Umkhiqizi we-PCB we-HDI Wezingqimba Ezi-8 eShayina

I-Highleap Electronics inikeza ukukhiqizwa kwe-PCB ye-HDI enezingqimba ezingu-8 zemikhiqizo ye-elekthronikhi edinga umzila wokuxhuma okuphezulu, ukuxhumeka kwe-microvia, ukuphuma kwe-BGA okuqondile kanye nokwakhiwa kwezingqimba eziningi okuyinkimbinkimbi. Sibuyekeza i-stackup yangempela, ngezakhiwo, izinto zokwakha kanye nezidingo zokukhiqiza ezikhethekile ukuze simise umzila wokukhiqiza ofanele. Thumela amafayela akho e-Gerber noma e-ODB++ ukuze abuyekezwe ngobunjiniyela kanye nesilinganiso esithile sephrojekthi, kanye nokuhlanganiswa kwe-PCB okutholakalayo kumaphrojekthi okukhiqiza ahlanganisiwe.

I-PCB ye-HDI enezingqimba eziyisishiyagalombili ayichazwa ngokubalwa kwezingqimba zethusi kuphela. Isakhiwo sokwakheka, ukuxhumeka kwe-microvia, izidingo zokubhoboza kanye nokufaka amaplati, i-geometry yomqhubi, ukuqeda kwendawo kanye nezici zemishini konke kuthinta ukwenzeka kokukhiqiza, izindleko kanye nesikhathi sokuhola. I-Highleap ihlola lezi zidingo njengomklamo owodwa we-PCB ohlanganisiwe kunokuphatha isici ngasinye esikhethekile njengenketho ehlukanisiwe.

Amandla Okukhiqiza e-PCB e-HDI anezingqimba eziyi-8

I-Highleap Electronics ibuyekeza amaphrojekthi e-HDI PCB enziwe ngokwezifiso anezingqimba eziyisishiyagalombili ahilela ukuhanjiswa kwezingxenye ezixinene, ama-microvia abhobozwe nge-laser, ama-via angaboni futhi agqitshwe, ukuxhumeka kwe-BGA okune-pitch encane kanye nemininingwane kagesi noma yemishini edingayo. Inqubo efanele incike ephaketheni eliphelele lokwenziwa, kufaka phakathi ukuhlelwa kwezingqimba, ukuxhumeka, ukukhethwa kwezinto, ubukhulu bebhodi kanye nokubekezelelana okudingekayo.

Kuye ngomklamo, isibuyekezo sokukhiqiza singase sihlanganise lezi zidingo ezilandelayo:

• Izakhiwo ze-HDI: Imibono yokwakha engu-1+6+1 kanye no-2+4+2, i-lamination elandelanayo, ama-via angaboni futhi agqitshwe, ama-microvia ahlanganisiwe noma ahlanganisiwe, kanye nezakhiwo ezingaphakathi kwephedi.
• Umzila we-Fine-pitch: Indlela yokuphuma ye-BGA ne-CSP, ama-capture pad amancane, izidingo zokulandelela okuncane kanye nesikhala, kanye nokubhaliswa okulawulwayo phakathi kwezingqimba.
• Ngokugcwalisa kanye nokuvala: Ama-via acacisiwe agcwele i-resin noma agcwele ithusi, izindawo ezihleliwe kanye nezakhiwo ezimbozwe ngethusi lapho kudingeka khona ngomklamo.
• Izici ezikhethekile zemishini: Izinhlaka zamabhodi eziyinkimbinkimbi, izikhala ezimboziwe, imigodi egobile, imiphetho emboziwe, umzila olawulwayo ojulile, imigodi kanye nezici zokufaka ngokunemba.
• Izidingo zikagesi nezinto zokwakha: I-impedance elawulwayo, ukwakheka kwesivinini esikhulu noma kwe-RF, izinto ze-dielectric ezilahlekelwa kancane, izisindo zethusi ezixubile kanye nezakhiwo ezisebenzisa ukushisa.
• Ukuqeda kobuso kanye nokuhlangana komhlangano: I-ENIG, i-ENEPIG noma ezinye izinto ezihambisanayo ezicacisiwe, i-selectal contact plating, izikhala ze-solder-mask kanye nezidingo zokuhlanganiswa kwezingxenye.

Lezi yizidingo zobunjiniyela okufanele zihlolwe, akusona isiqinisekiso sokuthi yonke inketho ingahlanganiswa kuzo zonke izingqimba eziyisishiyagalombili. Isibonelo, umklamo odinga ama-microvia ahlanganisiwe, ithusi eligcwele i-via-in-pad kanye negolide eliqinile elikhethiwe lidinga ukulandelana kwenqubo okuhambisanayo okuvikela kokubili ukuxhumana kanye nama-component pad okugcina.

Ukuze uthole ulwazi olujwayelekile lokukhiqiza izingqimba eziningi, bheka ukukhiqizwa kwe-PCB kwezingqimba ezingu-8 . Kumaphrojekthi e-HDI, ukwakhiwa okwengeziwe kanye nokucubungula okukhethekile kumele kufakwe kuncazelo yokukhiqiza.

Izidingo Zobunjiniyela be-Stackup ne-HDI

I-stackup inquma ukuthi izingqimba zethusi eziyisishiyagalombili zixhumene kanjani, ukuthi ingakanani indawo yokuhambisa etholakalayo kanye nokuthi yiziphi izinqubo zokufaka i-lamination kanye nokubhoboza ezidingekayo. Ukukhetha phakathi kuka-1+6+1, 2+4+2 noma olunye uhlelo olufanelekile kufanele kusekelwe ekuphakameni kwezingxenye, ukuminyana kwe-routing, izidingo zikagesi, ngokuthembeka kanye nokwenzeka kokukhiqiza.

Ukwakheka okungu-1+6+1 kubeka ungqimba olulodwa lokwakheka ohlangothini ngalunye lwesakhiwo esiphakathi esinezingqimba eziyisithupha. Kungafanelana nemiklamo lapho ubuningi bomzila bungaphathwa khona ngokuhlelwa kokwakheka okulinganiselwe kakhulu. Ukwakheka okungu-2+4+2 kunikeza izendlalelo ezengeziwe zokwakheka ohlangothini ngalunye, okungenzeka kudale ukuguquka okwengeziwe komzila kodwa futhi kwethula izidingo ezengeziwe zokufaka i-lamination, ukubhoboza, ukugcwalisa kanye nokubhalisa. Azikho izakhiwo ezingcono kakhulu emhlabeni wonke; ukukhetha okulungile kuncike ekwakhiweni.

Ukubuyekezwa kobunjiniyela kufanele kuqinisekise okulandelayo ngaphambi kokukhiqiza:

• Incazelo yesendlalelo kanye ne-dielectric: Uchungechunge lwezendlalelo zethusi, ukwakhiwa kwe-core kanye nokwangaphambi kokulungiswa, ubukhulu be-dielectric, izinsimbi zethusi kanye nobukhulu bebhodi eliqediwe.
• Ngemephu yokuxhumana: Izendlalelo zokuqala nezokugcina zohlobo ngalunye lwe-via, ama-microvia spans, ukuxhumana okungaboni noma okufihliwe, kanye nokuhlelwa okuhlanganisiwe noma okuhleliwe.
• Imininingwane ye-Microvia: Ukuvulwa kwe-laser, i-geometry yokubamba iphedi, isikhombimsebenzisi sephedi eliqondiwe, indlela yokugcwalisa kanye nezidingo zokuvala ngethusi.
• Ukwenziwa kahle komugqa: Ububanzi kanye nesikhala esincane sokulandelela, amasongo ajikelezayo, ubukhulu bephedi kanye nezidingo zokubhalisa kusukela kungqimba kuya kungqimba.
• Ukusebenza kukagesi: Ama-targets okulawula ukuvimba, ukuqhubeka kwe-reference-plane, ukuguquka kwesignali okubalulekile kanye nanoma yiziphi izidingo zesivinini esiphezulu noma ze-RF.
• Izinto zokwakha kanye nezici zemishini: Ibanga le-laminate, izidingo zokushisa, iphrofayili yebhodi, imiphetho eboshwe nge-plated, izimbobo ezikhethekile kanye nanoma yikuphi ukucubungula okujulile okulawulwayo.

Ngokugcwalisa, ukufaka iplagi kanye nokuvala ngethusi akuzona izici ezishintshaniswayo. Kumiklamo ye-BGA ephithizela kahle, indawo edingekayo yephedi kanye nesakhiwo kufanele kuchazwe ngokucacile. Ngokufanayo, ithagethi yokuvimbela elawulwayo kufanele ibuyekezwe ngokuqhathanisa nokwakhiwa kwe-dielectric yangempela, i-geometry yomqhubi, izici zethusi nezinto ezibonakalayo kunokuba kube yi-stackup eqagelwayo.

Ukubuyekezwa kwe -Highleap kwe -PCB DFM kungasiza ekuboneni izingxabano zokukhiqiza futhi kucacise izidingo zobunjiniyela obuvulekile ngaphambi kokukhishwa kokukhiqiza. Uma iphrojekthi yakho idinga ukwakhiwa okuqinile kunokuba kube yibhodi le-HDI eliqinile, bheka ikhasi lethu elihlukile lokukhiqiza i-PCB eliqinile elinezingqimba eziyi-8.

Izindleko ze-PCB ze-HDI ze-Layer eziyi-8 kanye Nesikhathi Sokuhola

Izindleko ze -PCB ye-HDI enezingqimba ezingu-8 zincike endleleni yayo yokukhiqiza, hhayi nje ubukhulu bebhodi noma inani lezingqimba zethusi. Izigaba ezengeziwe zokwakheka, ukubhoboza nge-laser, ukugcwaliswa kwe-microvia, ukufakwa kwe-copper, ukucutshungulwa komugqa ocolekileyo kanye nezinto ezikhethekile kungashintsha izidingo zokukhiqiza. Ukufakwa kwe-edge plating ekhethekile, izimbobo ezihlanganisiwe, imigodi, ukuqeda okukhethiwe kanye nezidingo zokulawulwa kwe-impedance nazo zingathinta amathuluzi, ukulandelana kwenqubo kanye nokuhlolwa.

Izici ezilandelayo zibaluleke kakhulu lapho ulungiselela ikhotheshini:

• Ukwakheka kwe-HDI: Inani lezigaba zokulandelana kwe-lamination kanye nobunzima bemephu yokuxhumeka kwengqimba kuya kwengqimba.
• Ngokucutshungulwa: Ubuningi kanye nokuhlelwa kwe-microvia, ama-via angaboni noma agqitshwe, ukugcwalisa, ukuvala kanye nanoma yikuphi ukuhlolwa kokuthembeka okudingekayo.
• Ubuningi bomklamo: Ukulandelela okuncane kanye nesikhala, ama-component pad aqondile, ukubekezelelana kokubhalisa kanye nesivuno sokukhiqiza esilindelekile.
• Izinto zokwakha kanye nethusi: Ibanga le-laminate, ubukhulu be-dielectric, isisindo sethusi, ubukhulu obuqediwe kanye nanoma yikuphi ukwakhiwa kwe-hybrid okufanelekile.
• Izidingo zemishini nezokuqeda: Usayizi webhodi, ukubekezelelana kwephrofayili, izici ezifakwe ipulasitiki, ukuqeda ubuso kanye nomshini okhethekile wokusebenza.
• Ubuningi nokuhlolwa: Iphrothokholi noma umthamo wokukhiqiza, ukufakwa kwamaphaneli, ukuhlolwa kukagesi, imibhalo kanye nezindlela ezengeziwe zokwamukelwa.

Isikhathi sokuhola sihlolwa ngokuqhathanisa nokutholakala kwezinto, ukulandelana kwenqubo evunyiwe, inani le-oda, umthamo wokukhiqiza kanye nobubanzi bokuhlola obudingekayo. Izakhiwo zokwakha eziyinkimbinkimbi kakhulu noma izinto ezikhethekile zingathinta isheduli. Ngakho-ke, isilinganiso sokulethwa kufanele siqinisekiswe ngokuqhathanisa nezidingo zangempela zomklamo kanye ne-oda.

Ukuze uthole ireferensi yamanani ajwayelekile, bheka izindleko ze-PCB ezingu-8 . Lowo mthombo ubhekana nentengo ye-PCB enezingqimba eziyisishiyagalombili kabanzi; ikhotheshini ye-HDI kumele futhi ibhekele ama-microvia acacisiwe, ukwakhiwa kwesakhiwo kanye nokucutshungulwa okukhethekile.

Ukuze uqhathanise izingcaphuno zabahlinzeki ngokunembile, nikeza idatha efanayo yokukhiqiza, i-stackup, ngezincazelo, izidingo zezinto zokwakha, ukuqeda kwendawo, ubuningi be-oda kanye nezindlela zokuhlola. Ukuqhathanisa amanani ngokusekelwe kuphela ebinzanani elithi “8 layer HDI PCB” kungabangela ukuqagela okuhlukile kokukhiqiza kanye nokunikezwa okungalingani.

Ikhwalithi Yokukhiqiza Nokuhlolwa

Ukulawulwa kwekhwalithi ye-PCB ye-HDI enezingqimba eziyisishiyagalombili kufanele kubonise ukwakhiwa kanye nezici zayo ezibalulekile. Inqubo evamile ingafaka phakathi ukuthathwa kwezithombe nokuhlolwa kwezingqimba zangaphakathi, ukubopha, ukucubungula nge-laser microvia, ukubopha noma ukugcwalisa, ukubhoboza ngomshini, ukuthathwa kwezithombe kwezingqimba zangaphandle, imaski yokubopha, ukuqeda ubuso, ukuphrofayili kanye nokuhlolwa kukagesi. Ukulandelana kwangempela kuyahlukahluka ngokuya ngesakhiwo sokwakheka kanye nezinqubo ezikhethekile ezichaziwe.

Izidingo zokuhlola zingafaka:

• Ubuqotho besendlalelo: Ukuhlolwa kwephethini yezendlalelo zangaphakathi, ukubhaliswa, ukuhlanzwa kwethusi kanye nokuqinisekiswa kobukhulu.
• Ikhwalithi ye-Microvia kanye nembobo: Ngokusebenzisa i-geometry, isimo se-plating, ukuhlaziywa kwe-microsection kanye nokuhlolwa kwezinto ezibalulekile ngokusebenzisa i-interface lapho kuchazwe khona.
• Ama-via agcwele futhi avaliwe: Gcwalisa ubuqotho, ukuhleleka kwendawo kanye nokufaneleka kokwakhiwa kwephedi yezingxenye okuhlosiwe.
• Ukusebenza kukagesi: Ukuhlolwa kokuqhubeka nokwehlukaniswa, kanye nokuqinisekiswa kwe-impedance kusetshenziswa izakhiwo zokuhlola ezivunyelwene ngazo lapho kudingeka khona.
• Izici ezikhethekile: Ukuhlolwa kwemiphetho eboshwe ngepulasitiki, imigodi egobile, amaphrofayili akhiwe ngomshini, imigodi noma ukuqedwa okukhethiwe ngokusho komdwebo.
• Imibhalo yokwamukela: Imininingwane ye-IPC esebenzayo kanye nokubuyekezwa, ikilasi lokwamukelwa, imibiko yokuhlola kanye nezidingo ezithile zamakhasimende.

Ama-microvia ahlanganisiwe kanye nezinye izinto ezibalulekile ezixhumene nazo zingadinga iziqu ezengeziwe ngale kokuhlolwa kokugcina kukagesi okuvamile. Izindlela zokwamukela kufanele kuvunyelwane ngazo ngaphambi kokukhiqiza kunokuba kucatshangelwe ngemva kokwenziwa. Noma yiziphi izinguquko eziphakanyisiwe ku-stackup evunyiwe, izinto zokwakha, ngesakhiwo noma i-geometry yokusebenza kufanele zibuyekezwe nekhasimende.

Kumaphrojekthi adinga kokubili ukwenziwa kwebhodi elingenalutho kanye nokuhlanganiswa kwezingxenye, i-Highleap iphinde inikeze izinsizakalo zokuhlanganiswa kwe-PCB . Izidingo zokuhlanganiswa njengokubekwa kwe-BGA encishisiwe, ukushiswa, ukuhlolwa kanye nokuhlolwa kufanele zifakwe kububanzi bephrojekthi uma kusebenza.

Izidingo ze-RFQ kanye nesilinganiso sokukhiqiza se-PCB

Ukuze uthole ikhotheshini enengqondo ye- PCB ye-HDI enezingqimba ezingu-8 eyenziwe eShayina , nikeza amafayela okuklama atholakalayo akamuva futhi ukhombe noma yiziphi izinqubo ezikhethekile ezibalulekile ebhodini eliqediwe. Lapho izidingo zokwakha nokwamukelwa zichazwa ngokusobala, kuba lula ukuhlola ukukhiqizwa, ububanzi benqubo kanye nokwenzeka kokulethwa.

• Amafayela okukhiqiza: I-Gerber X2 noma i-ODB++, amafayela okubhoboza, uhlaka lwebhodi kanye nomdwebo wokwenziwa.
• Isitaki Izendlalelo zethusi eziyisishiyagalombili, ibanga le-laminate, ubukhulu be-dielectric, isisindo sethusi kanye nobukhulu bebhodi eliqediwe.
• Ukuxhumeka kwe-HDI: Ngemephu, ama-microvia spans, ama-via angaboni noma agqitshwe, izakhiwo ezihlanganisiwe noma ezihlanganisiwe, kanye nezidingo zokugcwalisa noma zokuvala.
• I-geometry ebalulekile: Ukulandelela okuncane kanye nesikhala, amaphedi amancane, ubukhulu bebhodi, ukubekezelelana kwemigodi kanye nezidingo zephrofayili yomshini.
• Izinqubo ezikhethekile: Impedance elawulwayo, izinto zokulahlekelwa okuncane, imiphetho ehlanganisiwe, imigodi egobile, imigodi, ukuqeda okukhethiwe noma ezinye izici ezingezona ezejwayelekile.
• Izidingo zekhwalithi: Imininingwane ye-IPC esebenzayo, ikilasi lokwamukelwa, ukuhlolwa kukagesi, imibiko yokuhlola kanye nezidingo ezengeziwe zeziqu.
• Imininingwane ye-oda: Uhlobo noma inani lokukhiqiza, usuku lokulethwa okuqondiwe kanye nezidingo zokupakisha noma zokuthumela.
• Ububanzi bomhlangano: I-BOM, idatha yokukhetha nokubeka, imidwebo yokuhlanganisa kanye nezimfuneko zokuhlola uma kudingeka i-PCBA.

Uma isakhiwo esihlanganisiwe noma esidlulayo sisathuthukiswa, thola izinto ezingaxazululwanga embuzweni wakho. Ukubuyekezwa kobunjiniyela kungagxila kulezo zinqumo ngaphambi kokuba kuvunyelwe imininingwane yokugcina yokukhiqiza. Izinqubo ezikhethekile kufanele zihlolwe njengokwakhiwa okuhlangene; ukuhambisana kwazo akukwazi ukusungulwa ohlwini lwezici ngazinye zodwa.