I-Glass Interposer PCB vs Silicon Interposer

I-glass interposer iyi-substrate yokusabalalisa kabusha engenziwanga ebekwe phakathi kwama-semiconductor dies kanye ne-substrate yephakheji engaphansi kwawo. Umsebenzi wayo oyinhloko ukusabalalisa kabusha ukuxhumana kwe-fine-pitch die kufomethi yokuqondisa engasetshenziswa yizinga elilandelayo lokupakisha, ngenkathi futhi ithwala izimpawu ze-die-to-die, amandla, kanye nomhlabathi endaweni ehlanganisiwe. Empeleni, ama-glass interposer adonsela ukunaka ngoba anikeza indawo ephakathi phakathi kwama-silicon interposer kanye nama-organic interposer: ukuqondisa okuhle kanye nokuzinza okungcono kunezinto eziphilayo, kodwa amandla aphansi ezindleko kanye nokukhiqizwa okukhulu kwefomethi yephaneli kune-silicon elinganiselwe yi-wafer. Ukuze uthole izinto ezibanzi kanye nomongo wepulatifomu, bheka ukubuka konke kwe-PCB yengilazi.

Cela Isilinganiso Se-Glass Interposer

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Iyini i-Glass Interposer futhi yenzani?

Ekupakisheni kwe-semiconductor okuthuthukisiwe, i-interposer iwungqimba lokusabalalisa kabusha olubekwe phakathi kwama-dies angenhla kanye ne-substrate yephakheji engezansi. I-interposer yengilazi isebenzisa ingilazi njenge-substrate yayo eyisisekelo futhi ihlanganisa imisebenzi emithathu ebalulekile: ukusatshalaliswa kabusha kwesignali okuvundlile ngokusebenzisa izintambo ezincane ebusweni, ukudluliselwa okuqondile phakathi kobukhulu be-substrate, kanye nokuhumusha kwephimbo phakathi kwama-die bumps amahle kakhulu kanye nesakhiwo sokuxhuma esiqinile ngaphansi.

Lokhu kusho ukuthi i-glass interposer ayiyona into efanayo ne-substrate ephelele yephakheji. Ayithathi indawo yephakheji yonke engezansi. Esikhundleni salokho, ihlala phakathi kwama-dies kanye ne-substrate yephakheji, isiza ukuhambisa izimpawu ezixinene endaweni lapho izintambo zephakheji ezivamile ziba nzima kakhulu. I-substrate yephakheji engezansi isaphatha uxhumano olubanzi lwe-fan-out kanye nolwebhodi, kuyilapho i-interposer iphatha inkinga yokuxhumeka kwendawo exinene ngqo ngaphansi naphakathi kwama-dies.

Isakhiwo esijwayelekile se-inposer yengilazi sihlanganisa i-core yengilazi encane, ama-via engilazi adlulayo ukuze kuxhunywe ngokuqondile, kanye nezendlalelo zokusabalalisa kabusha ohlangothini olulodwa noma zombili. Ngenxa yokuthi ingilazi ngokwayo ivikela ngogesi futhi izinzile ngokwesilinganiso, inikeza ipulatifomu enhle yokuxhuma kahle, ukuhumusha ngephimbo, kanye nezakhiwo zokupakisha ezizoba nzima ukuzenza ezintweni ezijwayelekile zezinto eziphilayo.

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I-Glass Interposer vs Silicon Interposer vs Organic Interposer

Isizathu sokuthi ubuchwepheshe be-glass interposer bubalulekile ukuthi busendaweni ephakathi nendawo ewusizo kakhulu. Ama-silicon interposer anikeza ubuningi obuhle kakhulu bomzila, kodwa ayabiza futhi anqunyelwe ukukhiqizwa kwesikali se-wafer. Ama-organic interposer ashibhile futhi kulula ukuwakala, kodwa ubuningi bawo bomzila kanye nokuqina kobukhulu kunqunyelwe kakhulu. Ama-glass interposer agcwalisa igebe lamaphakheji adinga ubuningi obukhulu kunalokho okunganikezwa yi-organic, kodwa awadingi izindleko ezigcwele kanye nobunzima be-silicon.

Kusukela embonweni wesinqumo sokupakisha, i-silicon interposer ivame ukukhethwa lapho umklamo udinga ngokuphelele ubuningi bokusatshalaliswa kabusha obuhle kakhulu obutholakalayo. I-Organic interposer iyathandwa lapho izindleko zibusa futhi isidingo sobuningi bomzila sihlala silinganiselwe. I-Glass interposer iba yinhle lapho iphakheji idinga ukuzinza okungcono kobukhulu, umzila oqondile, noma ukusebenza kwe-optical ngaphandle kokungena ngokuphelele endaweni yezindleko ze-silicon-interposer.

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Umklamo we-Glass Interposer: I-TGV, i-RDL, i-Stack-Up, kanye ne-Warpage Control

Umklamo we-Glass interposer uyingxenye ebaluleke kakhulu yesihloko ngoba inani le-interposer alinqunywa kakhulu ngegama lezinto ezibonakalayo kodwa linqunywa kakhulu ngendlela isakhiwo esakhiwe ngayo. Kumaphrojekthi angempela, i-glass interposer ayinqunywa kuphela ngokuthi isebenzisa ingilazi. Inqunywa ngokuthi ingabe ukuxhumana kwayo kwe-through-substrate, izendlalelo zokusabalalisa kabusha, ukulingana kwe-stack, kanye nokusebenzisana kwephakeji kungasekela usayizi we-target die, i-bump pitch, inani lesignali, kanye nenqubo yokuhlanganisa.

1. Ubukhulu be-Glass core kanye nendima

Ingqikithi yengilazi ivame ukugcinwa incane ngoba i-interposer iyisakhiwo sokusabalalisa kabusha, hhayi ibhodi elikhulu lemishini. Ingilazi idinga ukuba nkulu ngokwanele ukugcina ukuzinza kobukhulu ngesikhathi sokucubungula nokuhlanganisa, kodwa ibe ncane ngokwanele ukusekela okuhlosiwe nge-geometry kanye nephrofayili yephakheji. Kule ndima, ingilazi iziphatha ngendlela ehlukile kunepulatifomu egcwele i-substrate njenge- PCB ye-glass core , lapho ingilazi yakha khona umgogodla ophakathi wesakhiwo se-substrate yephakheji uqobo.

2. Ama-vias angena ngengilazi njengomgogodla oqondile

Ama-via engilazi adlulayo abalulekile ngoba axhumanisa uhlangothi lomzila olubheke phezulu olubheke phezulu nohlangothi olubheke phezulu. Kuma-interposer engilazi, lawa ma-via avame ukuba nesikhala esiqinile, ubukhulu obuncane, kanye nezidingo zokugcwalisa eziqinile kunasemsebenzini wesekethe yengilazi ojwayelekile. Ukugcwalisa okuqinile kuvame ukuthandwa ngoba i-interposer kufanele isekele ukusatshalaliswa okuqinile kanye nokusebenza okuqondile okuzinzile kunokuba kube nje ukushintshana okuvela phezulu kuya phansi ngezikhathi ezithile. Inqubo eningiliziwe enengqondo ngemuva kwalokhu kuxhumana okuqondile ihlobene eduze ne -through-glass ngokusebenzisa ukwenziwa.

3. Ukwakheka kwesendlalelo sokusabalalisa kabusha

Isendlalelo sokusabalalisa kabusha, noma i-RDL, yilapho i-interposer empeleni yenza khona umsebenzi wayo wokuhumusha iphimbo. Ohlangothini oluphezulu, i-RDL ithola ukuxhumana kwe-fine-pitch die. Ohlangothini olungezansi, idlulisela lezo zimpawu ziye ku-substrate yepakeji. Lapho ama-dies amaningi abelana nge-interposer eyodwa, inethiwekhi efanayo ye-RDL nayo ihambisa ukuxhumana kwe-die-to-die eceleni. Lokhu kusho ukuthi isu lokuhambisa kumele licabangele ukuphunyuka kwesignali, ubude bendlela, isakhiwo sokubhekisela, ubuningi bendawo, kanye nendlela i-interposer exhumana ngayo ne-substrate ephilayo engaphansi.

Empeleni, ukwakheka kwe-interposer RDL akuyona nje "indlela engcono kakhulu yokuhambisa i-PCB." Kuseduze nokusatshalaliswa kabusha kwamaphakheji, lapho ukuminyana kwendawo, ukulingana, kanye nokusebenzisana kwezingqimba kuxhumene kakhulu nokuziphatha kokuhlanganiswa kanye nokugoba. Ukwakheka okubonakala kusebenza kahle ngogesi kungase kube kubi ngokwesakhiwo uma kudala ukungalingani kwethusi noma ukugxila kokucindezeleka okungasekelwa esitokisini se-interposer.

4. Ukulinganisa kwe-stack-up kanye nokuphathwa kwe-warpage

I-Warpage ingenye yezingozi zobunjiniyela obuphakathi ekwakhiweni kwe-glass interposer ngoba i-fine bump pitch ishiya umkhawulo omncane kakhulu wokuphambuka kwe-assembly. Uma isakhiwo sokusabalalisa kabusha singalingani, ukupholisa kusuka ekushiseni kwe-assembly kungadala ukugoba okwanele okubangela ukuvuleka kwe-bump, ukuxhumana okungalingani, noma ukulahlekelwa yisivuno. Izinto ezivame kakhulu ukungalingani kwethusi phakathi kwezinhlangothi ezimbili, ukwakheka kwe-dielectric okungalingani, ukuziphatha kokugcwalisa okungaphansi, kanye nokusebenzisana ne-substrate yephakheji engezansi.

Ngaleso sizathu, izitaki ze-interposer zivame ukuklanywa kucatshangelwa ukulingana. Izakhiwo zokusabalalisa kabusha eziphezulu nezingezansi kudingeka zicatshangelwe ndawonye, ​​hhayi ngokuzimela. Ibhalansi yobuningi bethusi, inani lezingqimba, kanye nokuhleleka kwenqubo konke kuthinta ukuthamba kokugcina kwe-interposer. Lesi ngesinye sezizathu eziyinhloko ezenza ingilazi ikhanga: i-CTE yayo ephansi kanye nokuzinza okuhle kobukhulu kusiza ukulawula ukuguqulwa kwephakeji kangcono kunezinye izindlela eziphilayo ezindaweni ezixineneyo zephakeji.

5. Isiginali, amandla, kanye nokuhlela ukushisa

Nakuba i-interposer ingasebenzi, kusadingeka ukuthi ithwale imisebenzi emithathu ehlukene yesistimu: ukusatshalaliswa kabusha kwesignali, ukusatshalaliswa kwamandla, kanye nokusebenzisana kokushisa nalo lonke iphakheji. Lokhu akuhlali kusunduza umklamo ohlangothini olufanayo. Umzila wesignali oqinile ohlangothini olulodwa ungancintisana nesidingo sezindlela zokulethwa kwamandla noma ukuqhubeka komhlaba. Ngokufanayo, ukwakheka kwe-bump kanye nokubekwa kwe-die kungadala izindawo zokugxila kokushisa kwendawo. Ngakho-ke ukwakheka okuhle kwe-interposer kudinga ukuhlanganiswa kuzo zonke izinhloso zikagesi, zemishini, kanye nezokupakisha kunokuba kwenziwe ngcono eyodwa yazo kuphela.

Yingakho i-glass interposer kufanele iphathwe njengenkinga yokuklama iphakheji, hhayi nje inkinga yokuqondisa umugqa oqondile. Iphethini efanele ngephethini, i-RDL stack, kanye nokuhlelwa kokwakheka kunqunywa ukwakheka kwephakheji lonke, kufaka phakathi inani lokufa, isikhala sokufa, i-substrate engezansi, kanye nendlela yokuhlanganisa.

Lapho Kusetshenziswa Ama-Glass Interposer ku-2.5D, 3D, kanye ne-Co-Packaged Optics

Ama-interposer engilazi avame ukuxoxwa ngawo ngokwesimo sokupakisha okuthuthukisiwe, kodwa izinhlobo zohlelo lokusebenza azifani zonke. I-interposer ingasebenza izindima ezihlukene kakhulu kuye ngokuthi iphakheji iyi-2.5D, 3D, noma i-photonic-electronic.

Ukupakisha kwe-chiplet engu-2.5D

Kumaphakheji angu-2.5D, ama-dies amaningi ahlala eceleni kwe-interposer, kanti i-interposer iphatha umzila ohlangene ohlangothini phakathi kwawo. Lesi ngesinye sezimo ezicacile zokusetshenziswa kobuchwepheshe be-glass interposer ngoba sidinga ukusatshalaliswa okuhle, i-geometry ezinzile, kanye nendawo ye-substrate engandiswa.

Izakhiwo zokusekela ukupakishwa kwe-3D

Ekulungiselelweni kwe-3D, i-interposer ingasebenza njengesendlalelo sokusabalalisa kabusha esiyisisekelo esisekela isitaki esihlanganiswe ngokuma. Ukubaluleka lapha akusikho nje ubuningi bomzila kodwa futhi nokuzinza komshini kanye nokuthembeka kokuxhumeka okuqondile ngaphakathi kwephakheji ehlanganiswe ngokuqinile.

Ukuhlanganiswa kwe-Photonic-electronic

Enye yezinzuzo ezivelele kakhulu zobuchwepheshe be-glass interposer ukucaca kwayo okubonakalayo. Le mpahla ivula isikhala sokuklama esingasekelwa yi-silicon interposer noma yi-organic substrates ngendlela efanayo. Ezinhlelweni ezihlanganisiwe ze-photonic-electronic, imisebenzi ye-optical kanye nekagesi ingahlanganiswa epulatifomu efanayo ye-substrate, okwenza kube nokwakhiwa okufushane nokuphumelelayo kokuxhumana okuphezulu kwe-bandwidth kanye nezinhlelo zokusebenza zokuzwa.

Lezi zimo zokusetshenziswa zibonisa nokuthi kungani ama-interposer engilazi engeke ahlolwe ngokuqhathanisa izindleko okulula. Kwezinye izixazululo zokupakisha, ingilazi ingakhethwa ngoba ishibhile kune-silicon. Kwezinye izimo, ikhethwa ngenxa yamakhono ayo ahlukile, njengokufinyelela okubonakalayo, amafomethi amakhulu e-substrate, noma izici zezinto ezihlukile. Kulezi zimo, ingilazi ayisebenzi nje kuphela njengenye indlela engabizi kakhulu kodwa njenge-substrate evumela izinketho zokuklama ezingatholakali nezinye izinto.

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Imibuzo Evame Ukubuzwa Nge-Glass Interposer kanye Nokuhlela Iphrojekthi

Uyini umehluko phakathi kwe-glass interposer kanye ne-glass core substrate?

I-glass interposer iwungqimba lokusabalalisa kabusha olungenamsebenzi olufakwe phakathi kwama-dies kanye ne-package substrate. I-glass core substrate iyisakhiwo se-package substrate esiphelele esingaphansi kwe-die noma i-interposer futhi ekugcineni sixhumanisa ne-interface ye-package yezinga lebhodi.

Kunini lapho i-glass interposer ingcono kune-silicon interposer?

I-Glass interposer ivame ukukhanga kakhulu lapho iphakheji idinga ukusatshalaliswa kabusha okucolekile kunalokho okunganikezwa yizinto eziphilayo, kodwa ayidingi ubuningi obukhulu obutholakala ku-silicon interposer. Iphinde ibe mnandi kakhulu lapho ezomnotho zesikali sephaneli noma ukusebenza kwe-optical kubalulekile.

Yiluphi ulwazi oludingekayo ukuqala iphrojekthi ye-glass interposer?

Iphrojekthi ivame ukuqala ngosayizi we-die, inani le-die, imephu ye-bump, indawo eqondiwe, inani lesignali, izinga ledatha, izidingo zamandla, kanye nesakhiwo sephakheji ngaphansi kwe-interposer. Lokho okufakwayo kunquma ubuningi bomzila we-interposer, ngokusebenzisa isu, kanye nesiqondiso se-stack-up.

Ingabe ama-interposer engilazi angahlanganiswa ngezindlela ezijwayelekile ze-flip-chip?

Zingahlanganiswa nokugeleza okujwayelekile kokuhlanganiswa okuthuthukisiwe, kodwa indlela yokusebenzisa amathuluzi nokusekela kumele ibonise ukuziphatha kwe-substrate ebuthakathaka yengilazi. Ukuhlela ukuhlanganiswa kuvame ukubuyekezwa kanye nendlela ebanzi yenqubo yephakheji echazwe ekukhiqizweni kwe -PCB yengilazi.

Iphrojekthi kufanele icashunwe kanjani?

Ikhotheshini ewusizo ivame ukuqala ngokwakhiwa kwephakeji kunokuba ngesicelo sobukhulu obungenalutho kuphela. Uma usuvele unolwazi oluqinile, imephu ye-bump, i-footprint target, noma imikhawulo yokuxhumana, yithumele ngekhasi lekhotheshini ukuze i-glass interposer ibuyekezwe ngokuhambisana nezidingo zangempela zephakeji.