Ukukhiqizwa kwe-mSAP PCB kwe-Fine-Line Circuitry

I-Highleap Electronics inikeza ukubuyekezwa kokukhiqiza kwe-mSAP PCB kanye nekhotheshini yemiklamo yesekethe yomugqa oqondile lapho i-geometry yomqhubi edingekayo, iphimbo kanye nokwakhiwa kwethusi kudinga inqubo elungisiwe yengxenye yokwengeza. Uma umhlinzeki wakho wamanje engakwazi ukusekela ububanzi bomugqa obubekiwe, isikhala noma ukwakheka kwephimbo eliqondile, sithumelele umsebenzi wobuciko okhishwe kanye ne-stackup ukuze izidingo zenqubo zihlolwe ngokumelene nomklamo wangempela.

Ekwenziweni kwe-mSAP PCB , inombolo encane yomugqa/yesikhala ngokwayo ayanele. Ububanzi bomqhubi obuqediwe, ukujiya kwethusi, uhlelo lwe-dielectric, ukubhaliswa kwesendlalelo, izinhloso ze-impedance, ukwakheka kwephaneli kanye nemigomo yokuhlola kumele kucatshangelwe ndawonye. Inqubo yekhotheshini ye-Highleap ihloselwe ukusungula ukwakhiwa okudingekayo nokuqinisekisa izibikezelo zenqubo ngaphambi kokuba intengo nokulethwa kwenziwe.

Ukukhiqizwa kwe-mSAP PCB vs Ukuqopha Okuncane

Ibhodi elivamile elinezingqimba eziningi lakhiwa ngokususa. Lonke ungqimba lumbozwe ngethusi, isithombe sinyatheliswa ngefilimu eyomile, ithusi eliveziwe liyaqoshwa, kanti ithusi elisele liyiphethini. Ngakho-ke ububanzi bomugqa wokugcina buyibubanzi bomugqa we-photolithography ngaphandle kwanoma yini esuswa yi-etch, futhi i-etch ayiqondile. Iyanciphisa, futhi yenza kanjalo ngokungalingani kuye ngobukhulu bethusi kanye nesilinganiso sesici.

Inqubo yokwengeza okuncane iguqula umqondo. Iphethini kuqala yadalwa njengengqimba encane yembewu ngesimo sezici ezifunwayo, bese kuthi ithusi lifakwe ugqinsi oluphelele. Ngenxa yokuthi ithusi lifakwe ugqinsi oluvela kungqimba encane yembewu, i-mSAP inganciphisa ukunqunywa okungaphansi kwe-lateral okuhlotshaniswa nokuqoshwa kwe-subtractive. I-geometry yomugqa wokugcina isancike ekuthathweni kwezithombe, iphrofayili yokumelana, ukujiya kwethusi elifakwe ugqinsi, ukususwa kwengqimba yembewu kanye nokulawulwa kwenqubo; akunqunywa yi-lithography yodwa.

Yilokhu okwenza i-mSAP ihluke ekusebenzeni. Ithusi eliqediwe alichazwa yi-etch. Lichazwa yisithombe, bese likhula. Yingakho i-mSAP ingakhiqiza ama-pad ahlanganisiwe kahle kanye nemikhondo emincane umzila osusayo ongase uyizungeze noma udinge ukulungiswa okukhulu ukuze usinde ku-etch.

Ukwakhiwa kwe-mSAP vs Standard PCB kwemiklamo emihle

Ngenxa yokuthi ungqimba lwembewu kufanele luphrintwe futhi i-plating kumele ifane, i-mSAP ku-laminate evamile ingenzeka kodwa akuyona indlela engcono kakhulu. Umkhuba wemboni ukwakha izakhiwo ze-mSAP ohlelweni lwezinto ezibonakalayo olune-chemistry engaphezulu esekela inqubo: i-foil yethusi ebushelelezi kakhulu, kanti ezakhiweni ezisebenza kahle kakhulu uhlelo lwe-resin olunokulahleka okuphansi kanye nokuvumelana okuhle kwe-dielectric.

Uma isidingo simane nje “imigqa emincane” hhayi “imigqa emincane ene-impedance elawulwayo ku-dielectric encane”, inqubo evamile yomugqa oqondile ku-laminate yezinga eliphezulu ingahlangabezana nesidingo ngezindleko eziphansi. Icala le-mSAP liba namandla lapho izici ezincane nazo ziminyene, lapho ithusi lijiyile uma liqhathaniswa nobubanzi bomugqa, noma lapho i-geometry isemkhawulweni wangempela walokho i-photolithography kanye nokuqopha okungakuxazulula.

Inqubo Yokukhiqiza ye-mSAP PCB yama-Fine-Line PCB

Uchungechunge olungezansi luyingqikithi yenqubo. Isinyathelo ngasinye sikhona ukulungiselela ubuso besinyathelo esilandelayo, futhi ukuhleleka akuguquguquki.

Isinyathelo sesi-4 yilapho ubunzima bukhona khona. Ukufaka i-electroplating kuyinqubo yezinga lephaneli: ukusatshalaliswa kwamanje kuphaneli enkulu akukaze kulingane ngokuphelele, ngakho-ke ukujiya kwethusi kuyahlukahluka, futhi lapho ukujiya kushintsha khona ububanzi bomugqa oqediwe kuyahlukahluka. Ifomethi yephaneli kanye nokusetshenziswa kwayo kuncike emishinini yomenzi, izilawuli zokufana kweplating kanye nomklamo othize. Ngakho-ke ubukhulu bebhodi eliqediwe kufanele bufakwe kusilinganiso ukuze ukwakheka kwephaneli okuhlongozwayo kanye nomzila wenqubo kuhlolwe.

Izidingo ze-mSAP Fine Line kanye nesikhala sokwenziwa kwe-PCB

Ibhavu lokucwebezela emgqeni we-mSAP alikwazi ukushintshaniswa nebhavu lokucwebezela lethusi elisetshenziswa kabanzi. Izithasiselo ebhavuni zilawula izinga lokucwebezela kanye namandla okuphonsa, futhi ukuziphatha okubalulekile ku-mSAP ukuthi ibhavu likhulisa kanjani ithusi emiseleni emincane phakathi kwezindawo zembewu. Ibhavu elicwebezela kahle endaweni evulekile lingaqeda ingaphakathi le-fine-pitch array, likhiqize i-taper noma igebe phakathi kwe-pad kanye ne-trace.

Imiphumela emithathu ilandela umthengi, futhi ifanele ukuqondwa ngoba ivela ekubuyekezweni komdwebo:

• Isilinganiso sesici esiqondisweni esihleliwe sibalulekile. I-pad array ende iziphatha njengeqoqo lemisele emincane ku-plater. Uma i-array inzima futhi i-pitch incane, kuba nzima ukuyi-plate ngokulinganayo, futhi inqubo incike kakhulu kumakhemikhali athile womenzi kanye nomklamo wephaneli.
• Ingqimba yembewu iyisithiyo sezakhiwo ezinhle. Ukufakwa ngaphandle kwe-electro endaweni enhle kungaba kancane noma kungaphelele. Lokhu kuyisithiyo sangempela ngobukhulu besici obungafinyeleleka futhi abususwa nge-lithography engcono.
• Ithusi elijiyile lilukhuni kakhulu ngokungalingani. Ngenxa yokuthi i-plating kufanele igcwalise isikhala ngokulinganayo kuze kufike esisindweni sethusi esigcwele, isidingo sethusi esinzima ezicini ezinhle singenye yezinhlanganisela ezinzima kakhulu kule nqubo.

Indlela ehlobene yokususa izakhiwo ezixinene ixoxwa ngayo enqubweni yethu ye-laser direct imaging (LDI) , kanye nohlangothi lokubhoboza lomsebenzi we-fine-pitch kuma- vias ethu e-PCB abhobozwe nge-laser . Kumabhodi ahlanganisa imigqa emincane nesakhiwo esakhiwe, umbuzo we-stackup uhlanganiswe ekwakhiweni kwethu kwe-HDI stackup.

Imithetho Yokuklama ye-mSAP PCB Yezingxenye Ezincane

Ukuklama i-mSAP akusikho ukuklama i-photolithography ejwayelekile enezinombolo eziqinile. Imithetho eminingana iyashintsha ngohlobo kunokuba ibe nenani.

• Indandatho ehlanganisiwe ayiseyona imingcele yobubanzi obuncane. Ngenxa yokuthi ithusi liyakhula kunokuba liqoshwe, iphedi lingasondela kusayizi womgodi oqediwe ngaphandle kokuthi i-undercut idle iphedi. Yilokhu okuvumela ama-pad aqinile, futhi kuyinzuzo yangempela endaweni eqondiswayo kumklamo we-pitch encane.
• Isinxephezelo se-etch asidingeki ngendlela efanayo. Umklami ojwayele ukunxephezela ukulahlekelwa yi-etch kufanele aphinde ahlole umklamo, ngoba isici esiqediwe siseduze nesici esithathwe esithombeni.
• Isisindo sethusi ezicini ezincane kufanele siqinisekiswe. Uma umklamo ucela ithusi elingu-2 oz emigqeni engu-50 µm, isinyathelo sokufaka iplati kufanele sigcwalise lokho ngokufanayo futhi umkhawulo wenqubo uba mncane. Ngokuvamile kuba nobudlelwano phakathi kobukhulu nobubanzi okufanele kubuyekezwe ngaphambi kokukhululwa.
• Amanani okuvimba kumele abalwe kabusha ngethusi eliqediwe. I-impedance ephawulekayo incike ebubanzini bomkhondo kanye nobukhulu bethusi, futhi ubuso bethusi be-mSAP bubushelelezi kunobobucwebe. Uma ithagethi ye-impedance isethwe kusukela ekubalweni kwenqubo ejwayelekile, kufanelekile ukuhlola ngokumelene ne-geometry yangempela eqediwe.

Ukulawulwa kwe-impedance ngokuvamile kuxoxwa ngakho ekulawulweni kwe-impedance ye-RF PCB kanye nasekwakheni kwe-PCB ebanzi ye-impedance elawulwayo , futhi imiphumela emihle yezakhiwo ze-RF ihlanganiswe eziqondisweni zethu zokuklama ze-RF PCB.

Isikhathi Sokusebenzisa Ubuchwepheshe be-mSAP kuma-PCB Aphezulu

I-mSAP ithola izindleko zayo ezimweni ezithile, kanti kwezinye inqubo evamile yomugqa oqondile kwi-laminate engcono iyimpendulo enengqondo. Iyakhokhela lapho umklamo uqukethe ama-array e-fine-pitch pad arrays umzila osusayo ongenakukwazi ukuwaxazulula, lapho ububanzi be-trace bubeka i-impedance yawo kanye nokubekezelelana kobubanzi kuqinile, lapho ithusi kumele libe likhulu uma liqhathaniswa nobubanzi bomugqa, futhi lapho isakhiwo sinzima ngokwanele ukuthi ibhodi elivamile lingadinga izendlalelo ezingaphezu kwalokho okuvunyelwa umklamo wemishini.

Akukhokhi uma okuwukuphela kwesidingo kuwukunciphisa okuncane ububanzi bomugqa, lapho ibhodi likhulu futhi isisindo sethusi sisinda kodwa izici zivamile, noma lapho ivolumu iphakeme ngokwanele ukuthi izindleko zenqubo zibusa futhi inqubo evamile ku-laminate yomugqa ocolekileyo ifinyelela ngaphakathi kokubekezelelana okudingekayo. Kulezo zimo, inqubo yokukhiqiza i-HDI PCB ene-laser drilling kanye ne-laminate yezinga eliphezulu ngokuvamile iyincazelo enengqondo kakhulu.

Ukukhethwa kwezinto ezibonakalayo kuhambisana nesinqumo ngaphezu kwalokho abathengi abakulindele. I-laminate kumele ihambisane ne-chemistry yesendlalelo sembewu, futhi ezakhiweni ze-RF, i-dielectric constant kanye ne-tangent yokulahlekelwa kohlelo lwe-resin kusetha ukusebenza okufinyelelekayo kungakhathaliseki ukuthi ithusi lihle kangakanani. Ukukhethwa kwethu kwezinto ezibonakalayo ze-PCB kuhlanganisa ukuguquguquka, kanye nemindeni yezinto ezibonakalayo ezilahlekelwa kancane ikakhulukazi ezintweni zethu ze-PCB ezine-Dk ephansi kanye ne-Df ephansi.

Izindleko ze-mSAP PCB kanye Nesikhathi Sokuhola Sokukhiqiza Okuhle

Ku-mSAP quotation, intengo akuyona ithusi ngokuyinhloko. Yizinyathelo zenqubo kanye nesifundo sephaneli.

• Inani lemijikelezo yokuthwebula izithombe kanye nokufaka amapuleti. Ingqimba ngayinye yangaphakathi esakhiweni sokwakheka iyimjikelezo ogcwele we-mSAP. Ukwakheka kwezingqimba ezine phezu kwenhliziyo kuyimijikelezo emine ye-mSAP, hhayi eyodwa.
• Usayizi wephaneli. Amaphaneli e-mSAP mancane ngoba ukufana kweplatingi kuyawohloka ezindaweni ezinkulu. Ibhodi elingafaneleki kahle iphaneli ejwayelekile lingabiza kakhulu ngenxa yaleso sizathu.
• Isivuno sezakhiwo ezinhle. Iphutha ku-dense array livame kakhulu futhi libiza kakhulu, ngoba livame ukutholakala sekwephuzile futhi lingasusa iphaneli lonke.
• Indaba. Incazelo ye-laminate ne-copper foil inenani eliphakeme kakhulu, futhi iyisabelo esikhulu sezindleko ebhodini elinomugqa omncane kunelejwayelekile.
• Ukulinganisa. Izici ezinhle zidinga ukukalwa, futhi indlela yokulinganisa iyingxenye yekhotheshini.

Uma ishejuli iyisithiyo kunokuba kube yintengo, yithi ku-RFQ. Iphaneli encane, i-stackup elula, noma ukuhlukanisa ukwakhiwa kube yizinyathelo ezimbili kungashintsha isikhathi sokulethwa ngokubonakalayo, futhi umenzi angakuthuthukisa lokho kuphela uma azi ukuthi kubalulekile. Isakhiwo sesikhathi sokulethwa salezi zakhiwo sichazwe ohlelweni lwethu lokukhiqiza lwe-PCB.

Umkhiqizi we-mSAP PCB wemiklamo ye-Fine-Line kanye ne-Fine-Pitch

Uma befuna umenzi we-mSAP PCB , onjiniyela kufanele baqhathanise ikhono lenqubo eliqinisekisiwe le-stackup ehlosiwe—hhayi nje ububanzi bomugqa obuncane obukhangisiwe. I-Highleap ingabuyekeza imibuzo yokwenziwa kwe-mSAP PCB ehilela umzila wemigqa emincane, amaphethini ephedi aminyene kanye ne-geometry yethusi elawulwayo, bese icacisa ukuthi yimiphi imininingwane yokwakha kanye nokuhlolwa kweziqu okudingekayo ngaphambi kokuzibophezela ekukhiqizeni.

Ukuze uthole isilinganiso sokukhiqiza se-PCB esinomugqa omuhle , nikeza ububanzi bomugqa oqediwe kanye nesikhala, ubukhulu bethusi ngeleveli, izinto ze-dielectric, i-stackup, inani leleveli, usayizi webhodi, izidingo ze-impedance kanye nevolumu elindelekile. Uma umklamo uhlose ama-fine-pitch pads noma amasignali esivinini esikhulu, faka imininingwane yezinyawo kanye nethebula le-impedance. Lokhu okufakwayo kusiza ukuhlukanisa umklamo odinga i-mSAP kulowo ongase ukhiqizwe ngenqubo evamile ye-fine-line ngezindleko eziphansi.

Lapho umklamo uhlanganisa umzila oqondile nokuxhumana okuphezulu, umzila wokukhiqiza we-HDI PCB we-Highleap ungase ufaneleke. Ngokuphathelene nokuvimbela okulawulwayo, faka izidingo kanye nemininingwane yomklamo we-PCB yokuvimbela okulawulwayo. Sebenzisa i -Cela ikhotheshini yokwenziwa kwe-PCB oqondile ukuze uthumele iphakheji ephelele yomklamo.

• Iphakheji yesilinganiso: Amafayela e-Gerber/ODB++, i-stackup, ama-target omugqa/esikhala, ukujiya kwethusi, ithebula le-impedance uma kusebenza, izidingo zokuhlola kanye nomthamo wokubikezela.

Imibuzo Evame Ukubuzwa Yokukhiqiza i-mSAP PCB

Ingabe i-mSAP ifana nesakhiwo sokwakheka noma sokulandelana kwe-lamination?

Cha, zinobukhulu obuhlukene. Ukuncibilikisa okulandelanayo kanye nokwakheka kuchaza indlela izendlalelo ezibekwa ngayo futhi zicindezelwe. I-mSAP ichaza indlela isithombe sethusi esendlaleloni esakhiwa ngayo. Ibhodi lingaba yi-mSAP ngaphandle kokuba yisakhiwo, kanti ukwakheka kungenziwa ngokucubungula okuncishisiwe. Avame ukusetshenziswa ndawonye, ​​​​yingakho amagama exutshwa emibuzweni.

I-mSAP ingafinyelela ububanzi bomugqa ongakanani ngempela?

Kuncike esisindweni sethusi, izinto ezisetshenziswayo, ikhemikhali yokubeka amapulangwe kanye nosayizi wephaneli. Esikhundleni sokucaphuna inombolo yesihloko, umbuzo owusizo uwukuthi yisiphi isici esincane kakhulu ebhodini lakho, ukuthi lithwala isisindo sethusi esingakanani, nokuthi lingakanani inani elilizungezile. Lokho kokugcina kunquma ukuthi umklamo ukhululekile noma ungaphansi.

Ingabe i-mSAP ingasetshenziswa nge-blind and hidden vias?

Yebo. Izakhiwo ze-via zakhiwa ngokubhoboza kanye nokufaka iplati njengakunoma iyiphi inqubo yokwakha, futhi izendlalelo zethusi zingakhiqizwa yi-mSAP. Ukusebenzisana okufanele kubhekwe ukugoba kodonga lwe-via kanye nokufaka iplati kwesendlalelo esijikelezayo, njengoba kokubili kwenzeka ebhavini elifanayo le-chemistry futhi i-via kumele ifakelwe ngendlela engabambeli ukungcola kwesendlalelo sembewu.

Ingabe i-mSAP iyashintsha inani lezingqimba ezingafinyeleleka?

Ishintsha umkhawulo osebenzayo ekwakhekeni okuxineneyo, ngoba ungqimba ngalunye olwengeziwe lunezela umjikelezo wokufaka iplati onengozi yalo yokukhiqiza. Imikhawulo yemishini neyezinto ezibonakalayo isasebenza ngasikhathi sinye. Umklamo odinga izendlalelo eziningi nezici ezinhle kakhulu uvame ukukhonzwa kangcono ngokubukeza inani lezingqimba njengokuguquguquka komklamo.

Ingabe ibhodi eliqediwe lingathengiswa futhi lihlanganiswe ngokujwayelekile?

Yebo. i-mSAP ithinta ukwakheka kwethusi, hhayi inqubo yokuhlanganisa. Kufanelekile ukuqinisekisa ukuthi ukuqeda kobuso kucacisiwe, njengoba ibhodi elincane elihlanganiswe endaweni engenakushiswa liyinkinga evamile futhi engagwenywa.