I-PCB Eyinhloko Yengilazi Yokupakisha Okuthuthukisiwe

I-PCB ye-glass core iyi-substrate yephakheji ethuthukisiwe esebenzisa ishidi elincane lengilazi esikhundleni se-organic resin core etholakala kuma-substrate ajwayelekile e-flip-chip BGA. Isizathu esiyinhloko sokusebenzisa ingilazi akuyona into entsha, kodwa ukusebenza kahle: ingilazi inikeza i-coefficient yokwanda kokushisa okusondele kakhulu ku-silicon, i-warpage ephansi kakhulu ngobukhulu bephakheji enkulu, kanye nokuzinza okungcono kokuxhumana kwe-fine-pitch. Lezi zakhiwo zenza ama-substrate e-glass core afaneleke kakhulu kuma-accelerator e-AI, ama-CPU asebenza kahle kakhulu, amaphakheji e-chiplet, kanye nezinye izinhlangano ze-semiconductor ezithuthukisiwe lapho ama-substrate e-organic esondela khona emikhawulweni yawo yemishini neyendlela. Izinto ezibanzi kanye nesizinda senqubo sitholakala ngaphakathi kobuchwepheshe be-PCB yengilazi.

Cela Isilinganiso se-PCB se-Glass Core

Iyini i-PCB ye-Glass Core?

I-PCB ye-glass core iyi-substrate yephakheji lapho ungqimba oluphakathi lwenziwe khona ngengilazi kune-laminate ephilayo njenge-BT resin noma i-FR-4 eguquliwe. Ekupakisheni kwe-semiconductor okuthuthukisiwe, lo mgogodla usebenza njengomgogodla wesakhiwo oqinile we-substrate, uchaza ukuthamba, ukuqina kobukhulu, kanye ne-geometry yokuxhumana okuqondile. Esikhundleni sama-via ajwayelekile abholiwe, umgogodla wengilazi usebenzisa ama-via adlula ngengilazi ukuhambisa izimpawu kanye namandla ngokusebenzisa ubukhulu be-substrate.

Ingilazi ngokwayo ayiyona ungqimba kagesi olusebenzayo. Indima yayo iwukwakheka nobukhulu. Izendlalelo zokusabalalisa kabusha kwethusi kanye nezendlalelo zokwakheka kwe-dielectric zakhiwa ngaphezulu nangaphansi komgogodla wengilazi, kuyilapho ingilazi inikeza isisekelo esizinzile esidingekayo sokuhlanganiswa kwe-die-pitch kanye nokwakhiwa kwephakheji yefomethi enkulu. Ngokwezinto ezingokoqobo, i-PCB ye-glass core ayifani nebhodi lesifunda lengilazi eliqinile elijwayelekile elisetshenziswa kuma-elekthronikhi ajwayelekile; ihloselwe ngqo izinhlelo zokusebenza ze-IC package substrate ezithuthukisiwe lapho ukuhambisana kwe-silicon kanye nokulawulwa kwe-warpage kubalulekile.

Yingakho i-PCB ye-glass core ixoxwa kakhulu kanye nokupakishwa kweprosesa yesizukulwane esilandelayo. Njengoba ubukhulu bephakheji bukhula futhi i-bump pitch iqhubeka nokuncipha, izinto eziyinhloko ziba yisici esivimbelayo, futhi ingilazi inikeza uphahla oluhlukile lokusebenza kunobuchwepheshe be-organic substrate.

Kungani i-Glass Core PCB Ithatha Indawo Yezingxenyana Zephakheji Yemvelo

Ama-substrate ephakethe le-organic asekele ukupakishwa kwe-semiconductor amashumi eminyaka, kodwa amaphakheji e-AI athuthukile kanye ne-HPC manje adlula imingcele ethembekile yokuziphatha kwe-organic core. Inkinga ebaluleke kakhulu ukungafani kokushisa-kwemishini. Ama-substrate e-organic ngokuvamile ane-coefficient yokwanda kokushisa ngaphezu kwe-silicon, okudala ukucindezeleka esibonakalayo se-die-to-substrate ngesikhathi sokugeleza kabusha kanye nokujikeleza kokushisa. Njengoba i-bump pitch iba ngcono, lokho kucindezeleka kuba nzima kakhulu ukumunca ngaphandle kokukhathala kwe-solder kanye nezinkinga zokuthembeka kwamalunga.

I-PCB eyinhloko yengilazi ibhekana nalokhu ngokusondeza i-substrate CTE eduze kakhulu ne-silicon. Lokho kunciphisa ukufuduka okuhlobene ngesikhathi sokushintsha kwezinga lokushisa futhi kusiza ukugcina ukuthembeka kwejoyinti le-solder kuzo zonke izinyathelo ezinkulu ze-die. Inzuzo yesibili enkulu ukulawula i-warpage. Ama-substrate amakhulu e-organic avame ukugoba ngesikhathi sokuhlanganiswa ngenxa yokwanda kokushisa okungalingani kuyo yonke i-stack-up. Ngosayizi wephakheji othuthukisiwe, lelo phepha le-warpage lingadala amajoyinti avulekile noma ukunamathiselwa kwe-bump okungaguquki. Ingilazi inokuqina okungcono kakhulu kobukhulu, okuvumela amaphaneli athambile kanye nokwakheka kokuxhumana okufanayo.

Umshayeli wesithathu ubuningi bokuxhumana. Ama-core e-organic ancike ekubholweni ngomshini ngezakhiwo ezinobukhulu obuncane obukhulu, kuyilapho ama-core engilazi angasekela ukwakheka kokuxhumana okuqondile okucolekile kakhulu. Ekuhlanganisweni kwe-chiplet yesimanje, lapho ubuningi bomzila kanye nosayizi wephakheji kukhula ndawonye, ​​​​leyo nhlanganisela ye-warpage ephansi, ukufana okungcono kwe-CTE, kanye nekhono elihle kakhulu yisona sizathu esiyinhloko esenza i-PCB ye-glass core iqale ukusetshenziswa kwezentengiselwano.

I-PCB ye-Glass Core vs i-Organic Core vs i-Glass Interposer

I-PCB ye-Glass core iphakathi kwe-organic package substrates kanye nezixazululo ze-silicon noma i-glass interposer endaweni yokusebenza ebiza kakhulu. Uma kuqhathaniswa ne-organic core substrate, ingilazi inikeza i-warpage ephansi, ukumuncwa komswakama okuphansi, ukuzinza okungcono kobukhulu, kanye nokulingana okushisayo kakhulu ne-silicon. Uma kuqhathaniswa ne-silicon interposer, i-glass core substrates ingasekela ukukhiqizwa okukhulu kwephaneli futhi inciphise izindleko eziphelele, ngenkathi isavumela izintambo ezincane kakhulu futhi ngokusebenzisa ubuningi kunezinto eziphilayo.

Umehluko oyinhloko phakathi kwe-PCB ye-glass core kanye ne-glass interposer yindawo yokusebenza ephaketheni. I-substrate ye-glass core iyi-substrate yephakheji ngokwayo, okuhlanganisa izendlalelo ezakhayo kanye ne-interface yokuxhumana yezinga lebhodi. I-glass interposer iyinto yokusabalalisa kabusha engenziwanga ebekwe phakathi kwama-dies kanye ne-substrate ukuze kuqondiswe umzila we-ultra-high-density. Uma ukugxila kwakho kuyisakhiwo se-interposer kunokwakhiwa kwe-substrate, indima ye- glass interposer PCB ihlukile.

Isakhiwo se-PCB ye-Glass Core kanye nomklamo wokwakha

I-PCB ejwayelekile yengilazi eyakhiwe yakhiwe eduze kweshidi elincane lengilazi, ngokuvamile eliphakathi kuka-0.1 mm kuya ku-0.3 mm, enezingqimba zengilazi ezakhiwe ngaphakathi kwengqimba futhi zigcwele ithusi ukuze kuhlanganiswe ngokuqondile. Kuzo zombili izinhlangothi zengilazi, kunezendlalelo zokusabalalisa kabusha kwe-dielectric nezethusi ezakhelwe ngaphakathi ukuze kudalwe isakhiwo sokuhambisa iphakheji. Uhlangothi oluphezulu luvame ukusekela i-fine-pitch die attachment, kuyilapho uhlangothi olungezansi luhlinzeka nge-solder ball noma i-package-level interconnect interface.

Umthetho obaluleke kakhulu wokuhlanganisa i-stack ukulingana. Ingilazi ngokwayo izinzile ngokwesilinganiso, kodwa i-substrate ephelele isengagoba uma izendlalelo zokwakheka eziphezulu nezingezansi zingalingani. Ubuningi bethusi, ukujiya kwe-dielectric, kanye nenani lezendlalelo kufanele kufane eduze nhlangothi zombili ukuze ukucindezeleka kokushisa kuhlale kulinganiswa ngesikhathi sokugeleza kabusha kanye nokwelashwa kokugcwala. Ngenxa yalesi sizathu, ukwakheka kwe-substrate ye-glass core akukhona nje ukukhetha ingilazi njengento; kumayelana nokulawula ukwakheka okuphelele kokwakheka okuzungeze leyo core.

Ukukhethwa kwezinto nakho kubalulekile. Ingilazi ye-borosilicate ivame ukuthandwa ngoba inikeza inhlanganisela enhle yokuqina kokushisa, izakhiwo zemishini, kanye nokuhambisana kwenqubo. Umehluko phakathi kwezinto ze-PCB zeglasi ezitholakalayo kubalulekile lapho ukhetha umongo wokuthuthukiswa kwephakheji.

Izinto Ezicatshangelwayo Zokuklama i-TGV kanye ne-Warpage

I-Through-glass via design ingenye yezihloko zobunjiniyela eziyinhloko ekuthuthukisweni kwe-PCB ye-glass core. Ububanzi be-TGV, i-pitch, isilinganiso se-aspect, ikhwalithi yokugcwalisa ithusi, usayizi wephedi yokubamba, kanye nokugcinwa komkhawulo konke kuthinta ngqo ukukhiqizwa kanye nokuthembeka. Uma kuqhathaniswa ne-PCB ejwayelekile via design, izakhiwo ze-TGV zidinga ukulawulwa okuqinile ngoba izinto ezizungezile ziyingilazi ebuthakathaka kunokuba yi-laminate ephilayo. Ngokubeka eduze kakhulu nomngcele we-substrate noma ukugxilisa ukucindezeleka kwendawo ngokweqile kungadala ukuzwela kokuqhekeka ngesikhathi sokucubungula noma ukushaqeka.

Ngaleso sizathu, ukwakheka kwe-TGV kuhlobene kakhulu nokuphathwa kwe-warpage kanye nokucindezeleka. Ngisho noma ingilazi inciphisa kakhulu ukuguquguquka kwezinga eliyinhloko uma kuqhathaniswa nezinto eziphilayo, i-substrate esiqediwe isabhekene nokucindezeleka okuvela ekungalinganini kwethusi, ukunamathela okudayiwe, ukwelashwa kokugcwalisa okungaphansi, kanye nokujikeleza kwezinga lokushisa. Ngakho-ke ukwakheka okuhle kwe-PCB ye-core core kuhlanganisa ukwakheka okuhle kwe-TGV nokusatshalaliswa kwethusi okulinganiselayo, izendlalelo zokwakheka ezihambisanayo, kanye nomodeli wemishini wezinga lephakheji.

Ngokwendlela engokoqobo, umgomo wokuklama akukhona nje ukwenza i-via conductive. Kungukwenza isakhiwo sonke esiyinhloko nesakhiwe siqine ngokwanele ukuze kuhlanganiswe kahle i-flip-chip endaweni egcwele iphakheji. Imininingwane yenqubo ngemuva kwengilazi ngokusebenzisa ukwakheka ithinta ngqo lowo mphumela.

Izicelo kanye ne-Glass Core PCB Imibuzo Evame Ukubuzwa

I-PCB ye-Glass core iyasetshenziswa lapho ama-substrate ephakethe avamile engasanikezi ukuthamba okwanele, ukufanisa ukushisa, noma ubuningi bomzila. Isidingo esinamandla kakhulu sivela kuma-accelerator e-AI, ama-CPU asebenza kahle kakhulu, kanye nokwakheka kwamaphakheji asekelwe ku-chiplet anobukhulu obukhulu bomzimba kanye ne-bump pitch encane kakhulu. Lawa maphakheji adinga i-substrate ehlala ithamba phakathi nokuhlanganiswa ngenkathi isekela ubuningi be-I/O obuphezulu kanye nokunamathiselwa okuthembekile kwe-die. I-Glass core nayo inokubaluleka okukhulayo ekupakisheni kwama-frequency aphezulu kanye ne-RF, lapho ukuzinza kwe-dielectric kanye nokunemba kobukhulu kubalulekile kuma-frequency okusebenza athuthukile. Kulezo zimo, ukuziphatha kukagesi kwezakhiwo ze-PCB zeglasi ezivame kakhulu kuba yingxenye yengxoxo yokuklama iphakheji.

Iyini inzuzo eyinhloko ye-PCB ye-glass core?

Inzuzo eyinhloko ukuhlanganiswa kwe-warpage ephansi kanye nokuhambisana kwe-CTE ne-silicon. Lokhu kwenza ama-substrate e-glass core afaneleke kakhulu kune-organic cores kumaphakheji amakhulu e-semiconductor athambile.

Ingabe i-PCB ye-glass core iyafana ne-interposer ye-glass?

Cha. I-PCB eyinhloko yengilazi iyi-substrate yephakheji uqobo lwayo, kuyilapho i-interposer iyingqimba yokusabalalisa kabusha ehlukile ebekwe phakathi kwama-dies kanye ne-substrate.

Kungani i-PCB ye-glass core ibalulekile kumaphakheji e-AI nama-chiplet?

Ngoba lawo maphakheji ahlanganisa usayizi omkhulu we-substrate, inani eliphezulu le-I/O, kanye ne-bump pitch encane. Izinto eziphilayo ziyalwela ukugcina ubushelelezi nokuthembeka ngaphansi kwalezo zimo, kuyilapho ingilazi isebenza kangcono.

Ingabe i-PCB eyinhloko yengilazi ithatha indawo ye-silicon interposers?

Akukhona kuyo yonke idizayini. Ingaphakathi lengilazi livame ukuba phakathi kwezingxenye eziphansi zezinto eziphilayo kanye nezixazululo ze-interposer ezisebenza kahle kakhulu.

Ingabe i-PCB eyinhloko yengilazi isivele iwubuchwepheshe bokukhiqiza?

Isuka ekuthuthukisweni iye ekukhiqizweni kwasekuqaleni kwezinhlelo zokupakisha ezithuthukisiwe, ikakhulukazi lapho kudingeka khona usayizi omkhulu we-substrate kanye nobuningi bokuxhumana okuncane. Izidingo zephrojekthi zingathunyelwa ngqo ngekhasi lesilinganiso.