkhiqizo weseli elincane ungadinga ukwakheka kwebhodi okuhlukile kakhulu kuye ngokusetshenziswa komsakazo.

2.1 Amaseli Amancane e-FR1 Avame Ukuhlanganisa i-RF kanye ne-High-Speed ​​​​Digital kuma-PCB e-Multilayer

Imiklamo ye-FR1 ingasebenzisa izakhiwo zokudlulisa ze-PCB ezivamile ngaphezu kwamabanga asebenzayo, kodwa ukulahlekelwa, ukuvinjelwa, ukuhlukaniswa, kanye nokusebenza kokushisa kwe-amplifier yamandla kusabalulekile. Imindeni ye-hydrocarbon/ceramic noma ye-laminate esezingeni eliphezulu elahlekelwa kancane ingasetshenziswa lapho isabelomali se-RF noma sesiteshi sedijithali siyidinga khona.

2.2 Ingabe Wonke Amaseli Amancane e-5G ayi-mmWave PCB?

Cha. Imikhiqizo eminingi yamaseli amancane e-5G isebenza ku-FR1 futhi ayiwona amabhodi amagagasi e-millimeter. Imiklamo ye-FR2 isebenza kumaza amagagasi e-millimeter, lapho ukulahlekelwa kokuxhumana kanye nokuzwela kokuguquka kungaba okubaluleke kakhulu. Ezinye izakhiwo zinciphisa ubude bendlela ye-PCB RF ngokuhlanganisa ama-antenna kanye ne-elekthronikhi yangaphambili kumamojula; lapho i-PCB eyinhloko isaphethe izakhiwo ze-mmWave, ukubekezelelana kwezinto, ubulukhuni bethusi, ukubhaliswa, ukuqeda ubuso, kanye ne-geometry yokuqalisa kudinga ukulawulwa okuqinile.

2.3 Umenzi Udinga Ibhendi Yangempela Namanethi Abalulekile

I-RFQ ethi “ibhodi le-5G” kuphela ayanele. Okungenani, thola ukuthi yiziphi izendlalelo kanye nezixhumi ezibonakalayo ezibalulekile kwi-RF, izakhiwo ezifanele ze-impedance, izinto eziqondiwe, izinto ezithathelwe indawo ezamukelekayo, kanye nanoma yiziphi izidingo zekhuphoni noma zokuhlola. Lokhu kuvumela umenzi ukuthi agxile enqubweni yokulawula izakhiwo eziqhuba ukusebenza.

3. Ama-Stackup e-PCB Aphansi kanye nama-Hybrid Okucubungula Idijithali ye-RF Plus

Ihadiwe yamaseli amancane ivame ukudinga ukusebenza kwe-RF kanye nomzila we-multilayer ongabizi kakhulu. I-hybrid stackup ingabeka izinto ze-RF ezilahlekelwa kancane kuphela lapho inikeza khona inani ngenkathi isebenzisa izinto zedijithali ze-FR-4-family noma zejubane eliphezulu kwenye indawo, kodwa i-mixed-material lamination kumele iklanywe ngokucophelela.

3.1 Ingabe i-PCB ngayinye yamaseli amancane e-5G iyayidinga i-Rogers noma i-PTFE?

Cha. I-PCB encane ye-5G ayidingi ngokuzenzakalelayo i-Rogers, i-PTFE, noma yimuphi umndeni owodwa we-laminate. Ukukhethwa kwezinto kufanele kulandele ibhendi yokusebenza, isabelomali sokufakwa-ukulahlekelwa, ubude bendlela ye-RF, izidingo zesiteshi sedijithali, izidingo zokushisa/ukuthembeka, izindleko, kanye nokwakheka okuphelele. I- hybrid RF / FR-4 stackup ingaba usizo lapho izinto ezilahlekelwa kancane zivunyelwe kuphela ezingqimbeni ezikhethiwe, kodwa i-mixed-material lamination kumele ibuyekezwe ukuze kutholakale ukuqina kwe-dielectric okuhambisanayo, ukuziphatha kokulungisa, ukuzinza kobukhulu, kanye nokwakhiwa kwe-bonding.

I-Highleap isebenza ngezinto ze-RF kanye nezinto zokulahlekelwa okuncane ezisetshenziswa emikhiqizweni yezokuxhumana, kufaka phakathi izinhlobo ezichazwe ezinsizeni zethu zokukhetha izinto ze-RF PCB . Ukuhlolwa kokugcina kwezinto kanye nanoma yiziphi izindlela ezilinganayo ezivunyiwe kufanele zihlale zixhunywe ezidingweni zikagesi nezethembekile zekhasimende.

3.2 I-Dk Akuyona Inombolo Eyodwa Yendawo Yonke

Amashidi edatha e-laminate angabhala amanani ahlukene e-Dk kuye ngendlela yokuhlola kanye nemvamisa. Abaklami kufanele basebenzise inani elifanele i-field solver yabo kanye nemodeli yezinto ezibonakalayo, bese behlobanisa amakhuphoni enziwe noma izakhiwo zokuhlola njengoba kudingeka. Ifektri ye-PCB akufanele ithathe indawo ye-laminate ngoba nje amashidi edatha amabili abonisa isihloko esifanayo se-Dk.

3.3 Iphrofayili Yethusi Ingathinta Ukulahlekelwa

Ithusi elisezingeni eliphansi linganciphisa ukulahlekelwa umqhubi ezindleleni ezivame kakhulu, kodwa i-foil yethusi ekhethiwe nayo ithinta ukunamathela, ukuziphatha kokwenziwa, kanye nokutholakala. Uma iphrofayili yethusi ibalulekile ngogesi, yichaze ku-stackup noma ku-callout yezinto esikhundleni sokucabanga ukuthi wonke ama-foil ethusi ayalingana.

4. Ukuqaliswa kwe-RF, Ngokushintshashintsha, Izindiza Ezibhekiselayo, kanye Nemiphumela Yomphezulu Wethusi

Iphuzu le-RF elibuthakathaka kakhulu livame ukuba ushintsho kunokuba kube umkhondo omude oqondile. Izixhumi, ama-via, izinguquko zesendlalelo, ama-component pad, ukuqaliswa kwesihlungi, kanye nokuguqulwa kube amamojula e-RF kuletha ukungaqhubeki.

4.1 Umklamo Wendlela Yokubuyela Ngendlela Yokuguquka Ngezinguquko

I-signal via kufanele icatshangelwe kanye nama-ground vias aseduze, i-antipad geometry, izinguquko ze-reference-plane, kanye nobude be-stub obungasetshenziswanga. Umhlahlandlela wethu wokuklama we-RF PCB via uhlanganisa iziguquguquko zokukhiqiza ngemuva kwalezi zinguquko. Ama-back-drilling noma ama-blind vias anganciphisa imiphumela ye-stub lapho imodeli yesiteshi ibonisa ukuthi ukuthuthukiswa kuyadingeka. Ekukhiqizeni, izidingo zokujula okulawulwayo kumele zichazwe ngokucacile kuthebula lokubhoboza.

4.2 Ukuqaliswa Kwesixhumi Kufanele Kuqandiswe Nge-Stackup

Izixhumi ze-RF ze-coaxial noma zebhodi kuya ebhodini zincome amaphethini omhlaba, kodwa ukuqaliswa kwe-PCB okuhle kakhulu kuncike nasekujikeni kwe-dielectric kanye ne-geometry yereferensi. Ukuguqulwa kwephedi/i-antipad ngesikhathi se-CAM kungashintsha ukulahlekelwa kokubuya. Ukuqaliswa okubalulekile kufanele kumakwe njengezindawo ezingaguquki ngaphandle kokuthi ubunjiniyela buvuma ushintsho.

4.3 Ukuphela Komphezulu Kuyingxenye Ye-RF kanye Nokuhwebelana Komhlangano

I-ENIG, isiliva lokucwilisa, i-OSP, kanye nokunye ukuqedwa kunemiphumela ehlukene yokuhlanganiswa, isitoreji, ukulingana, ukuthintana, kanye ne-RF. Ukukhetha okungcono kuncike esakhiweni se-RF esiveziwe, izidingo zokuxhumana kwesixhumi, ukuhlanganiswa kwe-fine-pitch, isikhathi seshelufu, kanye nenqubo yamakhasimende. Umhlahlandlela wokuqeda ubuso be-PCB we-Highleap ungasetshenziswa ukuxoxa ngalezi zinguquko ngaphambi kokukhishwa kokwenziwa.

5. I-HDI, i-BGA Assembly, Izindlela Zokushisa Ze-Power Amplifier, kanye ne-Shielding

Amaseli amancane avame ukuhlanganisa amaprosesa aminyene, ama-FPGA/SoC, ama-transceiver e-RF, ama-amplifiers wamandla, iwashi, inkumbulo, kanye nokuguqulwa kwamandla endaweni evalekile evinjelwe. I-Highleap isekela ukwenziwa kwe-PCB ye-high-frequency/RF kanye ne-HDI, ukutholakala kwezingxenye, ukuhlanganiswa kwe-BGA/SMT, ukuhlanganiswa kwesivikelo, ukuhlolwa kwe-AOI/X-ray kanye nokuhlolwa kokusebenza okuchazwe ngamakhasimende noma kwe-RF lapho kunikezwa khona indlela nemikhawulo ebhaliwe. I-PCB kufanele isekele kokubili ubuningi bomzila kanye nokususwa kokushisa.

5.1 I-HDI Ingagcina Izindlela Zesivinini Esiphezulu kanye Neze-RF Zifushane

Ama-Microvia, ama-via-in-pad, ama-via agqitshwe, kanye nezakhiwo ezakha ngokulandelana zivumela ukuphuma kwe-BGA eningi futhi zinciphise isidingo sokujikeleza isikhathi eside phakathi kwamathambo nenja. Lezi zici kufanele zikhethwe ngokusekelwe ezidingweni zephakeji kanye neziteshi. Ukwenziwa kwe-HDI PCB ye-Highleap kusekela imiklamo edinga ukuxhumana okubhobozwe nge-laser kanye nokujikeleza okuhlanganisiwe.

5.2 Ama-Amplifiers Amandla Adinga Indlela Yokushisa Ecacisiwe

Amadivayisi kagesi e-RF angasebenzisa ama-thermal pad abonakalayo, izakhiwo ze-copper coin, ama-thermal via arrays, ama-heat spreader, noma ama-interface aqondile ku-chassis. Ukuphathwa kwe-RF kanye ne-microwave PCB thermal kumele kuchazwe kanye nendlela yokuvala kanye nokupholisa ngomshini. Indlela ephumelela kakhulu incike emandleni ahlakazekile, iphakheji, ukunyuka kwezinga lokushisa okuvunyelwe, kanye nomklamo wokupholisa ngomshini. Ukukhiqiza kufanele kulondoloze izakhiwo ze-via fill/cap nezethusi ezidingwa yimodeli ye-thermal.

5.3 Izinguquko Zokuvikela Uchungechunge Lokuhlanganiswa

Amafreyimu okuvikela e-RF , izembozo, ama-absorber, ama-thermal pad, kanye nama-heat spreader angadinga i-oda elichaziwe lokuhlangana. Ivolumu yokunamathisela yohlaka lwesivikelo, ama-grounding pad, i-coplanarity, kanye nokufinyelela kabusha kufanele kucatshangelwe ngesikhathi se-DFA. Inqubo yokuhlangana ye-BGA ne-SMT ye-Highleap ingafaka lezi zinyathelo zomshini kanye ne-soldering zephrojekthi ethile.

6. Ukuhlolwa Nokuhlolwa: Lokho Umkhiqizi we-PCB Angakuqinisekisa Ngaphambi Kokufaneleka Kwe-RF Yesistimu

Uhlelo lokuhlola ukukhiqiza kufanele luqinisekise izimfanelo ifektri engazilawula futhi luzihlukanise ngokusobala nezimfanelo zesistimu yomsakazo.

6.1 Ukulawula Okungenalutho

Ukuhlolwa okufanele kungafaka phakathi ukuqhubeka/ukuhlukaniswa kukagesi, ukuhlolwa kobukhulu, amakhuphoni okulawula ukuvimba, ukuhlaziywa kwe-microsection, ukuqinisekiswa kwe-plating, ukuhlolwa kwe-solder-mask/finish, kanye nokubhalwa kwezinto/i-lot uma kudingeka. Amakhuphoni okuhlola i-RF angasetshenziswa futhi uma ikhasimende linikeza isakhiwo nendlela yokulinganisa.

6.2 Izilawuli Zokuhlanganisa

I-SPI, i-AOI, kanye ne-X-ray kukhethwa ngokwengozi yephakheji. I-X-ray iwusizo ikakhulukazi kuma-BGA/LGA/QFN kanye nama-thermal-pad joints angabonakali ngqo. Ukuhlolwa kwesihloko sokuqala kungaqinisekisa ubunikazi bengxenye, ukuqondiswa, indawo, ihadiwe yemishini, kanye nokuhlanganiswa kwesihlangu ngaphambi kokuba kuqhubeke yonke indawo.

6.3 Ingabe Umkhiqizi we-PCB Angakwazi Ukuqinisekisa Umkhiqizo we-5G?

Ukwenziwa okuvamile kanye nokuhlolwa kokuhlanganiswa akusho ukuthi isitifiketi se-3GPP, umqhubi, i-OTA noma sokulawula. Ifektri ye-PCBA ingenza ukuvuselelwa kwamandla, ukuhlela, ukuxhumana kwenethiwekhi, ukuhlolwa kwesikhathi, i-I/O yedijithali, kanye nokuhlolwa kwe-RF PCB okuchazwe ngamakhasimende lapho ukufinyelela kokuhlola, imishini elinganisiwe, isofthiwe, izinto ezifakiwe kanye nemikhawulo yokupasa/yokwehluleka kutholakala. Ukuhambisana kwe-3GPP, ukwamukelwa komqhubi, ukusebenza kwe-antenna ye-OTA, kanye neziqu zokulawula kuhlala kuyimisebenzi ehlukile yezinga lesistimu.

7. Uhlu Lokuhlola lwe-RFQ lwe-PCB Yeseli Encane ye-5G Lokwenziwa kanye ne-Turnkey PCBA

I-RFQ yamaseli amancane ephelele ngobuchwepheshe kufanele ifake:

• Idatha ye-Gerber/ODB++, amafayela okubhoboza, umdwebo wokukhiqiza, kanye nemikhawulo yamaphaneli uma ikhona
• I-stackup ephelele ene-laminate eqondile, ubukhulu be-prepreg/core, isisindo sethusi, kanye nezidingo zephrofayili yethusi lapho kubalulekile khona
• Umongo wohlelo lokusebenza lwe-FR1/FR2, amabhendi okusebenza angempela, kanye nokuhlonza izendlalelo/izixhumi ezibucayi ze-RF
• Izinhloso zokuvimbela ukulawulwa, ukubekezelelana, kanye nezidingo zekhuphoni
• Izidingo zokubhoboza ngemuva, ezingabonakali/ezingcwatshwe nge-microvia, i-via-in-pad, kanye nokugcwalisa/ukuvala
• Izidingo zokuqeda phezulu kanye ne-RF-copper eveziwe
• I-BOM enezingxenye ze-RF, amaprosesa, amadivayisi kagesi, amawashi, izixhumi, kanye nezinye izindlela ezivunyiwe
• Imidwebo yokukhetha nokubeka kanye nokuhlanganisa, imininingwane yesivikelo/isinki sokushisa/isixhumi esibonakalayo esishisayo
• Izinqubo zohlelo, ukulinganisa, ukuhlolwa kokusebenza, kanye nokuhlolwa kwe-RF
• Ukulandelelwa kwezinto, imibiko yokuhlola, kanye nezidingo zokulawula ushintsho ekukhiqizweni

Ngehadiwe entsha yomsakazo, i -PCB yesibonelo elawulwayo kanye nokwakhiwa kwe-PCBA yokuhlola kusiza ukuhlanganisa izinto, ukuqoqa, ukuqaliswa kwe-RF, ukwakheka kokushisa, kanye nokuhlanganiswa nokusebenza kwesistimu okulinganisiwe ngaphambi kokukhishwa kwevolumu. I-Highleap Electronics ingabuyekeza idatha yokukhiqiza futhi icaphune ukwenziwa kwe-PCB, ukutholakala kwezingxenye, ukuhlanganiswa, kanye nobubanzi bokuhlola/bokuhlola obuchazwe yiphrojekthi. Ukuze uthole izinto ezihlobene nokukhiqizwa kwebhodi yomsakazo, bheka ukukhiqizwa kwe-RF PCB kwethu kwemithombo yamadivayisi e-5G.