Izinselele Eziyisi-7 Eziyinhloko Zokuklama Kuma-PCB E-Drone Optical Data Link

I-PCB yesixhumanisi sedatha se-drone optical iyinjini yokuguqula i-electro-optical enkabeni yazo zonke iziteshi zokuxhumana ze-UAV eziboshwe ngefayibha. Ihumusha izimpawu zikagesi ezivela kukhompyutha yendiza zibe ukukhanya kwe-laser okuguquliwe ukuze kudluliselwe ifayibha, futhi yenza ukuguqulwa okuphambene nezimpawu zokukhanya ezingenayo - iphendulela ama-photon atholiwe emuva kudatha kagesi iprosesa engayenza. Wonke amanye amabhodi ohlelweni lwe-tether - isilawuli se-spool, i-canister electronics, isiteshi saphansi - kuncike kule ngxenye eyodwa eyenza ukuguqulwa kwayo ngokwethembeka okwanele ukuthi yonke isixhumanisi ihlangabezane nezinhloso zayo zesilinganiso sedatha, ukubambezeleka, kanye nezinga lamaphutha amancane.

Okwenza ukwakheka kwe-PCB yesixhumanisi sedatha ye-optical kube nzima ukuba khona kwezindawo zesignali ezingahambisani ebhodini elilodwa: amasignali omehluko we-gigabit-rate avela ku-FPGA, isekethe ye-laser drive enembile ezwela umsindo wezinga le-microvolt, i-photodetector engaphambili enomsindo ophansi esebenza emaphethelweni okuzwela kwayo, kanye nezizinda eziningi zamandla okumele zihlukaniswe ngenkathi zabelana nge-substrate encane.

Thola Isilinganiso se-PCB se-Optical Data Link

Indima Yesistimu Nokugeleza Kwesignali

I-PCB yesixhumanisi sedatha ye-optical itholakala esixhumini esiphakathi kwesistimu yedijithali ye-UAV kanye ne-fiber. Indawo yayo ku-tether chain inquma isabelomali sobuqotho besignali sayo yonke into engenhla nangezansi: noma ngabe i-optical power margin efinyelelwa yi-transceiver, noma ngabe i-timing jitter evezwa yi-SerDes, noma ngabe i-BER ikhiqizwa yisekethe yokubuyisa iwashi — lawa mapharamitha abophe lokho okungabuyiselwa yisiteshi sasemhlabeni.

Ukugeleza kwesignali endleleni yokudlulisa: i-FPGA ikhiqiza idatha ye-LVDS noma ye-CML ehlukile ngesivinini somugqa → i-SerDes serializer iguqula idatha ehambisanayo ibe umfudlana we-serial osheshayo → umshayeli we-laser we-transceiver ulawula i-laser diode → i-fiber ithwala amandla okukhanya esiteshini saphansi. Indlela yokwamukela ifana nalokhu: amandla okukhanya angenayo → i-photodetector → i-transimpedance amplifier → i-limiting amplifier → i-CDR (iwashi kanye nokubuyisa idatha) → i-FPGA deserializer → idatha ehambisanayo ne-processor.

Ibhodi kumele liphathe konke lokhu endaweni ye-UAV: ukudlidliza kulo lonke ibanga le-10–2000 Hz, ukushintsha kwezinga lokushisa kusuka ku-−20 °C ekuphakameni kuya ku-+60 °C elangeni eliqondile, ukushaqeka kwesixhumi kusukela ekufikeni, kanye nomkhawulo ongapheli wesabelomali sesisindo esilinganiswa ngamagremu. Lezi zidingo zakha isinqumo ngasinye kusukela ekukhetheni i-transceiver kuya ekukhetheni izinto ze-PCB. Uhlelo lwe-UAV tether PCB lubeka imikhawulo eyengeziwe yomshini ekuqondisweni kwesixhumi kanye nesici sefomu lebhodi.

Ukukhethwa kwe-Transceiver: i-SFP, i-Soldered TOSA/ROSA, kanye ne-Custom

Isinqumo sokukhetha i-transceiver sinemiphumela eminingi engezansi kunanoma yikuphi okunye ukukhetha ekwakhiweni kwebhodi lesixhumanisi sedatha ye-optical. Sinquma uhlobo lwesixhumi, i-geometry yekheji, indawo yonyawo, indlela yokushisa, isikhombimsebenzisi sokuhlinzeka, kanye — ngokujulile — ukuthi kungenzeka yini ukushintshwa kwensimu.

Kumiklamo ye-SFP/SFP+ evulekayo, ukukhetha ikheji kubaluleke kakhulu ngale kwesixhumi sikagesi. Ama-gasket e-EMI, amandla okugcina, kanye nesilinganiso sokudlidliza kuyahlukahluka phakathi kwabakhiqizi bekheji. Amakheji alinganiswa ngendiza anezindlela zokukhiya afanele noma iyiphi i-UAV edlula ekuqondisweni okuphawulekayo. Ikheji kufanele lihlanganiswe ngokushisa ne-PCB ngokusebenzisa ama-thermal vias kuya ekuthululweni kwethusi, kungashiywanga ukuthi liphenduke emoyeni.

Imiklamo ye-TOSA/ROSA ehlanganisiwe isusa ubunzima bekheji kodwa idinga umklami ukuthi achaze isikhombimsebenzisi sikagesi kumshayeli we-laser kanye ne-TIA ngqo. Inzuzo ukunciphisa isisindo esingu-3-6 g kanye nokususa ukuzwela kokudlidliza kwekheji — okufanelekile kumapulatifomu lapho ubuqotho besixhumi ngaphansi kokudlidliza buyinkinga.

Ubuqotho Besignali Esivinini Esiphezulu ku-10 Gbps

Ku-10 Gbps, isikhawu seyunithi singama-100 ps. I-A via transition enezela ama-15 ps we-delay asymmetry phakathi kwe-differential pair yonakalisa ukuvulwa kwamehlo ngendlela elinganisekayo. Izinqumo zokuqondisa ezingamukeleka ku-1 Gbps zikhiqiza izixhumanisi ezisemaphethelweni ku-10 Gbps kanye nokwehluleka okuvulekile ku-25 Gbps. Ibhodi lesixhumanisi sedatha ye-optical yilapho isiyalo sobuqotho besiginali kufanele sibe qatha kakhulu kuyo yonke i-drone PCB stack.

Ukulawulwa kwe-impedance okuhlukile: 100 Ω ±10% ye-interface ye-SFP/SFP+ host (imfuneko ye-IEEE 802.3). Kufezwa nge-geometry yokulandelela elawulwayo — ngokuvamile imikhondo engu-100 µm enesikhala esingu-100 µm ku-FR-4, iqine kakhulu ezintweni ezilahlekelwa kancane. Ushintsho ngalunye lwesendlalelo ludinga ukubuyiselwa kwereferensi ngaphakathi kwama-200 µm wesignali ngayinye nge.

Ngokusebenzisa ukuphathwa kwe-stub: Emabhodini ajiyile kuno-1.6 mm, i- via edlula ku-stackup ephelele idala i-stub ngaphansi kwesendlalelo sesignali esizwakala ebangeni le-10-20 GHz, ikhiqiza ama-notches okulahlekelwa ukufakwa kanye nokubonakaliswa. Ukubhoboza ngemuva kususa i-stub ngaphakathi kwe-125 µm kwesendlalelo sesignali. Ekukhiqizweni kwevolumu ephezulu, ama-vias angabonwa noma afihliwe asusa i-stub ngokuklama - i-via ikhona kuphela phakathi kwezingqimba ezidinga ukuxhuma. Ukukhetha phakathi kwama-vias angabonwa kanye nama-vias angabonwa/afihliwe kuncike ekujikeni kwebhodi, ivolumu, kanye nokubekezelela izindleko.

Ukwabiwa kwezendlalelo: Dlulisa ama-differential pair asheshayo aphezulu ezingqimbeni ze-stripline (izendlalelo zangaphakathi phakathi kwezindiza zokubhekisela) kunokuba yi-microstrip. I-Stripline inokusabalalisa kwamanje okubuyisayo okulinganayo futhi ivikelwe ekukhishweni kwegesi okuphumayo. Ungalokothi uhambise i-10G pair eduze kwendiza yamandla - ukungaqhubeki kwe-impedance lapho indiza ihlukana khona noma ishintsha i-voltage kukhiqiza ukubonakaliswa okuvula iso.

Ukuxhumanisa kwe-AC: Imininingwane ye-SFP+ idinga ukuxhumanisa kwe-AC ohlangothini lomsingathi, iphakethe le-100 nF ku-0402, elibekwe ngaphakathi kwama-5 mm ama-pads e-SFP+. Kudingeka ama-capacitor aphansi e-ESL — ama-ceramics ajwayelekile anezingqimba eziningi ku-dielectric ye-X5R/X7R. Ama-capacitor okuxhumanisa nawo asebenza njengebhulokhi le-DC elivimbela i-laser bias current ukuthi ingangeni kuma-FPGA SerDes.

Kumadizayini asekelwe ku-FPGA, ama-differential pair aphuma endaweni ye-FPGA BGA fanout adinga ukunakwa okukhethekile. Amasimu e-BGA adala ukungaqhubeki kokulayisha okunamandla. Umklami kumele akhethe phakathi kokuhambisa ngensimu ye-via (kuyamukeleka uma insimu incane) noma ukuhambisa ngokuzungezile (kuyadingeka kuma-array aminyene). Noma ngabe yikuphi, ubude obufanayo obungaphakathi kwama-µm angu-50 phakathi kwezimpawu ze-P kanye ne-N zebhangqa ngalinye buyadingeka kusukela ku-BGA pad kuya ku-SFP cage pad. Indlela ye -HDI PCB esebenzisa ama-microvia inciphisa ngezinkinga ze-stub ngenkathi ivumela i-BGA fanout eqinile.

Umklamo Wokunikezwa Kwamandla Nge-Laser

Ukwakheka okuthandwayo: i-switching converter inikeza ibhasi eliphakathi (3.3 V noma 5 V), kulandelwe ama-LDO azinikele anomsindo ophansi wesitimela ngasinye se-transceiver voltage. I-ferrite bead ene-impedance ephezulu ku-100 MHz–1 GHz ihlukanisa okokufaka kwe-LDO kokukhiphayo kwe-switching converter. Okuphumayo kwe-LDO kuxhuma kwi-transceiver ngesihlungi: i-ceramic enkulu engu-22 µF + i-bypass engu-100 nF + i-100 pF high-frequency decoupling, konke kungaphakathi kuka-3 mm kusuka kuma-power pins e-module.

Izizinda ze-voltage ze-Transceiver: amamojula ajwayelekile e-SFP adinga i-3.3 V kufika ku-1 A. Amamojula e-SFP+ angadinga ukuphakelwa okuhlukile kwe-3.3 V kanye nokuphakelwa kwe-1.8 V kwe-logic yangaphakathi. Lokhu okuphakelwa okubili kumele kulandelelwe — i-logic ngaphambi kwe-power amplifier — ngokokulandelana kwamandla kweshidi ledatha lemojuli. Ukulandelana okungalungile kulimaza abashayeli be-laser. Ukulandelana kwenziwa kuhadiwe (amasekethe okulibazisa e-RC noma i-sequencer IC ezinikele) kunokuthembela ku-oda lokuqalisa isofthiwe, elingathembekile ezimweni zokubuyisa amaphutha.

Ugesi wokubuyisa umhlaba udinga ukunakwa okufanayo nokunikezwa. Indlela yokubuyisa ugesi wokushayela i-laser kumele ibe uxhumano oluqondile, olune-impedance ephansi nereferensi yomhlaba ye-transmitter IC. Noma yikuphi ukungenisa umoya endleleni yokubuyisa kunezela ekuphepheni kokushayela i-laser okusebenzayo futhi kunciphisa umkhawulokudonsa wokuguquguquka. Sebenzisa i-polygon yethusi eqinile ngqo ngaphansi komshayeli we-laser, eboshwe endizeni yomhlaba ngokusebenzisa ama-via amaningi, kunokuba kube umkhondo womhlaba oqondiswe ngendlela ethile.

Thola Indlela kanye ne-Photodetector Front End

Indlela yokwamukela iqala kuma-RD± pin ekheji le-SFP (noma ugesi we-ROSA) bese iphela ekufakweni komehluko we-FPGA SerDes RX. Uchungechunge lwesignali luyi: i-photodetector → i-TIA (i-transimpedance amplifier, ngaphakathi kwe-module) → i-limiting amplifier → i-CDR → i-FPGA input. Kuma-architecture e-SFP axhumekayo, i-TIA kanye ne-limiting amplifier kungaphakathi kwe-module futhi umklami udinga kuphela ukunikeza indlela ehlanzekile yokuhlukanisa ehlanganiswe ne-AC eya ku-FPGA. Kuma-design asekelwe ku-ROSA, i-TIA ingaba yingxenye yangaphandle ku-PCB.

Ukuzwela kwesamukeli semojuli ejwayelekile ye-SFP kungu-−22 dBm okungenani. Ku-10G (SFP+), −9.9 dBm kuyinto evamile kuma-SR optics. Isabelomali samandla okukhanya — amandla okudlulisa ngaphandle kokulahlekelwa yi-optical (i-fiber, izixhumi, ama-splices) ngaphandle kokuzwela okuncane kokwamukela — yi-link margin. Ekusetshenzisweni kwe-tether engu-1 km enokulahlekelwa yi-fiber engu-0.4 dB/km kanye nezixhumi ezimbili ku-0.3 dB ngayinye, ukulahlekelwa okuphelele kwe-optical kungaphansi kuka-2 dB — ngaphakathi kwesabelomali se-12+ dB sama-optical ajwayelekile e-SFP+.

Ukuhlelwa kwe-PCB yendlela yokwamukela kumele kunciphise ukugoba okuhlukile kanye nokulayisha okunamandla kuma-trace e-RD±. Noma yikuphi ukungalingani phakathi kwama-trace e-P kanye ne-N kuhumusha ukugoba kwesikhathi kokufakwayo kwe-FPGA, okwehlisa ukuvulwa kwamehlo. Gwema ukubeka ama-via noma izinguquko ze-topology komunye umkhondo wamabili ngaphandle koshintsho olufanayo komunye. I-CDR kuma-FPGA SerDes ingabekezelela ukujikijela okuthile, kodwa hhayi okungenamkhawulo - ungqimba olungokoqobo kumele lulethe izimpawu ezihlanzekile ukugcina i-CDR ikhiyiwe kulo lonke ibanga lokushisa lokusebenza.

Ukuqapha Ukuxilongwa kwe-DDM

Amamojula e-SFP/SFP+ asebenzisa i-Digital Diagnostics Monitoring (DDM, ebizwa nangokuthi i-Digital Optical Monitoring noma i-DOM) ngokwe-SFF-8472. I-interface ye-I2C ekhelini elingu-0x51 inikeza ukufundwa kwesikhathi sangempela kwalokhu: amandla okudlulisa nge-laser (dBm), amandla okukhanya atholiwe (dBm), ugesi we-laser bias (mA), izinga lokushisa le-module (°C), kanye ne-voltage yokunikezela (V). Ipharamitha ngayinye ine-alamu elungisekayo yesofthiwe kanye nemingcele yesixwayiso.

Idatha ye-DDM ayisebenzi nje kuphela ekuxilongweni kwensimu - ivumela ukulungiswa kokubikezela. Ukwanda kokukhishwa kwe-laser ngenkathi amandla okudlulisa ehlala eqinile kubonisa ukuguga kwe-laser (umshayeli unxephezela ukusebenza kahle okunciphile). Ukwehla kwamandla okukhanya atholakele ngamandla okudlulisa azinzile kubonisa ukonakala kwefayibha noma isixhumi. Ukulandelela lezi zitayela ngokuhamba kwamahora okundiza kuvumela opharetha ukuthi bahlele ukulungiswa ngaphambi kokuba isixhumanisi esingaphansi sibe isixhumanisi esihlulekile.

Ibhasi le-I2C le-DDM kumele liqondiswe ngokucophelela. Amaphini e-I2C ekheji le-SFP+ aku-3.3 V logic. Uma i-FPGA noma i-microcontroller I2C iku-voltage ehlukile, kudingeka ukuhumusha kwezinga. Ibhasi kufanele libe nama-resistors okudonsa phezulu ku-3.3 V (ngokuvamile i-4.7 kΩ) futhi akufanele labelane ngebhasi le-I2C namanye amadivayisi angaletha amaphutha abangela ukuthi imojuli ingalungiseki kahle. I-counterpart yokuqapha ohlangothini lomhlaba isebenza ku- PCB ye-fiber optic canister , okuvumela ukubonakala kwempilo yesixhumanisi kusukela ekugcineni kuya ekugcineni kusukela emaphethelweni womabili ngesikhathi esisodwa.

Ukuhlela I-Layer Stack kanye ne-Impedance

I-stack enezingqimba eziyisithupha iwubuncane bebhodi lesixhumanisi sedatha ye-optical engu-10 Gbps enobuqotho obanele besignali kanye nokusatshalaliswa kwamandla. I-stack enezingqimba ezingu-8 ikhethwa kakhulu kumadizayini ane-BGA routing eningi, izizinda zamandla amaningi, noma i-analog kanye ne-digital circuitry ezitholakala ndawonye.

Isabelo esijwayelekile sezingqimba ezi-6: Isendlalelo 1 — izingxenye eziphezulu kanye nezibonakaliso ze-microstrip; Isendlalelo 2 — indiza yokubhekisela emhlabathini; Isendlalelo 3 — amabhangqa e-stripline asheshayo (i-FPGA kuya ku-SFP cage); Isendlalelo 4 — izindiza zamandla; Isendlalelo 5 — umhlaba; Isendlalelo 6 — izingxenye ezingezansi kanye nezibonakaliso zesibili. Izindiza ezimbili zomhlaba (L2 kanye ne-L5) zinikeza izindlela zokubuya zezibonakaliso zesivinini esiphezulu ku-L3 futhi zivikela ukusatshalaliswa kwamandla ku-L4 ekukhanyeni phezulu ezingqimbeni zesignali.

Kumiklamo edinga impedance elawulwayo , umenzi kumele azi ukungaguquguquki kwe-dielectric kanye nobukhulu bepheya ngalinye le-prepreg/core, impedance eqondiwe yesendlalelo ngasinye, kanye nokubekezelelana (±10% kwezicelo eziningi ze-optical link, ±5% kwezicelo ezidinga kakhulu). Ukuhlolwa kwe-TDR kwamabhodi okukhiqiza kuqinisekisa impedance yangempela ngokumelene nezinhloso zomklamo. Ukucacisa impedance elawulwayo kumanothi okukhiqiza - hhayi nje ukudweba imikhondo ebubanzini obubalwe - kuyadingeka ekukhiqizeni okuqhubekayo.

Ukukhethwa kwezinto ezidlula i-FR-4 ejwayelekile kuba yinto efanele ku-10 Gbps nangaphezulu. I-FR-4 (Dk ~4.2–4.5 ku-1 GHz, ekhuphuka ngemvamisa ephansi) iletha ukubambezeleka okuncike emvamisa okwehlisa amazinga onqenqema ekugijimeni okude. Emigijimweni yebhodi ende kune-100 mm ku-10 Gbps, izinto ezilahlekelwa kancane njenge- Isola 370HR noma i-Panasonic Megtron 6 zinciphisa ukulahlekelwa kokufakwa. Ku-25 Gbps, izinto ezilahlekelwa kancane ziyadingeka, hhayi ngokuzithandela.

Ukuphathwa Okushisayo

Amamojula e-SFP ahlakazeka phakathi kuka-0.5–1.5 W kuye ngohlobo kanye nesilinganiso sedatha. Amamojula e-SFP+ ahlakazeka afinyelela ku-2.5 W. Endlini ye-UAV evalekile enomoya olinganiselwe, lokhu kushisa kumele kuqhutshwe ku-PCB bese kufinyelele kufreyimu yomoya kunokuba kuncike ekushintsheni komoya.

Ikheji le-SFP linikeza isikhombikubona sokushisa ngokusebenzisa indawo yalo ephezulu uma lenzelwe lona — into ehambisanayo yokuxhumana kokushisa (i-TIM) phakathi kwesembozo sekheji kanye nendlu ye-UAV ihambisa ukushisa kwemodyuli ngqo ku-chassis. Isikhombikubona sekheji kuya ku-PCB sisebenzisa ama-via okushisa: ububanzi bokubhoboza obungu-0.3 mm, iphimbo elingu-1 mm, elihlelwe kugridi ngaphansi konyawo lwekheji. Ama-copper thermal ethululwayo angaphakathi aqoqa ukushisa okuvela kuma-via bese ekusakaza eceleni ngaphambi kokuba kufinyelele emaphethelweni ebhodi noma amaphuzu okufaka i-chassis.

Kumadivayisi e-TOSA/ROSA afakwe i-solder, indawo encane igxila ekushabalaleni kokushisa endaweni encane, okwandisa ukumelana nokushisa kwendawo. I-via array ngaphansi kwe-optics efakwe i-solder idinga i-pitch eqinile (0.6 mm) kanye nama-copper pad amakhulu ukuze kulungiswe. Izinga lokushisa lokuhlangana kumele liqinisekiswe ngokuhambisana nencazelo ephezulu yedivayisi kulo lonke uhla lokushisa lokusebenza - inhlanganisela yokushisa okuzungezile ezingeni lolwandle kanye nokuzifudumeza kungasondela emikhawulweni ngokushesha kunalokho umklami akulindele.

Ukulingisa ukushisa kufanelekile kuleli bhodi: imodeli yokushisa ye-2D ebonisa ukusatshalaliswa kokushisa kulo lonke ibhodi ngaphansi kokusatshalaliswa okuphezulu ekushiseni okuphezulu kwe-ambient kuthatha amahora ambalwa futhi kungavimbela ukubuyela ekuhleleni sekwephuzile ohlelweni. Isigaba sokuklama se-PCB yisikhathi esifanele sokuthola izinkinga zokushisa, hhayi ngesikhathi sokuhlolwa kwezimfanelo zemvelo.

Ukukhiqiza, Ukuhlanganisa, Nokuhlola

Impedance elawulwayo ngokuqinisekiswa kwe-TDR iyisidingo sokwenziwa esiyimpoqo samabhodi esixhumanisi sedatha ye-optical ku-10 Gbps. Umenzi ulinganisa i-trace impedance yangempela kumakhuphoni avela kuphaneli ngayinye futhi unikeza imibhalo - hhayi nje isitatimende sokuthi i-impedance elawulwayo yazanywa. Ukubekezelelana okuhlanganisiwe ku-FR-4: ±10% kungenzeka; ±5% idinga izinto zekhwalithi ephezulu kanye nokulawulwa kwenqubo okuqinile.

Ukuhlanganiswa kwe-BGA kwamadivayisi e-FPGA kudinga:

• Ukuphrinta kwe-solder paste ngesilinganiso sokuvuleka kwe-stencil esifanele i-pitch — ngokuvamile i-pitch engu-0.8 mm i-BGA isebenzisa ububanzi bokuvuleka okungu-0.45 mm ku-stencil engu-0.15 mm
• Iphrofayili yokugeleza kabusha ifanelana nencazelo yomhlinzeki we-BGA — ngokuvamile i-ramp-to-soak ku-150–170 °C ilandelwe ukucwilisa bese i-ramp ifinyelela esicongweni ku-240–250 °C.
• Ukuhlolwa kwe-X-ray kwawo wonke amalunga e-BGA ukuqinisekisa ukugeleza kabusha nokubona ukuvalwa noma izikhala
• I-microscopy ye-acoustic yezinhlelo zokusebenza ze-Class 3 ukuthola ukungasebenzi kahle kwe-subsurface

Ukuhlanganiswa kwekheji le-SFP kudinga ukuhlola ukulingana kwekheji ngaphambi kokugeleza kabusha — ikheji elizamazama kwi-PCB ngeke lihlanganise zonke izikhonkwane zomhlabathi ngokuthembekile futhi lizoletha ukuzwakala kwe-resonance ku-gasket ye-EMI. Iziqeshana zokugcina ikheji kumele zibandakanye imodyuli ngamandla acacisiwe okufaka nokukhipha; amakheji agugile ekuphathweni ngesikhathi sokukhulisa kufanele ashintshwe ngaphambi kokuhlanganiswa kokugcina.

Ukuhlolwa okusebenzayo kwebhodi lesixhumanisi sedatha ye-optical: xhuma i-fiber loopback (ukuphuma kwe-TX → i-attenuator isethwe ukuze ilingise isabelomali sesixhumanisi → okokufaka kwe-RX), sebenzisa iphethini ye-PRBS ngesivinini somugqa, bese ulinganisa i-BER ngaphezu kwesikhawu esivumelekile ngokwezibalo. I-BER engaphansi kuka-1×10⁻¹² enokunciphisa okwengeziwe okungu-3 dB ngale kwesabelomali sesixhumanisi iqinisekisa imajini eyanele. I-Highleap inikeza ukwenziwa kwe-impedance okulawulwayo kanye nokuhlanganiswa kokunemba kwamabhodi esixhumanisi sedatha ye-optical anokulandelela okugcwele kwemibhalo.

Izinhlobo Zokuklama Eziqondene Nepulatifomu

I-tether yokuqapha yezentengiselwano: I-SFP+ ku-10 Gbps, ingaxhunywa ukuze isetshenziswe ensimini, i-FR-4 ejwayelekile enomshini wokubhoboza ngemuva, i-stack enezingqimba ezi-6, ukuqapha kwe-DDM nge-microcontroller. Ibhodi lesifunda le-drone le-fiber optic kulesi sigaba likhonzwa kahle yi-SFP+ optics ezithengiswayo ezingaphandle kweshelufu ezine-cage assemblies ezijwayelekile.

Ipulatifomu esebenzisekayo eqondiswa yi-fiber: I-TOSA/ROSA efakwe i-solder, i-qualification yokuthembeka kokusetshenziswa kanye (ukuhlolwa kokusebenza kanye nokushiswa, akukho ukugqoka okufana nokwangempela okudingekayo), inani lezingqimba ezilungiselelwe izindleko. I- PCB yokulawula i-UAV eqondiswa yi-fiber idinga ibhodi lokuxhumanisa idatha ye-optical ukuthi isebenze ngokuthembekile kusukela ekuqaleni kuya ekupheleni komsebenzi - ngokuvamile imizuzu engama-30-90 - ngaphandle kokuqapha okuqhubekayo kokuxilonga okudingekayo kumapulatifomu angasetshenziswa kabusha.

Ipulatifomu ye-ISR yokuzivikela: I-substrate ye-Polyimide, i-IPC Class 3 assembly, i-conformal coating, i-MIL-STD-810 environmental qualification, i-transceiver engase ibe ngokwezifiso yokuzimela kwe-supply chain. Izidingo ezinemininingwane zalesi sigaba zisemongweni we -PCB we-fiber drone yezempi.

Ukugijima/ukusondela kwe-FPV: 1 Gbps I-SFP eyanele, ukubekwa phambili komklamo okulula, i-tether emfushane isho isabelomali sokulahlekelwa okubonakalayo esiphansi esivumela ukusetshenziswa kwe-fiber ye-multimode kanye nama-transceivers e-VCSEL angu-850 nm (izindleko eziphansi, amandla aphezulu, ukuzwela okuncane kwe-wavelength). I -PCB ye-fiber optic FPV drone imelela ifilosofi yokuklama yalesi sigaba.

Kuzo zonke izinhlobo, ibhodi lesixhumanisi sedatha ye-optical lisebenzisana ne- fiber optic tether spool PCB ngekhebula le-tether — ukucindezeleka kanye nokuphathwa kokusabalalisa kwebhodi le-spool kuthinta ngqo ubuqotho befayibha ngakho-ke isabelomali samandla e-optical ibhodi lesixhumanisi sedatha okumele lisivumelane naso.

Imibuzo Evame Ukubuzwa

Yimaphi amazinga edatha ajwayelekile ezinhlelweni zamanje ze-UAV fiber tether?
Izinhlelo zezentengiselwano ezisetshenzisiwe zivame ukusebenzisa i-1 Gbps (SFP) noma i-10 Gbps (SFP+). Ama-drone okuqapha amakhamera amaningi e-4K athwala imifudlana eminingi engacindezelwanga adinga ubuncane be-10 Gbps. Izinhlelo ezithuthukisiwe ziya ku-25 Gbps ngomzila ngamunye kusetshenziswa i-QSFP28 noma izixhumi ze-VCSEL-array ezenziwe ngokwezifiso. Izinhlelo ezindala ezixhunywe nge-tethered zisebenzise i-100–400 Mbps; iningi lemiklamo emisha liyawaqa la mazinga likhetha amazinga e-1G noma e-10G anezindawo zemvelo ezitholakalayo.

Ingabe ibhodi lingakwazi ukusingatha ukusakazwa kwevidiyo okuningi ngasikhathi sinye?
Yes — the FPGA multiplexes streams into the optical channel. Three 1080p60 uncompressed streams require approximately 9 Gbps, fitting within a 10 Gbps link with margin. Three 4K30 streams require compression or a move to 25 Gbps. The FPGA’s role in stream aggregation is separate from the optical data link board’s physical layer function, but the FPGA and i-optical transceiver share the same board and their layout interacts.

Yini enquma ubude obukhulu be-tether yomklamo webhodi elithile?
Isabelomali sesixhumanisi sokubona: amandla okudlulisa (i-SFP+ −1 kuya ku-+3 dBm) ukulahlekelwa kwesixhumi (0.3–0.5 dB ngayinye) ukulahlekelwa kwefayibha (0.35 dB/km ku-1310 nm) ukuzwela kokuthola (−9.9 dBm okuvamile ku-SFP+ SR, −20 dBm ku-LR). I-1310 nm LR SFP+ ene-−3 dBm yokudlulisa kanye ne-−20 dBm yokwamukela iveza isabelomali se-17 dB — esekela ukulahlekelwa kwefayibha okungaphezu kwamakhilomitha angu-40, okungaphezu kakhulu kwanoma yikuphi ukusetshenziswa kwe-tether okusebenzayo. Imikhawulo eminingi yobude be-tether iwumshini (isisindo sefayibha kanye nomthamo we-spool), hhayi optical.

Ukudlidliza kuyithinta kanjani i-optical interface?
Amakheji e-SFP axhunywayo azwela ekudlidlizeni ngezindlela ezimbili: imoduli ingasebenza ngokukhululekile ekhejini uma i-retention latch ingaxhunywanga kahle, futhi amajoyinti e-cage-to-PCB solder angakhathala ngaphansi kokudlidliza isikhathi eside. Amakheji anesilinganiso sendiza abhekana nakho kokubili: anezindlela zokugcina eziqinile kanye nama-array aqinile omhlaba. Ngemiklamo ezobhekana nokuhlolwa okukhulu kokudlidliza, kufanelekile ukucacisa amakheji anesilinganiso sendiza ku-BOM kunemihlangano ejwayelekile yamakheji ezentengiselwano.

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