I-Through Glass Via ku-Glass PCB Design

I-through-glass via (TGV) uxhumano lukagesi oluqondile olwakhiwe nge-substrate yengilazi. Ekwakhiweni kwe-PCB yengilazi, ivumela amasignali, amandla, umhlabathi, noma ukushisa ukuthi kudlule ebukhulu bengilazi ukuze i-substrate ikwazi ukusekela umzila phakathi kobuso, izendlalelo, kanye nezifunda ezisebenzayo. Lokhu kwenza i-through-glass vias ibe isici esibalulekile sokuklama kuzakhiwo ze-PCB yengilazi, izakhiwo ze-core yengilazi, umzila wesitayela se-interposer, kanye namasekethe e-RF lapho ukuthamba, ukuzinza kobukhulu, kanye nokuxhumana okulawulwayo kubalulekile. Njengengxenye yomklamo we-PCB yengilazi , i-through-glass via akuyona nje isici sokukhiqiza, kodwa futhi isici somzila kanye nokuhlanganiswa esakha indlela yonke i-substrate esetshenziswa ngayo.

Cela Isilinganiso se-Glass PCB

Kusho ukuthini ukusebenzisa i-Through-Glass Via ku-Glass PCB Design

Ekwakhiweni kwe-PCB yengilazi, i-through-glass via iyi-connectivity eqondile exhumanisa izici zomqhubi ezinhlangothini eziphezulu nangezansi ze-substrate yengilazi. Ngaphandle kwayo, ingilazi ingasekela kuphela umzila womphezulu olula kakhulu. Uma ama-through-glass via esethulwe, umklamo ungaqala ukusebenzisa zombili izindawo ze-substrate ngendlela ehlelekile, futhi ingilazi iba yingxenye yokwakheka kwesekethe okuphelele esikhundleni sokusebenza njengokusekelwa okuqinile kuphela.

Yingakho i-through-glass via kungafanele iqondwe njengembobo nje edlula engilazini. Iyisakhiwo somklamo esinomthelela kagesi, wemishini, kanye nenqubo. Imbobo esengilazini, insimbi engaphakathi kwayo, i-pad geometry eyizungezile, kanye nomzila oxhunywe kuyo konke kusebenza ndawonye.

• Indima kagesi: ixhumanisa izimpawu, umhlabathi, amandla, noma izindlela zokushisa emzimbeni wengilazi
• Indima yemishini: kumele ihambisane ne-substrate ebuthakathaka, eqinile
• Indima yokuqondisa: ivumela izinhlangothi zombili zengilazi ukuthi zabelane ngemisebenzi yesekethe
• Indima yokuhlanganisa: isekela izakhiwo eziyinkimbinkimbi kakhulu kunendlela yokuqondisa ingilazi enobuso obubodwa

Indima Yokuqondisa Ye-Through-Glass Vias Kuma-PCB Engilazi

Indima eyinhloko yokuqondisa ye-through-glass via ukuhambisa izindlela zikagesi nge-substrate ukuze umklamo ungagcini endaweni eyodwa. Ku-PCB yengilazi, indawo yokuqondisa ivame ukulinganiselwa kakhulu kunasebhodini elivamile le-multilayer organic ngoba umklamo ungadinga ukugcina isikhala se-optical, ukuphatha ubuningi be-conductor ngokucophelela, noma ukusekela imisebenzi ehlukene ezinhlangothini eziphambene ze-substrate. I-through-glass via isiza ukuxazulula leyo nkinga ngokungeza i-vertical routing kusu lokwakheka.

Lokhu kuba wusizo kakhulu uma izinhlangothi eziphezulu nezingezansi zengilazi zinikezwa imisebenzi ehlukene. Uhlangothi olulodwa lungasetshenziswa ukuhambisa isignali ngendlela eqondile, kanti uhlangothi oluphambene lungasetshenziswa ukubhekisela emhlabathini, ukusatshalaliswa kwamandla, izakhiwo zokuvikela, izindlela zokushisa, noma ama-interconnect pad amakhulu.

Njengoba ubuningi bomzila bukhula, ngokusebenzisa indawo, iphimbo, kanye nokuguqulwa kwephedi kuqala ukuthinta yonke inhlangano yesekethe. Lesi esinye sezizathu ezenza ukuthi ingilazi ixhumane kakhulu nokukhiqizwa kwe -PCB yengilazi , lapho ngokusebenzisa ukwakheka, ukwenziwa kwamaphethini omqhubi, kanye nokusetshenziswa kwendawo kufanele kusebenze ndawonye.

Kungani Ingilazi Ishintsha Nge-Design Logic

I-through-glass via ayikwazi ukuphathwa ngendlela efanayo ne-plated through-hole ebhodini le-FR-4 ngoba ingilazi ishintsha indlela yokuklama. Ama-laminate e-organic ayabholwa futhi afakwe i-plated enqubweni ye-PCB evuthiwe enezingqimba eziningi, futhi ama-via awo avame ukuphathwa njengezici ezijwayelekile zokuhlanganisa. Ingilazi ihlukile. Iqinile, iyaphuka, izinze kakhulu ngobukhulu, futhi ayibekezeleli kakhulu umonakalo onqenqemeni noma ukuqala kokuqhekeka okungalawulwa.

Lokho kusho ukuthi i-via akuyona nje inguquko kagesi kodwa futhi iyisenzakalo sendawo semishini esisekelweni. Ukubekwa kwe-Via, isikhala somphetho, ukulayisha kwensimbi yendawo, kanye nobudlelwano bobukhulu konke kudinga ukunakwa okwengeziwe kunasezindaweni ezivamile ze-FR-4.

Ukuhlanganiswa Kwensimbi Nokwakha

Ukwenziwa kwensimbi kubalulekile engilazini ngokusebenzisa ukusebenza kahle ngoba ukuvulwa kwengilazi kuba usizo kuphela ngemva kokuba iguqulwe yaba isakhiwo esizinzile sokuqhuba. Ngokwendlela yokuklama, ukwenziwa kwensimbi kuthinta okungaphezu kokuqhubeka kukagesi. Kuphinde kuthinte ukunamathela, ukumelana, ukuhambisana kwenqubo, ukuthamba kwendawo ezungeze i-via, kanye nokuthi ukuxhumana okuqondile kuhlangana kanjani nohlelo lokuqhuba kuzo zombili izinhlangothi ze-substrate.

Ngaleso sizathu, ukwenziwa kwensimbi kufanele kuphathwe njengengxenye yokwakhiwa komklamo kunokuba kuthathwe njengesinyathelo sokukhiqiza esingezansi.

1. Ukwakheka kokuvula: indlela edlulayo idalwe engilazini nge-geometry elawulwayo
2. Ukulungiswa kwendawo: ubuso bengilazi bulungiselelwe ukunamathela kwensimbi okuthembekile
3. Ukwakheka kwembewu kanye nokuqhuba: i-via iba umqhubi oqondile osebenzisekayo
4. Ukuhlanganiswa nomzila: ama-pads okuhlanganisa nge-via, ama-traces, kanye nezici zokwakheka kuzo zombili izinhlangothi

Lokhu kuba nzima kakhulu uma i-via iyingxenye ye-substrate eyakhelwe phezulu kunokuba ibe yi-glass circuit elula enezinhlangothi ezimbili. Yingakho i-through-glass via design ihlobene eduze nezakhiwo ze-PCB ze-glass core , lapho ukuxhumana okuqondile, ibhalansi yokwakha, kanye nokuzinza kwe-substrate kufanele kucatshangelwe ndawonye.

Izinto Okucatshangwa Ngazo Ngomklamo Wezakhiwo Ze-Glass Core, Interposer, kanye ne-RF

Izinto okufanele zicatshangelwe ngomklamo we-through-glass via zincike kakhulu ohlotsheni lwesakhiwo sengilazi esakhiwayo. Umqondo ofanayo we-via ungadlala izindima ezihlukene kakhulu kuye ngokuthi ngabe i-substrate ihloselwe ukuhlanganiswa kwephakheji, ukuhanjiswa kwe-interposer, noma ukusebenza kwe-RF.

Izakhiwo ze-Glass core

Kuma-substrate e-glass core, i-via ivame ukuba yingxenye yesistimu yokuxhumanisa yesitayela sephakheji esiminyene. Ukusebenza kahle komzila, ukulingana kokwakheka, ikhwalithi yokuguquka okuqondile, kanye nokuba yisicaba kwe-substrate konke kubalulekile ndawonye.

Izakhiwo ze-Interposer

Ezakhiweni zesitayela se-interposer, i-via isebenza njengengxenye yokwakhiwa kabusha kokusabalalisa lapho ubuningi bomqhubi kanye nokunemba kokuhlelwa kuyisisekelo somsebenzi we-substrate. Lolu uhlobo lwendawo lapho izakhiwo ze-PCB ze-interposer zeglasi zithembele kuma-via e-through-glass njengengxenye yenethiwekhi yomzila kunokuba zibe ukuxhumana okuhlukanisiwe.

Izakhiwo ze-RF

Ezakhiweni ze-RF kanye ne-microwave, i-via ingaba yingxenye yokubeka phansi, ukuvikela, ukuguqulwa kwereferensi, noma ukunyakaza kwesignali okulawulwayo emzimbeni wengilazi. Kulezi zakhiwo, i-via geometry ayikwazi ukuhlukaniswa nesakhiwo sephedi, indlela yokubuya, ukuhlelwa komqhubi, kanye nokuziphatha kwe-dielectric okuzungezile. Yingakho ukuhlela ngengilazi edlulayo kuvame ukubhekwa kanye nezidingo ze-PCB zengilazi ezivame kakhulu.

Izicelo kanye ne-FAQ

Ama-vias asebenzisa ingilazi asekela izinhlelo zokusebenza ze-PCB zengilazi ngokuvumela i-substrate ukuthi ithwale imisebenzi yesekethe engaphezu kweyodwa ngesikhathi esisodwa. Kwezinye izakhiwo, axhuma izici zesignali phakathi kwezindawo ezimbili zebhodi lengilazi eliqinile. Kwezinye, asiza ukuhlukanisa imisebenzi yesignali, yomhlabathi, kanye namandla ezinhlangothini ezahlukene ze-substrate. Ezindaweni ezihlobene nephakeji ezixineneyo, asekela ukuguquka okuqondile ngaphakathi kwenethiwekhi yokuxhumana ehlanganisiwe.

Ziwusizo futhi lapho umzila kagesi kufanele uhlanganiswe nezinye izidingo zezinga le-substrate. Ezinye izakhiwo ezicacile noma ezingabonakali kangako zidinga ukubekwa komqhubi ukuze kuphathwe ngokucophelela ngenkathi kulondolozwa ukuxhumana nge-substrate. Ezinye imiklamo ehlobene nokushisa noma ukukhanya idinga izindlela eziqondile zokuqhuba ezisekela umzila kanye nokunyakaza kokushisa. Yingakho ama-via engilazi abonakala futhi kwezinye izakhiwo ze-PCB zengilazi ye-LED.

Njengoba ubuchwepheshe besekethe obusekelwe engilazini buqhubeka nokukhula, ama-via engilazi ahlala engenye yezici zokuklama ezenza lokho kwanda kwenzeke. Avumela ingilazi ukuthi isebenze hhayi nje kuphela njenge-substrate eqinile noma esobala, kodwa njengengxenye yesistimu yokuxhumana enekhono kakhulu yokupakisha okuthuthukisiwe, ukuqondisa i-RF, kanye nokuhlanganiswa okukhethekile kwe-elekthronikhi. Izidingo zephrojekthi zingathunyelwa ngqo ngekhasi lesilinganiso.