Amathrendi Okupakisha Kwe-Semiconductor: Kusuka ku-PCB Yendabuko kuya kuma-Substrates Ashumekiwe

Isingeniso

Ukupakishwa kwe-semiconductor kuyaqhubeka nokuguqulwa okuyisisekelo njengoba ama-PCB ahlanganisiwe evala igebe phakathi kwamabhodi wesekethe aphrintiwe avamile kanye nokupakishwa kwe-IC okuthuthukisiwe. Njengoba uMthetho kaMoore usondela emikhawulweni ebonakalayo, imboni ishintshe ukugxila kusuka ekuncipheni kobukhulu be-transistor kuya kuzakhiwo zokupakisha ezintsha. Ubuchwepheshe be-substrate obuhlanganisiwe bumelela iphuzu elibalulekile lokushintsha lapho amakhono okukhiqiza e-PCB avamile ehlangana khona nezidingo zokunemba kwebanga le-semiconductor.

Lokhu kuziphendukela kwemvelo kuqhutshwa izimfuno zokuhlanganiswa okungafani, lapho ama-chiplets amaningi-i-logic, inkumbulo, nama-processor akhethekile-kufanele axhumane ne-latency encane kanye nokusebenza kahle okukhulu. Ukuqonda lolu shintsho kwezobuchwepheshe kubalulekile kubakhiqizi nabaklami bezinto zikagesi abalungiselela izicelo zesizukulwane esilandelayo ku-AI, izimoto, kanye nekhompyutha esebenza kahle kakhulu.

Ukuvela kwe-PCB kuya ku-Advanced Packaging Substrate

Ukusuka ku-Discrete kuya ku-Integrated Architecture

Ama-PCB endabuko asebenza njengezinkundla zokuxhumana ezingenzi lutho, amasiginali omzila phakathi kwama-chips apakishiwe abekwe endaweni yawo. Le ndlela ehlukahlukene yehlukanisa inqubo yokupakishwa kwe-chip ekuhlanganisweni kwebhodi, idala imikhawulo engokwemvelo kubuqotho besignali kanye nesici sefomu. Ukushintshela kubuchwepheshe be-PCB ye-substrate eshumekiwe kushintsha ngokuyisisekelo le pharamitha ngokuhlanganisa ama-chips ngokuqondile ngaphakathi kwezendlalelo ze-substrate, kuqedwe ukulahlekelwa kwesixhumi esibonakalayo futhi kuvumela izakhiwo ezihlangene ezinezinhlangothi ezintathu.

I-Material Evolution ku-Embedded Substrate PCB

Ukushintsha ukusuka ku-FR-4 laminate kuya kumasistimu e-resin athuthukisiwe kuphawula isivumbuzi esibalulekile sezinhlelo zokusebenza ze-substrate eshumekiwe. I-FR-4 evamile, nakuba ingabizi kakhulu kumabhodi endabuko, ayinakho ukuzinza kwe-dimensional kanye nezakhiwo ze-dielectric ezidingekayo ekuxhumaneni kwe-semiconductor ye-fine-pitch. Imiklamo yesimanje ye-PCB eshumekiwe ye-substrate isebenzisa i-Ajinomoto Build-up Film (ABF), i-bismaleimide-triazine (BT) resin, kanye nezinto ezikhethekile ze-resin-coated copper (RCC) ezihlinzeka nge-coefficient ephakeme yokumataniswa kokushisa okushisayo ne-silicon.

Ukuqhathanisa Kwesakhiwo Kuzo zonke Izizukulwane

Kwa-Highleap Electronics, siye sabona izidingo zekhasimende zishintsha zisuka kumabhodi ajwayelekile e-HDI ziye kuma-substrates ashumekiwe ebanga lokupakisha adinga ukubekezelela okulawulwayo kokubekezelela ngaphansi kuka-5% kanye nokucaciswa kokucaba kwendawo okukalwa ngama-micrometer anedijithi eyodwa.

Amashayeli Abalulekile Ngemva Kokwamukelwa Kwe-PCB Eshumekiwe Ye-Substrate

I-Miniaturization Ihlangabezana Nokuqhuma Kwe-I/O

Ama-system-on-chips esimanje aqukethe izigidigidi zama-transistors kodwa abhekene nenselelo yokuminyana kwe-I/O isibopho esivamile sentambo esingakwazi ukubhekana nayo. Iphrosesa yesicelo seselula esezingeni eliphezulu ingase idinge uxhumo olungaphezu kuka-1,000 endaweni engaphansi kwamamilimitha-skwele ayi-100. Ubuchwepheshe be-PCB be-substrate eshumekiwe buvumela lokhu kuminyene ngokusebenzisa izendlalelo zokusabalalisa kabusha kwephimbo elihle kanye noxhumano lwendawo yohlelo, okusekela ukujula kwehle kuze kufike kuma-micrometer angu-40.

Izidingo Zokusebenza Okushisayo Nogesi

Ikhompuyutha esebenza kahle kakhulu kanye nezisheshisi ze-AI zichitha ukuminyana kwamandla angaphezu kwama-watts angu-500 kumaphakheji ahlangene. Izindlela zokupakisha ezijwayelekile zenza izingqinamba ezishisayo kanye nokwehliswa kobuqotho besignali okuvimbela ukusebenza. Ama-substrates ashumekiwe abhekana nezinselele zombili ngesikhathi esisodwa:

• Ukubambezeleka kwesignali okuncane - Amabanga e-chip-to-interconnect akalwa ngama-micrometer anika amandla amanani edatha e-multi-gigahertz
• I-Superior thermal coupling - Ukuma okuqondile eduze kwezindiza ezishisayo kunciphisa ukumelana ne-junction-to-case ngo-30-50%
• Imiphumela ephansi ye-parasitic - Ukunciphisa amandla kanye ne-inductance kunciphisa ukubonakaliswa kwesignali kanye ne-crosstalk

Izidingo Zokuhlanganisa Ezihlukahlukene

Imboni ye-semiconductor yamukele izakhiwo ze-chiplet lapho ama-dies akhethekile ahlangana ephaketheni elilodwa. Le ndlela ye-System-in-Package idinga i-PCB ye-substrate eshumekiwe esebenza njengendwangu esebenzayo yokuxhuma, ehambisa izinkulungwane zamapheya ahluka ngesivinini esiphezulu kuyilapho iletha ukusatshalaliswa kwamandla ahlanzekile. Izinhlelo zokusebenza zezimoto ziyisibonelo salo mkhuba, ukuhlanganisa ama-sensor fusion processors, izisheshisi ze-AI, nezilawuli ezibaluleke kakhulu kwezokuphepha ngaphakathi kwamaphakheji ahlanganisiwe.

Ukuhlangana kwe-Supply Chain

Abakhiqizi be-PCB babesebenza ngokwehlukana nezinkampani zokupakisha ze-semiconductor, kodwa amandla emakethe manje athanda ukuhlanganiswa okuqondile. Abakhiqizi be-PCB abahamba phambili okuhlanganisa ne-Highleap Electronics bandisa amakhono okubhekana nezidingo zezinga lokupakisha, kuyilapho abahlinzeki be-OSAT bendabuko besebenzisa amasu ezinga lebhodi. Lokhu kuhlangana kudala amathuba kubakhiqizi abangakwazi ukuhlanganisa womabili ama-domain, banikeze izintambo zokuphakelwa ezilungiselelwe kahle kanye nesikhathi esincishisiwe sokuya emakethe.

Ukukhula Kwe-Embedded Substrate PCB Technology

Ukuchaza I-Embedded Substrate Architecture

Ubuchwepheshe be-PCB be-substrate eshumekiwe buhlanganisa i-semiconductor efa ngaphakathi kwezendlalelo eziyinhloko zesakhiwo sezendlalelo eziningi kunokuzigxumeka phezulu. I-substrate ngokwayo iba yingxenye yephakheji, ne-chip ehlala endaweni enembayo noma imbozwe ngokugcwele ngaphakathi kwezendlalelo ze-dielectric. Lesi sakhiwo sinika amandla amaphakheji awonke azacile, ukuhlangana okushisayo okuthuthukisiwe, nokuvikela izindawo ezithambile zokufa ngesikhathi sokuhlangana okulandelayo.

Izakhi Zobuchwepheshe Eziyinhloko

1. Inqubo yokushumeka kwe-Chip

Inqubo yokushumeka iqala ngokunemba kokwakhiwa komgodi ezintweni ezibalulekile, okufinyelelwa ngokukhipha i-laser noma umzila we-CNC wokubekezelela okungaphansi kwama-micrometer angu-25. Ishona yenziwa imisebenzi yokukhetha nendawo kusetshenziswa okokusebenza okukhethekile okukwazi ukunemba kokubekwa kwe-sub-micrometer. Kwa-Highleap Electronics, inqubo yethu yokushumeka ihlanganisa amasistimu okubona esikhathi sangempela futhi iphoqelele impendulo ukuze kuqinisekiswe ukubekwa kwe-chip okungaguquki kuwo wonke amavolumu okukhiqiza.

2. Laser Microvia Formation

Imiklamo ye-PCB eshumekiwe ye-substrate incike kakhulu kuma-microvias abhobozwe nge-laser ukuze asungule ukuxhumana phakathi kwama-chip ashumekiwe nezendlalelo zomzila zangaphandle. I-CO2 noma amasistimu we-laser we-UV adala ngokusebenzisa izimbobo ezisuka ku-25 kuya ku-75 micrometer ububanzi, ne-aspect ratio ngokuvamile ikhawulelwe ku-1:1 ukuze kufakwe ikhopha okuthembekile. Ukulungiselelwa kwe-microvia estakiwe futhi ehlelekile kudala amanethiwekhi okuxhumanisa anezinhlangothi ezintathu, okunika amandla umzila wokuphunyuka kumaphedi e-fine-pitch chip.

3. I-Redistribution Layer Architecture

Izakhiwo ze-RDL kuma-substrates ashumekiwe asebenza ngendlela efanayo ekufakweni kweleveli ye-wafer, kusetshenziswa i-photolithography yomugqa ocolile ukuze kwakhe amaphethini omzila anobubanzi bemigqa nezikhala ezingaphansi kwama-micrometer angu-10. Izendlalelo eziningi ze-RDL zakha amanethiwekhi okuxhumana ayinkimbinkimbi, ngokuvamile asebenzisa izinqubo ze-semi-additive (SAP) noma izinqubo ze-semi-additive ezilungisiwe (mSAP) zokulawula ubukhulu.

Izinzuzo Zokusebenza ze-Embedded Substrate PCB

Indlela eshumekiwe ye-PCB ye-substrate iletha ukuthuthukiswa kokusebenza okulinganisekayo kuzo zonke izilinganiso eziningi:

• Ukuthuthukiswa kobuqotho besignali – Ukubambezeleka kokusabalalisa kwehla ngo-5–10× uma kuqhathaniswa nezinye izinto ezibekwe phezulu
• Ukusebenza okushisayo - Ukumelana nokushisa kwe-Junction-to-ambieent kwehla ngo-30-50% ngokuhlanganiswa kwendlela yokushisa eqondile
• Ukuncishiswa kwesici sefomu - Ubukhulu bephakheji buncipha ngo-40% noma ngaphezulu kuzinhlelo zokusebenza eziphathwayo nezigqokekayo
• Ukwethembeka komshini - Ama-chips ashumekiwe agwema ukuchayeka ekuguquguqukeni kwezinga lebhodi kanye nokushaqeka okushisayo

Ama-Packaging Packaging Architectures Asebenzisa Ama-Substrates Ashumekiwe

Ukuhlanganiswa kwe-2.5D nama-Silicon Interposer

Ukupakishwa kwe-2.5D kubeka ama-chips amaningi ngapha nangapha kusifakeli se-silicon esiqukethe umzila we-fine-pitch kanye ne-pass-silicon vias. I-interposer igibela ku-PCB ye-substrate egxilile engaphansi, ehlinzeka ngokuletha amandla, i-fanout yesignali ekuxhumekeni kwangaphandle, nokuphathwa kokushisa. Le ndlela eyingxubevange ihlanganisa amandla omzila wokuminyana okuphezulu kakhulu kwe-silicon nendawo eyongayo kanye nokubalwa kongqimba kwama-substrates ashumekiwe ezinto eziphilayo.

Ukupakishwa Kwe-3D Nge-TSV Technology

Ukupakishwa kweqiniso kwe-3D IC kume mpo kuzitaki eziningi ezisebenzayo ezinoxhumo oluqondile lwe-TSV olungena ngama-silicon substrates. I-PCB ye-substrate eshumekiwe ekucushweni kwe-3D isebenza njengesisekelo sephakheji, ilawula ukulethwa kwamandla kuwo wonke ama-tier astakiwe namasiginali womzila aphuma kusitaki esime mpo. Izinselele ezishisayo ziyaqina ezakhiweni ze-3D, ukushayela imiklamo ye-substrate ehlanganisa i-thermal vias, izisabalali zokushisa, noma iziteshi zokupholisa ezishunyekiwe.

I-Fan-Out Packaging Evolution

I-Fan-out wafer-level packaging (FOWLP) iqeda ama-substrates endabuko ngokwakha izakhiwo ze-RDL ngokuqondile kumawafa akhiwe kabusha noma amaphaneli amakhulu. Kodwa-ke, njengoba amaphakheji e-fan-out efinyelela kosayizi abakhulu kanye nokuba yinkimbinkimbi okuphezulu, aya ngokuya afane nama-PCB ashumekiwe e-substrate esakhiweni nasezimfuneko zokukhiqiza. Imiklamo ethuthukisiwe yokuphuma kwabalandeli ihlanganisa izendlalelo eziningi ze-RDL kanye nezikhala ezishumekiwe, ezifiphalisa umehluko phakathi kwezindlela.

I-Substrate PCB eshumekiwe njengeBridge Technology

Ubuchwepheshe be-substrate obushumekiwe buthatha indawo ebalulekile phakathi kokupakisha okujwayelekile kwabalandeli kanye nama-substrate emvelo endabuko. Ihlinzeka ngamakhono omzila omuhle kanye nokushumeka asondela ekusebenzeni kwabalandeli kuyilapho kugcinwa ukuqina kwemishini, ukuguquguquka kwesibalo sesendlalelo, kanye nezinketho zokuphatha okushisayo kwamaphakheji asekelwe kwi-substrate. Kuzinhlelo zokusebenza ezidinga osayizi abakhulu be-die, ama-chips amaningi ahlukahlukene, noma ukuhlanganiswa kwezingxenye ezihlukene, ama-substrates ashumekiwe anikeza ibhalansi yokusebenza kwezindleko elungile.

Izinselele Zezinto Ezibalulekile Nezokukhiqiza Ku-PCB Eshumekiwe Ye-Substrate

Izinhlelo ze-Resin Ezithuthukisiwe Zokuzulazula kwe-Fine-Pitch

Ukuzuza ububanzi bomugqa kanye nezikhala ezingaphansi kwama-micrometer angu-10 ekukhiqizeni kwe-PCB eshumekiwe engaphansi kudinga izinto ezisebenza ngokuzinza kobukhulu obukhethekile kanye nobulukhuni obuphansi bendawo. I-ABF ihlala iyindinganiso yemboni yezinhlelo zokusebenza eziningi, enikeza izici ezinhle kakhulu zokumba i-laser nokunamathela okuthembekile kucwecwe lwethusi. Ama-resins e-low-dielectric-constant (low-Dk) kanye ne-low-dissipation-factor (low-Df) abhekana nezimfuneko zesignali yobuqotho kumafrikhwensi angaphezu kuka-50 GHz, ngamavelu ka-Dk angaphansi kuka-3.0 kanye ne-Df ngaphansi kuka-0.005.

Ububanzi Bomugqa kanye Nokulawula Inqubo Yesikhala

Ukugcina ububanzi bomugqa wama-micrometer angu-10 nokufana kwezikhala kuwo wonke amaphaneli okukhiqiza kudinga ukulawula okunembile kwe-photolithography nezinqubo zokucwenga zethusi. Izinqubo ze-semi-additive ne-additive semi-additive eziguquliwe zithatha indawo yokufaka okujwayelekile kokukhiphayo, kusetshenziswa izendlalelo zembewu yethusi elincanyana kanye ne-electroplating ukuze kwakhiwe amakhondakta anokusika kancane kancane. Kwa-Highleap Electronics, sisebenzisa amasistimu okuhlola azenzakalelayo anokulungiswa kwe-sub-micrometer ukuze siqinisekise ukuhambisana kwe-dimensional kukho konke ukukhiqiza.

Izinto Zokulawula Okushisayo Kuma-Substrates Ashumekiwe

Imiklamo ye-PCB eshumekiwe enamandla amakhulu ihlanganisa izici ezikhethekile zokuphatha okushisayo:

• Ukuhlanganiswa kohlamvu lwemali yethusi - Izisabalali zokushisa kusuka ku-0.3 kuya ku-3 millimeters zinikeza izindlela ezishisayo eziqondile ukusuka kuma-chips kuye kumasinki okushisa angaphandle
• Kugcwaliswe nge-thermal vias - Isici esiphezulu se-aspect ratio ngokusebenzisa i-copper paste iqinisekisa ukudluliswa kokushisa okuphumelelayo ngokusebenzisa izendlalelo ze-substrate
• Ama-cores afana ne-CTE - Izinto eziyinhlanganisela zinciphisa i-warpage, ngokungafani kwe-CTE kugcinwa ngaphansi kwe-5 ppm/°C

Izidingo zokujwayela komkhiqizi we-PCB

Abaqambi bendabuko be-PCB abangena emakethe ye-substrate eshumekiwe babhekana nezikhala ezinkulu zamandla enqubo. Amasistimu wokumba ama-laser kufanele afinyelele osayizi bamabala nokunemba kokubeka indawo ngendlela enobukhulu obungcono kunokukhiqiza okujwayelekile kwe-HDI. Izinqubo zokucwenga zidinga isilawuli esinembile samanje sokuminyana ukuze kuzuzwe ukusatshalaliswa kwethusi okufanayo ezakhiweni ze-microvia ezine-aspect ratio esondela ku-1:1. Ukucaciswa kwepulani yeleveli yephaneli kuyaqina ukusuka ekuphakameni okujwayelekile kwama-micrometer angu-50 kuya ezidingweni ze-micrometer enedijithi eyodwa ukuze kuhlanganiswe iphimbo elihle.

I-Outlook Yesikhathi esizayo: I-Substrate Eshumekiwe ye-PCB Convergence

Ukuqedwa Kwemingcele Yezimboni

Umngcele phakathi kokwenziwa kwe-PCB kanye nokupakishwa kwe-semiconductor uyaqhubeka nokuncibilika njengoba ubuchwepheshe be-PCB be-substrate ehlanganisiwe buthuthuka. Abakhiqizi abahamba phambili bathuthukisa amamephu omgwaqo abheke ekupakishweni kwezinga lephaneli okusebenzisa i-lithography yesitayela se-semiconductor kanye namasu okubeka ezindaweni ezinkulu, okungenzeka kunciphise izindleko zokupakisha ngo-40-60%. Ukwakhiwa kwe-RDL-on-substrate kuhlanganisa ukubalwa kwezingqimba ze-substrate eziphilayo kanye nendawo enezingqimba zokusabalalisa kabusha ze-ultrafine-pitch.

I-AI kanye Nokusheshisa Kwemakethe Yezimoto

Ubuhlakani bokwenziwa kanye nezinhlelo zokusebenza zezimoto zisheshisa ukutholwa kwe-PCB ye-substrate eshumekiwe ngokusebenza okuyingqayizivele nezidingo zokwethembeka. Izinhlelo zokuqeqesha ze-AI zidinga umkhawulokudonsa wenkumbulo omkhulu kanye nokubambezeleka okuncane, okutholakala kuphela ngokupakishwa okuthuthukile ngokufa okushunyekiwe kanye nokuxhumana okufushane kakhulu. Ama-elekthronikhi ezimoto adinga ukwethembeka okukhethekile kuwo wonke amazinga okushisa anwetshiwe ngenkathi ehlangabezana nemigomo eqinile yezindleko amaphakheji e-ceramic angakwazi ukubhekana nayo.

Isikhundla Esibalulekile Sokukhula

Njengoba lokhu kuhlangana kuqhubeka, abakhiqizi bezinto zikagesi abawazi kahle amakhono ashumekiwe e-PCB ye-substrate bazothwebula inani elikhulayo ochungechungeni lokunikezela. Ubuchwepheshe abumeli nje ukuthuthukiswa okukhulayo kodwa ukuhlelwa kabusha okuyisisekelo kokuthi amasistimu kagesi ahlanganisa kanjani imisebenzi ye-semiconductor, i-passive, kanye ne-interconnect. Izinkampani ezihlanganisa ngempumelelo isikali sokukhiqiza se-PCB nokunemba kweleveli yokupakisha zizochaza isizukulwane esilandelayo samakhono omkhiqizo we-elekthronikhi.