I-Semiconductor Substrate vs PCB: I-Technical Comparison Guide

Isingeniso

I-Semiconductor substrate (ebuye ibizwe ngebhodi lokupakisha le-IC) kanye nama-PCB ajwayelekile abukeka afana ngokubuka nje, kodwa akhiwe emithethweni ehlukene. Ama-substrates abeka kuqala umzila ocoleke kakhulu, ukuzinza okushisayo nobukhulu bokupakishwa kwe-chip, kuyilapho ama-PCB ebeka kuqala ukuxhumeka kwezinga lesistimu nokwenziwa.

Lo mhlahlandlela uqhathanisa izinto zokwakha, ukujiya, ububanzi bomugqa/isikhala, izinqubo zokukhiqiza, nezinhlelo zokusebenza ezijwayelekile ukusiza onjiniyela babone ngokushesha umehluko esinqumweni “se-substrate vs PCB” futhi benze izinqumo ezinolwazi.

I-Semiconductor Substrate vs PCB: Incazelo kanye Nomehluko Wendima

Iyini i-Semiconductor Substrate?

I-semiconductor substrate, noma ibhodi lokupakisha le-IC, lisebenza njengeplathifomu yokuxhumanisa ethwala ngokuqondile i-bare die, amabhola e-solder, namaqhuqhuva. Lawa mabhodi asebenza kumazinga okupakisha wesi-2 kanye nelesi-3, ahlanganisa umhlaba we-silicon owubona kancane ukuya endaweni ye-macroscopic yesistimu kagesi.

Iyini i-PCB?

Ibhodi lesifunda eliphrintiwe lisebenza ezingeni lesistimu, amamojula axhumayo, izingxenye, namasistimu angaphansi komkhiqizo. Ama-PCB asebenza emazingeni aphezulu okupakisha, ahlinzeka ngosekelo lwemishini kanye nokuxhumana kukagesi ezingxenyeni ezihlanganisiwe ezihlanganisa ama-IC apakishiwe, izixhumi, nezingxenye ezingenzi lutho.

Ukuma kwe-Hierarchical

Ama-Semiconductor substrates aphatha izinguquko ze-chip-to-package lapho ukuminyana kwe-I/O kufinyelela izinkulungwane zokuxhunywa ngesentimitha yesikwele ngayinye. Ama-PCB aphatha ukuhlanganiswa kwephakheji kuya ohlelweni lapho ukuminyana kokuxhumana kuncipha kodwa ubunzima bebhodi buyanda. Lo mehluko oyisisekelo ushayela zonke izinto ezilandelayo, inqubo, nokwehlukaniswa kwedizayini.

Izinketho ze-Semiconductor Substrate Material: BT, ABF, kanye neCeramic

I-BT (Bismaleimide-Triazine) Substrates

I-BT resin ihlinzeka ngokuzinza okuhle kakhulu kokushisa ngamazinga okushisa engilazi angaphezu kuka-180°C kanye ne-coefficient yokwanda okushisayo okufana eduze ne-silicon. Le nto eqinile ye-semiconductor substrate ibusa izinhlelo zokusebenza ezizwelayo ezindleko ezidinga ukuminyana kwe-I/O okumaphakathi kwamaphakheji ajwayelekile e-BGA kanye namaphrosesa amaphakathi nebanga.

Ama-substrates e-ABF (Ajinomoto Build-Up Film).

I-ABF imele okokusebenza kwe-premium semiconductor substrate yezinhlelo zokusebenza ezisebenza kahle kakhulu. Le dielectric yefilimu ezacile inika amandla ububanzi bomugqa obungaphansi kuka-15 μm futhi isekela ukuminyana kwe-I/O okuphezulu kakhulu okudingwa ama-CPU athuthukile nama-GPU. I-ABF ephansi ye-dielectric engaguquki igcina ubuqotho besignali kumafrikhwensi e-multi-gigahertz kuyilapho igcina ukuhambisana kwe-laser-drill ye-micro-vias.

I-Ceramic ne-Metal-Core Alternatives

Ama-substrate e-ceramic ahlinzeka ngokushisa okuphezulu kanye ne-CTE ephansi kakhulu yezinhlelo zokusebenza zamandla aphezulu kodwa abhekene nokuqhekeka kanye nemikhawulo yezindleko. Izinketho ze-Metal-core zinikeza ukushabalaliswa kokushisa okuthuthukisiwe ngezingqimba zesisekelo se-aluminium noma sethusi, kugxilwe kuma-electronics kagesi lapho ukuphathwa kokushisa kudlula khona izidingo ze-fine-pitch.

Izinto ezijwayelekile ze-PCB (FR-4)

I-FR-4 isalokhu iyinto yokusebenza yama-PCB avamile, inikeza izakhiwo zikagesi ezamukelekayo kanye nokusebenza kahle kwezindleko okumangalisayo. I-FR-4 ejwayelekile ikhonza amabhodi asezingeni lesistimu lapho ububanzi bomugqa budlula khona ama-μm angu-75 futhi izidingo zokushisa zihlala ziphakathi. Izinhlobo ze-PCB ezisebenza kahle zifaka i-FR-4 ephezulu ye-Tg kanye ne-polyimide yezinhlelo zokusebenza ezikhethekile kodwa azikwazi ukufanisa amakhono e-substrate ye-semiconductor.

Ithebula Lokuqhathanisa Okubalulekile

Ukucaciswa kweJiyomethri yeSemiconductor Substrate: Ukuqina, Ububanzi Bomugqa, kanye Nezobuchwepheshe

Ububanzi Bomugqa kanye Namakhono Esikhala

Ububanzi bomugqa we-semiconductor substrate nesikhala ngokuvamile sifinyelela ku-30 ​​μm noma kancanyana, ngemikhiqizo ethuthukisiwe ezuza u-10-15 μm wezinhlelo zokusebenza ezisezingeni eliphezulu. Ama-PCB ajwayelekile e-FR-4 asebenza ku-75-150 μm (3-6 mil) amandla, kuyilapho ama-HDI PCB angasondela ku-50 μm kodwa asasele ngemuva kokusebenza kwe-semiconductor substrate.

Izidingo Zokuqina Kwebhodi

Ama-substrates okupakisha e-IC ngokuvamile anesilinganiso esingu-0.3-0.5 mm obukhulu kuye ngohlobo lwephakheji, anciphisa ubude bendlela yesiginali kanye nokunciphisa inductance ye-parasitic. Ama-PCB avamile ngokuvamile asebenzisa ukujiya okungu-0.6-1.6 mm, nezinga elingu-1.6 mm kuzinhlelo zokusebenza zabathengi nezimboni. Iphrofayili ye-semiconductor substrate ezacile inciphisa ubungozi bekhasi le-warpage ngesikhathi sokugeleza kabusha.

I-Micro Via Technology kanye ne-Pitch

Ama-Semiconductor substrates asebenzisa i-laser-drilled micro-vias evumela umzila ominyene wokuphunyuka wokuxhuma:

• Nge-diameter - 25-50 μm uma kuqhathaniswa no-200-400 μm kuma-PCB ajwayelekile
• Ngephimbo - Ngaphansi kwe-100 μm evumela umzila ngaphansi kwemikhondo yezinyawo
• Amandla wokupakisha - Ukwakheka okulandelanayo kusekela ama-vias amaningi astakiwe
• aspect ratio - Izilinganiso eziphansi ngenxa yezendlalelo ezincane ze-dielectric zithuthukisa ukwethembeka

Ukubalwa Kwesendlalelo kanye Nesakhiwo Sokwakha

Ama-semiconductor substrates esimanje ahlanganisa izendlalelo ezingu-4-20 ngobuchwepheshe bokwakha obulandelanayo obungeza izendlalelo ze-dielectric ezincane kakhulu. Isendlalelo ngasinye sokwakha sikala u-15-30 μm uma kuqhathaniswa nezingqimba ze-prepreg ezingu-50-100 μm kuzitaki ezivamile ze-PCB. Lokhu kuvumela ama-substrates ukuthi afinyelele ukuminyana okuphezulu komzila ngaphakathi kwamaphrofayili amafushane.

Inqubo Yokukhiqiza I-Semiconductor Substrate: I-MSAP vs Izindlela Ezivamile

I-Modified Semi-Additive Process (MSAP)

I-MSAP inika amandla amandla omugqa we-semiconductor substrate ocolisekile ngokufaka izendlalelo zembewu yethusi emincane, ukusebenzisa amaphethini e-photoresist, imikhondo ye-electroplating conductor, bese isusa ungqimba lwembewu phakathi kokulandela umkhondo. Le ndlela yokwengeza ikhiqiza ububanzi bomugqa obungaphansi kuka-30 μm ngenxa yokuthi ukuqoshwa kwephethini kususa ithusi elincane kunokuchaza izici ngokusebenzisa ukushumeka kwethusi ngobuningi.

Inqubo Ejwayelekile Yokukhipha I-PCB

Ukukhiqizwa kwe-PCB okujwayelekile kusebenzisa izinqubo zokususa lapho ukumbozwa kwethusi okugcwele kususwa khona ngokukhetha kusetshenziswa imaski yokumelana ne-photoresist. Le ndlela isebenza kahle ngobubanzi bemigqa engaphezu kuka-75 μm kodwa ihlushwa yi-geometries encane ngenxa yemikhawulo ye-etch factor. Indlela yokususa inikeza ukugeleza okusheshayo kanye nezindleko eziphansi zezinhlelo zokusebenza ezinobuningi obumaphakathi.

I-Advanced Surface Finishes

Ama-Semiconductor substrates asebenzisa kakhulu i-ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) ekuqedeni kwaphezulu okuhlinzeka ngokudayiswa okuhle kakhulu, ukuhambisana kwe-wire bonding, nokumelana nokugqwala kwezinhlelo zokusebenza ezinephimbo elihle. Ama-PCB ajwayelekile ngokuvamile asebenzisa i-HASL, i-ENIG, noma i-OSP ngokusekelwe ezindlekweni kanye nezidingo zokusebenza.

I-Laser Drilling kanye ne-Sequential Lamination

Ukukhiqizwa kwe-Semiconductor substrate kuncike embonweni we-CO2 noma we-UV laser ukuze uthole ukwakheka okunembile kwe-micro-via ngaphandle kwengcindezi yemishini. I-lamination elandelanayo yakha izendlalelo ngazinye, iqinisekisa ukunemba kokubhaliswa futhi ivumele ukujiya okuyisisekelo okuhlukile. I-PCB mass lamination evamile kanye nokubhola ngomshini kufanelana nezici ezinkulu kodwa ayikwazi ukuzuza ukunemba kwe-semiconductor substrate.

Ukusebenza Kwe-Semiconductor Substrate: Okogesi, Okushisayo, kanye Nokwethembeka

Izidingo Zokusebenza Kogesi

Ama-substrate e-semiconductor aphatha umzila obalulekile we-first intshi kusukela kumabhola e-die kuya kuma-package, adinga ukulawulwa kwe-impedance okuqinile (±10%) kanye nokulahleka okuncane kwesignali kuma-frequency amaningi e-gigahertz. Izinto eziphansi ze-dielectric constant kanye nezinto zokusabalalisa zigcina ubuqotho besignali kuzo zonke izixhumi ezimfushane kodwa ezixineneyo. Ama-PCB aphatha ama-trace amade ngokubekezelelana okukhululekile lapho ukulawulwa kwe-impedance kuhlose khona ±15-20%. Ekupakishweni kwe-organic build-up, ama-substrate e-ABF build-up kanye ne-interface yawo ye-PCB achaza umehluko phakathi kwe-package interconnect kanye nebhodi lesistimu.

Ukucatshangelwa kokuphatha okushisayo

Idizayini ye-substrate eshisayo igcizelela izindlela eziphansi zokumelana nokushisa ukusuka ekufa kuye kusisakazeni sokushisa ngokusebenzisa izendlalelo ezincane ze-dielectric, i-thermal vias, nezakhiwo ezigcwele insimbi. Iphrofayili emincane kanye nokuminyana okuphezulu kunika amandla ukusabalalisa ukushisa okusebenzayo. Ama-PCB ahlanganisa izindiza ezishisayo kanye nezindiza zethusi kodwa agxila ekulahlekeni kokushisa kwengxenye yengxenye esikhundleni sokuphatha okushisayo okuqondile.

Ukuthembeka Komshini kanye Nokumatanisa kwe-CTE

Ama-substrates e-semiconductor adlula ekujikelezeni okushisayo okwedlulele ngesikhathi sokugeleza kabusha (ukuphakama kuka-260°C) kanye nokushintshashintsha kwezinga lokushisa:

• Ukulinganisa kwe-CTE - Izinto eziphansi ze-CTE ezifaniswa ne-silicon (2.6 ppm/°C) zivimbela ukukhathala okuhlangene kwe-solder
• Ukulawulwa kwe-Warpage - Umnsalo webhodi unomkhawulo ku-<0.3% we-diagonal dimension
• Ukuxineka okushisayo - Imijikelezo eminingi yokugeleza kabusha kanye nokweqisa kwezinga lokushisa kudinga ukuzinza okuphezulu kobukhulu
• Ukuthembeka okuhlangene kwe-Solder - Ukuxhumeka kwe-Fine-pitch kudinga ukuhleleka okungaguquki kanye nekhwalithi yokuqedwa kwendawo

Ukuhlola Ukuthembeka Okujwayelekile

Ukufaneleka kwe-Semiconductor substrate kufaka phakathi ukuhamba ngebhayisikili okushisayo okujwayelekile kwe-JEDEC (-55°C kuya ku-+125°C, imijikelezo engu-500-1000), ukuhlolwa kwezinga lokuzwela umswakama, nokugcinwa kwezinga lokushisa eliphezulu. Ukuthembeka okuhlanganyelwe kwe-solder kuthola ukucutshungulwa okuthile ngokugunda ibhola nokuhlolwa kokudonsa. Ukuhlolwa kokwethembeka kwe-PCB kuhlanganisa izindawo ezifanayo ezinemibandela yokwamukela ekhululekile ebonisa izidingo zeleveli yesistimu.

Izimo Zokusebenzisa I-Semiconductor Substrate

Izicelo Zekhompyutha Ezisebenza Kakhulu

Ama-CPU nama -GPU aphezulu kakhulu asebenzisa ama-substrate e-ABF ukuze afake izinkulungwane zokuxhumeka kwe-I/O nge-fine pitch ngenkathi egcina ubuqotho besiginali ye-DDR5, i-PCIe Gen5, nezinye izixhumi zesivinini esikhulu. Amaphakheji e-high-bandwidth memory (HBM) adinga ama-substrate e-ultra-fine-pitch semiconductor avumela ukuxhumana nge-through-silicon-via (TSV). Amamojula e-System-in-package nama-multi-chip ahlanganisa ama-dies amaningi kuma-substrate abiwe.

Izicelo Ezivamile ze-PCB

Amabhodi omama namabhodi esistimu ahlanganisa izingxenye ezipakishiwe, izixhumi, namamojula kusetshenziswa ubuchwepheshe be-PCB obujwayelekile lapho ubuningi bokuxhumana buvumela izinqubo zokukhiqiza ezijwayelekile. Ama-elekthronikhi anamandla athanda ama-PCB ethusi elisindayo noma ama-PCB ensimbi ahlinzeka ngomthamo wokuthwala ugesi kanye nokusatshalaliswa kokushisa ngaphandle kokudinga ukuhanjiswa kwe-pitch encane. Ama-elekthronikhi abathengi kanye nezinhlelo zezimoto zisebenzisa kakhulu ama-PCB e-FR-4 alinganisela ukusebenza kanye nezindleko.

Izibonelo Zokukhetha Ubuchwepheshe

Iphrosesa ye-flagship idinga i-ABF substrate ngoba ukuxhumeka okungu-4000+ I/O kokuthi i-pitch yebhola engu-0.35 mm ifuna ububanzi bomugqa ongaphansi kuka-30 μm nokusebenza kukagesi okuphakeme. Isiguquli samandla sisebenzisa i-FR-4 PCB ewugqinsi ngoba ukuxhumeka kwayo okungu-100-200 kubeka phambili ukuphatha kwamanje ngaphezu kokuminyana komzila. I-smartphone isebenzisa ubuchwepheshe be-HDI PCB obusondela kumakhono afana ne-substrate ukuze kuhlanganiswe ingxenye kodwa iyeka ukushoda ezidingweni zangempela ze-semiconductor substrate.

Imihlahlandlela Yokukhetha Ubunjiniyela: I-Semiconductor Substrate vs PCB Decision Factors

Ukuminyana kwe-I/O kanye nokuhlolwa kwe-Ball Pitch

Izinhlelo zokusebenza ezidinga ukuphakama kwebhola ngaphansi kuka-0.5 mm ngezibalo zokuxhumeka ezingaphezu kuka-1000 I/O ngokuvamile zigunyaza ubuchwepheshe be-semiconductor substrate. Bala amashaneli omzila asebenzayo atholakalayo phakathi kwamabhola usebenzisa ububanzi bomugqa kanye nekhono lokuhlukanisa ukuze uthole ukuthi umzila wokuphunyuka uhlala ungenzeka yini ngobuchwepheshe be-PCB.

Ububanzi Bomugqa Nezikhala Ezidingekayo

Lapho imithetho yokuklama idinga ububanzi bomugqa ngaphansi kuka-50 μm, izinqubo ezivamile ze-PCB azikwazi ukusebenza futhi ubuchwepheshe be-semiconductor substrate noma i-substrate-like PCB (SLP) buyadingeka. I-SLP imele indlela emaphakathi esebenzisa izinqubo ze-PCB ezithuthukisiwe ukuze kuzuzwe izici ezingu-30-50 μm ngezindleko eziphansi kunama-semiconductor substrates agcwele.

Ukucatshangelwa Okushisayo Nokwethenjelwa

Izinhlelo zokusebenza zokuminyana kwamandla aphezulu (>1 W/mm²) kuhlanganiswe namasiginali azwela imvamisa avuna ama-semiconductor substrates asebenza ngokushisa okuphezulu nokusebenza kukagesi. Izinhlelo zokusebenza ezihlangabezana nokuhamba ngebhayisikili okushisayo okudlulele noma ezidinga ukuthembeka kwezinga le-JEDEC zidinga izinto ezisetshenziswayo ze-substrate nokumataniswa kwe-CTE. Izinhlelo zokusebenza ezizwelayo izindleko zamukela ukumelana nokushisa kwe-PCB futhi zisebenzisa izixazululo zokupholisa ezithuthukisiwe.

Izindleko nekhono Lokukhiqiza

Izici ezibalulekile zezomnotho nezokukhiqiza lapho ukhetha ama-semiconductor substrates:

• Umehluko wezindleko - Ama-substrates abiza i-3-10× ngaphezulu kwama-PCB asezingeni elilinganayo ngenxa yezinto ezithuthukisiwe nokucubungula
• isikhathi Ukuhola - Amaviki angu-8-12 wama-substrates aqhathaniswa namaviki angu-2-4 wama-PCB anomthelela emijikelezweni yokuthuthukiswa
• Ukucatshangelwa kwevolumu - Ukukhiqizwa kwevolumu ephezulu kungathethelela ukutshalwa kwezimali kwe-substrate lapho izidingo zokusebenza zingenakufinyelelwa ngenye indlela
• Amandla omphakeli - Qinisekisa amandla e-MSAP, isipiliyoni se-ENEPIG sokumba, kanye nobungcweti bokubhola nge-micro-via ngaphambi kokwenza

Isiphetho

Ukukhetha phakathi kwe-semiconductor substrate ne-PCB kuncike ekumitheni kwe-I/O, izidingo zobubanzi bomugqa, izimfuno ezishisayo, kanye nemikhawulo yezindleko. Ama-semiconductor substrates ahamba phambili ekufakweni kweleveli ye-chip lapho iphimbo elicokeme kakhulu, ukuminyana okuphezulu kokuxhumeka, nokusebenza kukagesi okuphakeme kuvumela izindleko eziphakeme. Ama-PCB avamile ahlala elungile ekuhlanganisweni kwezinga lesistimu lapho ukuminyana okumaphakathi, ukukhiqizwa okuqinisekisiwe, nokusebenza kahle kwezindleko kuhlangabezana nezidingo zohlelo lokusebenza.

Uzakwethu ne-Highleap Electronics

Njengomkhiqizi we-PCB onolwazi nomhlinzeki womhlangano, i-Highleap Electronics iletha izixazululo eziphelele kuwo wonke umkhakha wezobuchwepheshe:

• Ukukhiqiza okuthuthukisiwe kwe-HDI PCB - Amandla we-Fine-line asondela ekusebenzeni okufana ne-substrate kwezinhlelo zokusebenza ezifunayo
• Ubuchwepheshe be-PCB enezingqimba eziningi - Izitaki eziyinkimbinkimbi ezivela kuma-prototypes ngokukhiqizwa kwevolumu ephezulu
• Idizayini yokwenziwa - Ukwesekwa kwezobunjiniyela ukuze kuthuthukiswe imiklamo yezindleko nebhalansi yokusebenza
• Ubambiswano lwe-Substrate sourcing - Ukuxhumana nabahlinzeki be-substrate abakhethekile ukuze uthole izixazululo ezihlanganisiwe
• Qedela izinkonzo zomhlangano - Ukwenziwa kwe-PCB ngokuhlanganiswa komkhiqizo wokugcina ngaphansi kophahla olulodwa

Xhumana nethimba lethu lobunjiniyela ukuze uxoxe ngezidingo zakho zephrojekthi. Sizokusiza ekuhloleni ukuthi ubuchwepheshe be-PCB obuthuthukisiwe noma ukuhlanganiswa kwe-semiconductor substrate kusebenzela kangcono uhlelo lwakho lokusebenza, bese sinikeza ikhambi elifanele kakhulu ukusebenza kwakho kanye nemigomo yesabelomali.

Imibuzo Evame Ukubuzwa: I-Semiconductor Substrate vs Ukukhetha kwe-PCB

1. Ingabe I-PCB Ingasetshenziswa Njenge-Substrate?

Ama-PCB ajwayelekile awakwazi ukumiselela ama-semiconductor substrates ezinhlelweni zokusebenza ezinomthamo omkhulu we-I/O ngenxa yobubanzi bomugqa oyisisekelo nangemikhawulo. Ubuchwepheshe be-PCB obufana ne-substrate buvala igebe lezinhlelo zokusebenza zokuminyana okumaphakathi, kuzuzwe izici ezingama-30-50 μm kusetshenziswa izinqubo ezithuthukisiwe. Ukusebenza kweqiniso kwe-semiconductor substrate kudinga izinto ezizinikele kanye nokukhiqizwa kwe-MSAP.

2. Ungakhetha nini i-ABF vs BT Substrates?

Khetha i-ABF yezinhlelo zokusebenza ezidinga ukuphakama kwe-ultra-fine (ngaphansi kuka-25 μm ububanzi bomugqa), ukusayina kwesivinini esiphezulu ngaphezu kuka-10 Gbps, noma i-I/O ibala ngaphezu koxhumo oluyi-2000. Khetha i-BT yezinhlelo zokusebenza ezingazweli izindleko ezinokuminyana kwe-I/O okumaphakathi namaphakheji ajwayelekile e-BGA. I-ABF ibiza ngo-30-50% ngaphezu kwe-BT kodwa iba yimfuneko ekucubunguleni nasekusetshenzisweni kwenkumbulo.

3. Yini Echaza I-Substrate-like PCB (SLP)?

I-PCB efana ne-substrate isebenzisa izinqubo ze-PCB eziguquliwe ukuze ifinyelele izici ezinhle kakhulu kunokukhiqiza okuvamile kodwa ngaphandle kwamandla aphelele e-MSAP. I-SLP ivame ukunikeza ububanzi bomugqa obungu-40-60 μm kusetshenziswa amasu ethusi amancane kanye nokusika okulawulwayo noma okuyingxenye yokwengeza okuncane. Le ndlela ifanela izinhlelo zokusebenza ezidinga ukusebenza kwe-PCB okungcono kunejwayelekile ngaphandle kokuqinisekisa izindleko ezigcwele ze-semiconductor substrate.