I-Castellated PCB: Umhlahlandlela Obalulekile Wokuhlanganisa Imojula & ne-DFM

1. Isingeniso: Ukuchaza i-Modular Edge

I-PCB egobile iyibhodi lesifunda elinezimbobo ezigobile kancane eceleni komngcele walo, elenzelwe ngqo ukuvumela ukuhlanganiswa kwemoduli ye-solder-on-board. Lezi zinqenqema ezigobile ezihlukile—ezibizwa nangokuthi i-castellations noma i-half-holes—ziguqula ama-sub-module abe yizingxenye ezijwayelekile ze-SMT ezifakwa ngqo kumabhodi okusingatha nge-reflow soldering. Le ndlela yokuklama inikeza ukuqhubeka kukagesi okuthembekile kanye nokunamathela okuqinile kwemishini phakathi kwamamoduli endodakazi kanye nezinhlangano eziyinhloko.

Lo mhlahlandlela ovela ku-Highleap Electronics unikeza incazelo yesakhiwo, izidingo ezibalulekile ze-DFM, imininingwane yenqubo yokukhiqiza, kanye nezinto ezidingekayo zokuthembeka ukuze kuhlanganiswe ngempumelelo i-PCB ehlanganisiwe emikhiqizweni yakho. 

2. Iyini i-PCB eqoshiwe? Isakhiwo kanye namagama asetshenziswayo

2.1 Incazelo Esemthethweni

I-PCB egobile ichazwa njengebhodi lesifunda eliphrintiwe elinezimbobo ezigobile uhhafu eceleni komphetho walo, elidalwe ngokudlula phakathi kwezimbobo ezigobile uhhafu ( PTHs ). Izimbobo ezigobile uhhafu zifana nezindonga zodonga lwenqaba yasendulo, yingakho igama elithi “izimbobo ezigobile.” Izimbobo ezigobile uhhafu ngamunye zinikeza indawo yokuxhumana egobilekayo eqala kusukela kungqimba lwethusi oluphezulu kuya phansi.

2.2 Uchungechunge Lokukhiqiza

Inqubo yokukhiqiza ilandela izinyathelo ezintathu eziyinhloko: Ukubhoboza → Ukuplata → Ukuhlela/Ukugaya. Ama-PTH ajwayelekile aqala ngokubhoboza ezindaweni zomphetho webhodi, bese embozwa ngethusi ngogesi. Isinyathelo sokugcina sokuhlela sinqamula ngqo phakathi kwemigodi, siveze ithusi elimboziwe futhi sakhe ama-contact pad ahlukile achaza iphrofayili yomphetho oqoshiwe.

3. Kungani Kufanele Usebenzise Imiphetho ye-PCB Eyenziwe Nge-Castelled? Imisebenzi Eyinhloko

3.1 Ukuhlanganiswa kanye nokuxhumana kwe-SMT Module

Imiphetho egobile ivumela amamojula ukuthi abekwe futhi afakwe i-solder emabhodini amakhulu kusetshenziswa imishini ejwayelekile yokukhetha nokubeka kanye nezinqubo zokugoqa kabusha. Izimbobo ezifakwe uhhafu zinikeza amandla aphezulu okuhlangana kwe-solder uma kuqhathaniswa nama-edge pad alula, njengoba i-solder yakha i-fillet egoqa umgqomo wethusi oveziwe. Le geometry yokuhlangana enezinhlangothi ezintathu iqinisekisa ukuqhubeka kukagesi okuthembekile kanye nokuzinza kwemishini ngaphansi kokucindezeleka kokusebenza.

3.2 Ukuvuselelwa Okulula kanye Nezinzuzo Zenqubo

Amandla Okusebenza Kabusha

Amamojula ahlanganisiwe angasuswa futhi ashintshwe ngaphandle kwezinqubo eziyinkimbinkimbi zokususa i-solder ezidingekayo kumaphakheji e-BGA noma e-QFN. Isiteshi sokuvuselela umoya oshisayo sisusa kalula imojula, futhi ama-pad ebhodi lokusingatha ahlala engashintshiwe ukuze kufakwe imojula entsha. Lokhu kunciphisa isikhathi sokuvuselela futhi kuthuthukisa isivuno ezindaweni zokukhiqiza.

Ukuhlolwa Kwangaphambi Kokuhlanganiswa

Abakhiqizi bamamojula bangahlola ngogesi zonke izixhumanisi zokufaka/zokukhipha ngaphambi kokuthunyelwa. Ama-castellations avele ahlinzeka ngezindawo zokuhlola ezifinyelelekayo zokuqinisekisa ukusebenza, okuqinisekisa ukuthi amamojula anephutha ayahlonzwa ngaphambi kokuhlanganiswa nokuhlanganiswa komkhiqizo wokugcina.

3.3 Ukuthobela Nokuhlukanisa Umklamo

Amamojula e-RF avame ukudinga ukuhlukaniswa kukagesi nokwemishini ebhodini lokusingatha ukuze kuhlolwe ukuhambisana nomthetho kanye nokuvikela i-EMI. Ukwakhiwa kwe-PCB e-Castelled kuvumela imojula ukuthi ihlolwe ngokuzimela, iqinisekiswe njengeyunithi ezimele, bese ihlanganiswa ngaphandle kokuqinisekiswa kabusha kwenhlangano yonke ezindaweni eziningi.

4. Izicelo Ezivamile Zama-PCB Ahlanganisiwe

Amamojula e-Castelled PCB asetshenziswa emikhiqizweni eminingi ye-elekthronikhi. Izinhlelo zawo ezivame kakhulu zifaka:

• Amamojula okuxhumana angenantambo afana namadivayisi e-RF, i-Wi-Fi, i-Bluetooth, kanye ne-LoRa athembele ezigabeni zomsakazo eziqinisekiswe kusengaphambili ukuze kube lula ukuthuthuka.

• Amamojula okuguqulwa kwamandla afaka phakathi abaguquli be-DC-DC kanye ne-AC-DC abazuza ezinhlakeni zikagesi ezizinzile kanye nokuhlukaniswa nezisekethe ezibucayi.

• Amamojula esistimu afakiwe njenge-MCU cores kanye namabhodi ememori anweba noma ahlele ukusebenza kwesistimu.

• Amabhodi okulingisa ahlanganisa amabhodi okuqhuma kanye namabhodi endodakazi asheshisa intuthuko yesigaba sokuqala.

Ndawonye, ​​lezi zinhlelo zokusebenza ziqokomisa ukuguquguquka nokusebenza kahle kokuhlanganiswa kobuchwepheshe be-Castellated PCB.

5. Ukubuka Konke Kwenqubo Yokukhiqiza i-Castelled PCB

5.1 Ukubhoboza Nokucwebezela (I-PTH)

Inqubo iqala ngokubhoboza ama-PTH agcwele ajwayelekile ezindaweni eziqokiwe. Ubukhulu be-copper plating ngaphakathi kwalezi zimbobo bubalulekile—ukungabi khona kwe-plating okwanele kuholela ekuqhekekeni okubuthakathaka okungase kuqhekeke ngesikhathi sokuhamba noma kubonise ukungakwazi ukusonta kahle. Imininingwane evamile idinga ubuncane bobukhulu be-copper obungu-20-25µm emgqonyeni.

5.2 Ukuqondisa noma Ukugaya (Ukudala Umgodi Oyingxenye)

Ngemva kokufaka iplati kanye nokuqedwa kwendawo, ukuqondisa ngokunemba kunqamula ngqo izikhungo ze-PTH. Lesi sinyathelo sidinga ukulawulwa okuqinile kokubekezelelana ukuze kulondolozwe ububanzi bendandatho ye-annular obuhambisanayo ngaphakathi kwengxenye ngayinye yomgodi. Ukuphambuka kokuqondisa kubangela ukuvezwa kwethusi okungalingani, okuholela ezifweni zokusonta noma ubuthakathaka bomshini ekuqhekekeni okuqediwe.

5.3 Ukuqedwa kwendawo

Izimbobo ezimboziwe zitholakala ngokuphela kwendawo — ngokuvamile i-ENIG (i-Electroless Nickel Immersion Gold) noma i-Immersion Tin — ukuze kube lula ukunamathela kanye nokuphila isikhathi eside eshalofini. I-ENIG inikeza ukumelana okuhle kakhulu kwe-oxidation kanye nezindawo zokuthintana ezisicaba, kuyilapho i-Immersion Tin inikeza izinzuzo zezindleko zezinhlelo zokusebenza ezinezidingo zokugcina ezimfushane.

6. Izidingo Eziyinhloko Zokuklama Ama-PCB Afakwe I-Castelled (Idatha Ebalulekile Ye-DFM)

6.1 Ububanzi bembobo kanye ne-Pitch

Imininingwane Yobubanzi Bembobo

Ububanzi obujwayelekile bemigodi ye-castella buqala ku-0.6mm kuya ku-1.2mm. Imigodi emincane iba nzima ukuyibeka ngokwethembeka futhi ingase ibonise izikhala zethusi noma amabala amancane. Imigodi emikhulu idla izindlu ezengeziwe ezisemaphethelweni ebhodi. Ububanzi obungu-0.8mm kuya ku-1.0mm bunikeza ibhalansi efanele phakathi kwekhwalithi yokuyibeka kanye nokusebenza kahle kwesikhala kwezicelo eziningi.

Izidingo ze-pitch

Kunconywa i-castellation pitch encane (isikhala esiphakathi nendawo) esingu-1.0mm kuya ku-1.27mm (~50 mil). I-pitch eqinile iyingozi yokubopha i-solder ngesikhathi sokugeleza kabusha, kuyilapho isikhala esiningi sichitha indawo yebhodi. I-pitch kumele ivumele ukwakheka okufanele kwe-solder fillet phakathi kwe-castellations eziseduze ngaphandle kokubopha i-bridging.

6.2 Indandatho Ehlanganisiwe Nobukhulu Bethusi

Ubuqotho Bendandatho Ehlanganisiwe

Indandatho yethusi yangaphakathi kumele igcine ububanzi obanele ngemva kokujikeleza ukuze kuvinjelwe ukudabuka kwethusi kuya emaphethelweni. Kunconywa ububanzi bendandatho ye-annular okungenani engu-0.15mm. Indandatho ye-annular enganele ibangela ukuthi ithusi elicwebezelwe lihlukane ne-substrate ngesikhathi sokujikeleza noma ngaphansi kokucindezeleka kokushisa.

Izidingo Zokumboza Ngethusi

Ubukhulu obanele bokucwebezela buqinisekisa ukuqhubeka kukagesi okuthembekile kusukela phezulu kuya phansi kuze kufike onqenqemeni lwengxenye yomgodi. Umgqomo wethusi kumele umelane nokucindezeleka komshini wokuhambisa ngaphandle kokuqhekeka noma ukuxebuka. Cacisa ubukhulu obuncane be-25µm bokucwebezela ukuze kusetshenziswe ngokuthembeka okukhulu.

6.3 I-Solder Mask kanye ne-Pad Layout

I-Solder Mask Clearance

Imaski yokugoqa kumele idonswe emuva nxazonke kwengxenye ngayinye yomgodi ukuqinisekisa ukuthi ithusi livezwe ngokugcwele futhi lilungele ukugoqwa. Ukuhlukaniswa okuvamile okungu-0.1mm kuya ku-0.15mm kusukela onqenqemeni lwe-castellation kuvimbela ukungena kwemaski okungavimbela ukumanzisa kwe-solder kanye nokwakheka kwe-fillet.

Umklamo Wephedi Lokuhlangana

Iphedi ye-PCB yomphathi kufanele idlule u-0.2mm kuya ku-0.3mm idlule unqenqema lwe-castellation ukuze kukhuthazwe ukumanzisa okulinganayo kwe-solder kanye nokwakheka okwanele kwe-fillet. Lokhu kwandiso kwephedi kunikeza indawo eyengeziwe yobuso be-solder joint, okuthuthukisa ukuthembeka kukagesi kanye namandla okusebenza kwesinamathiselo semojuli.

6.4 Ukuqondanisa Nokubekezelelana Kwemizila

Ukubekezelelana okuphelele kwe-PCB egobile kunquma ukuthembeka komkhiqizo wokugcina. Ukuqondisa ngokunemba okuphezulu (± 0.1mm noma ngaphezulu) kubalulekile ukuvimbela ukungalingani kwe-plating nokuqinisekisa ukuvezwa kwethusi okufanayo kuzo zonke i-castellations. Ukungahambisani kahle kokuqondisa kubangela imigodi engalingani ekhombisa ukunamathela okungaguquki kanye namandla emishini ancishisiwe.

7. Izindlela Ezinhle Zokuklama I-PCB Ene-Castelled

7.1 Amandla Omshini We-Module

Sabalalisa izimbobo ezigobile ngokulinganayo eceleni komphetho wemojuli, ubeke izimbobo emakhoneni ukuze wandise amandla omshini wokunamathisela. Izimbobo ezigobile zimelana ne-torque futhi zivimbela ukuphakanyiswa kwemojuli ngaphansi kokudlidliza noma ukucindezeleka kokujikeleza kokushisa.

7.2 Izindawo Zokugcina Izinto Eziyingxenye

Gwema ukubeka izingxenye, ama-via, noma imikhondo ebalulekile ngaphakathi kwe-1.0mm yomphetho we-castellation. Inqubo yokuqondisa ingadala ukucindezeleka komshini okulimaza izici eziseduze. Ukugcina indawo efanele ivulekile kuvimbela nokungcola komphetho we-castella ngesikhathi sokushiswa kwezingxenye.

7.3 Izici Zokuqondanisa ze-SMT

Faka izimpawu ze-fiducial eduze kwemiphetho egobile ku-PCB yokusingatha ukuqinisekisa ukubekwa kwemojula okunembile ngesikhathi sokuhlanganiswa kwe-SMT okuzenzakalelayo . Ama-fiducial avumela izinhlelo zokubona ukuthi zibeke ngokunembile imishini yokukhetha nokubeka, ukuvimbela ukungahambisani kahle okubangela amaphutha e-solder noma amasekethe avulekile.

8. Ukuthembeka kanye nokuhlolwa kwe-PCB e-Castelled

8.1 Ubuqotho Bokubambisana Kwe-Solder

Indawo eyinhloko yokuhluleka ekuhlanganisweni kwe-castellated module ngokuvamile i-solder fillet. Qinisekisa ukuthi ivolumu eyanele ye-solder paste idala i-concave fillet ekhulisa amandla amalunga. Ukuhlolwa okubonakalayo kufanele kuqinisekise ukumanziswa okuphelele kwe-castellation copper kanye nokwakheka kwe-fillet ebushelelezi ku-host pad.

8.2 Ukusebenza Kwebhayisikili Elishisayo

Hlola ukuthembeka kwemodyuli ngaphansi kokujikeleza kokushisa ukuqinisekisa ukuthi isakhiwo se-half-hole simelana nokucindezeleka okuvela ekungahambelani kwe-CTE phakathi kwemodyuli nebhodi lokusingatha. Amajoyinti e-solder kumele avumelane nokwandiswa okuhlukile ngaphandle kokuqhekeka noma ukuhlukanisa phakathi komjikelezo wokuphila komkhiqizo.

8.3 Izinto Okucatshangelwayo Ngokuhlanganisa Amaphaneli

Uma ufaka amaphaneli amamojula acwebezelayo, qiniseka ukuthi indlela yokuqondisa ukuze kuhlanganiswe ayivezi ukudlidliza okweqile okungalimaza i-half-hole copper plating ebuthakathaka. Ukuqondisa ngokujula okulawulwayo noma ukuhlanganisa okufanele kunciphisa ukucindezeleka ngesikhathi sokuhlukaniswa kwamaphaneli.

9. Ukuqhathanisa: Ama-PCB Ahlanganisiwe vs. Ama-Standard Edge Pads

I-10. Isifingqo

Ama-PCB aqinile amelela indinganiso yegolide yokuhlanganiswa kwemoduli enokwethenjelwa okuphezulu, ethengiswayo, okuvumela ukuhlanganiswa kwe-SMT kwama-sub-circuits njengezingxenye ezijwayelekile. Impumelelo incike ekunamatheleni ngokuqinile emithethweni ye-DFM—ikakhulukazi ububanzi bembobo, imininingwane yephimbo, kanye nokubekezelelana okuqondile komzila okuqinisekisa ukucwebezela okuhlanzekile nokuqinile eceleni komphetho osikiwe.