I-ABF Substrate: Izinto zokwakha, Inqubo Yokukhiqiza, Izicelo, kanye Nokuhlanganiswa kwe-PCB

Kubonjiniyela abahlola ukubala okuthuthukisiwe, ukuxhumana, i-AI, i-accelerator, i-processor, noma ezinye izinhlelo zokusebenza ze-high-I/O, ukuqonda ubudlelwano phakathi kwezinto ze-dielectric ze-ABF, ama-IC substrates, ama-package interconnects, izakhiwo ze-HDI, kanye nama-PCB asezingeni lesistimu kubalulekile.

Iyini i-substrate ye-ABF?

I-ABF imele i -Ajinomoto Build-up Film , ubuchwepheshe befilimu ye-dielectric obuthuthukiswe ukusetshenziswa kokupakisha kwe-semiconductor enobuningi obukhulu.

I-substrate ye-ABF ngokuvamile iqukethe isakhiwo esiyinhloko esihlanganiswe nezendlalelo eziningi zokuxhumanisa i-dielectric ne-copper. Ama-trace amancane ethusi kanye nama-microvia akheka ngaphakathi kwalezi zendlalelo zokwakheka ukuze kudalwe umzila oqinile odingekayo phakathi kwephakheji ye-semiconductor kanye ne-PCB yangaphandle.

Lokhu kwakha kuhluke kakhulu kwi-PCB evamile enezingqimba eziningi.

I-PCB yendabuko ivame ukulungiswa ngokuhambisana nokuqina kwemishini, ukukhiqizwa kwayo, ukusebenza kukagesi, izidingo zokushisa, kanye nezindleko ezingeni lebhodi lesistimu. I-substrate yephakheji ye-ABF, uma iqhathaniswa, kumele ivumelane nokuxhumana okuxinene kakhulu eduze kwedivayisi ye-semiconductor.

Ngakho-ke i-substrate isebenza njengebhuloho likagesi nelemishini phakathi kwezindawo ezimbili ezihlukene kakhulu:

Le ndima ephakathi yingakho ubuchwepheshe be-ABF buhlobene eduze nobuchwepheshe be-IC substrate kunokwenziwa kwe-PCB okuvamile.

Kungani i-ABF isetshenziselwa ukupakisha okuthuthukisiwe kwe-IC?

Isizathu esiyinhloko sokuthi i-ABF ibalulekile ukuthi amaphakheji e-semiconductor athuthukile adinga ubuningi bokuxhumana obungenakunikezwa ubuchwepheshe be-PCB obuvamile.

Amaprosesa esimanje, ama-GPU, ama-accelerator e-AI, amadivayisi okuxhumana, kanye namanye amaphakheji e-semiconductor aphezulu e-I/O angaqukatha inani elikhulu kakhulu lokuxhumeka kukagesi ngaphakathi kwendawo encane yephakheji.

Ngakho-ke i-substrate yephakheji kumele ihlinzeke:

• Umzila wethusi oqondile
• Ubuningi bokuxhumana okuphezulu
• Izendlalelo eziningi zokwakha
• Ama-microvia enziwe nge-laser
• Ubukhulu be-dielectric obulawulwayo
• Izakhiwo zikagesi ezizinzile
• Izixhumi ze-copper-to-dielectric ezithembekile
• Ukuziphatha okulawulwayo kobukhulu
• Ukuhambisana nezinqubo zokupakisha ze-semiconductor

Izakhiwo zokwakheka kwe-ABF zenza kube nokwenzeka ukwandisa ubuningi bomzila ngokuqondile nangokuqondile.

Esikhundleni sokuzama ukuqondisa yonke inethiwekhi ngesakhiwo se-PCB esivamile esijiyile, onjiniyela bangakha izendlalelo ezengeziwe ze-dielectric nezethusi ezizungeze i-substrate eyinhloko futhi basebenzise ama-microvia ukuxhuma izendlalelo eziseduze.

Le ndlela ivumela ubuningi obukhulu bomzila ngaphakathi kwephakeji elincane.

Umphumela ubaluleke kakhulu kumadivayisi e-semiconductor lapho ukuminyana kwephakheji ye-I/O sekungomunye wemikhawulo emikhulu ekwakhiweni kwesistimu iyonke.

I-ABF Substrate vs. I-PCB Ejwayelekile

Kubalulekile ukungasebenzisi amagama athi ABF PCB kanye ne-ABF package substrate ngokushintshana.

Nakuba zombili zisebenzisa omqhubi bethusi nezinto zokwakha i-dielectric, izinhloso zazo zokuklama kanye nezidingo zokukhiqiza zihlukile.

I-PCB evamile ingaxhuma iprosesa, inkumbulo, isekethe yamandla, izixhumi, nezinye izingxenye ebhodini elikhulu.

I-substrate yephakheji ye-ABF yenza umsebenzi ohlukile: inikeza ukuxhumana okuxinene kakhulu ngaphansi noma eduze kwephakheji ye-semiconductor.

Lowo mehluko uchaza nokuthi kungani ubuchwepheshe buvame ukuvela ndawonye ezinhlelweni ze-elekthronikhi ezithuthukisiwe.

Indlela Izakhiwo Zokwakha ze-ABF Ezisebenza Ngayo

Isakhiwo se-substrate se-ABF esenziwe lula singaqondwa njengochungechunge lwezendlalelo ze-dielectric nezethusi ezakhiwe zizungeze umongo.

Umqondo wokukhiqiza ngokuvamile uhilela izigaba eziningana ezinkulu:

Ukugeleza kwenqubo ngqo kuyahlukahluka ngokuya ngokwakhiwa kwe-substrate, ikhono lomkhiqizi, imithetho yokuklama, kanye nezidingo zephakheji.

Ukwakheka Kwe-Dielectric

Ifilimu ye-ABF inikeza ungqimba lokuvikela phakathi kwezakhiwo zethusi eziqhubayo.

I-dielectric kumele ihlinzeke ngezici zikagesi ezidingekayo ngenkathi futhi isekela ukwenziwa kwezici ezinhle kanye nokuxhumeka okuthembekile.

Ubukhulu kanye nezakhiwo zesendlalelo ngasinye se-dielectric kuthinta i-geometry yokuqondisa, ngokwakheka, ukuziphatha kwe-impedance, amandla, kanye nezici zemishini.

Ama-Microvia e-Laser

Esinye sezici ezichazayo zezakhiwo ezithuthukisiwe zokwakheka ukusetshenziswa kwama-microvia enziwe nge-laser.

Ngokungafani nezimbobo ezinkulu ezivamile, ama-microvia angaxhumanisa izendlalelo eziseduze ezihlanganisiwe ngenkathi ethatha indawo encane kakhulu.

Lokhu kuvumela iziteshi zokuhambisa ukuthi zidlule ezindaweni ezinabantu abaningi.

Ngakho-ke, i-geometry ye-microvia, ubukhulu be-landing-pad, ikhwalithi ye-copper plating, kanye nokunemba kokuqondanisa kubalulekile ekuvuneni kwe-substrate.

Ngobuchwepheshe be-PCB obuhlobene, umhlahlandlela wethu wezakhiwo ze-PCB zokuxhumanisa okuphezulu unikeza isizinda esiwusizo sendlela ukuxhumana okuqondile okuncane okwandisa ngayo ubuningi bomzila.

I-Copper Metallization

Ngemva kokwakheka kwe-dielectric kanye nokubhoboza nge-laser, kumele kudalwe izakhiwo zethusi eziqhubayo.

Kuye ngenqubo yokukhiqiza, ukwakheka kwezingqimba zembewu, ithusi elingena-electro, i-electroplating, kanye nezinqubo zokudweba zingahlanganiswa ukuze kukhiqizwe i-geometry edingekayo yokuqhuba.

Ezilinganisweni ze-substrate ezithuthukisiwe, ukulawulwa kwenqubo kuba yinto ebaluleke kakhulu ngoba ukuhlukahluka okuncane kakhulu kobukhulu bethusi, ububanzi bomugqa, isikhala, noma ukubhaliswa kungathinta ukusebenza kukagesi nokukhiqiza.

Izinselele Zokukhiqiza Izinto Ezingaphansi Kwe-ABF

Ukukhiqizwa kwe-ABF substrate kudinga kakhulu kunokwenziwa kwe-PCB okuvamile okunezingqimba eziningi.

Ubunzima abubangelwa inqubo eyodwa. Bubangelwa ukusebenzisana kwamajiyometri amahle kakhulu, imijikelezo eminingi yokwakha, ukuziphatha kwezinto, ukucubungula ithusi, ukubhoboza nge-laser, ukubhaliswa, ukuhlolwa, kanye nokuphathwa kwesivuno.

Ukupeyinta Okuhle

Njengoba ububanzi bemigqa nezikhala kuncipha, ukuhlukahluka okuncane kuba okubaluleke kakhulu ngokulingana.

Ukwehluka kwenqubo okungabalulekile kwi-PCB evamile kungase kungamukeleki uma i-geometry yomqhubi ilinganiswa ngesilinganiso esincane kakhulu.

Ngakho-ke abakhiqizi badinga izinqubo zokuthatha izithombe ezilawulwa ngokuqinile, ukucwebezela, ukuqopha, ukubhalisa, kanye nokuhlola.

Ukubhaliswa Kwesendlalelo-kusendlalelo

Isendlalelo ngasinye sokwakheka esengeziwe sethula esinye isidingo sokuqondanisa.

I-microvia kumele ihlale kahle esibonelweni sethusi esingaphansi, kuyilapho iphethini yomzila ophezulu kumele ivumelane nesakhiwo esizungezile.

Ngakho-ke amaphutha okubhalisa anganqwabelana kulo lonke uhlelo lokukhiqiza.

Nge Ukuthembeka

Ama-Microvia kumele agcine ukuxhumana okuthembekile kukagesi nokwemishini ngokucubungula nokusebenza okulandelayo.

Ukungakheki kahle, ukungabi khona kahle kwethusi, ukuqhekeka, noma ukucindezeleka ngokweqile kungabangela izinkinga zokuthembeka.

Ngakho-ke ubudlelwano phakathi kokubhoboza nge-laser, i-desmear, ukwakheka kwembewu, i-plating, kanye nemijikelezo yokushisa elandelayo kumele bulawulwe ngokucophelela.

Ukuzinza Kwezinto Ezibonakalayo Nobukhulu

Ama-substrate ephakheji abhekana nokucindezeleka kokushisa kanye nokwemishini ngesikhathi sokwenziwa, ukuhlanganiswa, kanye nokusebenza.

Umehluko ku-coefficient yokwanda kokushisa, ukuziphatha komswakama, izakhiwo ze-dielectric, ukusatshalaliswa kwethusi, kanye nokwakhiwa kwezingqimba kungathinta ukuzinza kobukhulu kanye nokuthembeka kwephakheji.

Ngenxa yalesi sizathu, ukukhethwa kwezinto akukwazi ukuhlukaniswa nesakhiwo esiphelele se-substrate.

Ubuchwepheshe be-ABF Substrate kanye ne-HDI

Ama-substrate e-ABF nama-HDI PCB abelana ngemibono eminingana ebalulekile yokukhiqiza, kodwa akufanele aphathwe njengobuchwepheshe obufanayo.

Zombili zingasebenzisa:

• Izendlalelo ze-dielectric ezakhelwe ngaphakathi
• Laser imishini
• Ama-Microvias
• Ithusi elinomugqa omuhle
• Ukucutshungulwa okulandelanayo
• Umzila wobuningi obukhulu

Kodwa-ke, i-substrate yephakheji ye-ABF isebenza ezingeni lephakheji ye-semiconductor, lapho ubuningi bokuxhumana kanye nezidingo zobukhulu zingaba nzima kakhulu.

Ubuchwepheshe be-HDI buhlala bubaluleke kakhulu ohlangothini lwebhodi lesistimu.

Isibonelo, uhlelo lokubala olusezingeni eliphezulu lungaqukatha:

Ngakho-ke i-substrate yephakheji kanye ne-PCB yesistimu kudingeka kusebenze ndawonye ngogesi nangomshini.

Lesi esinye sezizathu ezenza abakhiqizi be-PCB abathuthukile badinge kakhulu ubuchwepheshe ezakhiweni ezinabantu abaningi kunokuba kwenziwe kuphela izingqimba eziningi ezivamile.

Ukwakheka okulandelanayo kubaluleke kakhulu lapho kuklanywa izakhiwo ze-HDI eziyinkimbinkimbi. Onjiniyela bangafunda kabanzi ngale ndlela esihlokweni sethu mayelana nomklamo we-HDI PCB stack-up.

Ukusebenza Kukagesi Kwezingxenye Ezingaphansi Ze-ABF

Ukukhethwa kwe-substrate ye-ABF akugcini nje ngokuxinana komzila ongokoqobo.

Ukusebenza kukagesi kuba yinto ebaluleke kakhulu njengoba izixhumi zephakeji zisekela amazinga aphezulu edatha kanye nokubalwa okukhulu kwesignali.

Properties Dielectric

Izici ze-dielectric constant kanye nokusatshalaliswa kwesistimu ye-dielectric zithinta ukusabalala kwesignali, amandla, impedance, kanye nokulahlekelwa.

Izakhiwo ezifanele kumele zihlolwe kanye nesakhiwo sangempela sephakheji kunokuphathwa njengezinombolo zezinto ezihlukanisiwe.

Ubuqotho Besiginali

Ukuxhumana okufushane akuziqedi ngokuzenzakalelayo izinkinga zokuqina kwesignali.

Ngamazinga aphezulu edatha, ukulandelwa kwamaphakheji, ama-via, ukuguqulwa, izindiza zokubhekisela, kanye nokuxhumeka kwe-PCB konke kungasiza kulokhu:

• Ukulahleka kokufakelwa
• Buyisela ukulahleka
• I-Crosstalk
• ukucabanga
• Skew
• Impedance discontinuities

Ngakho-ke i-substrate yephakheji yakha ingxenye yesiteshi esiphelele sesivinini esikhulu.

Uma isignali isiphuma ku-substrate yephakheji futhi ingena ku-PCB yesistimu, i-PCB stackup kanye nesistimu yezinto kumele iqhubeke nokusekela izidingo zikagesi.

Ngezinhlelo zokusebenza ezingeni lesistimu, onjiniyela bangabuyekeza izinsiza zethu ekukhiqizweni kwe-PCB okusheshayo kanye nezinto ze-PCB ezisheshayo.

Amandla Ubuqotho

Amaprosesa athuthukisiwe kanye nama-accelerator angadala nezidingo zokulethwa kwamandla ezidingakalayo.

I-substrate yephakheji kumele ivumelane namandla aminyene kanye nokuxhumeka komhlabathi ngenkathi igcina ukusebenza kukagesi nokushisa okwamukelekayo.

Lokhu kuba kubaluleke kakhulu ezinhlelweni zokubala ezisebenza kahle kakhulu lapho ukuminyana kwamandla eprosesa, izixhumi zesivinini esikhulu, umkhawulokudonsa wememori, kanye nomklamo wokushisa kuxhumene kakhulu.

Izicelo ze-ABF Substrate

Ama-substrate e-ABF ahlotshaniswa kakhulu nokupakishwa kwe-semiconductor okuthuthukisiwe lapho kudingeka khona ubuningi bokuxhumana okuphezulu.

Ama-CPU nama-GPU

Amaprosesa asebenza kahle adinga inani elikhulu lokuxhumeka kwephakheji kanye nomzila we-substrate oqinile.

Ama-substrate ephakheji asekelwe ku-ABF anganikeza isakhiwo sokuxhumana esihle esidingekayo phakathi kwephakheji ye-semiconductor kanye nesistimu yangaphandle.

I-AI Accelerators

Ihadiwe yokubala ye-AI ibeka izidingo ezinkulu ku-processor I/O, i-memory interfaces, ukulethwa kwamandla, kanye nokuxhumana okusheshayo.

Njengoba izakhiwo ze-accelerator ziba yinkimbinkimbi kakhulu, ubuningi bokuxhumana kwezinga lephakheji buba yinto ebaluleke kakhulu.

I-PCB yangaphandle kumele ihlinzeke ngengqalasizinda kagesi, yemishini, ye-thermal, kanye neyamandla efanele ezungeze iphakheji.

Ihadiwe Yenethiwekhi kanye Nesikhungo Sedatha

Amadivayisi okushintsha okusheshayo kanye nokuxhumana angadinga ukuxhumana okukhulu kwamaphakheji kanye nomzila webhodi lesistimu odingayo.

I-substrate yephakheji kanye ne-PCB kumele zisebenzisane ukuze kulondolozwe ubuqotho besiginali kuyo yonke isiteshi.

Amadivayisi e-ASIC kanye ne-Custom Computing

Amasekethe ahlanganisiwe aqondene nohlelo lokusebenza angaba nezidingo zephakheji ezenziwe ngokwezifiso kakhulu.

Ukwakheka kwe-substrate kungadinga ukwamukela amalungiselelo athile e-I/O, izizinda zamandla, izixhumi zesivinini esikhulu, kanye nemikhawulo yemishini.

Ukwakhiwa Okusekelwe Ku-Chiplet

Ukwakhiwa kwe-Chiplet kubeka izidingo ezengeziwe ekuxhumekeni kwephakeji ngoba ama-semiconductor dies amaningi angase axhumane ngesakhiwo sephakeji esivamile.

Njengoba ukwakheka kwamaphakheji kushintsha, i-substrate iba yingxenye ebaluleke kakhulu yesistimu yokuxhumana iyonke.

I-ABF Substrate kanye ne-BGA Packaging

Ubuchwepheshe be-ABF buhlobene eduze nezakhiwo zamaphakheji ezithuthukisiwe, kufaka phakathi amaphakheji e-BGA asezingeni eliphezulu.

I-substrate yephakheji isabalalisa amasignali avela ku-semiconductor die kuya kuma-terminal ephakheji angaphandle, angabe esexhuma kwi-PCB yesistimu.

Lokhu kudala amazinga amaningi okuxhumana:

Ukushintsha phakathi kwala mazinga kumele kuklanywe ngokucophelela.

Konjiniyela abasebenza ohlangothini lwebhodi lwalesi sixhumi, ukuqonda ama-substrate e-BGA kanye nezakhiwo zamaphakheji kuyasiza.

Uma iphakheji ye-BGA isibekwe ebhodini lesistimu, i-geometry ye-solder-joint, ukwakheka kwephedi, iphrofayili yokushisa, ukubekwa kwezingxenye, kanye nokuhlolwa nakho kuba yinto ebalulekile.

Ukuklama i-PCB Ezungeze Iphakheji Esekelwe ku-ABF

I-PCB yesistimu kumele iklanywe ukuze ihambisane nephakheji kunokuphatha iphakheji njengengxenye ehlukanisiwe.

Ukuphuma Kwabalandeli Nokubaleka

Amaphakheji e-High-I/O angadala izindawo eziminyene kakhulu zomzila wokuphunyuka.

Umklami we-PCB kungadingeka ahlanganise umzila we-BGA oqondile, izakhiwo ze-via-in-pad, ama-microvia, ama-via afihliwe, kanye nokwabiwa kwezingqimba okuhlelwe ngokucophelela.

Inhloso akukhona nje ukuhlanganisa zonke izixhumanisi ebhodini. Ukwakheka kwe-routing kumele futhi kugcine ukukhiqizwa nokusebenza kukagesi.

Ukukhetha Okuhlanganisiwe

I-PCB stackup ithinta:

• Ukuvimba kwesignali
• Ukuqhubeka kwendiza yokubhekisela
• Ukusabalalisa amandla
• I-Crosstalk
• Ukuziphatha okushisayo
• Ngokwakhiwa kwezakhiwo
• Ubunkimbinkimbi bokukhiqiza

Kumabhodi eprosesa anesivinini esikhulu kanye nenethiwekhi, ukuguqulwa kwephakheji kuya ku-PCB kufanele kucatshangelwe ngesikhathi sokuthuthukiswa kwe-stackup.

Ukunikezwa kwamandla

Amaprosesa amakhulu kanye nama-accelerator angadinga ukulethwa kwamandla kagesi amakhulu ezindaweni ezincane kakhulu zamaphakheji.

Ngakho-ke i-PCB idinga isakhiwo esifanele sendiza yamandla, ukusatshalaliswa kwethusi, ngokuhlelwa, isu lokuhlukanisa, kanye nomklamo wokushisa.

Ukukhiqiza Ukubekezelelana

Isixhumi esibonakalayo sephakheji esiyinkimbinkimbi kakhulu singenza ukwenziwa kwe-PCB kube bucayi kakhulu ekuqongeleleni kokubekezelelana.

Ubukhulu bephedi, ukubhaliswa kwemaski yesolder, ngokubeka, ukujiya kwethusi, ukunemba kokubhoboza, kanye nokubhaliswa kwezingqimba konke kufanele kuhlolwe ngokuqhathanisa nekhono langempela lokukhiqiza.

Ukubuyekezwa okuqinile komklamo we-PCB wokukhiqiza kungakhomba izinkinga zokukhiqiza ngaphambi kokuba kuqale ukukhiqizwa.

I-ABF Substrate vs. Ezinye Ubuchwepheshe be-IC Substrate

I-ABF akuyona yodwa into noma ukwakhiwa okusetshenziselwa izinto ezisetshenziswayo ze-semiconductor substrates.

Izinhlobo ezahlukene zamaphakheji zingadinga ubuchwepheshe obuhlukene be-substrate.

Ukukhetha okufanele kuncike ezintweni ezifana nalezi:

• Inani le-I/O
• Usayizi wephakheji
• Ubuningi bomzila
• Isivinini sesiginali
• Izidingo zokushisa
• Intengo eqondiwe
• Izithiyo zemishini
• Ivolumu yokukhiqiza
• Ukwakhiwa kwephakheji ye-semiconductor

I-ABF ihlotshaniswa ikakhulukazi ne-substrates ezisezingeni eliphezulu ze-organic, kodwa ezinye izindlela ze-substrate zingase zifaneleke kakhulu ezinhlotsheni ezahlukene zephakheji.

Yingakho ukukhetha i-substrate kufanele kuqale ngokwakhiwa kwephakheji kanye nezidingo zikagesi kunokukhetha nje izinto ezisezingeni eliphezulu kakhulu ezitholakalayo.

Izinto Ezicatshangelwayo Zokwethembeka Kwe-ABF Substrate

Ukuthembeka kumele kuhlolwe kulo lonke uhlelo lwephakheji kanye nebhodi.

I-Thermal Cycling

Izinguquko zokushisa eziphindaphindayo zibangela ukucindezeleka kwemishini ngoba izinto ezahlukene ziyanda futhi zinciphe ngamazinga ahlukene.

Ngakho-ke i-substrate yephakheji, iphakheji ye-semiconductor, ama-solder joints, kanye ne-PCB kudingeka kuhlolwe njengesakhiwo esihlanganisiwe.

umswakama

Izinto ze-dielectric eziphilayo zingasebenzisana nomswakama, okungase kuthinte ukuziphatha kokucubungula kanye nokuthembeka.

Ngakho-ke izimo zokuphathwa komswakama kanye nokugcinwa kwazo zidinga ukulawulwa ngokwezidingo zezinto zokwakha kanye nenqubo yephakheji.

Ukuthembeka kwe-Microvia

Izakhiwo ze-microvia kumele zihlale zithembekile ngogesi nangomshini ngokukhiqiza kanye nokusebenza ngokujikeleza kokushisa.

Ikhwalithi yethusi, ngokusebenzisa i-geometry, i-plating, i-dielectric interfaces, kanye nokucindezeleka kokushisa konke kunegalelo ekusebenzeni kahle.

Ukuthembeka kwephakheji kuya ku-PCB

Ngisho noma i-substrate ye-ABF ngokwayo isebenza kahle, ukuhlanganiswa okuphelele kusengaba nokwehluleka ku-interface yephakheji kuya ku-PCB.

Amajoyinti e-BGA solder, i-PCB warpage, ukungafani kokushisa, iphrofayili yokuhlanganisa, kanye nokulayisha ngomshini konke kungathinta ukuthembeka kwensimu.

Ngezinhlelo zokusebenza ze-BGA, onjiniyela bangabuyekeza ulwazi lwethu mayelana nokuhlanganiswa kwe-BGA PCB kanye nokuhlolwa okuhlobene kanye nokucatshangelwa kwe-solder-joint.

Indlela Yokuhlola Iphrojekthi Ye-ABF Substrate

Uma kuhlolwa iphrojekthi ehlobene ne-ABF, kuyasiza ukuhlukanisa izidingo zibe amazinga amane.

1. Izidingo Zephakheji Ye-Semiconductor

• Usayizi wedayi
• Inani le-I/O
• Ubukhulu bephakheji
• Iphimbo le-I/O
• Izidingo zamandla
• Izidingo ze-interface yesivinini esikhulu
• Ukwakhiwa kwephakheji

2. Izidingo Ze-Substrate

• Ukwakhiwa okuyinhloko
• Inani lezendlalelo ezakhiwe
• Uhlelo lwe-dielectric
• Umugqa/isikhala esincane
• Ubukhulu be-Microvia
• Ubukhulu bephedi
• Ukujiya kwethusi
• Ukuqedwa kwendawo
• Izidingo zokubhalisa
• Izidingo ze-Warpage

3. Izidingo ze-PCB Yesistimu

• Inani lezingqimba ze-PCB
• isitaki
• Uhlelo lwezinto ezibonakalayo
• Impedance elawulwayo
• Isu lokubaleka le-BGA
• Ngesakhiwo
• Isisindo sethusi
• Izidingo zokushisa
• Ukusabalalisa amandla
• Ukuqedwa kwendawo

4. Izidingo Zomhlangano

• Imininingwane yengxenye ye-BGA
• I-solder inamathisela
• Umklamo we-stencil
• Geza kabusha iphrofayela
• Izidingo ze-AOI
• Ukuhlolwa kwe-X-ray
• Ukuhlolwa kukagesi
• Izimfuneko zokusebenza kabusha
• Ukulandelela

Ukuhlukanisa la mazinga amane kwenza kube lula ukubona ukuthi inkinga ivela kuphi.

Inkinga yezinga lephakheji akufanele iphathwe ngokuzenzakalelayo njengenkinga yokwenziwa kwe-PCB, futhi umkhawulo womzila wezinga le-PCB akufanele ubhekwe ngokuzenzakalelayo ku-substrate ye-ABF.

I-ABF Substrate ku-Advanced Electronics Manufacturing Chain

Ubuchwepheshe be-ABF bubonisa indlela ukupakisha kwe-semiconductor kanye nokukhiqizwa kwe-PCB okuxhumana ngayo kakhulu.

Ipulatifomu yesimanje yokusebenza kahle kakhulu ingaba nobuchwepheshe obuhlukahlukene bokukhiqiza:

Isigaba ngasinye sinezidingo zobuchwepheshe ezahlukene, kodwa ukuxhumana kukagesi nokwemishini phakathi kwazo kumele kuhlale kuhambisana.

Kubakhiqizi be-PCB, lokhu kusho ukuthi ukuqonda ukupakishwa kwe-semiconductor kuya ngokuya kuba yigugu ngisho nalapho umthwalo wangempela wokukhiqiza ugxile ebhodini lezinga lesistimu.

I-PCB ayiseyona nje ipulatifomu engenzi lutho ezungeze iprosesa. Yakha ingxenye yokwakheka okuphelele kukagesi, ukushisa, kanye nokwemishini.

Kungani i-DFM Ibalulekile Kumaphrojekthi e-PCB ahlobene ne-ABF

Amaphakheji asekelwe ku-ABF angakha izixhumi ze-PCB eziminyene kakhulu.

Ukuzama ukuxazulula lezo zindawo zokusebenzelana kuphela ngemva kokuba ukwakheka kwe-PCB sekuqediwe kungaholela ekuklanyweni kabusha okungadingekile.

Ukubuyekezwa kwe-DFM kufanele kuqale ngaphambi kokukhishwa kokukhiqiza.

Inhloso ukugcina umklamo kagesi ohlosiwe ngenkathi kuqinisekiswa ukuthi ibhodi elibonakalayo lingakhiqizwa njalo.

Lokhu kubaluleke kakhulu uma umklamo uhlanganisa amaphakheji athuthukile nezakhiwo ze-HDI, ngoba umklamo ongasetshenziswa ngokwemfundiso ungase ungasebenzi ezingeni lokukhiqiza.

Kusukela kuphakheji ye-ABF kuya ku-PCBA eqediwe

I-substrate ye-ABF ngokwayo iyingxenye eyodwa kuphela yomkhiqizo ophelele.

Uma iphakheji ethuthukisiwe isinamathiselwe kwi-PCB yesistimu, inqubo yokukhiqiza iyaqhubeka ngokubekwa kwezingxenye, ukushiswa nge-solder, ukuhlolwa, ukuhlolwa, kanye nokuhlanganiswa okungenzeka kube yizinga lesistimu. Ezingeni le-PCB, ukuhlanganiswa kwe-HDI esibonakalayo sebhodi lesistimu kuhlala kungumsebenzi wokukhiqiza ohlukile ekukhiqizeni i-substrate yephakheji.

Ngakho-ke, umlingani wokukhiqiza onekhono kufanele aqonde ubudlelwano phakathi kwe-PCB engenalutho kanye nokuhlanganiswa kokugcina.

Kumaphrojekthi adinga kokubili ukwenziwa kwebhodi kanye nokuhlanganiswa kwezingxenye, izinsizakalo zokuhlanganiswa kwe-PCB zingasiza ukuxhumanisa izigaba zokwenziwa kanye nokuhlanganiswa ngaphakathi kwenqubo yokukhiqiza ehlelekile.

Lokhu kuba usizo kakhulu kumabhodi eprosesa anabantu abaningi lapho imininingwane yokwenziwa kwe-PCB kanye nemingcele yokuhlanganiswa ingenakucatshangelwa ngokuzimela.

I-ABF Substrate: Izinto Ezibalulekile Okufanele Uzicabangele

Ubuchwepheshe be-ABF substrate bunesikhundla esibalulekile phakathi kokupakisha kwe-semiconductor kanye nokukhiqizwa kwe-PCB ezingeni lesistimu.

Amaphuzu abaluleke kakhulu yilawa:

• I-ABF isho ifilimu yokwakha i-Ajinomoto, ubuchwepheshe be-dielectric obusetshenziswa kakhulu kuma-substrate ephakethe athuthukile.
• An I-substrate yephakheji ye-ABF akuyona nje i-PCB evamile eyenziwe nge-laminate ehlukile.
• Inhloso yayo eyinhloko ukuhlinzeka ngokuxhumana kukagesi okuqinile kakhulu phakathi kwephakheji ye-semiconductor kanye nohlelo lwangaphandle.
• Izendlalelo ezakhiwe, ama-laser microvia, ukuhanjiswa kwethusi okucolekile, kanye nokubhaliswa okuqinile kubalulekile kubuchwepheshe.
• Ama-substrate e-ABF ahlotshaniswa kakhulu nezinhlelo zokusebenza ze-semiconductor eziphezulu ze-I/O ezifana nama-processor, ama-accelerator, ama-ASIC, namadivayisi enethiwekhi athuthukile.
• I-substrate yephakheji kanye ne-PCB yesistimu kumele kucatshangelwe ndawonye ukuze kutholakale ubuqotho besiginali, ukulethwa kwamandla, ukuziphatha kokushisa, kanye nokuthembeka.
• Ubuchwepheshe be-PCB obunobuningi obuphezulu njenge-HDI bubaluleke kakhulu esibonakalayo sephakheji ebhodini.
• Ukukwazi ukukhiqiza kufanele kubuyekezwe kusenesikhathi ngoba amajiyometri amancane kanye nokubekezelelana okuqinile kungathinta kakhulu isivuno kanye nezindleko.
• Umkhiqizo wokugcina awuxhomekile nje kuphela ekhwalithini ye-substrate kodwa futhi nasekukhiqizweni kwe-PCB, ekuhlanganisweni, ekuhlolweni nasekuhlolweni.

Imibuzo Evame Ukubuzwa Mayelana Nezingxenye Ze-ABF