Ukukhiqizwa kwe-PCB Yezingqimba Eziyi-8 Zokwenziwa Kwezifanekiso Nokukhiqizwa Kwevolumu

I-Highleap Electronics inikeza ukukhiqizwa kwe-PCB enezingqimba ezingu-8 kanye nokuhlanganiswa kwe-PCB kwamabhodi ajwayelekile anezingqimba eziningi kanye nokwakhiwa okuyinkimbinkimbi okubuyekezwe ubunjiniyela. Siphatha imiklamo ye-FR-4, i-HDI, eqinile-eguquguqukayo, yesivinini esiphezulu kanye ne-RF, ama-lamination ezinto ezixubile, amabhodi ethusi elisindayo kanye nezici ezikhethekile zokwenziwa kwama-prototype, ama-batch kanye nama-oda okukhiqiza aphindaphindwayo.

Kuma-PCB anezingqimba eziyisishiyagalombili anezinto ezicacisiwe, i-impedance elawulwayo, ukubhoboza okukhethekile, oxhumana nabo abasemaphethelweni noma izici ezingavamile zemishini, ukukhiqiza kuhlolwa ngokuhambisana nokuqoqwa okugcwele, imidwebo kanye nezidingo zoku-oda. Amaphrojekthi e-dielectric axubile awakhawulelwe ku-Rogers/FR-4: amazinga e-laminate aceliwe kanye nohlelo lokubopha kunquma umzila wokukhiqiza.

Izakhiwo ze-PCB Ezinezingqimba Eziyi-8 Esizenzayo

I-Highleap ibuyekeza ama-oda e-PCB anezingqimba eziyisishiyagalombili kuzo zonke izakhiwo, inhlanganisela ye-laminate, ama-via, ithusi, ukuqeda ubuso kanye nomshini okhethekile. Izinketho zokukhiqiza ezingezansi zingachazwa ngazinye noma ndawonye; ukuhambisana kanye namafasitela enqubo atholakalayo kuyaqinisekiswa ukuze kuhlanganiswe izinto zangempela. Izinto ezidinga iziqu ezizinikele azithathwa njengezakhiwo ezijwayelekile.

Ukwakhiwa kwe-PCB eqinile nezinto eziyisisekelo

• Ukukhiqizwa kwe-PCB okuqinile okujwayelekile okunezingqimba ezingu-8 ze-FR-4
• Amabhodi amaningi anezingqimba eziningi ze-High-Tg FR-4
• Ukwakhiwa kwe-PCB enezingqimba eziyisishiyagalombili ezingenayo i-Halogen
• Ama-laminate aqinile asekelwe ku-polyimide asezingeni lokushisa eliphezulu, angabuyekezwa
• Amabhodi amaningi anemigqa emihle kanye nezikhala ezincane
• Amabhodi ezingxenye ze-BGA eziminyene kanye ne-fine-pitch
• Amabhodi okujiya okulawulwayo kanye nokuthamba okuqinile
• Ama-PCB aqinile anezingqimba eziyisishiyagalombili ezincane kakhulu
• Ama-PCB amaningi anezingqimba eziyisishiyagalombili obukhulu kakhulu
• Amabhodi amakhulu anezingqimba eziyisishiyagalombili futhi amakhulu kakhulu
• Izinhlaka ezingajwayelekile kanye namabhodi anezicucu eziningi
• Amabhodi anezingqimba eziyisishiyagalombili afakwe amaphaneli omhlangano ozenzakalelayo

Ama-lamination e-hybrid, ama-PCB avame kakhulu kanye nesivinini esikhulu

• Ukukhiqizwa kwe-PCB ehlanganisiwe enezingqimba ezingu-8 zeRogers/FR-4
• Ukwakhiwa kwe-hybrid ye-Taconic/FR-4 enezingqimba ezingu-8
• Ukwakhiwa kwe-hybrid kwe-Isola okunezingqimba ezingu-8 okuphansi kokulahlekelwa/i-FR-4
• Izakhiwo ze-Panasonic Megtron/FR-4 ezihlanganisiwe ezinezingqimba ezingu-8
• Izitaki ze-dielectric ezixubile ze-Nelco ezinezingqimba ezingu-8 ezinesivinini esikhulu/i-FR-4
• Ama-lamination ahlanganisiwe e-Arlon RF/FR-4 anezingqimba ezingu-8
• Ama-PCB e-PTFE/FR-4 ahlanganisiwe anezingqimba eziningi
• Ama-hybrid e-hydrocarbon laminate/FR-4 agcwele i-ceramic
• Izakhiwo ze-dielectric ezixubile ezine-Dk ephezulu kanye ne-Dk ephansi
• Inhlanganisela ye-laminate ye-multi-grade low-loss kanye ne-RF
• Amabhodi e-digital/RF hybrid anezingqimba eziyisishiyagalombili asheshayo aphezulu
• Ukwakhiwa kwezingqimba eziningi okune-Df ephansi, okulahlekelwa ukufakwa okuphansi
• Amabhodi okulawula ukuvimba okukodwa kanye namabhodi okuhlukanisa
• Ukwakhiwa kwe-RF/i-microwave signal-layer kanye ne-reference-plane
• I-foil yethusi ephansi kanye nokwakhiwa kwe-RF bondply okucacisiwe
• Ukwakhiwa kwe-RF okuqukethe i-LCP noma i-PPO, kuncike ekuqinisekisweni kwenqubo

Ngokuhlanganisa izinto ezisezingeni elithile, i-Highleap inikeza izinketho ze-laminate ezivame kakhulu kanye ne-hybrid-stackup . Ireferensi ye-Rogers/FR-4 lamination ikhuluma ngenhlanganisela eyodwa evame ukucelwa, hhayi ububanzi bokukhiqiza izinto ezixubile.

I-HDI PCB, ama-via kanye nokuxhumana kwezingqimba eziningi

• Ama-PCB e-HDI anezingqimba ezingu-8 anama-microvia abhobozwe nge-laser
• Ama-PCB anezingqimba eziyisishiyagalombili kanye nama-PCB agqitshwe nge-blind-via
• Ukuxhumana okunembobo edlulayo kanye nokuxhumana okuxubile
• Izakhiwo ezakhiwe nge-HDI eziyi-1+6+1
• Izakhiwo ze-HDI ezilandelanayo ezingu-2+4+2
• Ezinye izindlela zokubopha i-lamination ezivunyiwe ezinezigaba eziningi
• I-microvia ehlanganisiwe kanye nezakhiwo ze-microvia ezihlanganisiwe
• Ama-microvia e-laser agcwele ithusi
• Amabhodi agcwele futhi anezivalo nge-via-in-pad (VIPPO)
• Ama-via agcwele imigodi futhi axhunyiwe
• Ama-vias avaliwe/ahlelwe kahle ngaphansi kwama-BGA pads acwebezelayo
• Ukususa i-backdrilling ekhethiwe kanye nokususwa okujulile okulawulwayo nge-stub
• Ama-PCB okuhambisa umzila we-BGA oqondile
• Ububanzi bemigodi ekhethekile, izilinganiso zesici kanye nokubekezelelana kokubhoboza

Ukuze uthole ama-laser vias kanye nokulandelana kokwakheka, bheka amakhono okukhiqiza okuxhumana okuphezulu kwe-Highleap . Amaphrojekthi anemikhawulo ye-via-stub ye-signal-layer angacacisa nokubhoboza okujulile okulawulwayo.

Izakhiwo ezinezingqimba eziyisishiyagalombili neziguquguqukayo neziqinile

• Ukwenziwa kwe-PCB eqinile neguquguqukayo enezingqimba ezingu-8
• Ukwakhiwa kwe-PCB okuguquguqukayo okunezingqimba zethusi eziyisishiyagalombili
• Amabhodi aqinile anezendlalelo eziyisishiyagalombili ezindaweni eziqinile
• Ukwakhiwa okuqinile okuguquguqukayo okunezibalo ezahlukene zezendlalelo ze-flex-zone
• Izisekethe ze-polyimide flex eziningi
• Izinketho ze-laminate eziguquguqukayo nezinamathelayo ezingenamathelisi
• Imiklamo yokugoba okuqinile kanye nokugoba okuguquguqukayo, kuncike ekuqinisekisweni
• Amabhodi aqinile aguquguqukayo futhi aguquguqukayo e-HDI
• Ukwakhiwa kwe-impedance elawulwayo kanye ne-RF eqinile neguquguqukayo
• Izigaba eziningi eziguquguqukayo kanye noshintsho oluqinile oluya ekuguquguqukeni
• Isembozo, izinto zokuqinisa ezikhethiwe kanye namafasitela agobile acacisiwe
• Ifilimu ekhethiwe yokuvikela i-EMI ezindaweni eziguquguqukayo ezinezingqimba eziningi, lapho isekelwa khona
• Izinhlangano ezigobile ezinezixhumi zokuthintana namaphedi avuliwe

Izinketho zokukhiqiza ze-Highleap eziqinile neziguquguqukayo kanye nokwakhiwa kwe-PCB okuguquguqukayo okunezingqimba eziningi kubalulekile lapho kuhlonzwa inani lezingqimba kanye nohlelo lwezinto endaweni ngayinye.

Izici zethusi elinzima, amandla aphezulu kanye nokushisa

• Ukukhiqizwa kwe-PCB esindayo yethusi enezingqimba ezingu-8
• Izisindo zethusi ezixubile phakathi kwezingqimba zesiginali kanye nezakhi zamandla
• Ama-PCB wamandla aphezulu anezingqimba eziyisishiyagalombili
• Ukwakhiwa kwengqimba yangaphakathi neyengaphandle yethusi esindayo
• Izendlalelo zesignali ezicacile ezihlanganiswe nezindiza zamandla
• Ama-array asebenzisa ukushisa kanye nezakhiwo zokudlulisa ukushisa okujiyile
• Ukwakhiwa kwezinhlamvu zethusi ezifakiwe kanye nokufakwa kwethusi, okungabuyekezwa
• Izakhiwo ezisekelwe ngensimbi noma ezinye izakhiwo ezikhethekile zokusabalalisa ukushisa, kuncike ekuqinisekisweni
• Ukuhlukaniswa kwamandla aphezulu kanye nemiklamo ethile yokusika/yokususa
• Inhlanganisela yezinto eziningi ezidinga ukushisa

Kumaphrojekthi ahlanganisa izendlalelo zethusi ezinamandla aphezulu kanye nesekethe yesignali eningi, bheka izidingo zokwenziwa kwethusi elisindayo bese uchaza isisindo sethusi ngokwehlukana kwesendlalelo ngasinye.

Iminwe yegolide, ukuqedwa kwendawo kanye nomshini wokulungisa ngokunemba

• Ama-PCB anezingqimba ezingu-8 aneminwe eqinile yegolide ekhethiwe
• Ukuthintana okude/okufushane nokuhlukaniswe ngeminwe yegolide
• Amalungiselelo okuxhumana onqenqemeni anyathelisiwe, aqondile futhi angalingani
• Izixhumi zekhadi ezigobile
• I-ENIG, i-ENEPIG kanye nezinhlanganisela zokuqeda ezikhethiwe
• I-OSP, isiliva lokucwilisa, ithini lokucwilisa kanye nokuqedwa kwe-HASL okungenalo i-lead
• Ukufakwa kwe-board-edge kanye ne-wraparound edge metallization
• Izimbobo ezigobile kanye nezimbobo ezigobile
• Izikhala ezifakwe amapulangwe kanye nezikhala zokunemba ezingafakwanga amapulangwe
• Izikhala zokugaya ezilawulwayo nezingaboni
• Amaphakethe anezitebhisi, izindawo ezifihliwe kanye nemigodi engaboni
• Izimbobo ezikhethekile eziqondiswe emzileni kanye nokusikwa kwangaphakathi
• Izimbobo zokufaka eziboshiwe futhi ezifakwe ngaphansi kwamanzi
• Izimbobo eziqinile ezivumela ukucindezela
• Ukuphrofayilisha i-Edge, ukufaka ama-V kanye nokuqhekeka kwephaneli eliqondisiwe
• Ukuvula imaski yesolder ekhethiwe kanye nokufaka amatende/ukuxhuma
• Oxhumana nabo be-carbon-inki kanye nezici ezikhethekile zokuhambisa eziphrintiwe, lapho kusekelwa khona
• Imaski yokusoda evulekayo kanye nezici zemaski yokusoda ekhethiwe, lapho isekelwa khona

Izindawo zokuthintana kwensimbi kanye nokuguguleka kufanele zifakwe kumanothi okwenziwa; i-hard-gold finger plate ayishintshisani nokuqedwa kwe-immersion-gold pad.

Ukuqinisekiswa kokukhiqiza: Lokhu kuyizilungiselelo noma izinqubo ezikhethekile ezitholakalayo ukuze kubuyekezwe iphrojekthi, akusona isiqinisekiso esingenamibandela sazo zonke izinhlanganisela ezinezingqimba eziyisishiyagalombili. Ukusebenziseka kokugcina, imikhawulo yemishini, ukutholakala kwezinto kanye nezidingo zokwamukelwa kuqinisekiswa ngokumelene namafayela okuklama ngaphambi kokwamukelwa kwe-oda.

Ama-Prototypes e-PCB ayi-8, ama-oda e-Batch kanye nokukhiqizwa kwevolumu

I-Highleap isekela amaphrojekthi e-PCB anezingqimba eziyisishiyagalombili kusukela kumasampula obunjiniyela kuya ezindaweni zokuhlola, ukukhishwa okuhleliwe kanye nokukhiqizwa okuphindaphindiwe. Izidingo ezisebenzayo ziyahlukahluka ngesigaba soku-oda:

• Isibonelo kanye nokujika okusheshayo: Nikeza ukubuyekezwa kwamanje, izici okumele ziqinisekiswe, imikhawulo yezinto ezibonakalayo kanye nosuku lokuthunyelwa oluceliwe. Ama-laminate akhethekile kanye nokucubungula okulandelanayo kungathinta isheduli.
• Ukugijima okuphansi kanye nokuhlolwa kwe-pilot: Chaza amakhefu enani, ubufakazi bokuhlola, noma yiziphi izidingo zokuhlanganiswa kanye nezinguquko ekwakhiweni kweprototype ngaphambi kokukhishwa komshayeli.
• Ukukhiqizwa kweqembu kanye nomthamo omkhulu: Faka i-stackup evunyiwe, inqubomgomo yokushintsha izinto, ifomethi yephaneli, ivolumu yonyaka eqondiwe, izidingo zokwamukelwa kwenqwaba kanye nokubikezela.
• Ama-oda aphindaphindwayo kanye nokudluliselwa komhlinzeki: Yabelana ngenombolo yengxenye ekhishwe, umlando wokubuyekezwa, ukuvunyelwa kwenqubo ebalulekile kanye namadokhumenti okuhlola adingekayo ukuze kugcinwe amashejuli amasha ehambisana nebhodi elifanelekayo.

Uma udinga ukukhiqizwa komthamo webhodi elihlanganisiwe eliqinile, i-HDI noma ibhodi elihlanganisiwe elinezingqimba eziyisishiyagalombili, faka kokubili inani le-oda lokuqala kanye nesidingo esiphindaphindayo. Inani lodwa alixazululi ukutholakala kwezinto, inzuzo yenqubo noma isikhathi sokuhola; lokho kuhlolwa ngokuqhathaniswa nokwakhiwa okuvunyiwe.

Isibuyekezo Sobunjiniyela Sezakhiwo Eziyinkimbinkimbi Ze-PCB Ezinezingqimba Eziyi-8

Ngaphambi kokukhishwa komkhiqizo, i-Highleap ibuyekeza idatha yokwenziwa kwamapharamitha alawula umsebenzi: amazinga e-laminate nama-bondply, izendlalelo zethusi eziyisishiyagalombili, ukujiya okuqediwe kanye nesisindo sethusi; ngokuxhumeka nokubhoboza; i-geometry yebhodi; ukuqeda; kanye nanoma yiziphi izinhloso zokusebenza noma zokuhlola.

• Ukuqoqwa kwe-stackup kanye nokusayinwa kukagesi: Qinisekisa ilungiselelo le-dielectric elihlongozwayo, izendlalelo zokubhekisela kanye nezinhloso ze-impedance. Imvume yamakhasimende iyadingeka ukuze kube nezinguquko ezithinta ukusebenza okulawulwayo. Okuningiliziwe izinto okufanele uzicabangele nge-stackup enezingqimba eziyisishiyagalombili ziphathwa ngokuhlukile kule nsizakalo yokukhiqiza.
• Ukusayinwa kwenqubo ekhethekile: Thola ukuxuba izinto, i-lamination elandelanayo, ama-vias angaboni/afihliwe, ngokugcwalisa/i-cap, imikhawulo ye-backdrill, izici zokujula ezilawulwayo kanye ne-plating ekhethiwe.
• Ukuvumelana kwedatha yokukhiqiza: Qinisekisa ukuthi idatha ye-Gerber noma ye-ODB++, amafayela okubhoboza, imidwebo yokwenziwa kanye nokubuyekezwa kwebhodi kuchaza ukwakhiwa okufanayo.
• Okuhlukile kwenqubo: Lapho kuphakanyiswa into yokufaka esikhundleni, isinxephezelo sokulandelela noma isici esiguquliwe, bhala phansi okuhlukile bese uthola imvume ngaphambi kokwenziwa.

Ukubuyekezwa kwe-DFM kwangaphambi kokukhiqizwa kwe-Highleap kusiza ekuboneni imininingwane engekho kanye nokungqubuzana kokukhiqiza ngaphambi kokuba kukhishwe i-oda.

Ikhwalithi ye-PCB engu-8 kanye nokwamukelwa kokukhiqiza

Ukuhlolwa kudinga ukuhambisana nezidingo zomkhiqizo okuvunyelwene ngazo kunokuba kube yisimangalo esingachazwanga sokuthi “ikhwalithi ephezulu.” Kumabhodi anezingqimba eziyisishiyagalombili, uhlelo lokukhiqiza nokwamukela lungahlanganisa ukuhlolwa kwezingqimba zangaphakathi, ukubhaliswa kwezingqimba, ubuqotho bembobo ehlanganisiwe, ukuqeda kobuso, ubukhulu bokugcina kanye nokuhlolwa kokuqhubeka/ukuhlukaniswa kwebhodi elingenalutho.

Ama-oda okulawula ukuvimba, i-RF, i-HDI noma ukuthembeka okukhethekile angacacisa amakhuphoni okuvimba, imiphumela yesigaba esincane, imibiko yokuhlonza izinto noma yokulandelela. Faka isigaba sokwamukelwa esidingekayo, ukubuyekezwa okujwayelekile, ukusampula noma imininingwane yombiko ku-RFQ ukuze ububanzi bokuhlola bukwazi ukubekwa intengo futhi kuvunyelwane. Ukuhlolwa kukagesi okuphasisiwe ebhodini elingenalutho kuphela akuqinisekisi ukulahlekelwa kokufakwa, ukukhuthazela kokuguquguquka noma zonke ezinye izidingo ezithile zesicelo.

Ukwakhiwa Nokuhlanganiswa Kwe-PCB Yezingqimba Ezi-8

I-Highleap Electronics iphinde ihlinzeke ngamabhodi ahlanganisiwe anezingqimba eziyisishiyagalombili. Amaphrojekthi angabuyekezwa ndawonye ukuze kukhiqizwe ama-PCB angenalutho, kuthengwe izingxenye, kuhlanganiswe ama-SMT kanye nemigodi edlulayo, kuhlolwe i-BGA kanye nokuhlolwa kokusebenza okucacisiwe ngensizakalo yethu yokwenziwa kwe-PCB kanye nokuhlanganiswa kwayo.

Kwibhodi elihlanganisiwe le-HDI, eliqinile noma elixubile, ukwakheka kwamaphaneli, ukuvezwa kwe-soldering, ukubekwa kwezingxenye kanye nokufinyelela kokuhlola kufanele kuhlolwe kanye nomklamo webhodi elingenalutho. Faka i-BOM enezinombolo zezingxenye zomkhiqizi, ezinye ezivunyiwe, idatha yokukhetha nokubeka, imidwebo yokuhlanganisa kanye nanoma yimiphi imiyalelo ye-firmware noma yokuhlola uma i-PCBA iyingxenye ye-oda lakho.

Okufanele Ukuthumele Ukuze Uthole Isilinganiso Sokukhiqiza se-PCB Esinezingqimba Eziyi-8

Thumela iphakheji yakamuva yokukhiqiza, hhayi nje "izendlalelo ezingu-8," usayizi webhodi kanye nentengo eqondiwe. Ulwazi olulandelayo lwenza kube nokwenzeka ukubuyekeza ububanzi bangempela be-oda lakho:

• Amafayela okwenziwa kwe-Gerber noma i-ODB++, idatha yokubhoboza ye-NC kanye nomdwebo/ukubuyekezwa okulawulwayo.
• I-stackup enezingqimba eziyisishiyagalombili, isheduli ye-core/preg noma i-bondply, amazinga e-laminate kanye nesisindo sethusi ngesendlalelo.
• Uhlaka lwebhodi, ukujiya okuqediwe, ubukhulu, ukubekezelelana kanye nezidingo zephaneli, lapho kuchazwe khona.
• Ngamamephu, imininingwane ye-laser-via noma ye-backdrill, izidingo ezigcwalisiwe, imigodi ekhethekile kanye namanothi e-contact plating.
• Izinhloso zokungavimbeli/zokulahlekelwa, ukuqeda ubuso kanye nemibiko yokuhlola noma yokulinganisa edingekayo.
• Uhlobo lwesibonelo, inani lokuhlola kanye/noma ivolumu, ukubikezela kanye nosuku lokuthunyelwa oluceliwe.
• I-BOM, amafayela okubekwa, imidwebo yokuhlanganisa kanye nezidingo zokuhlola ezisebenzayo zama-oda e-PCBA.