Izinsizakalo Zokwenza I-Borosilicate Glass PCB

Ama-PCB engilazi ye-borosilicate angamabhodi wesekethe aklanywe ngokunemba akhiwe phezu kwezingxenye zengilazi ze-borosilicate, anenani lokuqina kwawo okulinganayo, ukubonakala okubonakalayo, ukulahlekelwa okuphansi kwe-dielectric, kanye nokusebenza okuthembekile kokushisa. Lawa mabhodi asetshenziswa kabanzi kumasekethe e-RF, i-radar yezimoto, ama-elekthronikhi acacile, kanye namaphakheji e-IC eyinhloko yengilazi. Amaphrojekthi aphumelelayo adinga ukubuyekezwa kokusetshenziswa ngokucophelela, ukukhethwa kwezinto, ukuhlolwa kwe-DFM, kanye nokuqinisekiswa kwesakhiwo ukuqinisekisa ukukhiqizwa nokusebenza. Ukulungiswa kobunjiniyela kwasekuqaleni kubalulekile ngoba izingxenye zengilazi ziziphatha ngendlela ehlukile ku-FR-4, ngokubekezelelana okuqinile kokuthamba, ngokubeka, kanye nokwandiswa kokushisa.

Thola Isilinganiso se-Borosilicate Glass PCB

Ukubuka Konke kanye Nezinzuzo Zama-PCB Engilazi E-Borosilicate

Ingilazi ye-borosilicate iqukethe i-~70–80% SiO₂ kanye ne-10–15% B₂O₃, okwenza ikhule kancane ekushiseni, ukumelana nokushaqeka okuphezulu kokushisa, kanye nokulahleka okuphansi kwe-dielectric. I-borosilicate yebanga le-PCB ikhiqizwa ngokubekezelelana okuqinile (ukujiya ±0.01 mm, ukuba flat Ra <0.5 µm) kanye nobuningi obuncane bokukhubazeka. Ubukhulu obujwayelekile busukela ku-0.3 mm kuya ku-3 mm, ngezinketho ezincane kakhulu ezifinyelela ku-0.1–0.2 mm kusetshenziswa ukwesekwa kwenkampani, kanye namaphaneli amakhulu (4–6 mm) ezinhlelo zokusebenza ze-LED noma zesakhiwo.

• I-CTE ifana kakhulu ne-silicon (~3.3 ppm/°C vs 2.6 ppm/°C), kunciphisa ukucindezeleka kwe-solder futhi kuthuthukise ukuthembeka ku- amaphakheji e-IC eyinhloko yengilazi.
• Ukulahleka kwe-dielectric okuphansi (Df ~0.004–0.010 ku-1–77 GHz), kufanelekile kumadizayini e-impedance alawulwa yimvamisa ephezulu, ama-array ahlukaniswe ngezigaba, kanye nezinhlelo zokusebenza ze-mmWave.
• Ukuqina kobukhulu kanye nokuba yisicaba kuvumela umzila oqondile kanye nezakhiwo zesitayela sephakeji, okubaluleke kakhulu kumasekethe engilazi amaningi kanye nezakhiwo ze-interposer ezinabantu abaningi.
• Ukumuncwa komswakama okungekho kuthuthukisa ukuthembeka kwesikhathi eside ezindaweni zezindiza, zezimoto, kanye nezezimboni.
• Ukukhanya okubonakalayo (ukukhanya okubonakalayo okungu-91–93%) kwenza kube lula ukuhlanganiswa kwe-elekthronikhi esobala, izinzwa, kanye nama-LED arrays.

Uma kuqhathaniswa namabhodi e-FR-4, ama-PCB engilazi e-borosilicate adinga izinyathelo ezikhethekile zokukhiqiza: okusekelwe ku-laser ngokwakhiwa kwama-vertical interconnects, i-PVD metallization yokufakwa kwe-conformal copper, kanye ne-photolithographic patterning yama-geometries okulandelela amahle kakhulu. Lezi zinqubo ziqinisekisa ukusebenza okunembile kagesi nokwemishini ngenkathi kuvumela izakhiwo zesekethe ezithuthukisiwe.

Izici zikagesi nezishisayo

Ingilazi ye-borosilicate igcina izakhiwo zikagesi ezizinzile kububanzi bemvamisa ebanzi. I-Dielectric constant (Dk) isukela ku-4.55 ku-1 GHz kuya ku-4.47 ku-77 GHz, ene-dissipation factor ephansi (Df) engu-~0.004–0.010, okwenza ifaneleke kakhulu kumasekethe edijithali e-RF, 5G mmWave, kanye nesivinini esikhulu. Ukwehluka okuncane kwe-Dk kwenza kube lula ukwakheka kwe-impedance elawulwayo futhi kunciphisa ukuphambuka kwesignali.

Izakhiwo zokushisa zifaka:

• Ukuqhathaniswa kwe-CTE: Kunciphisa ukucindezeleka kokushisa kwamasekethe e-flip-chip kanye nesitayela sephakheji, kusekela ama-bump pitches angu-50–100 μm. Kuqinisekisa ukuthembeka kwejoyinti le-solder lesikhathi eside kumaphakheji e-radar yezimoto kanye nama-IC avame kakhulu.
• Ukumelana nokushaqeka okushisayo: Izinzile kusukela ku-−40°C kuya ku-+500°C, ifanele ukusetshenziswa kwezimoto, izindiza, izimboni, kanye nolwandle lapho kwenzeka khona ukujikeleza kwezinga lokushisa okusheshayo.
• I-Thermal conductivity: ~1.2 W/m·K, okwanele ukushabalalisa ukushisa okumaphakathi kuma-LED, amamojula e-RF, kanye nama-compact package assemblies. Ukulingisa ukushisa kanye nokuhlolwa kwamandla kungathuthukisa ukwakheka kokusebenza okuqhubekayo.

Umklamo kagesi kumele ucabangele ububanzi bokulandelela, ukujiya kwesendlalelo, ngokusebenzisa amandla, kanye nesu lokuxhumana okuqondile ukuze kulondolozwe impedance, ubuqotho besignali, kanye nokuphathwa kokushisa. Ukubuyekezwa kwe-DFM kuqinisekisa ukuthi la mapharamitha aqinisekiswa kusenesikhathi, kubhekiselwa kumakhono okukhiqiza i-PCB yengilazi.

Izakhiwo Zemishini, Zokubona, Nezamakhemikhali

Ama-PCB engilazi ye-borosilicate ahlinzeka ngenhlanganisela yokuqina, ukukhanya okubonakalayo, kanye nokumelana namakhemikhali:

• Ukuzinza kwemishini: Izinyathelo zokuphepha eziqinile, eziyisicaba, nezihambisanayo; kubalulekile ukuvimbela ukuqhekeka noma ukuqhekeka. Ukubhala nge-laser noma ukusika okujulile kuvame ukusetshenziselwa ukusika.
• Ukusebenza kokubonisa: Ukudlulisa okubonakalayo okungu-91–93%, i-near-IR engu-91–95%, kufanelekile kuma-electronics abonakalayo, izinzwa ze-optical, namaphaneli e-LED. Lokhu kuvumela ukuhlanganiswa kwezindawo ze-optical ngaphandle kokuphazamisa umzila kagesi.
• Ukumelana kwamakhemikhali: I-Hydrolytic Class 1 (ISO 719), imelana nama-acid, izisekelo, izinyibilikisi, kanye nezinto zokuhlanza ezijwayelekile. Isekela izembozo ezihlanganisiwe, ama-encapsulants, kanye nezinamathiseli zezinhlelo zokusebenza zangaphandle nezemvelo ezinzima.
• Amandla angaphezulu: Amandla aphezulu ongaphezulu athuthukisa ukunamathela kwamafilimu ensimbi e-PVD, ama-photoresist, kanye nezingubo zokugqoka ezihlanganisiwe. Ukwelashwa nge-plasma kungathuthukisa kakhulu ukusebenza kobuso.

Lezi zakhiwo zemishini, ezibonakalayo, nezamakhemikhali zivumela ukuqondisa umqhubi we-high density, ukubekwa kwephedi okunembile, kanye nokuhlanganiswa kwezici zokushisa noma ezibonakalayo, ngenkathi kugcinwa ukuthembeka kwesikhathi eside ezindaweni ezinzima.

Umklamo, Ukwenziwa, kanye Nokucatshangelwa kwe-DFM

Ukubuyekezwa kwe-DFM kubalulekile ukuqinisekisa ukuthi imiklamo ye-PCB ye-borosilicate iyakhiqizwa. Ingilazi iziphatha ngendlela ehlukile kune-FR-4: iyaphuka, izinzile ngokwezinga, futhi iyazwela ekucindezelekeni komphetho. Izinto ezibalulekile okufanele uzicabangele zifaka:

• Ngokuhlela indawo, ububanzi, kanye nokuxhumeka okuqondile, ukubhekisela ingilazi edlulayo ngezidingo
• Ububanzi bokulandelela, isikhala, kanye nezinhloso zokuvimbela ezilawulwayo, okubalulekile ekwakhiweni kwemvamisa ephezulu kanye ne-RF
• I-geometry yephedi, ukulingana kwezingqimba, kanye nokusatshalaliswa kwethusi ukuze kuncishiswe ukugoba kanye nokucindezeleka komshini
• Ukususwa komphetho, ukusika, kanye nokuphathwa kwe-substrate ukuze kutholakale i-laser singulation noma ikhwalithi yomphetho obonakalayo
• Izindawo ezibonakalayo, ukucaca, kanye nemingcele yokuhlangana ukuze kugwenywe ukungalungi kahle nokugcina ukuhleleka

Ukubuyekezwa kwasekuqaleni kwe-DFM kuqinisekisa ukuthi ama-prototype noma ukukhiqizwa kweqembu elincane kuhlangabezana nezidingo zikagesi, zemishini, nezokushisa. Impendulo evela kulokhu kubuyekezwa iqondisa ukulungiswa kwesakhiwo, ukwakheka kwamaphedi, kanye nokukhethwa kwenqubo ukuze kutholakale isivuno esifanayo.

Izicelo kanye Nokuhlela Ukukhiqiza

Ama-PCB engilazi ye-borosilicate akhethwa kumaphrojekthi adinga ukusebenza kukagesi, ukuzinza kokushisa, noma ukucaca:

• Amamojula e-RF e-5G mmWave, ama-antenna e-array ahlukaniswe ngezigaba, kanye nezinhlelo ze-AiP ezidinga ukulawulwa okuqondile kwe-impedance
• Amasekethe e-radar yezimoto (77 GHz) kanye namamojula enzwa amancane
• Amaphakheji e-IC eyinhloko yengilazi ukuhlanganiswa kwe-flip-chip ephihliwe kahle
• Amaphaneli e-LED abonakalayo kanye nezinto zobuchwepheshe ezithinta ukukhanya
• I-elekthronikhi yezemvelo enzima: izindiza, olwandle, uwoyela negesi, izinhlelo zezimboni ezishisa kakhulu
• Ama-biosensor e-optical kanye namadivayisi e-lab-on-chip adinga ukuzinza kwamakhemikhali kanye nokuhambisana kokubulala inzalo

Ukuhlela ukukhiqiza kuhlanganisa ukuhlolwa kwe-prototype, ukulungela ukuhlanganiswa, kanye nokukhiqiza okuphindaphindiwe. Ukuqeda indawo, ukubeka amaphedi, ngokugcwalisa, kanye nokuvikelwa komphetho kulungiswa ngesikhathi sokubuyekezwa kobunjiniyela kwasekuqaleni. Abaklami bangathumela amafayela ngekhasi lesilinganiso ukuze bathole impendulo eningiliziwe yokukhiqiza, ukuqinisekisa ukuthi iphrojekthi ihambisana kokubili nemikhawulo yezinto ezibonakalayo kanye nenqubo.