Izinhlobo ze-Glass PCB Substrate Izakhiwo kanye nokuqhathanisa izinto

I-substrate ye-PCB yengilazi iyingqimba eyisisekelo ye-dielectric yebhodi lesekhethi lengilazi—izinto ezihlinzeka ngokusekelwa komshini, ukufakelwa kukagesi, kanye neplatifomu yokwenza amaphethini omqhubi. Inquma yonke impahla ebalulekile kagesi neyomzimba yebhodi eliqediwe: ukungaguquguquki kwe-dielectric, i-tangent yokulahlekelwa, ukunwetshwa kokushisa, ukuthamba komphezulu, ukudluliselwa kokukhanya, kanye nokumelana namakhemikhali.

Ukukhetha i-substrate akuyona isinqumo sesibili. Kuchaza ukuthi isekethe ingenzani, ingasebenza kangaki, nokuthi iziphatha kanjani ngaphansi kokujikeleza kwezinga lokushisa, umswakama, kanye nokucindezeleka komshini. Onjiniyela abaklama amasekethe angaphezu kwe-10 GHz, ama-substrate ephakheji ye-semiconductor adinga ukuhambisana kwe-CTE ne-silicon, noma amasekethe okukhanya adinga ukucaca ebhodini abakwazi ukuphatha ukukhethwa kwe-substrate njengokuzenzakalelayo.

Lo mhlahlandlela uhlanganisa izinhlobo ezine ze-substrate zengilazi zezentengiselwano ezisetshenziswa ekukhiqizweni kwe-PCB, izakhiwo zazo zikagesi nezokushisa ezilinganisiwe, izindlela zokukhetha ngokusetshenziswa, nokuthi uhlobo lwe-substrate luthinta kanjani inqubo yokwenziwa kanye nesikhathi sokuhola. Ukuze uthole umbono ophelele wobuchwepheshe be-PCB yengilazi, bheka umhlahlandlela we-PCB yengilazi.

Thola Isilinganiso Sephrojekthi Yakho Ye-PCB Yengilazi

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Iyini i-Glass PCB Substrate?

Kubuchwepheshe be-PCB, i-substrate iyingqimba eyisisekelo ye-dielectric lapho kwakhiwe khona wonke ama-conductor, ama-via, kanye nokuqedwa kwendawo. Ku-PCB ejwayelekile ye-FR-4, i-substrate iyinhlanganisela ye-fiberglass elukiwe kanye ne-epoxy resin. Ku-PCB yengilazi, i-substrate iyishidi lengilazi elilinganayo—elifanayo ngokwesakhiwo, elingenayo i-fiber weave, futhi lenziwe ngokwezincazelo ze-optical surface flatness kune-standard laminate tolerances.

I-substrate yengilazi yenza imisebenzi emithathu ngesikhathi esisodwa ebhodini lesifunda eliqediwe:

• Isithwali semishini: inikeza ukwesekwa kwesakhiwo okuqinile kwabaqhubi, izingxenye, kanye nama-via ngobukhulu obusukela ku-0.05 mm (ingilazi eguquguqukayo encane kakhulu) kuya ku-6 mm (amaphaneli okwakha)
• Isivikelo sikagesi: ihlukanisa izendlalelo zomqhubi nge-dielectric enamanani acacisiwe, azinzile e-Dk kanye ne-Df asetshenziswa ekubalweni kwe-impedance
• Izinto ezisebenzayo: kunegalelo ekukhanyeni kokukhanya, ukungangeni kwamakhemikhali, ukuhanjiswa kokushisa, kanye nokuzinza kobukhulu obungenakuhlinzekwa yi-FR-4

Le misebenzi emithathu isebenza ngesikhathi esisodwa, futhi ukukhetha uhlobo lwengilazi kusho ukukhetha ibhalansi yezakhiwo ezikhonza uhlelo lokusebenza—hhayi ukwenza ngcono noma iyiphi ipharamitha eyodwa ehlukanisiwe.

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Izinhlobo Ezine Zezingqimba Zengilazi Zezentengiselwano

Izakhi ezine zengilazi zisetshenziswa kwezentengiselwano ekukhiqizweni kwe-PCB. Ngayinye inenhlanganisela ehlukile yezakhiwo zikagesi, ze-optical, ze-thermal, neze-mechanical.

I-Borosilicate Glass

Borosilicate glass is a family of glass compositions used in electronic and packaging applications. Its dielectric loss, thermal expansion and process compatibility depend on the exact grade and measurement conditions. Select a named material using current manufacturer data at the operating frequency; the term borosilicate alone does not establish suitability for a radar, antenna or package substrate.

I-Fused Silica (i-Fused Quartz)

I-silica ehlanganisiwe (i-SiO₂ emsulwa, >99.9% ubumsulwa) inikeza ukulahleka kwe-dielectric okuphansi kakhulu kunanoma iyiphi i-substrate ye-PCB yezentengiselwano—ngaphansi kuka-0.0002 ku-1 GHz, okuhlala ngaphansi kuka-0.0005 ngaphezu kuka-100 GHz. Iphinde inikeze i-dielectric constant ezinzile kakhulu (Dk = 3.78 ± 0.01) kuwo wonke amazinga okushisa nomswakama. Lezi zakhiwo zenza i-silica ehlanganisiwe ibe yi-substrate edingekayo yezinhlelo zokusebenza ezingaphezu kuka-60 GHz (ucwaningo lwe-E-band, i-D-band, i-THz) kanye nezindinganiso zokulinganisa ze-RF ezinembile. I-CTE yayo engu-0.55 ppm/°C ifana kakhulu ne-silicon yanoma yiluphi uhlobo lwengilazi. Intengo ephezulu ngaphezu kwe-borosilicate ingu-3–5×.

I-Soda-Lime Glass

Ingilazi ye-soda-lime (i-SiO₂ + Na₂O + CaO) iyinhlanganisela ejwayelekile esetshenziswa emafasiteleni, emabhodleleni, nasengilazini yokubonisa yephaneli eyisicaba. Okuqukethwe kwayo okuphezulu kwe-sodium kukhiqiza i-tangent yokulahlekelwa ephezulu (~0.010 ku-1 GHz) kanye ne-CTE engu-9 ppm/°C—iphakeme kakhulu ekufanisweni kwe-silicon CTE okunembile kanye ne-marginal yezinhlelo zokusebenza ze-RF ezingaphezu kwe-5 GHz. Kodwa-ke, ukudluliselwa kwayo kwe-optical (>90%) kanye nezindleko eziphansi kwenza kube kufanelekile kumaphaneli engilazi ye-LED, amasekethe abonakalayo okwakha, kanye nezinhlelo zokusebenza zokubonisa ezitolo lapho ukusebenza kwe-RF kungeyona imfuneko yokukhetha.

Ingilazi ye-Aluminosilicate (Eqiniswe Ngamakhemikhali)

Ingilazi ye-Aluminosilicate (i-SiO₂ + i-Al₂O₃) iyinhlanganisela eyisisekelo yemikhiqizo yengilazi eqiniswe ngamakhemikhali kufaka phakathi i-Corning Gorilla Glass. Ukuqina kwamakhemikhali (inqubo yokushintshana kwama-ion) kuthatha indawo yama-ion e-sodium ebusweni bengilazi ngama-ion amakhulu e-potassium, okudala ungqimba lokucindezela olucindezelayo olwandisa ubulukhuni bomphezulu kanye nokumelana nokuqhekeka ngo-4–6× uma kuqhathaniswa nengilazi ejwayelekile. Lena yi-substrate yezinzwa zesikrini sokuthinta kanye namadivayisi abathengi adinga ukumelana nokuklwebheka kanye nokushayisana. I-Dk kanye ne-Df yayo ziphakathi nendawo phakathi kwe-soda-lime kanye ne-borosilicate.

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Ukuqhathaniswa kwezakhiwo zikagesi

Izakhiwo zikagesi ezinquma ukufaneleka kwe-substrate ye-RF kanye nezinhlelo zokusebenza zedijithali ezisheshayo yi-dielectric constant (Dk) kanye ne-loss tangent (Df).

Ikholomu yokuqina kwe-Dk ifanelwe ukunakwa okukhethekile. Ukwehluka kwe-FR-4's ±0.3–0.5 Dk kubangelwa ukuluka kwefayibha—imikhondo ewela ezindaweni zengilazi ihlangabezana ne-Dk ehlukile kunemikhondo ewela ezindaweni ezicebile nge-resin. Lokhu kubangela ukungavumelani kwe-impedance kanye nokugoba kwe-differential pair. Izisekelo zengilazi ziyafana ngokwesakhiwo—akukho ukuluka kwefayibha—ngakho ukwehluka kwe-Dk kulo lonke iphaneli akunamsebenzi (<0.02 ye-borosilicate, <0.01 ye-fused silica). Kuma-antenna e-phased array lapho ukuhambisana kwesigaba se-element-to-element kubalulekile, lokhu kuhlangana kuyimfuneko yokusebenza.

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Izakhiwo ezishisayo nezemishini

I-CTE yengilazi ye-borosilicate (3.3 ppm/°C) cishe isondele ngo-5× ku-CTE ye-silicon (2.6 ppm/°C) kune-FR-4. Lokhu kunciphisa kakhulu ukucindezeleka kwe-thermomechanical ku-interface ye-die-to-substrate kumaphakheji e-flip-chip. Ukuze uthole i-die attach eqondile kuma-bump pitches angaphansi kuka-100 μm, inzuzo ye-CTE ye-borosilicate kune-FR-4 umehluko phakathi kokuphila okwanele kokukhathala kwamalunga e-solder kanye nokwehluleka kwensimu ngaphambi kwesikhathi. I-Fused silica ku-0.55 ppm/°C inikeza ukufana okusondele kakhulu ne-silicon CTE, efanele izinhlelo zokusebenza zokupakisha ze-semiconductor ezidinga kakhulu. Lokhu kuhlanganiswe ngokuningiliziwe kumhlahlandlela we-PCB we-glass core.

Indlela Yokukhetha I-Substrate Yengilazi Efanele

Ukukhetha i-substrate kufanele kulandele izidingo zesicelo ngokulandelana kokubaluleka:

• Imvamisa yokusebenza engaphezu kuka-60 GHz: I-silica ehlanganisiwe kuphela. I-Borosilicate Df ku-60–100 GHz ingasetshenziswa kancane emigqeni yokudlulisa emifushane kakhulu; kunoma yisiphi isifunda esinezindlela zesiginali ezingaphezu kuka-2 cm kulezi mvamisa, i-Df ye-silica ehlanganisiwe engaphansi kuka-0.0005 iyadingeka.
• Microwave and millimeter-wave operation: Compare named glass grades using dielectric data measured at the intended frequency and temperature. Manufacturer data show that loss varies by grade and frequency; a single borosilicate Df range does not validate every 5G, radar or satellite design. Review the construction constraints in the glass PCB design guide futhi SCHOTT electrical-properties reference before specifying a substrate.
• Ukupakishwa kwe-semiconductor / i-fine bump pitch: I-Borosilicate (CTE 3.3 ppm/°C) noma i-fused silica (CTE 0.55 ppm/°C). Ukukhetha kuncike ekujuleni kwe-bump kanye nobunzima bomjikelezo wokushisa. Nge-bump pitch engaphansi kwama-50 μm nge-automotive thermal cycling, i-fused silica inikeza ukufaniswa okungcono kwe-CTE ne-silicon.
• Isibonisi se-LED/esibonakalayo (ngaphakathi): Ingilazi ye-soda-lime. Ingabizi kakhulu, idlulisela ukukhanya okuphezulu, itholakala ngefomethi ezinkulu zokwakha. Ukusebenza kwe-RF akuyona indinganiso yokukhetha.
• Isibonisi se-LED/esibonakalayo (sangaphandle noma sezimoto): I-Borosilicate. Ukumelana nokushaqeka kokushisa kuyadingeka ukuze kuqhutshwe ukushisa kwangaphandle kanye ne-AEC-Q100 yezimoto.
• Isikrini sokuthinta sabathengi / esingamelani nokushayisana: I-aluminosilicate eqiniswe ngamakhemikhali. Amandla omshini kanye nokumelana nokuklwebheka yizona zindlela eziyinhloko zokukhetha.
• Ukulinganisa i-RF okunembile noma i-electronics ye-vacuum: I-silica ehlanganisiwe. Kudingeka ukuqina okuphezulu kwe-Dk kanye nokukhishwa kwegesi okungenalutho.

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Ukulungiswa Komphezulu Nokwenziwa Kwensimbi

Izisekelo zengilazi zidinga ukulungiswa kwendawo ngaphambi kokufakwa kwe-conductor ngoba ingilazi ayihlangani kahle ngokwemvelo nethusi. Ukwelashwa okubili kwendawo kujwayelekile:

Ukwelashwa kwe-silane coupling agent kusebenzisa ungqimba lokunamathela kwama-molecule ebusweni bengilazi, kuhlinzeka ngamaqembu obuso obusabelayo anamathela kokubili ku-substrate yengilazi (ngokusebenzisa i-silanol chemistry) kanye nongqimba lwembewu yensimbi olubekwe kamuva (ngokusebenzisa i-functional group chemistry). Lokhu kwelashwa kwenziwa ngokushesha ngaphambi kokufakwa kwe-PVD ukuze kuvinjelwe ukungcoliswa kobuso ekuphazamiseni i-bonding chemistry.

Ukuhlanza nokusebenzisa i-plasma kusebenzisa i-oxygen noma i-argon plasma ukususa ukungcola okungokwemvelo ebusweni bengilazi nokudala amaqembu e-hydroxyl asebenzayo (–OH) ebusweni athuthukisa ukunamathela kwensimbi. Ukusebenza kwe-plasma kwenziwa ngokushesha ngaphambi kokwenziwa kwensimbi ukuvimbela ukungcola kabusha.

Ngemva kokulungiswa kwendawo, ukufakwa komqhubi kuma-PCB engilazi kusebenzisa ukufakwa komoya ongokoqobo (i-PVD)—ikakhulukazi ungqimba lokunamathela lwe-titanium noma i-titanium-tungsten (20-50 nm) kulandelwe ungqimba lwembewu yethusi (200-500 nm) olufakwa ngokusputter. Lesi sitaki sefilimu esincane sibe sesifakwa ngogesi sibe ugqinsi lokugcina lwethusi (ngokuvamile 12-35 μm ngezendlalelo zesignali, 35-70 μm ngezendlalelo zamandla). Amandla okunamathela kwalesi sitaki se-PVD-electroplated engilazini elungiselelwe kahle adlula amandla okukhuhla angu-0.8 N/mm—okwanele kuzo zonke izinqubo ezijwayelekile zokuhlanganisa i-PCB kufaka phakathi ukusonta kabusha kanye nokubopha ucingo. Inqubo yokukhiqiza ichazwe ngokugcwele kumhlahlandlela wokukhiqiza we-PCB yengilazi.

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Uhlobo lwe-Substrate kanye nenqubo yokwenza

Uhlobo lwe-substrate yengilazi luthinta ukukhethwa kwenqubo yokwenziwa ezindaweni ezimbili: ngokwakheka kanye nokuhlanganiswa kwe-substrate.

Ngokwakheka: Zonke izinhlobo ezine zengilazi zisekela i-laser ngokwakheka. I-LIDE (i-Laser-Induced Deep Etching) ikhethwa kakhulu kuma-vias anesilinganiso esiphezulu kanye ne-fine nge-pitch ku-borosilicate kanye ne-fused silica. I-CO₂ laser ablation isetshenziselwa ama-vias amakhulu (≥150 μm) kuzinhlelo zokusebenza ze-LED zeglasi le-soda-lime kanye ne-aluminosilicate. I-Fused silica idinga amapharamitha e-laser ahlelwe ngqo ngenxa yokwakheka kwayo okumsulwa okuphezulu—ayikwazi ukucutshungulwa ngamapharamitha e-laser e-borosilicate ejwayelekile ngaphandle kokwandiswa ngokuqina kodonga. Inqubo ephelele ye-TGV ichazwe kabanzi ku- through-glass ngesiqondiso.

Ukwehlukaniswa kwe-substrate: Amaphaneli engilazi ahlukaniswa (anqunywa abe yizilinganiso zokugcina zebhodi) ngokuqoshwa nge-laser kanye nokuhlukaniswa kwemishini, noma ngokusika okujulile kwe-laser. Ukwehlukaniswa kwemishini—okujwayelekile kwe-FR-4—akusetshenziselwa ingilazi ngoba inqubo yokwehlukaniswa kwe-abrasive iphula imiphetho yengilazi futhi idale imifantu emincane esakazeka ize ihluleke. Ingilazi ye-soda-lime inokuqina okuphansi kakhulu kokuqhekeka futhi idinga ukuphathwa komphetho ngokucophelela okukhulu. I-aluminosilicate eqiniswe ngamakhemikhali iyona emelana kakhulu nokuqhekeka komphetho ngenxa yengqimba yayo yokucindezela ecindezelayo.

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Imibuzo Evame Ukubuzwa Nge-Glass PCB Substrate

Iyiphi i-substrate yengilazi esetshenziswa kakhulu kuma-RF PCB?

There is no universal frequency cutoff that selects borosilicate below 60 GHz and fused silica above it. Compare the specified grades using frequency-dependent dielectric data, conductor geometry, metallization, thermal expansion, process compatibility and the system loss budget. Confirm the selected substrate and fabrication route with the supplier before release.

Ingabe i-substrates ye-PCB yengilazi ingasetshenziswa nge-standard reflow soldering?

Yebo. Zonke izinhlobo ezine ze-substrate zengilazi zezentengiselwano ziyahambisana namaphrofayili ajwayelekile e-SAC305 angenawo umthofu (inani eliphakeme kakhulu lingu-245–255°C). Ingilazi izinzile ngokushisa ngaphezu kwamazinga okushisa aphinde ageleze—i-substrate ngokwayo ayishintshi izakhiwo ngenqubo yokugeleza kabusha. I-substrate yengilazi encane (ngaphansi kuka-0.5 mm) idinga izinto zokuthwala ngesikhathi sokuthuthwa kwe-conveyor kabusha ukuze kuvinjelwe ukugoba kwephaneli ekushiseni okuphezulu.

Bungakanani ubukhulu be-substrate obutholakalayo?

Ama-substrate e-PCB engilazi ye-borosilicate ne-fused silica atholakala kusukela ku-0.1 mm ubukhulu ngezindlela ezijwayelekile zamaphaneli. Ku-0.1 mm, i-substrate ingaphathwa ngesandla kuphela ngezinto ezikhethekile zokuhlanza. Ama-substrate angaphansi kuka-0.3 mm adinga amaphaneli okuthwala kuyo yonke inqubo yokukhiqiza. Ubuncane obusebenzayo bezinhlelo eziningi ze-PCB ngu-0.3 mm ngaphandle kwe-carrier. Ingilazi encane kakhulu (0.05–0.1 mm) iyatholakala kwizinhlelo ezikhethekile zesekethe yengilazi eguquguqukayo.

Ubucaba bomphezulu we-substrate yengilazi buqhathaniswa kanjani ne-FR-4?

Ama-substrate engilazi akhiqizwa ngokwezincazelo zokuthamba komphezulu obonakalayo. I-Borosilicate Ra ingaphansi kuka-0.5 nm; i-fused silica Ra ingaphansi kuka-0.1 nm. Ukungaguquguquki komphezulu we-FR-4 esibonakalayo se-conductor-dielectric kungu-1–3 μm ngenxa ye-fiber-weave surface topography. Lo mehluko ongu-1000–10000× ekungaguquguquki komphezulu unemiphumela ebalulekile yokulahlekelwa yi-conductor kuma-millimeter-wave frequency: ugesi wesikhumba ulandela iphrofayili yokungaguquguquki komphezulu, ngakho-ke ubuso bengilazi obushelelayo bunciphisa ukulahlekelwa yi-conductor ngo-15–30% ku-28 GHz uma kuqhathaniswa nobuso obungaguquguquki be-FR-4, noma ngabe womabili ama-substrate anamanani afanayo e-Df.

Ingabe ingilazi ye-borosilicate iyafana nePyrex?

I-Pyrex igama lomkhiqizo wendlela ethile yokwenza ingilazi ye-borosilicate eyenziwe ekuqaleni yi-Corning. Ingilazi ye-borosilicate yebanga le-PCB yenziwa ngendlela eqine kakhulu futhi evumelana nokwakheka kunemikhiqizo yabathengi be-Pyrex, kodwa i-chemistry eyisisekelo iyafana. Umhlahlandlela ogcwele wezinto ze-borosilicate use- borosilicate glass PCB.