Ukukhiqiza i-PCB ye-Fiber Yezempi Yezinga Lokuzivikela

Izinhlelo ze-UAV zempi zibeka umkhawulo wezidingo zomklamo we-PCB we-fiber optic drone. Amabhodi kumele asinde ezindaweni lapho imiklamo yezentengiselwano ingakaze ihlangane nazo: −55 °C kuya ku-+125 °C ububanzi bokusebenza, ukudlidliza kufike ku-20 g ku-20-2000 Hz sweep, ukushaqeka okungu-40 g kusukela ekuqalisweni, inkungu kasawoti, ukuchayeka ku-fungus, ukugwinya isihlabathi nothuli, kanye nokuphakama kusuka ezingeni lolwandle kuya ngaphezu kwamamitha angu-15,000. Kumelwe agcine ukuxhumana okuphephile, okungabonakali ezindaweni ze-electromagnetic ezenzelwe ukunqoba izixhumanisi ezisekelwe kumsakazo. Futhi kumele enze konke lokhu ngokuqeqeshwa kochungechunge lokuhlinzeka, ukulandelelwa kwamadokhumenti, kanye nokuqina kokuhlola okudingwa ukuthenga ukuzivikela.

Ukuqonda ukuthi yini ngempela edingwa yizindinganiso zempi — ngokungafani nalokho okucatshangwa ukuthi kusho ukuthini ngezinye izikhathi — kubalulekile kunoma yimuphi unjiniyela oklama lolu hlelo lokusebenza. Izindinganiso zicacile mayelana nezindlela zokuhlola, izindlela zokwamukela, kanye nemibhalo. Ukuhlangabezana nazo akuyona into ongayikhetha ezinhlelweni ezinezinkontileka zokuzivikela; ukuzilinganisa akufani.

Thola Isilinganiso se-PCB se-Military Fiber Drone

Kungani Ama-UAV Ezempi Akhetha I-Fiber Kune-RF Eqinisiwe

Inzuzo ye-bandwidth ye-fiber iyisisusa esengeziwe kwezinye izinhlelo: i-fiber yemodi eyodwa ku-1310 nm ithwala i-10 Gbps ku-strand enesisindo esingu-5 g/m, uma kuqhathaniswa nobunzima nesisindo sezinhlelo ze-RF ezifinyelela ngisho ne-1 Gbps ngaphezu kwezixhumanisi zomugqa wokubona. Kumapulatifomu athwala amakhamera amaningi e-EO/IR kanye nemithwalo yokukhokha ye-SAR noma ye-SIGINT, i-bandwidth ye-fiber ivumela ukuhlanganiswa kwenzwa esiteshini saphansi lapho izixhumanisi ze-RF zingenakukusekela.

Izindinganiso Ezisebenzayo: Lokho Okudingwa Yilowo Nalowo Ngempela

I-IPC Class 3A (isijobelelo "A" sesikhala kanye nezinhlelo zokusebenza zempi) senezela izidingo ngale kwe-Class 3: ubuncane bethusi obuyi-1 oz (35 µm) kuzo zonke izendlalelo kufaka phakathi izendlalelo zangaphakathi, ukuhlukaniswa kwamakhuphoni avela kuwo wonke amaphaneli okukhiqiza, kanye nemibhalo eyengeziwe elandelela ibhodi ngalinye endaweni yalo yokukhiqiza.

Izinto zokwakha: I-Substrate, i-Copper, kanye ne-Surface Finish

I-FR-4 ejwayelekile (Tg 130–140 °C) ayanele ebangeni lokusebenza eliphakathi kuka-−55 no-+125 °C elidingwa yi-MIL-STD-810. Izinga lokushisa lokushintsha kwengilazi le-substrate kumele lidlule izinga lokushisa lokusebenza eliphezulu nge-margin — i-high-Tg FR-4 (Tg 170–175 °C, ngokwencazelo ye-Isola 370HR ) iyinto encane kakhulu yezinhlelo zokusebenza eziningi zokuzivikela. I-Polyimide substrate (Tg 250 °C+) ikhethwa lapho ububanzi bokushisa buphezulu kakhulu noma lapho uhlelo ludinga ukuhambisana nokuhlolwa kwe-MIL-PRF-31032 Group A okuhlanganisa ukujikeleza kokushisa kuya ku-−65 °C.

Isisindo sethusi: I-IPC Class 3 idinga okungenani u-1 oz (35 µm) ezingqimbeni zangaphandle. Izingqimba zangaphakathi kufanele zifane ukuze kufane ukushisa futhi kugwenywe ukucindezeleka kwe-CTE okuhlukile ngesikhathi sokujikeleza kokushisa. Ithusi elisindayo (2 oz noma 3 oz) lisetshenziselwa ukusatshalaliswa kwamandla ezingxenyeni zokulawula izimoto kanye nokusabalala kokushisa ngaphansi kwezingxenye zokusatshalaliswa okuphezulu.

Ukuphela kobuso: Igolide Elicwiliswayo Le-Nickel Elingenagesi (ENIG) nge-IPC-4552 lijwayelekile — igolide elingu-3–6 µin ngaphezu kwe-nickel engu-120–240 µin. Igolide livikela i-nickel ekungcolisweni ngesikhathi sokugcina; i-nickel inikeza indawo yokunamathisela. I-ENIG iyahambisana nokusonta okungenalo i-lead kanye ne-tin-lead (i-tin-lead isavunyelwe kwizicelo zempi ze-Class 3 lapho i-DoD inikeze khona ukukhululwa kwi-RoHS). Igolide eliqinile (i-electrolytic, 30+ µin) lisetshenziswa ezixhumini ezinqenqemeni ezingaphansi kokufakwa okuphindaphindiwe. Isiliva elicwiliswayo liyagwenywa kwizicelo zokugcina isikhathi eside ngenxa yengozi yokufuduka kwesiliva ezindaweni ezinomswakama.

Ngezidingo zobuqotho besignali zezingxenye zesixhumanisi sedatha ye-optical ye-10 Gbps, izinto zokulahlekelwa okuncane ( Megtron 6 , Isola I-Tera MT40 ) zinciphisa ukulahlekelwa kokufakwa ekugijimeni okude okulandelanayo. Izidingo zokushisa kwezempi kanye nezidingo zobuqotho besignali zibeka imininingwane ehlanganisiwe yezinto ezibonakalayo esusa i-FR-4 ejwayelekile futhi ikhomba esigabeni se-laminate esine-Tg ephezulu, esilahlekelwa kancane.

Izilawuli Zenqubo Yokukhiqiza

Ukukhiqizwa kwe-IPC Class 3 kudinga ukulawulwa kwenqubo okubhaliwe kuzo zonke izinyathelo. Umenzi kumele abonise ikhono lenqubo (Cpk) lokubhaliswa kwemigodi, ukujiya kodonga olungena ngembobo, ukuvinjelwa, kanye nobukhulu bokuqedwa kobuso. Ukuhlolwa kwesihloko sokuqala (i-FAI) ngokwe-AS9102 kuqinisekisa ukuthi ibhodi lokuqala lokukhiqiza lihambisana nenhloso yokuklama ngaphambi kokukhishwa kwenqwaba.

Ukuhlolwa kokunamathisela i-Solder (SPI) ngemva kokuphrinta, ukuhlolwa okuzenzakalelayo kwe-optical (AOI) ngemva kokugeleza kabusha, kanye nokuhlolwa kwe-X-ray kwazo zonke izingxenye ze-BGA kanye neziqediwe phansi kuyimpoqo, akuyona into ongayikhetha. Ama-algorithm e-AOI kumele alungiswe ebhodini elithile — ukubiza okungamanga akwamukeleki ngoba kudala ukuhlolwa ngesandla okudala izingozi zekhwalithi. I-X-ray kumele yenziwe ngabaqhubi abaqeqeshwe besebenzisa imishini elinganisiwe; ukuhumusha isithombe kwamaphutha ekhanda elise-callow (HiP) kanye namaphutha angavulwanga (NWO) kudinga ulwazi olunganikezwa ukuhlolwa kwe-X-ray okuvamile.

Ukuhlukanisa izingxenye ezincane: amakhuphoni okukhiqiza avela kuphaneli ngayinye ahlukaniswa, apholishwe, futhi ahlolwe ngaphansi kokukhulisa. Ubukhulu bodonga lwembobo ehlanganisiwe, ukumbozwa kwamadolo, ubukhulu be-dielectric, kanye nokubhaliswa kuyalinganiswa futhi kubhalwe phansi. Noma yiliphi ikhuphoni elingaphumeleli ezindinganisweni zokwamukelwa ze-IPC Class 3 libangela ukuthi lonke iphaneli livalelwe lilinde ukususwa.

Izinqubo zokuthobela imithetho ye-IPC ye-Highleap kanye nokuqinisekisa ikhwalithi zisekela ukukhiqizwa kwe-Class 3 ngamaphakheji aphelele emibhalo.

I-Conformal Coating kanye ne-Ecapsulation

Ukugqoka okuhlanganisiwe kuyimpoqo kumabhodi ezempi asebenza endaweni enomswakama, inkungu kasawoti, kanye nezindawo zokuminyana. Ukugqoka kufaka phakathi amalunga e-solder kanye nemizimba yezingxenye, kuvimbele ukungena komswakama, ukungcola, kanye nokuvuza kobuso be-ionic okungabangela ukwehluleka ngezikhathi ezithile.

Izinhlobo zokumboza zezinhlelo zokusebenza zokuzivikela:

• I-Acrylic (AR): Kulula kakhulu ukukulungisa kabusha, ukumelana kahle nomswakama, ukumelana namakhemikhali okulinganiselwe. Kufanelekela amabhodi afakwe ezindlini ezivalekile.
• I-Polyurethane (UR): ukumelana kwamakhemikhali okungcono kune-acrylic, ubunzima bokulungisa kabusha obumaphakathi. Ukukhetha okuvamile kokusetshenziswa kwezempi okujwayelekile.
• I-Silicone (SR): ububanzi obukhulu kakhulu bokushisa (−65 kuya ku-+200 °C), ukumelana nokudlidliza okuguquguqukayo, okuhle kakhulu. Kuyadingeka ezindaweni ezishisayo ezidinga kakhulu. Ukulungisa kabusha kunzima — kudinga ukuhlanzwa kwesinyibilikisi esingahlasela izinto eziseduze.
• I-Parylene (XY): ibekwe nge-vapor, ayinazimbobo, incane (12–50 µm), isembozo esihle kakhulu sejometri eziyinkimbinkimbi. Ayikwazi ukuphinde isetshenziswe ngaphandle kwemishini ekhethekile. Ikhethelwe amabhodi lapho ukulungiswa kabusha kungalindelekile noma kungamukeleki.

Ukusetshenziswa kwengubo yokumboza kumele kufake imaski ezixhumi, izindawo zokuhlola, kanye nezingxenye ezine-interface yokushisa. Ikhwalithi yengubo yokumboza ithinta ukuthembeka: izindawo ezimbozwe ngemaski ezingcolisa oxhumana nabo bezixhumi zibangela ukuxhumana okungenazikhawu; izindawo ezimbozwe ngemaski zishiya indawo yebhodi engavikelekile. Kuma-assembly ambozwe nge-conformal, izindlela zokwamukelwa ze-IPC-A-610 Class 3 zidinga ukumbozwa okufanayo okungenamabhamuza, ukuhlukanisa, noma ukugijima okungabamba umswakama.

Isicelo Sezikhali Zokuzulazula

Izibhamu ezizulazulayo (ama-LM) zimele uhlangothi oluqondiswa yi-fiber lomndeni wezempi we-UAV: amapulatifomu asebenzisekayo andiza umsebenzi futhi angatholakali. Izidingo ze-PCB zama-LM zihlukile kuma-drone e-ISR angasetshenziswa kabusha ngezindlela eziningana ezithinta izinqumo zokuklama nezokukhiqiza.

Imodeli yokuthembeka komsebenzi owodwa: ibhodi kumele lisebenze kahle isikhathi somsebenzi (ngokuvamile imizuzu engama-30-120) ngaphandle kokwehluleka. Akudingeki ukuthi lisinde emisebenzini eminingi noma liphumelele ukuhlolwa kokuphila emahoreni ayi-1000+. Lokhu kushintsha isu lokufaneleka kusukela ekuhlolweni kokuphila liye ekuhlolweni kokuthembeka komsebenzi: ukuhlolwa kwemvelo kumayunithi ayi-100%, ukuhlolwa kokusebenza ngaphambi nangemva kokuhlolwa, kanye nokushiswa ekushiseni okuphezulu (ngokuvamile emahoreni angama-48-72 kuma-85 °C) ukuze kuqedwe ukwehluleka kokuphila kwangaphambi kokubeletha ngaphambi kokufaka i-field.

Ukusinda kwesitoreji: Ama-LM angagcinwa iminyaka ngaphambi kokusetshenziswa. I-PCB kumele isinde endaweni yokugcina (ukujikeleza kwezinga lokushisa ezitsheni ezivaliwe, ukushintshashintsha komswakama, ukushaqeka ngezikhathi ezithile ngenxa yokuphathwa) bese isebenza kahle ekuvuseleleni kokuqala ngemva kokugcina. Izingxenye ezinesikhathi esilinganiselwe seshelufu (ama-capacitor e-electrolytic, amabhethri) zidinga ukunakwa ekuphathweni kwesimo sesitoreji kanye nokufakwa kabusha ngezikhathi ezithile.

I-PCB yesiqondiso sezibhamu ezizulazulayo ichazwe kabanzi kumongo we-PCB yokulawula i-UAV eqondiswa yi-fiber , ehlanganisa ukubambezeleka komyalo, ukuphepha okuhlulekile, kanye nezidingo zokuqapha ezinikezwayo eziqondene namapulatifomu angasetshenziswa.

Isicelo Seplatifomu Ye-ISR Yobuhlakani

Amapulatifomu e-ISR angasetshenziswa kabusha amelela ukuphela okufunwa kakhulu kwesikhala sokuklama i-PCB ye-drone ye-fiber yezempi: amabhodi kumele asinde amakhulu amahora okundiza kulo lonke uhla lwemvelo, alondoloze ukusebenza njengoba izingxenye zikhula, futhi asekele ukulungiswa okuhleliwe okuhlanganisa izibuyekezo ze-firmware kanye nokuxilongwa.

Isikhathi sokuklama: Amahora okundiza angu-500–2000 ajwayelekile kumapulatifomu e-ISR okuzivikela. I-PCB kumele iklanywe futhi ifanelekele lesi sibalo sokuphila ngokunciphisa okufanele. Izindlela ezibalulekile zokunciphisa impilo: ukukhathala kwamalunga e-solder okuvela ekujikelezeni kokushisa (ukuhamba ngakunye kuwumjikelezo wokushisa), ukuguguleka kwesixhumi okuvela ekuhlanganeni okuphindaphindiwe, ukuguga kwe-capacitor (umthamo we-electrolytic uyancipha ngokuhamba kwesikhathi, ukwanda kwe-voltage ye-ripple ezimpahleni zamandla), kanye nokuguga kwe-laser ye-transceiver ye-optical (ukuhamba kwamanje komkhawulo kanye nokusebenza kahle kwe-slope ngamahora okusebenza).

Ingqalasizinda yokubopha yamapulatifomu angasetshenziswa kabusha — i-spool PCB , i-ground station canister electronics , kanye nebhodi lokuxhumanisa idatha ye-optical — kumele ifane nekilasi lokuthembeka lebhodi lokuxhumana. Ibhodi lokuxhumana le-Class 3 elixhunywe ebhodini le-spool le-Class 2 lidala isixhumanisi esibuthakathaka ku-spool esilimaza ukutshalwa kwezimali ebhodini lokuxhumana.

Ukuxilongwa Kwangaphakathi: amapulatifomu ezempi angasetshenziswa kabusha azuza kukhono lokuhlola okwakhelwe ngaphakathi (i-BIT) — izindlela zokuzihlola ezisebenza ngokuvula amandla nangokuqhubekayo ngesikhathi sokusebenza, zibika impilo yesistimu kubasebenzi bokulungisa. Idatha ye-BIT iqhuba ukuhlela ukulungiswa kokubikezela, ivumela ukushintshwa kwengxenye ngaphambi kokwehluleka kunokuba ngemva kwalokho. Idatha ye-optical DDM evela ku-transceiver (amandla okudlulisa, amandla okwamukela, ukuthambekela kwe-laser) iwukufaka okuyinhloko kwe-BIT — izitayela kulezi zinhlaka zibikezela impilo ye-fiber kanye ne-transceiver izinyanga ngaphambi kokwehluleka.

I-Boot Evikelekile kanye Nomklamo Ongaphazamisi

Izinhlelo zokuvikela ezisingatha idatha yomsebenzi ohlukanisiwe noma ama-algorithm okusebenza zidinga ukuvikelwa ekuguqulweni kwe-firmware okungagunyaziwe, ukukhishwa kwedatha, kanye nobunjiniyela obubuyela emuva. Umklamo we-PCB usebenzisa izendlalelo eziningi zokuvikela:

Isici esivikelekile: Imojuli yokuphepha yehadiwe (i-HSM) noma imojuli yesikhulumi esithembekile (i-TPM) igcina okhiye be-cryptographic kwimemori engaguquki engabonakali. Okhiye bakhiqizwa kudivayisi futhi abakaze badluliselwe ngombhalo ocacile. Isici esivikelekile senza imisebenzi yokuqinisekisa kanye nokukhishwa kokhiye ngaphandle kokuveza izinto ezibalulekile esikhaleni sememori yeprosesa eyinhloko.

Uchungechunge lwe-boot oluqinisekisiwe: I-boot ROM (ku-mask ROM, engaguquki) iqinisekisa isiginesha ye-bootloader yesigaba sokuqala isebenzisa ukhiye womphakathi ogcinwe ku-secure element. I-bootloader yesigaba sokuqala iqinisekisa isigaba sesibili; isigaba sesibili siqinisekisa i-firmware yohlelo lokusebenza. Noma yikuphi ukuphuka kuchungechunge kumisa i-boot futhi kubangele impendulo yokuphazamiseka. Lokhu kuvimbela umhlaseli ongashintsha imemori ye-flash ekusebenziseni ikhodi engagunyaziwe.

Ukushintshashintsha kwe-zero ekutholeni ukuphazamiseka: Izinzwa zokuphazamiseka ngokomzimba (i-accelerometer yokuthola ukuwa/umthelela, inzwa yokukhanya yokuvula ikesi, i-voltage monitor yokuphathwa kokunikezwa) zixhuma kokufakwayo kokuphazamiseka kwento evikelekile. Uma kwenzeka ukuphazamiseka, into evikelekile ibhala ngaphezulu okhiye be-cryptographic ngo-zero - umsebenzi uphela ngemizuzwana emincane, ngokushesha kunanoma yikuphi ukuhlasela kokukhishwa kokhiye okusebenzayo.

I-Anti-tamper mesh: Imikhondo emincane yokuhambisa umoya eqondiswa ezingqimbeni zangaphakathi ze-PCB ngephethini ehlanganisa izingxenye ezibucayi. Noma yikuphi ukubhoboza noma ukuhlukanisa okuzama ukufinyelela izingxenye ezingaphansi kwe-mesh kuphula umkhondo, okutholwa njengokwehluleka kokuqhubeka okubangela ukungabi khona kwe-zero. Iphethini ye-mesh kumele iqondiswe ukuze kuvinjelwe ukwakhiwa kabusha kusukela ekuhlukaniseni kwengqimba ngengqimba.

Izembozo ezivikelayo: Ukumboza nge-epoxy noma ukugqoka okuqinile okuqinile phezu kwezindawo ezibucayi kwenza ukufinyelela ngokomzimba ngokugaya noma ukupholisha kube nzima futhi kubhubhise kakhulu - noma yikuphi ukuhlasela okufinyelela ngempumelelo ku-silicon kulimaza izingxenye ezihlaselwayo.

Uchungechunge Lokunikezela Nokuvimbela Amanga

Izingxenye ze-elekthronikhi mbumbulu ziwusongo olubhalwe phansi ezinhlelweni zokuzivikela — izingxenye zezentengiselwano ezihlungiwe ezibhalwe kabusha njengezinga lezempi, izingxenye ezibuyiselwe emabhodini okusindisa, kanye nezingxenye ezenziwe ngokuphelele zonke zitholakale ezinhlotsheni zokunikezwa kwezokuvikela. Imiphumela isukela ekwehlulekeni kwensimu kusenesikhathi kuya kuma-trojan ehadiwe ngamabomu ezingxenyeni ezikhiqizwe yizitha.

I-SAE AS6171 inikeza izindlela zokuhlola zokuthola izingxenye ezisolwayo/ezingekho emthethweni. Izindlela ezibalulekile: I-X-ray fluorescence (XRF) ukuqinisekisa ukwakheka kwe-alloy yohlaka lwe-lead, ukuskena i-electron microscopy (SEM) ukuze kutholakale izimpawu zobuso kanye ne-topology yedayi, ukucaciswa kukagesi ngokumelene nemikhawulo yedatha yokuqala, kanye nokususwa kwe-capsulation ukuze kuhlolwe idayisi ebonakalayo. Akuzona zonke izingxenye ebhodini ngalinye ezidinga leli zinga lokuhlola — ukuhlolwa okusekelwe engcupheni kugxila kuma-IC aphezulu, izingxenye ezimakwe ngebanga lezempi, kanye nezingxenye ezitholwe ngaphandle kwenethiwekhi yabasabalalisi enikezwe ilungelo lobunikazi.

Ukuhambisana ne-DFARS (Defense Federal Acquisition Regulation Supplement): Izinkontileka zezokuvikela zase-US kumele zithole izingxenye ze-elekthronikhi kuphela kubakhiqizi bemishini yokuqala (ama-OEM), abasabalalisi abagunyaziwe, noma abasabalalisi abazimele abathobela izidingo zomthetho mbumbulu ze-AS6081. I-DFARS 252.246-7008 yenza lokhu kube yimfuneko yenkontileka, hhayi isincomo.

Ukulandeleka kwezingxenye: yonke ingxenye ebhodini lokuzivikela kufanele ilandelelwe kukhodi yayo yosuku, inombolo yengxenye, kanye nomthombo. Lokhu kwenza ukuthi kubuyiselwe futhi kuhlolwe okuqondiwe uma indawo yomgunyathi itholakala kuchungechunge lokuhlinzeka ngemva kokuba amabhodi efakiwe. Idatha yokulandeleka ibanjwa ekuhlanganisweni futhi igcinwe ohlelweni lokuphatha ukucushwa oluxhunywe enombolweni ye-serial yebhodi ngalinye.

Ukuhlolwa Kweziqu Zemvelo

Izindlela zokuhlola ze-MIL-STD-810H ezihambisana nama-PCB e-airborne fiber drone:

Indlela 501.7 (Izinga Lokushisa Eliphezulu): Ukuhlolwa kokusebenza ku-+71 °C (umkhawulo ophezulu wendiza), ukuhlolwa kwesitoreji ku-+85 °C. I-transceiver ebonakalayo kumele ihlangabezane nencazelo yayo ye-BER ekushiseni okuphezulu — umkhawulo wamanje we-laser kanye nokusebenza kahle kwe-slope kuncike ekushiseni, futhi ukunikezwa kwamandla ebhodi kumele kukhokhele.

Indlela 502.7 (Izinga Lokushisa Eliphansi): Isebenza ku-−40 °C, isitoreji ku-−55 °C. Ukuqala okubandayo kudinga ukunakwa: ama-capacitor e-electrolytic ane-ESR ephakeme ekushiseni okuphansi; ama-crystal oscillator kungenzeka angaqali ngokwethembeka ngaphansi kwe-−40 °C ngaphandle kwezakhi ze-heater; izembozo ezihambisanayo zingase ziqhekeke uma zisetshenziswa zijiyile kakhulu.

Indlela 514.8 (Ukudlidliza): Iphrofayili yokudlidliza okungahleliwe efanele indawo yokusebenza yesikhulumi. Kuma-UAV, iphrofayili efanele ifaka phakathi ukudlidliza okubangelwa ukuqhutshwa (ama-rotor harmonics, ukudlidliza kwemoto) kanye nokuxokozela. Ukuthembeka kwamalunga e-Solder kuyindaba eyinhloko — amaphakheji e-BGA kanye ne-QFP ngaphansi kokukhathala kokudlidliza — adinga ukugcwaliswa okwanele kwama-BGA amakhulu kanye nomklamo ofanele wezinyawo ukuze kusatshalaliswe ukucindezeleka kokudlidliza.

Indlela 516.8 (Ukushaqeka): Ama-pulse okushaqeka kwe-Half-sine ku-40 g, ubude be-11 ms (ukushaqeka okusebenzayo), kanye ne-sawtooth engu-75 g (ingozi yokushaqeka). Izixhumi, amakristalu, kanye nama-inductor yizona zinto ezisengozini kakhulu yokushaqeka. Isikhala sokuma kwebhodi lokufaka kumele sakhiwe ukuze kugwenywe ukuzwakala kwamaza okushaqeka.

Ukuhlolwa kweziqu kwenziwa kumayunithi okuthuthukiswa kobunjiniyela (ama-EDU) ngaphambi kokukhishwa komklamo. Izindawo zokukhiqiza ziqinisekiswa ngokuhlolwa kokwamukelwa kwamasampula ngokwezinga lokuhlolwa kwenkontileka (ngokuvamile i-S-2 nge-MIL-STD-1916 noma okulinganayo).

Imibuzo Evame Ukubuzwa

Ingabe yonke idrone yezempi idinga ukuxhumana kwefayibha?
Cha. Ama-drone amaningi ezempi asebenza ngezixhumanisi ze-RF eziqinile — ukugxuma-imvamisa, i-spread-spectrum, ama-waveform amelana ne-jam. I-Fiber ikhethwa ngenxa yezidingo ezithile zokusebenza: ukukhishwa kwe-RF okungu-zero kwe-LPD/LPI, ukungavikeleki kwe-jam ngokuphelele, noma i-bandwidth edlula ikhono le-RF elisebenzayo. Isinqumo senziwa yidokhumenti yezimfuneko zokuxhumana zepulatifomu, hhayi ngokuthanda okuvamile kwe-fiber kune-RF.

Ingabe amabhodi e-drone e-fiber ethengiswayo angashintshwa ukuze asetshenziswe empini?
Amabhodi ezentengiselwano angasebenza njengobufakazi bomqondo wokwenza i-prototyping kanye nokuqinisekiswa komqondo. Awakwazi ukufaka esikhundleni semiklamo yezinga lezempi ezinhlelweni zokukhiqiza. Umehluko awusiwo ubuhle — izinto ze-Tg, ukujiya kwethusi, ngokusebenzisa i-plating, umsebenzi wokuhlanganisa, ukuhlolwa kwezingxenye, kanye nokulandeleka kwamadokhumenti konke kuhluke kakhulu phakathi kokukhiqiza kwezentengiselwano kanye nezinga lezempi. Ukuzama ukudlula amabhodi ezentengiselwano ngokuhlolwa kweziqu zempi kuvame ukuholela ekuhlulekeni ekuhlolweni kwemvelo.

Isikhathi esingakanani sokukhiqiza i-PCB yezinga lezempi?
Ukwenziwa kwe-IPC Class 3 ngokuhambisana ne-MIL-PRF-31032 ngokuvamile kudinga amasonto angu-4-8, uma kuqhathaniswa namasonto angu-1-2 e-Class 2 yezohwebo. Isikhathi esengeziwe sibonisa ukuhlolwa kwamakhuphoni, ukuhlukaniswa kwezingxenye ezincane, kanye nokulungiswa kwamadokhumenti okungenziwa ekukhiqizweni kwezohwebo. Izinhlelo ezinesikhathi esiqinile kufanele zihlele lesi sikhathi sokuhola kusukela ekuqaleni kokukhishwa kokukhiqiza, hhayi kusukela ekunikezweni kwenkontileka.

I-Highleap izisekela kanjani izinhlelo zokuzivikela?
I-Highleap inikeza ukwenziwa kwezinga lokuzivikela ngezilawuli zenqubo ze-IPC Class 3 kanye inhlangano kuya ezindinganisweni ze-IPC-A-610 Class 3. Imibhalo ephelele yokulandelela, i-impedance elawulwayo enokuqinisekiswa kwe-TDR, i-conformal coating, kanye nokusekelwa kokuthola izingxenye kuyatholakala. i-PCB yezempi amakhono ahlanganisa izidingo zokwenziwa kanye nokuhlanganiswa ezichazwe kulesi sihloko.

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