5G HDI PCB Design and Material Guide | I-Highleap Electronics

Isingeniso

Ukuthunyelwa kwamanethiwekhi angenantambo esizukulwane sesihlanu kuziguqule ngokuyisisekelo izimfuneko zedizayini yebhodi lesifunda eliphrintiwe. Njengoba amasistimu e-5G esebenza kuzo zonke izibukeli zefrikhwensi eziya ngokuya ziyinkimbinkimbi ukusuka kuma-sub-6GHz ukuya kuma-millimeter-wave bands, isidingo sezisombululo zokuxhumanisa okuthuthukile siye sakhula. Ubuchwepheshe be-5G HDI PCB bubhekana nalezi zinselele ngokuhlanganiswa kokuminyana okuphezulu, ukulawula okuqondile kokuvimba, kanye nezakhiwo zendlela yesignali ethuthukisiwe amabhodi ezendlalelo eziningi ezivamile angeke akwazi ukuyifeza.

Amabhodi wesekethe aphrintiwe axhumene ngobuningi obukhulu avumela ukwenziwa okuncane kanye nokuthuthukiswa kokusebenza okubalulekile kumamojula we-RF wesimanje. Ngama-microvia, ama-trace amahle, kanye nama-stackup e-layer ayinkimbinkimbi, imiklamo ye-5G HDI PCB isekela izici zikagesi eziqinile ezidingekayo ekudlulisweni kwedatha ngesivinini se-gigabit ngenkathi igcina ubuqotho besiginali kuzo zonke izizinda eziningi zemvamisa.

Kungani Amamojula e-5G RF Adinga Ubuchwepheshe be-HDI PCB

Izinselele ze-Spectrum Frequency

Amasistimu angenantambo esizukulwane sesihlanu asebenza kumabhendi efrikhwensi ahlukahlukene asukela ku-sub-6GHz ukuya kububanzi begagasi be-millimeter ku-28GHz kanye no-39GHz. Ibhendi ngayinye yefrikhwensi yethula izidingo ezihlukile zikagesi ezithinta ngokuqondile imingcele yedizayini ye-PCB. Amasignali amafrikhwensi aphezulu akhombisa ukuzwela okwedlulele ekulandeleni i-geometry, izakhiwo ze-dielectric, nezakhiwo zokuxhumanisa, okwenza ubuchwepheshe obujwayelekile be-PCB bunganele ezinhlelweni ze-RF ezithuthukisiwe.

Imikhawulo ye-PCB Yendabuko

Amabhodi ezendlalelo eziningi ajwayelekile ahlangabezana nezithiyo ezibalulekile zokusebenza ezindaweni ezinemvamisa ephezulu. Nge-Hole Vis yethula i-parasitic inductance namandla ahlanekezela amagagasi esignali futhi adale ukungaqhubeki kwe-impedance. Ukuminyana komzila okulinganiselwe kukhawulela izinketho zokubeka izingxenye, okuphoqelela imizila yesignali ende ekhulisa ukulahlekelwa kokufaka kanye nokuphazamiseka kazibuthe kagesi.

Izinzuzo ze-HDI Technology

I-High-density interconnect architecture inqoba le mikhawulo ngokusebenzisa ama-microvias adotshwe nge-laser anciphisa imiphumela ye-parasitic kuyilapho evumela izindlela zesignali ezimfushane. Idizayini ye-RF HDI ihlanganisa izakhiwo ezithuthukile ezifinyelela ukuminyana komzila okungenakwenzeka ngokumba ngomshini:

• Ukubekwa ngephedi - Isusa ama-stub resonances futhi inike amandla ukukhweza okuqondile kokuxhumanisa.
• Ikhono lomugqa omuhle - Landelela ububanzi kuze kufike kuma-microns angama-50-75 asekela ukulawulwa okuqondile kwe-impedance nge-crosstalk encishisiwe.
• I-lamination elandelanayo - Inika amandla ukuxhumeka kwanoma yisiphi isendlalelo ngenkathi igcina ubuqotho besignali kuyo yonke i-spectrum yefrikhwensi.

Ukukhethwa Kwezinto Zokusebenza kwe-5G HDI PCB

Izidingo Zokusebenza Kwe-Dielectric

Ukukhetha okubalulekile kunquma ngokuqondile ikhwalithi yesiginali kuzinhlelo zokusebenza zamafrikhwensi aphezulu. Izici eziphansi ze-dielectric (Dk) kanye ne-low dissipation factor (Df) zinciphisa ukuncishiswa kwesignali kanye nokuhlanekezelwa kwesigaba kuwo wonke amabhendi efrikhwensi ye-RF. Izakhiwo zikagesi ezizinzile kukho konke ukuhlukahluka kwezinga lokushisa ziqinisekisa ukusebenza okungaguquguquki ezindaweni zokusebenza ezifunayo lapho imihlangano ye-5G HDI PCB kufanele igcine ukucaciswa okunembayo.

Izinketho ze-Laminate eziphakeme kakhulu

Izinhlelo zokusebenza ze-RF ezithuthukisiwe zidinga izinto ezikhethekile ze-substrate ngale kwe-FR-4 ejwayelekile. I-laminate ekhethekile ephansi yokulahlekelwa kanye ne-laminate ekhethekile ephansi yokulahlekelwa inikeza amanani e-Dk aphakathi kuka-3.38 no-3.48 anezimpawu eziphansi kakhulu zokulahlekelwa ezifanele amaza e-microwave. I-Panasonic Megtron 6 inikeza ibhalansi ephumelelayo phakathi kokusebenza kanye nokukhiqizwa kwezinhlelo zokusebenza ezingaphansi kwe-6GHz, kuyilapho izinto ezisekelwe ku-PTFE ezifana ne-Taconic RF-35 ziletha ukusebenza kukagesi okuphezulu kumaza e-millimeter-wave.

Ukuhwebelana Kokusebenza Okubalulekile

Ama-substrates ajwayelekile e-FR-4 abonakala engabizi kakhulu kodwa abonisa ukulahlekelwa okukhulu kwe-dielectric ngaphezu kuka-2GHz, okuwenza angafaneleki ukufuna izicelo ze-5G. Ama-laminates ama-High-frequency laminates athuthukisa kakhulu ukusebenza kukagesi ngenkathi ethula ukucatshangelwa kokukhiqiza okuhlanganisa izindleko eziphezulu zempahla kanye nezidingo ezikhethekile zokucubungula. I-coefficient yokumatanisa kokunwetshwa okushisayo phakathi kwezendlalelo zezinto ezihlukene iba semqoka ekugcineni ukuthembeka kuwo wonke amabhayisikili okushisa, ikakhulukazi ekwakhiweni kwezinto eziningi ze-HDI PCB.

Idizayini yesitaki ye-5G HDI PCB Yobuqotho Besiginali

I-Core Stackup Architectures

Ukuqaliswa kwesitaki okusebenzayo kwe-5G HDI PCB kuvamise ukulandela ukulungiselelwa okungu-1+n+1 noma 2+n+2, lapho izendlalelo ezixhumene ezixhumene kakhulu endaweni engaphandle zixhumeka ezakhiweni ezivamile eziyinhloko. Imiklamo ye-HDI yanoma iyiphi isendlalelo inika amandla ukuxhumana okuqondile phakathi kwezendlalelo ezingasondelene, inciphisa ngokubala nokunciphisa ubude bendlela yesignali. Le ndlela ifakazela ukuthi ibaluleke kakhulu kumamojula e-RF ayinkimbinkimbi lapho izingqimba zamasignali eziningi ezilawulwa yi-impedance kufanele zihlangane namanethiwekhi okusabalalisa amandla.

Ukucushwa Kwendiza Eyisethenjwa

Izindiza eziyisithenjwa eziqinile ezibekwe eduze kwezendlalelo zesignali zihlinzeka ngendawo elawulwayo ye-impedance futhi zinciphisa ukuphazamiseka kozibuthe. Amandla alinganayo nokubekwa kongqimba lomhlabathi kudala izitaki ezilinganayo ezinciphisa i-warpage ngesikhathi sokucubungula okushisayo. Amasu ngokubeka axhumanisa izindiza eziyizethenjwa ngezikhathi ezijwayelekile, zigcine izindlela zokubuya ezine-inductance ephansi ebalulekile kubuqotho besignali yemvamisa ephezulu.

I-Microvia Implementation Isu

Ubuchwepheshe be-Via-in-pad buqeda ubude be-stub obubangela ukuboniswa kwesignali, okubaluleke kakhulu ngaphezu kuka-10GHz lapho ama-quarter-wavelength stubs adala ama-resonances. Ama-microvias angcwatshwe nangaboni anika amandla ukubekwa kwengxenye eminyene kuyilapho elondoloza iziteshi zomzila ukuze zilandele umkhondo olawulwayo we-impedance. Lezi zakhiwo zidinga ama-vias agcwaliswe futhi ahlelwe ukuze kuqinisekiswe ukunamathela kwengxenye okuthembekile, iletha izinzuzo ezibalulekile zokusebenza zemiklamo ye-millimeter-wave.

I-Dielectric Thickness Control

Isikhala sesendlalelo kuya kwesendlalelo sinquma ngokuqondile ukuthintana kwesici se-microstrip ne-stripline geometries. Ukulawula ukubekezelelana kuba bucayi kakhulu kumafrikhwensi aphezulu lapho ukuhluka okuncane kwe-dimensional kuba nomthelela omkhulu ekusebenzeni kukagesi. Ukulawulwa okunembile kobukhulu obuyinhloko kanye nobukhulu be-prepreg kuqinisekisa i-HDI PCB yemiklamo ye-5G ihlangabezana nokucaciswa okuhlosiwe kokuphazamiseka kuyo yonke indawo yebhodi.

I-RF HDI PCB Isakhiwo sokucatshangelwa

Imigqa Yokudlulisa Imvamisa Ephakeme

Ukucushwa komzila we-Microstrip kanye ne-stripline kwakha isisekelo sedizayini ye-RF HDI yezindlela zesiginali ye-impedance elawulwayo. Ukulandela umkhondo we-Microstrip ezendlalelo zangaphandle kunikeza ukufinyelela okulula kokulungisa nokulinganisa kodwa kubonisa imisebe ye-electromagnetic. Umzila we-stripline phakathi kwezindiza eziyireferensi unikeza ukuhlukaniswa okuphezulu kanye nokukhishwa kwegesi okuncishisiwe, okubalulekile kumasekethe e-RF azwelayo adinga ukufana okunembile kwe-impedance.

Amasu okuhlukanisa amasignali

I-Via fencing idala imigoqo kazibuthe evimbela ukuhlangana phakathi kwamasekhethi e-RF azwelayo nezingxenye zokunengqondo zedijithali. Ground ngama-arrays azungeze ukulandelelwa kwefrikhwensi ephezulu kuhlanganisa izinkambu zikazibuthe futhi kunciphise i-crosstalk phakathi kwemizila yesignali ehambisanayo. Ukubekwa kwengxenye yamasu kuhlukanisa izigaba zokudlulisa amandla aphezulu ukusuka kumamukeli azwelayo, kuncishiswe ukuphazamiseka ngokusetshenziswa okufanele kokuhlukanisa isignali.

Ukuqinisekiswa Okushayelwa Ukulingisa

Izixazululi zensimu ye-Electromagnetic zinika amandla ukuqinisekiswa kwesakhiwo sangaphambilini samaphrofayili we-impedance, amapharamitha we-S, nezindlela zokuhlanganisa ekucushweni komzila okuyinkimbinkimbi. Ukuhlaziywa kobuqotho bamandla kukhomba ama-resonance kanye nokunqanyulwa okwanele ngaphambi kokwenziwa kwesibonelo. Ukulingisa kwesizinda sesikhathi se-time-domain kuveza ukungaqhubeki kokushintshashintsha, amaphedi engxenye, nezixhumi zokuxhumana, okufakazela ukuthi kubalulekile empumelelweni yokudlula yokuqala kumiklamo ye-millimeter-wave 5G HDI PCB.

Ukuphathwa kwe-Thermal kanye ne-EMI

Ama-amplifiers e-RF anamandla amakhulu akhiqiza ukushisa okukhulu okudinga i-thermal vias ukuxhuma ezindizeni zangaphakathi noma izendlalelo ezizinikele ezisakaza ukushisa. Amakhompathithi avikelayo noma ama-gasket e-conductive aqukethe izinto ezikhishwa yi-electromagnetic ezivela ezingxenyeni zokudlulisela kuyilapho evimbela ukuphazamiseka kwangaphandle ekuphazamiseni ukuzwela komamukeli. Amasu afanele okusungula kanye nokusebenza kwesihlangu kuba nomthelela ngokuqondile ekuthotshelweni kwe-EMI kwezinga lesistimu nokusebenza kokusebenza.

Izinselelo Zokukhiqiza ku-5G HDI PCB Production

Ukuthembeka kwe-Microvia

Ubuchwepheshe bokugaya nge-laser budala izimbobo ezinodayamitha ezincane ezibalulekile ezinhlakeni ezixhumene ezisondelene kakhulu, ngokuvamile ezisukela kuma-microns angama-75 kuye kwangama-150. Ukufana kwe-Copper Plating ngaphakathi kwalawa ma-microvias kuthinta ngqo ukuqhutshwa kukagesi nokuthembeka komshini:

• Ukwelashwa kwe-plasma desmear - Isusa i-resin smear futhi ivule izindonga zembobo ukuze zinamathele ethusi.
• Imbewu yethusi engenawo ugesi - Inikeza ungqimba olufanayo lwe-conductive ngaphambi kokusebenza kwephaneli yokucwenga.
• Ukulawulwa kwe-aspect ratio - Ukwakheka okulandelanayo kunika amandla ukufakwa okuthembekile kwezakhiwo ze-aspect ratio ephezulu.

High-Frequency Material Processing

Ama-laminates asekelwe ku-PTFE aletha izinselelo eziyingqayizivele zokukhiqiza uma kuqhathaniswa nama-substrates e-epoxy-glass yendabuko. Amazinga okushisa engilazi aphansi akhawulela ukucubungula amafasitela okushisa phakathi nemijikelezo yokuhlobisa. Ukulungiswa kwendawo ebonakalayo kudinga ukwelashwa okukhethekile ukuze kutholakale ukunamathela okwanele kwethusi, kuyilapho ukunemba kokubhaliswa kwesendlalelo kuba kudingekile kakhulu ngezitaki ze-dielectric ezixubile ezihlanganisa ama-FR-4 cores anezendlalelo eziphezulu zefrikhwensi.

Ukukhethwa Kokwelashwa Okungaphezulu

Ukukhetha ukuphela kwendawo kufanele kulinganisele izidingo zokusebenza kukagesi ngokuhambisana nenqubo yokuhlanganisa. Electroless nickel immersion gold (ENIG) ihlinzeka ngezindawo ezinokwethenjelwa ezithengiswayo kodwa yethula ukulahlekelwa okuncane ekusetshenzisweni kwefrikhwensi ephezulu. I-Electroless nickel electroless palladium immersion gold (ENEPIG) inikeza izici ezithuthukisiwe zokubopha izintambo ezibalulekile ekuhlanganisweni kwemojula ye-RF, kuyilapho isiliva lokucwiliswa siletha izakhiwo zikagesi ezinhle kakhulu ezinokonakala kwesignali okuncane kwezicelo ze-5G HDI PCB.

Izicelo Ezijwayelekile ze-5G HDI PCB Technology

Ingqalasizinda Yesiteshi Esiyisisekelo

Iziteshi ezinkulu ze-MIMO zifaka amaketanga okudlulisa nokwamukela, ngasinye sidinga ubudlelwano obunembayo besigaba obugcinwa ngokulawulwa komzila wokuvinjelwa. Amamojula wesikhulisi samandla adinga imiklamo ekwazi ukuphatha amazinga aphezulu wamanje kuyilapho ekhipha imithwalo eshisayo eshisayo. Amabhodi okucubungula i-Baseband ahlanganisa ukuxhumana kwedijithali okunesivinini esikhulu ne-RF front-end circuitry, okudinga ukuhlukaniswa ngokucophelela ngaphakathi kwezitaki ezihlanganisiwe ze-5G HDI PCB.

Amamojula Wokuhlanganisa Antenna

Ukwakheka kwe-Antenna-in-Package (AiP) kufeza ukwenziwa okuncane kakhulu ngokuhlanganisa izinto ezikhipha imisebe ngqo ne-RF transceiver die kubuchwepheshe obuthuthukisiwe be-substrate. Ama-array e-antenna ahlakaniphile ezinhlelo zokusebenza zokufaka imisebe adinga ukubekezelelana okuqinile kwemishini ukuze kulondolozwe ukunemba kwesikhala sezinto kuwo wonke ama-frequency e-millimeter-wave bands. Lezi zakhiwo ze-mmWave PCB zihilela amanethiwekhi okuphakelayo ayinkimbinkimbi anejubane lesigaba elilawulwa kahle kanye nokungalingani okuncane kwe-amplitude.

Izicelo Zezimoto kanye ne-IoT

Amasistimu e-radar yezimoto asebenza ku-77-81GHz adinga izindlela ezifanayo zokuklama imvamisa ephezulu njengengqalasizinda ye-5G ngaphakathi kwezidingo eziqine kakhulu zemfundo yezimoto. Amamojula okuxhumana emoto aya kuyo yonke into ahlanganisa amaphrothokholi angenantambo amaningi kuzinto ezihlangene lapho ubuchwepheshe be-HDI buvumela ukuminyana komzila odingekayo. Amasango e-IoT ye-Industrial ahlanganisa amaselula, i-WiFi, nezindawo zokusebenzela ezingenantambo, ezizuza kumakhono we-PCB we-5G RF module.

Amathrendi Azayo Ekuthuthukisweni kwe-5G HDI PCB

I-Advanced Interconnect Evolution

Ukwakhiwa kwe -HDI yanoma yiluphi ungqimba kuvumela ukuxhumana okuqondile phakathi kwezingqimba ezimbili ezingahleliwe, kususa imikhawulo yokunyathela kwengqimba kuya kwengqimba yezinqubo ezijwayelekile zokwakheka ngokulandelana. Ubuchwepheshe be-PCB obufana ne-substrate bunciphisa osayizi bezici ngaphansi kobubanzi bomugqa ongu-25-micron, busondela emandleni okusabalalisa kabusha kwe-semiconductor. Lezi zakhiwo zisekela ukuhlanganiswa kwe-RF front-end okuyinkimbinkimbi njengoba izibalo zesiteshi ziphindaphindeka ezinhlelweni ezithuthukisiwe ze-5G.

Ukuhlanganiswa Kwezinto Ezihlanganisiwe

Ukwakhiwa kwe-dielectric okuxubile kuhlanganisa ama-laminates aphezulu-frequency ezigabeni ze-RF nezinto ezingabizi kakhulu ze-FR-4 ezindaweni zokucutshungulwa kwedijithali. Izindlela zokuhlanganisa ezihlukene ezishumekiwe ezisebenzayo zifa ngqo kuma-PCB substrates, kuncishiswe izimuncagazi zoxhumano lwemisebenzi ebalulekile ye-RF. Izindlela ezithuthukisiwe zokucwenga zinika amandla ukuhlangana okuthembekile phakathi kwezinto ezingafani ngenkathi kugcinwa ukunemba kokubhalisa kubalulekile ekucacisweni kokusebenza kwe-5G HDI PCB.

Izidingo Zesizukulwane Esilandelayo

Ukuvela kocwaningo lwe-5G-Advanced kanye neyokuqala ye-6G kuqondise amafrikhwensi adlulela ngalé kuka-100GHz, okudinga amabhajethi okulahlekelwa aqinile kanye nosayizi besici abancane. Izinto zokulahlekelwa okuphansi kakhulu ezinezici zokushabalalisa ezingaphansi kuka-0.001 zidingeka njengoba imingcele yomkhawulokudonsa wesiginali ikhula futhi nezibalo zesiteshi zikhula. Izibalo zesendlalelo eziphakeme ezinezendlalelo ezingu-20-plus ezihlanganisa izifunda eziningi ze-HDI zizosekela ukuminyana kokuhlanganiswa okudingekayo kwingqalasizinda engenantambo yesizukulwane esilandelayo.

Isiphetho

Ubuchwepheshe be-high-density interconnect buhlinzeka ngesisekelo esibalulekile sokusebenza kwemojula ye-5G ne-RF ngokukhethwa kwempahla ekhethekile, izakhiwo zokupakisha ezithuthukisiwe, nezinqubo zokukhiqiza ezinembayo. Ukuqhubekela phambili kusuka kumabhodi ezendlalelo eziningi kuya ekwakhiweni okuthuthukisiwe kwe-5G HDI PCB kubhekana nezinselelo ezibalulekile ekusakazweni kwesignali yemvamisa ephezulu, okuvumela ukuminyana okuncane nokuhlanganisa okufunwa amasistimu angenantambo esimanje asebenza kusukela ku-sub-6GHz ukuya kuma-millimeter-wave frequency range.

I-Highleap Electronics iletha izixazululo eziphelele ze-HDI PCB eziklanyelwe izinhlelo zokusebenza ze-5G ne-RF:

• Ukuthengwa kwezinto ezithuthukile – i-laminate ekhethekile ene-low loss, i-Megtron, kanye ne-PTFE laminates enezakhiwo ze-dielectric eziqinisekisiwe zokusebenza kwemvamisa ephezulu.
• Amakhono okukhiqiza anembile - Ama-microvias adotshwe nge-laser asuka kuma-microns angama-75, umzila oqondile ukuya kuma-microns angama-50, kanye nokubekezelelana okulawulwayo kokubekezelela ngaphakathi ku-±5%.
• Idizayini yosekelo lokwenziwa – Ukuthuthukisa isitaki, ukubonisana kobuqotho besignali, nokubuyekezwa kwe-DFM yangaphambi kokukhiqiza ukuze kuqinisekiswe impumelelo yepasi lokuqala.
• Izinsizakalo ezigcwele zomhlangano we-turnkey - Ukuthola ingxenye, ukubekwa kwe-SMT, ukuhlolwa kwe-RF, nokuqinisekiswa okusebenzayo kokukhiqizwa kwamamojula okuphelele.

Xhumana nethimba lethu lonjiniyela ukuze nixoxe ngokuthi ubuchwepheshe bethu bokukhiqiza i-5G HDI PCB bungasekela kanjani ukuthuthukiswa komkhiqizo wakho okungenazintambo esizukulwaneni esilandelayo.