Umklamo we-Glass PCB Wezisekethe Ezibonakalayo, Eziqinile, Nezesitayela Sephakheji

Umklamo we-Glass PCB inqubo yobunjiniyela yokuguqula i-substrate yengilazi ibe yisakhiwo sesekethe esisebenzisekayo ngenkathi kulinganiswa ukusebenza kukagesi, ukuthembeka kwemishini, ukukhiqizwa, kanye, kwamanye amaphrojekthi, izidingo ze-optical. Ngokungafani nomsebenzi wokuhlelwa kwe-FR-4 ojwayelekile, umklamo osekelwe engilazini awukwazi ukubhekwa njengokushintshana kwezinto ezilula. I-substrate iqinile, iyaphuka, izinzile ngokwezinga, futhi ivame ukusetshenziselwa izinhlelo zokusebenza ezidinga umzila ongcono, izindawo ezisobala, ukulawulwa okuqinile kokuthamba, noma ukuxhumana kwesitayela sephakheji. Lokho kusho ukuthi umklamo we-PCB yengilazi uqala ngencazelo yesakhiwo, hhayi umzila wethusi kuphela. Abaklami bavame ukudinga ukunquma kusenesikhathi ukuthi ingilazi izosetshenziswa kanjani, ukuthi hlobo luni lokuxhumana oludingekayo, lapho ukucindezeleka kuzogxila khona, nokuthi ukwenziwa nokuhlanganiswa kuzothinta kanjani ibhodi eliqediwe. Ukuze uthole isizinda sobuchwepheshe esibanzi, bheka ukubuka konke kwe-PCB yengilazi.

Cela Isibuyekezo Somklamo we-Glass PCB

Okushiwo Umklamo we-Glass PCB

Umklamo we-Glass PCB ungaphezu kokuhambisa ithusi ku-substrate engeyona ejwayelekile. Kuhlanganisa ukukhetha uhlobo lwengilazi olufanele, ukuchaza ukuthi isekethe izosebenzisa kanjani i-substrate, ukuhlela ukwakheka komqhubi, ukulawula ukucindezeleka kanye nezimo zomphetho, kanye nokufanisa umklamo nomzila wokukhiqiza ohlosiwe. Kwamanye amaphrojekthi, ingilazi ikakhulukazi inikeza ukuthamba, ukuzinza kwamakhemikhali, noma ukucaca. Kwamanye, iyingxenye yesakhiwo sokuxhuma esiminyene esincike ekuhambiseni kahle, izendlalelo zokusabalalisa kabusha, noma ukuxhumana okuqondile nge-substrate.

Yingakho ukwakheka kwe-PCB yengilazi kuvame ukuqala ngesigaba sesakhiwo kunokuba kube nobubanzi bomugqa kuphela. Isekethe yengilazi esobala, ibhodi lenzwa yengilazi eqinile, i-substrate yephakheji yengilazi eyinhloko, kanye nokwakheka okuhlobene ne-interposer yengilazi akulandeli izinto ezibalulekile zokuklama ezifanayo yize konke kuwela ngaphansi komndeni ofanayo wezinto ezibanzi. Uma kwenziwa ukucabanga kwesakhiwo okungalungile ekuqaleni, izinqumo zokuqondisa kamuva kanye nokuhlanganisa zivame ukuba nzima kakhulu ukuzilungisa.

Ukukhetha izinto ezibonakalayo kuyingxenye yomklamo, hhayi isinqumo sokuthenga esihlukile. Izinketho ezahlukene ze-PCB substrate zeglasi zishintsha ukuziphatha kwebhodi kagesi, okushisa, okubonakalayo, kanye nokwemishini. I-Borosilicate, i-aluminosilicate, i-fused silica, kanye nengilazi ye-soda-lime azishintshisani ngokwemigomo yokwakheka, ngoba ngayinye ishintsha indlela ibhodi okufanele liqondiswe ngayo, liphathwe futhi lihlanganiswe ngayo.

Indlela Umklamo we-PCB Yengilazi Ohluke Ngayo Kumklamo we-PCB Ojwayelekile

Umehluko omkhulu ukuthi ingilazi ibeka imingcele yesakhiwo ngaphambi kwesikhathi kune-FR-4. Ukuhlelwa kwe-PCB okujwayelekile kuvame ukuqala ngokuxhumeka kukagesi bese kuhlola ukukhiqizwa ngemva kwalokho. Ekwakhiweni kwe-PCB yengilazi, ukuhleleka kuvame ukuguqulwa noma okungenani ngesikhathi esisodwa. Ukuziphatha komshini, ibanga lomphetho, ukujiya kwe-substrate, ngokusebenzisa isu, ukulawulwa kwendawo esobala, kanye nendlela yokuhlanganisa kufanele kucatshangelwe ngenkathi ukwakheka kusathatha isimo.

Ingilazi iqinile futhi izinzile ngobukhulu, okuwusizo ekwakhiweni komzila onembile kanye nezakhiwo zesitayela sephakheji, kodwa futhi iyaphuka. Lokho kushintsha indlela abaklami abaphatha ngayo amakhona, ama-cutout, izindawo ezingasekelwa, kanye nokushintshana phakathi kwama-conductor amahle nezindawo eziqinile zensimbi. Ukwakheka okubonakala kulula ngogesi ku-CAD kusengaba buthakathaka ekuphatheni noma kube nzima ukukukhiqiza uma ukucindezeleka komphetho, ubuningi bendawo, noma izici ze-substrate-through kungahlelwanga ngokucophelela.

Omunye umehluko ukuthi ingilazi ivame ukukhethwa ngoba ibhodi kumele lenze okuthile okungaphezu komzila ojwayelekile we-PCB. Amasekethe abonakalayo adinga izindawo ezibonakalayo ezilawulwayo. Imiklamo yesitayela sephakheji ingadinga ukuba yisicaba esiqinile kanye nokuziphatha okungcono kwe-CTE. Amabhodi asebenzisa i-substrate-through interconnect adinga umzila wawo kanye nesakhiwo sephedi esihlelwe nxazonke kwengilazi ngezidingo kusukela ekuqaleni. Ngamanye amazwi, umklamo we-PCB yengilazi uvame ukuholwa umsebenzi kunokuba uholwe yizinto ezibonakalayo.

Imithetho Eyisisekelo Yokuklama Yesakhiwo Nesakhiwo se-PCB Yengilazi

Lena yingxenye ebaluleke kakhulu yomklamo we-PCB yengilazi, ngoba impumelelo yephrojekthi ayixhomekile kakhulu emcabangweni "wokusebenzisa ingilazi" kodwa incike kakhulu ekutheni isakhiwo sibekwe ngendlela ingilazi engasekela ngayo ngempela. Umklamo omuhle we-PCB yengilazi uwukulinganisela okuhlanganisiwe phakathi kokuziphatha kwe-substrate, ubuningi bomqhubi, isu lokuxhumana, indawo ye-optical, kanye nendlela yokuhlanganisa.

Qala ngendima yesakhiwo se-substrate

Umbuzo wokuqala wokuklama ukuthi ingilazi yenzani kumkhiqizo. Uma ingilazi ihlinzeka ngokusobala kakhulu, umzila kanye nokubekwa kwezingxenye kufanele kuvikele indawo ebonakalayo. Uma ihlinzeka ngokuba yisicaba kanye nokuqina komzila wesitayela sephakheji, ibhalansi ye-stack-up kanye ne-conductor ibaluleke kakhulu. Uma iyingxenye yesikhulumi sokuzwa noma se-optical, izifunda ezicacile, ukumbozwa, kanye nezici zokuqondanisa zingabaluleka njengethusi uqobo. Le ndima yesakhiwo inquma yonke i-logic yokwakheka.

Gcina umklamo onqenqemeni kanye nowokusika ulondoloza

Ingilazi ibucayi kakhulu ekulimaleni komphetho kanye nokusabalala kwemifantu kunamabhodi avamile e-laminate. Ngaleso sizathu, ama-trace, ama-pad, ama-via, kanye nezindawo ezisindayo zethusi akufanele kucindezelwe ngamandla kakhulu emaphethelweni noma ezinqunyiwe zangaphakathi. Ukuma kwekhona, i-geometry yesikhala, kanye nezingxenye ezincane ezingasekelwa konke kuthinta ukuthembeka kokuphathwa. Umklamo ungaba olungile ngogesi futhi uhlale ubuthakathaka uma uhlaka lungahambisani nokuziphatha kwengilazi.

Hlela ukuminyana kwethusi, hhayi nje ukuxhumana okune-inthanethi

Engilazini, ukusatshalaliswa kwensimbi yendawo kuthinta okungaphezu kwamandla amanje. Kuphinde kuthonye ibhalansi yokucindezeleka, ukuziphatha kokuba yisicaba, ukubukeka okubonakalayo emiklamo ecacile, kanye nokushintsha phakathi kwezici ezinhle nezindawo zokuxhuma eziqinisiwe. Ithusi eliqinile kolunye uhlangothi kanye nethusi elincane kolunye kungadala ukungalingani ezakhiweni ezakhiwe noma zesitayela sephakheji. Emiklamo ecacile, ubuningi bethusi buthinta nendlela ibhodi elibukeka ngayo ngaphakathi kwe-substrate, okusho ukuthi izinqumo zomzila ziba yingxenye yomklamo we-optical futhi.

Qondanisa isitayela sokuxhumanisa nomsebenzi webhodi

Akuwona wonke ama-PCB engilazi adinga ukuxhumana kwe-substrate-through, kodwa uma kwenzeka, leso sinqumo kufanele senziwe kusenesikhathi. Isu lokuqondisa liyashintsha lapho izimpawu noma amandla kufanele ahambe ngokuqondile engilazini. Ukubanjwa kwephedi, ukugcina, ukwabiwa kwesendlalelo, kanye nokuhlela indlela yokubuya konke kuncike kulokho kukhetha. Ezindaweni ezihlobene nephakeji exineneyo, lokhu kungahlangana nomklamo we-PCB we-glass core noma ngisho nokuhlela i-glass interposer , lapho i-substrate iyingxenye yokwakhiwa kabusha okuthuthukisiwe kakhulu.

Hlukanisa indawo ebonakalayo endaweni yokusekela esebenzayo

Kumasekethe engilazi abonakalayo, elinye lamasu okuklama aphumelela kakhulu ukuhlukanisa indawo yokubuka esebenzayo noma indawo yokukhanya endaweni yokusekela. Indawo yokusekela ingaba nomzila oqinile, ukuxhumana okuqinisiwe, izixhumi, kanye nezingxenye ezinkulu, kuyilapho indawo yokukhanya igcinwa ivulekile futhi ihlanzekile ngangokunokwenzeka. Lesi futhi esinye sezizathu ezenza ukuthi imiklamo ekhanyayo idinga ukubuyekezwa kanye nezidingo ze-PCB ezisobala kunokuphathwa njengamabhodi aqinile avamile enziwe ngezinto ezicacile.

Yakha i-stack-up kanye ne-routing njengohlelo olulodwa

Engilazini, ukuqondisa umqhubi, i-pad geometry, ukujiya kwe-substrate, kanye nokuphela kwendawo akufanele kuthathwe njengezinyathelo ezihlukene. Kuthintana ngqo. I-substrate encane ingathuthukisa ingxenye eyodwa yomklamo kodwa yenze ukuphathwa nokuhlanganiswa kube nzima. Iphethini yokuqondisa eyinkimbinkimbi ingaxazulula inkinga kagesi kodwa idale ukucindezeleka kwendawo noma ukuphazamiseka kokubona. Ukwakhiwa kwesitayela sephakheji kungadinga ukulingana nokulinganisela kunokuba kube yizingqimba ezengeziwe zokuqondisa. Ukwakheka kwe-PCB yengilazi eqinile kuvela ekwenzeni lezi zinqumo ndawonye esikhundleni sokwenza ngcono ngayinye yodwa.

Bhukha indawo yemingcele yangempela yokuhlanganisa

Amabhodi engilazi avame ukusetshenziswa emiklamo lapho ibhodi elingenalutho liyinselele encane kuphela. Izinto ezifakiwe, ukwesekwa kokubekwa, iphrofayili yokushisa, ukulayishwa kwesixhumi, kanye nokuphathwa ngesikhathi sokuhlanganiswa konke kuthinta ukuthi umkhiqizo wokugcina uthembekile yini. Lokhu kubaluleke kakhulu kumabhodi amancane, ukwakheka okusobala, kanye nezakhiwo ezine-interconnect encane noma imiphetho ebucayi. Umklamo omuhle ushiya umkhawulo owanele wemishini yenqubo yokuhlanganiswa kwangempela esikhundleni sokudweba ibhodi okufanelekile kuphela.

Ukuklama Ukwakhiwa Nokuhlanganiswa

Umklamo we-PCB yengilazi kufanele ubuyekezwe ngelensi yokukhiqiza ngaphambi kokukhishwa kweprototype. Empeleni, i-DFM yengilazi idlula ububanzi kanye nesikhala sokulandelela. Ngokuvamile ifaka phakathi ukulingana kwe-substrate, ukuma kwebhodi, isimo somphetho, isu lokuxhumana, ukulungela ukuhlanganiswa, nokuthi ngabe umklamo ungowesigaba senqubo efanele kwasekuqaleni. Ukwakheka okubonakala kunengqondo esikrinini kungase kudinge izinguquko uma ukuphathwa kwe-substrate, i-metallization, i-singulation, noma ukwesekwa kwe-fixture sekucatshangelwe.

Abaklami kufanele bahlole ukuthi i-stack-up iyafana yini ne-substrate ekhethiwe, ukuthi ngabe izindawo ezibonakalayo nezemishini zichazwe ngokucacile yini, ukuthi ngabe ukushintshela ezixhumini noma ezindaweni eziqinisiwe kuqinile yini, nokuthi ngabe yiziphi izici ze-through-substrate ezibekwe ngendlela engokoqobo. Amaphrojekthi angena ekukhiqizweni kusenesikhathi avame ukuthola ukuthi inkinga bekungewona uxhumano lukagesi, kodwa i-geometry yengilazi engasekelwa, ibhalansi embi, noma ukucabanga kokuhlanganiswa okungafanelanga izinto.

Yingakho ukwakheka kwe-PCB yengilazi kufanele kuhlanganiswe nokukhiqizwa kwe-PCB yengilazi ngaphambi kokuba ukwakheka kukhiywe. Kumaphrojekthi amaningi, umphumela omuhle kakhulu we-DFM awuyona into encane mayelana nesikhala. Kuyilungiselelo lesakhiwo elenza ibhodi libe lula ukulakha, kube lula ukuhlanganisa, futhi likwazi ukusinda kuma-prototypes okuqala ngaphandle kokuklama kabusha.

Izimo Ezijwayelekile Zokuklama I-PCB Yengilazi

Umklamo we-Glass PCB uvela ezimweni eziningana eziphindaphindayo, futhi ngayinye isunduza ukwakheka ngendlela ehlukile. Kumabhodi ezinzwa aqinile noma ezimbonini, inani livame ukuvela ekuzinzeni, ekuhlanzekeni, nasekumelaneni nemvelo. Emikhiqizweni esobala, inselele ukulinganisela isekethe nendawo ebonakalayo. Emiklamo yesitayela sephakheji, i-substrate iba yingxenye yesistimu yokuxhumana ehlanganisiwe enezidingo zokuthamba eziqinile kanye nomzila. Ezakhiweni ezihlobene ne-LED noma ukukhanya, ukuziphatha kokushisa, izindawo ezibonakalayo, kanye nokubekwa komqhubi konke kungabalulekile ngesikhathi esisodwa. Ezinye zalezi zinhlobo zephrojekthi nazo zihlangana nezidingo zomklamo we-PCB yeglasi le-LED.

Umklamo kufanele uthuthelwe nini engilazini esikhundleni se-FR-4?

Ingilazi ivame ukuba yinto efanelekile ukuyicabangela lapho umklamo udinga ukucaca, ukuzinza kwe-substrate, ukuthamba kwesitayela sephakheji, i-geometry ekhethekile yokuxhumana, noma ukuziphatha kwemvelo okungasekelwa amabhodi avamile e-laminate. Uma iphrojekthi ingadingi lezo zinzuzo, i-FR-4 ingase ibe yisinqumo esisebenziseka kakhulu.

Ingabe yonke i-PCB yengilazi idinga ama-vias angena ngengilazi?

Cha. Amanye amabhodi engilazi aqondiswa phezulu kuphela. Ukuxhumana okungaphansi kwe-substrate kuyadingeka kuphela uma isakhiwo noma iphakheji idinga ukudluliselwa kukagesi okuqondile ngengilazi.

Iyiphi indlela engcono kakhulu yokuqala iphrojekthi ye-PCB yengilazi?

Indawo engcono kakhulu yokuqala ukuchaza isakhiwo ngokucacile ngaphambi kokuba kuqedwe umzila: umndeni we-substrate, indima yebhodi, izindawo ezibonakalayo, isidingo sokuxhumana okuqondile, kanye nendlela yokuhlanganisa. Uma usuvele unesakhiwo noma umqondo, thumela ngekhasi lesilinganiso ukuze umklamo ubuyekezwe ngokumelene nemikhawulo yangempela yezinto ezibonakalayo kanye nenqubo.